LED路灯的早期故障筛选试验探讨

LED照明产品不同于传统照明产品,更类似于电子产品,该文主要依据GB/T2423标准对LED路灯可靠性试验项目进行探讨,提出LED路灯可靠性的早期故障筛选试验方案,并通过试验总结出可行的试验方法,为检验检测机构和生产企业提供参考。     

用环境应力筛选试验研究SMT焊点可靠性的探讨

本文结合实际SMT混装组件制，阐述SMT混装组件失效的机理，介绍了环境应力筛选试验的情况和结果，对影响可靠性的各种因素进行了分析与总结，提出了提高可靠性的措施，指出了环境应力筛选是保证SMT混装组件产品可靠性的必要工作手段，它可排除早期故障、使产品可靠性接近设计的固有可靠性水平。     

石英谐振器可靠性筛选的研究和实践

1 前言 可靠性筛选是八十年代新兴的一种可靠性试验技术。它是指为了选择一定特性的产品,或为了剔除早期失效的产品而对元器件100％地进行一项或多项的试验。广州中国电子元器件可靠性试验中心有资料记载,八十年代中期以来,我国电子元器件行业,只有晶体管、电阻、电容、继电器集成电路等十余种元器件逐步开展了可靠性筛选的研究和试验,而石英谐振器可靠性筛选,此前还没有听说哪个企业进行。 我于一九八八年开始负责企业质量检验和试验室工作,开始了对通讯机用JA80A型石英谐振器可靠性筛选的研究和试验。 在这之前,石英谐振器成品经过检验合格后即出厂。用户上机率仅80％左右,最高85%。产品质量远远满足不了整机厂对石英     

用环境应力筛选试验研究SMT焊点可靠性的探讨

本结合实际SMT混装组件制，阐述了SMT混装组件失效的机理，介绍了环境应力筛选试验的情况和结果，对影响可靠性的各种因素进行了分析与总结，提出了提高可靠性的措施，指出了环境应力筛选是保证SMT混装组件产品可靠性的必要工作手段，它可排除早期故障、使产品可靠性接近设计的固有可靠性水平。     

有线电视设备的可靠性选择及维护

有线电视设备、器材的可靠性，通俗地讲就是指经常满意地运行的能力，所谓满意地运行有两个方面的含义：不容易出故障和出了故障容易修复。可靠性与基本技术性能指标既有区别又有联系。所谓可靠性高，就是指产品的技术性能充分地发挥出来，但一般来说，产品的技术性能不包含时间这个因素在内。或者说是T=0时的质量，而可靠性则是包含了时间因素在内的，或者说是指T=t时，或T=O到T=t这段时间内的质量。因此，也有人把可靠性称为时间的质量。     

半导体器件老炼筛选试验设计

老炼筛选试验是有效剔除内含固有工艺缺陷的半导体器件,以及保证半导体器件使用可靠性的重要途径。本文阐述了半导体器件早期失效的基本概念,并给出了半导体器件早期失效率的预计方法。在此基础上提出了半导体器件老炼筛选试验设计方法,以期最大限度地保证半导体器件出厂后的使用可靠性。     

电子产品环境应力筛选方法及其应用

环境应力筛选是保证产品使用可靠性的一种有效方法，作为一项生产工艺，其效费比大小是衡量ＥＳＳ方法优劣的根本标准。本文作者根据长期从事电子产品可靠性试验的经验和对筛选机理的研究结果，提出了根据产品特点制定高效ＥＳＳ的一般方法，以便用较短的试验时间暨较低的试验成本，达到对产品早期故障的充分剔除。     

工程可靠性与故障

本文简述了产品可靠性诞生的过程，并讲述了工程可靠性与故障的属性及预防产品故障的设计方法。     

可靠性强化试验在机载设备验收试验中的应用

首先,简要地介绍了可靠性强化试验的概念和基本原理;然后,在现行的可靠性验收试验技术的基础上,提出了一种针对直升机机载电子设备的快速的可靠性验收试验方法,即先应用强应力筛选试验技术,充分地剔除产品的早期故障,提高产品的可靠性,然后采用高风险定时截尾或MTBF保证试验等验证试验方案对产品进行可靠性验收试验;最后,对该方法在某单位批生产的一批产品的验收中的具体运用进行了简单的介绍,从而证明了该方法的有效性和实用性.     

