The effect of a stiffener on a cracked plate under skew-symmetric loading

In this paper, the title problem is studied by using Reissner's transverse shear theory. The main purpose of the paper is to investigate the effect of a stiffener on the stress intensity factors in plates under twisting moments and/or transverse shear loads. The asymptotic stress state near the crack tip terminating at the stiffener is examined, and normalized Mode II and Mode III stress intensity factors are tabulated for various crack geometries. The results also include the effect of Poisson's ratio, stiffness constants and material orthotropy for specially orthotropic materials on the stress intensity factors.     

Transient Thermoelastic Analysis of a Solid Cylinder Containing a Circumferential Crack Using the C–V Heat Conduction Model

This article presents the transient thermoelastic analysis in a long solid cylinder with a circumferential crack using the C–V heat conduction theory. The outer surface of the cylinder is subjected to a sudden temperature change. The Laplace transform technique is adopted to solve the one-dimensional hyperbolic heat conduction equation, and the axial thermal stress is obtained for the un-cracked cylinder in the Laplace domain. Then this axial thermal stress with a minus sign is applied to the crack surface to form a mixed boundary value problem in the cylindrical coordinate system. A singular integral equation is derived by applying the Fourier and Hankel transforms to solve the mode I crack problem. The transient thermal stress intensity factors are obtained by solving the singular integral equation numerically. The influences of thermal relaxation time, crack geometry, and Biot's number upon transient temperature distributions, axial stress fields, and stress intensity factors are analyzed.     

Transient Intensity Factors for a Parallel Crack in a Plate of a Functionally Graded Piezoelectric Material Under Thermal Shock Loading Conditions

A crack in a plate of a functionally graded piezoelectric material is studied under thermal shock loading conditions. The crack faces are supposed to be completely insulated. All material properties are assumed to be exponentially dependent on the distance from the crack line parallel to the boundaries of the plate. By using both the Laplace transform and Fourier transform, the thermal and electromechanical problems are reduced to a singular integral equation and a system of singular integral equations that are solved numerically. The stress and electric displacement intensity factors vs. time for various material constants and geometric parameters are calculated.     

A Surface Crack in a Graded Coating Bonded to a Homogeneous Substrate under Transient Thermal Loading

The elastodynamic problem of a surface crack in a graded coating bonded to a homogeneous substrate under transient heat flux is considered. The coating is graded along the thickness direction and modelled as a nonhomogeneous medium with an isotropic stress-strain law. The problem is solved under the assumption of plane strain or generalized plane stress conditions. The resulting crack problem is of mode I because the orientations of the crack axis, the material gradient and the heat-flux are all parallel. The equivalent crack surface tractions are first obtained and substituted in the plane elasticity equations which are then converted analytically using appropriate integral transforms into a singular integral equation. The resulting equation is solved numerically using orthogonal Jacobi polynomials to yield the Mode I stress intensity factor. The main objective of the research is to study the effect of the layer thickness and nonhomogeneity parameters on the dynamic crack tip stress intensity factor for the purpose of gaining better understanding on the behavior of graded coatings under transient thermal loading.     

Transient Thermal Stress Analysis of Orthotropic Functionally Graded Materials with a Crack

The transient thermal fracture problem of a crack (perpendicular to the gradient direction) in a graded orthotropic strip is investigated. Most of the materials properties are assumed to vary as an exponential function of thickness direction. The transient two-dimensional temperature problem is analyzed by the methods of Laplace and Fourier transformations. A system of singular integral equations are obtained and solved numerically. Numerical results are figured out to show the variation of the temperature on the crack faces and extended line and stress intensity factors for different material parameters with dimensionless time.     

A Surface Crack in a Graded Coating Bonded to a Homogeneous Substrate under Thermal Loading

The elastostatic problem of a surface crack in a graded coating bonded to a homogeneous substrate under steady-state heat flux is considered. The coating is graded along the thickness direction and modeled as a nonhomogeneous medium with an isotropic stress-strain law. The problem is solved under the assumption of plane strain or generalized plane stress conditions. The resulting crack problem is of mode I because the orientations of the crack axis, the material gradient and the heat-flux are all parallel. The equivalent crack surface tractions are first obtained and substituted in the plane elasticity equations which are then converted analytically into a singular integral equation. The resulting equation is solved numerically using orthogonal Jacobi polynomials to yield the Mode I stress intensity factor. The main objective of the article is to study the effect of the layer thickness and nonhomogeneity parameters on the crack tip stress intensity factor for the purpose of gaining better understanding on the behavior of graded coatings under thermal loading.     

Infinite Row of Parallel Cracks in a Functionally Graded Piezoelectric Material Strip Under Mechanical and Transient Thermal Loading Conditions

In this paper, the problem of an infinite row of parallel cracks in a functionally graded piezoelectric material strip (FGPM strip) is analyzed under static mechanical and transient thermal loading conditions. The crack faces are supposed to be completely insulated. Material properties are assumed to be exponentially dependent on the distance from the bottom surface. By using the Laplace and Fourier transforms, the thermoelectromechanical problem is reduced to a singular integral equation, which is solved numerically. The stress intensity factors for both the embedded and edge cracks are computed. The results for the crack contact problem are also included.     