GB/T 1227-2002《精密压力表》检验规则

检验规则1．精密压力表的出厂检验及判定规则，精密压力表应按GB／T1227-20024.3～4.7及4.11～4.12规定逐台进行出厂检验。当被检精密压力表在出厂检验中存在一个或一个以上检验项目不合格时，则应判定其为不合格产品。强调地说：只有在所规定的出厂检验项目全部合格后，才能判定其为合格产品。出厂检验合格精密压力表应附有其合格证才能出厂。     

R&M 2000 and Environmental Stress Screening

The United States Air Force, Army, and Navy have established the need for Environmental Stress Screening (ESS). The Air Force policy statement issued 1986 November imposed the provision that all fielded major electronic systems must deliver 2000 hours failure free. To accomplish this will require changes in design, producibility, and manufacturing attitudes. Defectives must be removed in the factory, at the most cost effective point in the production cycle. This will require assessing failures from the field, then developing a system to identify these defectives in the factory, at the lowest level of assembly. Poor reliability rooted in high component failure rates leads to premature equipment failures. Fielded systems and spares provisioning with resultant maintenance actions cost heavily during each year of life. The result is that the spares provisioning & logistic support is now exceeding 50 percent of the defense allocation (1984 and 1985 budgets). Cost increases result from poor equipment reliability. Today, systems originally contracted to deliver over 500 hours mean time-between-failures (MTBF) are delivering less than 50 hours MTBF, (Navy Maintenance Material Management ``3M' report). Excessive failure of components is a major cause of reduced life of equipment. Most maintenance actions involve the replacement of piece parts. The roots of this problem lie in the factory. Manufacturers are not removing defectives early in the product design/production cycle. Because of inadequate testing, most defectives are not detected in the factory. Failures are then precipitated in the field.     

New concerns about integrated circuit reliability

Accelerated-stress life testing is widely used for the purpose of controlling process aberrants which could supply whole lots of high-failure-rate parts. Accelerated-stress conditions are also used for screening purposes to reduce or eliminate early failures. But, a new reliability consideration results from the fact that many electronic systems which use large numbers of integrated circuits are now being shipped directly from the factory to the final customer, without requiring lengthy installation and test periods. Infant-mortality failures, which were formerly absorbed in the installation period by the equipment manufacturer, are now seen by the user, and the measurement and control of these failures becomes more important. Although these failures include a large variety of failure mechanisms, some temperature dependence is apparent (0.25-0.4 eV) and time-to-failure parameters can be identified so the specific conditions of device or equipment burn-in, with respect to time and stress, can be quantified and optimized. Failure-rate plots are given for the infant-mortality period. They show that failure rates of multiple-device-chip assemblies can be predicted from known failure-rate plots of individual chips.     

电子产品防静电系统工程设计探讨

对电子产品生产企业而言,静电防护系统是企业生产系统的基础性工程,它是产品高可靠性的保障.以一工程实例为例,较详细介绍了静电防护系统的规划、方案设计,系统配置及系统管理,有助于电子产品整机企业内如何建立静电防护系统工程.     

LED组件寿命评估方法的研究

由于LED技术的飞速发展,其应用产品不断扩大到人们生活的各个方面,因此LED产品的可靠性问题也日益受到人们的关注。在可靠性工程常用的寿命分布中,指数分布是应用广泛的一种分布,进入偶然失效期以后都可以认为产品失效分布是指数分布。LED产品的寿命试验有定时截尾和定数截尾2种方式,由于定数结尾需要较长的试验时间,因此采用定时截尾的试验方法来获取试验数据。给出了LED组件的寿命评估方法,该方法对LED模块和应用产品同样适用。     

Acceleration factors for THB induced degradation of AlGaAs/InGaAs pHEMT devices

PHEMT devices initially showing high failure rates during Temperature Humidity Bias (THB) reliability testing were investigated further using a number of temperature and humidity conditions. Ambient temperature was varied from 85 °C to 110 °C, humidity from 65% RH (Relative Humidity) to 85% RH. Failure rates were fit to a Peck acceleration model using the method of maximum likelihood. Median time to failure (MTTF) estimates were calculated at anticipated field service conditions using the experimentally determined model parameters. The MTTF is predicted to be typically less than a year for the die variant studied. Countermeasures outside the scope of this investigation have been implemented to effectively eliminate this issue allowing RFMD to supply products with suitable reliability.     

电子产品退化失效的BS模型

退化失颜色的电子产品的寿命试验通常只能得到性能退化的数据，使用传统的方法很难对其可靠性进行评估。考虑到电子产品的退化类似于材料的疲劳，以金属化膜电容器为例，研究了BS模型在电子产品可靠性中的应用。从金属化膜电容器的失效过程推导出了该类型电容器的BS模型，经过计算比较，BS模型对脉冲电容器可靠性的评估要优于Weibull等其它模型。该实例证明BS模型能应用于电子产品的退化失效。     

直放站研制的质量与可靠性控制

从设计到器件采购,产品生产和设备出厂检验以及产品服务等五个方面,论述了直放站产品研制中如何进行质量与可靠性控制的问题,并提出了相应的方法和措施,对提高通信产品的质量与可靠性有指导作用.     

Lifetime Estimation Using Only Failure Information From Warranty Database

Knowledge about product lifetime obtained from actual usage (field data) is of great importance to manufacturers who want to get information about the true reliability of their products. Warranty data are frequently used to estimate reliability characteristics because such databases are automatically generated and updated at no additional cost from repair claims during warranty coverage. For engineering purposes, usage time (e.g., mileage) is more relevant, and lifetime parameters measured in usage time is an integral part of reliability analysis using warranty data. Usually, warranty data consist of only failure information. Censored data (e.g., mileage of non-failure automobiles) are not obtainable, of which usage time distributions are different from those of failed ones. Effective usage-based estimation thus requires supplementary information about usage accumulation for non-failure units such as follow-up studies, or a usage time distribution which includes both failure, and non-failure products. However, sometimes usage-based data for non-failed units are expensive and difficult to obtain. Thus, the unavailability of the usage time of censored units makes it difficult to estimate the usage-based lifetime distribution of products. This paper deals with that problem, and discusses how to estimate the lifetime distribution using warranty data which consist of only failure information. The practical consequence of this finding is that supplemental information is not needed to obtain correct estimates of the lifetime parameters.      

DDR3芯片基于XR8238A全地址全功能老炼过程测试

集成电路老炼的主要目的是模拟芯片的工作寿命,加偏压、加高温模拟产品最坏的工作条件,作为可靠性监控和从批次产品中剔除早期失效产品。取决于老炼时间的长短,早衰期或者损耗期的缺陷均可导致芯片的失效。第三代双倍数据率同步动态随机存储器目前还没有一套完整的老炼试验方法。基于设备XR8238A设计一套印制板,区别于传统的老炼试验模式,给芯片写入完整的数据,输出符合预期的波形,有效地完成了老炼过程测试,提供了第三代双倍数据率同步动态随机存储器产品出货平均故障间隔时间试验的一种方法,提升了集成电路老炼的效果。     

Separating HBT wearout from defects during early life operation

This is a paper that bridges the gap between quality and reliability. It is focused specifically on early life failures – the ones that customers actually experience. Progress on identifying, duplicating, and predicting early failures is necessary to remove defects and improve reliability for semiconductor products. This work relies on the notion that quality is an integral part of device reliability and the results shown here reinforce the existence of quality-to-reliability correlations for certain failure mechanisms. This work advances the knowledge of reliability by showing the importance of the relationship between quality and reliability to draw the focus back to what really matters for customers... reduced defects and lower early fallout.