EDGE CRACK IN A NONHOMOGENEOUS HALF PLANE UNDER THERMAL LOADING

This paper deals with the problem of an edge crack in a semi-infinite nonhomogeneous plate under steady heat flux loading conditions. The objective of the study is to assess the effect of material nonhomogeneity on the thermal stress intensity factor. All material properties are supposed to be exponentially dependent on the distance from the boundary of the plate. By using the Fourier transform, the problem is reduced to a singular integral equation that is solved numerically. The thermal stress intensity factors for various material constants are calculated. The results show that by selecting the material constants appropriately the stress intensity factor can be reduced.     

Contact Zone Approach for an Electrically Impermeable Crack in Piezoelectric Materials Under Thermal-Mechanical Loading

A partial contact zone model is developed for the stress and electric displacement fields due to the obstruction of a uniform heat flux by an electrically impermeable crack in piezoelectric materials. Green's function method is used to reduce the problem to a set of singular integral equations that are solved in closed form. When the crack is assumed to be traction free, the crack opening displacement is found to be negative over one-half of the crack unless a sufficiently large far field tensile stress is superposed. The problem is reformulated assuming a contact zone at one crack tip. The extent of this zone, the stress and electric displacement intensity factors at each crack tip are obtained as functions of the applied mechanical stress and heat flux.     

THERMAL STRESS ANALYSIS IN THERMOPIEZOELASTIC STRIP WITH AN EDGE CRACK

The analysis of thermal stresses becomes important when the piezoelectric material has to be operated in either extremely cold or hot temperature environments. Hence, it is essential to know the interaction of mechanical defects with temperature changes. This investigation is concerned with a strip problem of transversely isotropic thermopiezoelastic material containing an edge crack under partial thermal and electric loading conditions. Thermopiezoelastic stresses are analyzed by introducing potential functions and Fourier transforms. The problem reduces to solving a singular integral equation, and the singular integral equation is solved. Numerical calculations of the thermal stress intensity factors are carried out for a cadmium selenide material.     

Transient Thermoelectroelastic Response of a Functionally Graded Piezoelectric Strip with Two Parallel Axisymmetric Cracks

In this article, the problem of two parallel axisymmetric cracks in a plate of a functionally graded piezoelectric material (FGPM) strip is analyzed under transient thermal loading conditions. It is assumed that the thermoelectroelastic properties of the strip vary continuously along the thickness of the strip, and that the crack faces are supposed to be insulated thermally and electrically. By using both the Laplace and Hankel transforms, the thermal and electromechanical problems are reduced to two systems of singular integral equations. The singular integral equations are solved numerically, and a numerical method is then employed to obtain the time dependent solutions by way of a Laplace inversion technique. Systematic numerical calculations are carried out, and the field intensity factors versus time are presented for various values of dimensionless parameters representing the crack geometry and the material non-homogeneity.     

Thermal Stress Analysis of an Embedded Crack in a Graded Orthotropic Coating-Substrate Structure

An analysis of a coupled plane thermoelastic problem for a graded orthotropic coating-substrate structure is performed under thermomechanical loading conditions. The crack direction is parallel to the free surface. Applying the superposition principle and Fourier integral transform, the heat conduction and plane elasticity equations lends themselves to the derivation of two sets of Cauchy-type singular integral equations. The thermal stress intensity factors are defined and evaluated. In the numerical results, the effects of the orthotropy parameters, thermoelastic non-homogeneity parameters, and dimensionless thermal resistance on the temperature distribution and the thermal stress intensity factors (TSIFs) are studied. The obtained results can be used to design graded orthotropic coating-substrate structures under thermomechanical loading.     

Effects of Crack Surface Conductance on Intensity Factors for a Functionally Graded Piezoelectric Material Under Thermal Load

Effects of crack surface conductance on intensity factors for a functionally graded piezoelectric material under thermal load are investigated. The heat flux through the crack is assumed to be proportional to the local temperature difference. Moreover, two models for more realistic crack face electric boundary conditions are proposed. By using the Fourier transform, the thermal and electromechanical problems are reduced to a singular integral equation and a system of singular integral equations, respectively, which are solved numerically. Detailed results are presented to illustrate the influence of the thermal and electric conductance on the stress and electric displacement intensity factors.     

An Annular Crack in a Functionally Graded Piezoelectric Strip Under Thermoelectric Loadings

A thermoelectroelastic problem of a functionally graded piezoelectric material (FGPM) strip containing an annular crack is solved. It is assumed that the thermoelectroelastic properties of the strip vary continuously along the thickness of the strip, and that the strip is under the thermoelectric loadings. The crack faces are supposed to be insulated thermally and electrically. Using integral transform techniques, the problem is reduced to that of solving a singular integral equation and a system of singular integral equations. Numerical calculations are carried out, and the variations of the stress and electric displacement intensity factors are plotted against the geometric parameters for some values of the material non-homogeneity parameters.     

Green's function for infinite thin plate with elliptic hole under bending heat source and interaction between elliptic hole and crack under uniform bending heat flux

Green's function is derived for the bending problem of an infinite thin plate with an elliptic hole under a bending heat source. Then the interaction problem between an elliptic hole and a crack in a thin plate under uniform bending heat flux is analyzed. First, the complex variable method is developed for the thermoelastic problem of bending. Then an exact solution in explicit form is derived for the Green's function by using the complex variable method. Distributions of temperature moment, heat flux moments, bending moments along the hole edge are shown in figures. For solving the interaction problem, a solution for an infinite thin plate with an adiabatic elliptic hole under uniform bending heat flux, and two Green's functions of the plate under a bending heat source couple and a bending dislocation are given. The interaction problem then reduces into singular integral equations using the Green's functions and the principle of superposition. After the equations are solved numerically, the moment intensity factors at crack tips are presented in the figures.     

An Embedded Crack in a Graded Coating Bonded to a Homogeneous Substrate Under Thermo-Mechanical Loading

ABSTRACT

The problem of an embedded partially insulated crack in a graded coating bonded to a homogeneous substrate under thermal and mechanical loading is considered. The heat conduction and the plane elasticity equations are converted into singular integral equations which are solved to yield the temperature and the displacement fields in the medium as well as the crack tip stress intensity factors. A crack-closure algorithm is applied to avoid interpenetration. The main objective of the paper is to study the effect of the coating nonhomogeneity parameters, partial insulation of the crack surfaces and crack-closure on the crack tip stress intensity factors for the purpose of gaining better understanding of the thermo-mechanical behavior of graded coatings.     

THERMAL SHOCK FRACTURE IN A W-Cu DIVERTOR PLATE WITH A FUNCTIONALLY GRADED NONHOMOGENEOUS INTERFACE

The plane elasticity solution is presented in this article for the crack problem of a W-Cu divertor plate under thermal shock. The material is made of a graded layer with exponentially varying thermomechanical properties bonded between a homogeneous substrate and a homogeneous coating and is subjected to a cycle of heating and cooling on the coating surface of the material. The surface layer contains an embedded or a surface crack perpendicular to the boundaries. Using superposition the problem is reduced to a perturbation problem in which the crack surface tractions are only external forces. The dimensions, geometry, and loading conditions of the original problem are such that the perturbation problem may be approximated by a plane strain mode I crack problem for an infinite divertor plate. Fourier transforms are used to formulate the crack problem in terms of a singular integral equation. After giving some sample results regarding the distribution of thermal stresses, stress intensity factors for embedded and surface cracks are presented. Also included are the results for a crack/contact problem in a divertor plate that is under compression near and at the surface and tension in the interior region.     

MULTIPLE SURFACE CRACKING IN GLASS-FIBER-REINFORCED PLASTICS DUE TO A THERMAL SHOCK AT A LOW TEMPERATURE

We consider the transient thermal singular stress problem of multiple surface cracking in glass-fiber-reinforced plastics due to a thermal shock at a low temperature. The layered composite is made of a layer bonded between two layers of different physical properties, and it is suddenly cooled on the surfaces. The surface layers contain parallel arrays of the embedded or edge cracks perpendicular to the boundaries. The thermal and elastic properties of the material are dependent on the temperature. For the case of the crack that ends at the interface between orthotropic elastic materials, the order of stress singularity around the tip of the crack is obtained. Finite element calculations are carried out, and the transient thermal stress intensity factors are shown graphically.     

THERMAL STRESS IN AN ORTHOTROPIC PLATE CONTAINING A PAIR OF COPLANAR CENTRAL CRACKS

Abstract

The thermal stress problem for a pair of coplanar central cracks contained in an orthotropic plate is investigated using the techniques of Fourier transforms and finite Hilbert transforms. The crack surfaces are subjected to symmetrical thermal loadings. Exact expressions for the temperature field, the crack shapes, and the thermal stresses in the crack plane are obtained for the case of constant temperature. The opening-mode stress intensity factors at the inner and outer crack tips are also obtained in closed forms in terms of the material properties and the distance between the cracks. The properties of the stress intensity factors are shown to be different from the shear-mode stress intensity factors because of the disturbance of a uniform heat flow by a pair of central cracks.     

Transient thermal response of a functionally graded piezoelectric laminate with a crack normal to the bimaterial interface

In this article, the problem of a functionally graded piezoelectric material strip (FGPM strip) containing a crack perpendicular to the interface between the FGPM strip and a homogeneous layer is analyzed under transient thermal loading condition. The crack faces are supposed to be completely insulated. Material properties are assumed to be exponentially dependent on the distance from the interface. Using the Laplace and Fourier transforms, the thermoelectromechanical problem is reduced to a singular integral equation, which is solved numerically. The stress intensity factors of embedded and edge cracks are computed. The results for the crack contact problem are also included.