Design and Analysis of On-Chip ESD Protection Circuit with Very Low Input Capacitance for High-Precision Analog Applications

An ESD protection design is proposed to solve the ESD protection challenge to the analog pins for high-frequency or current-mode applications. By including an efficient power-rails clamp circuit into the analog I/O pin, the device dimension (W/L) of ESD clamp device connected to the I/O pad in the analog ESD protection circuit can be reduced to only 50/0.5 (m/m) in a 0.35-m silicided CMOS process, but it can sustain the human-body-model (machine-model) ESD level of up to 6 kV (400 V). With such a smaller device dimension, the input capacitance of this analog ESD protection circuit can be significantly reduced to only 1.0 pF (including the bond pad capacitance) for high-frequency applications. A design model to find the optimized layout dimensions and spacings on the input ESD clamp devices has been also developed to keep the total input capacitance almost constant (within 1% variation), even if the analog input signal has a dynamic range of 1 V.     

A New Approach to Realize Variable Gain Amplifiers

A new methodology to develop variable gain amplifiers is developed. The methodology is based on a feedback loop to generate the exponential characteristic, which is required for VGA circuits. The proposed idea is very suitable for applications that require very low power consumption, and as an application, a new current mode variable gain amplifier will be shown. The gain is adapted via a current signal ranges from –7.5 A to +6.5 A. Pspice simulations based on Mietec 0.5 m CMOS technology show that the gain can be varied over a range of 29.5 dB, with bandwidth of 3 MHz at maximum gain value. The circuit operates between ±1.5 V and consumes an average amount of power less than 495 W.     

RF CMOS Cells for Wireless Applications

There is increasing interest in the use of CMOS circuits for high frequency highly integrated wireless telecommunications systems. This paper presents the results of on-going work into the development of a cell library that includes many of the circuit elements required for the high frequency sub-systems of communications integrated circuits. The cell library studied included an RF control element, single ended Class A amplifier, RF isolator, and Gilbert cell mixer circuit topologies. Circuit design criteria and measurement results are presented. All cells were fabricated using standard 2.0, 1.2, and 0.8 m CMOS integrated circuit fabrication processes with no post-processing performed. The results indicate that 2.0 m CMOS can be used successfully up to approximately 250 MHz with 0.8 m cells useful up to approximately 1000 MHz.     

A 1.2 V Rail-to-Rail Analog CMOS Rank-Order Filter with k-WTA Capability

In this paper, we design a rank-order filter with k-WTA capability for 1.2 V supply voltage. The circuit can find a rank order among a set of input voltages by setting different binary signals. Moreover, without modifying the circuit, the k-WTA function can be easily configured. The circuit has been designed using a 0.5 m DPDM CMOS technology. Seven input voltages are used to verify the performance of the circuit. The results of HSPICE post-layout simulation show that the response time of the circuit is 10 s for each rank-order operation, the input dynamic range is rail-to-rail, and the resolution is 10 mV for 1.2 V supply voltage. An experimental chip has been fabricated, in which accuracy of the comparator is measured as 40 mV for low-voltage operation. The dynamic power dissipation of the chip is 550 W.     

1 V All-MOS ΣΔ A/D Converters in the Log-domain

This paper presents novel low-voltage all-MOS analog circuit techniques for the synthesis of oversampling A/D converters. The new approach exploits the possibilities of Log-domain processing by using the MOSFET in subthreshold operation. Based on this strategy, a complete set of very low-voltage (down to 1 V) low-power (below 100 W) all-MOS basic building blocks is proposed. The resulting analog circuit techniques allow the integration of A/D converters for low-frequency (below 100 KHz) applications in digital CMOS technologies. Examples are given for a standard 0.35 m VLSI process.     

A CMOS Offset Phase Locked Loop for a GSM Transmitter

This paper describes a CMOS offset phase locked loop (OPLL) for a global system for mobile communications (GSM) transmitter. The OPLL is a PLL with a down-conversion mixer in the feedback path and is used in the transmit (Tx) path as a frequency converter. It has a tracking bandpass filter characteristic in such a way that the OPLL can suppress the noise in the GSM receiving band (Tx noise) without a duplexer. When the loop bandwidth of the OPLL was 1.0 MHz, the Tx noise level of –163.5 dBc/Hz, the phase error of 0.66° rms, and the settling time of 40 s were achieved. The IC was implemented by using 0.35-m CMOS process. It takes 860 m×620 m of total chip area and consumes 17.6 mA with a 3.0 V power supply.     

An Analog Correlator for a WCDMA Receiver

A prototype analog correlator structure suitable for a WCDMA receiver was implemented. The advantages of this correlator are low power consumption compared to a digital correlator and small chip area. The target is to use such correlator as parallel correlators (fingers) of a RAKE receiver. The analog baseband correlator utilizes passive MOS-multipliers, a first-order low-pass continuous-time oversampling sigma–delta analog-to-digital converter and a second-order sinc type of decimation filter (for both I and Q input paths). The modulator sampling rate is twice the chip rate with oversampling ratios of 8–512 depending of the PN code length. The circuit was implemented in 0.8 m CMOS-technology with a supply voltage of 2.8 V. The layout size is 345 m×686 m and the current drain is approximately 370 A.     

Multi-Value Voltage-to-Voltage Converter Using a Multi-Stage Symmetrical Charge Pump for On-Chip EEPROM Programming

A fully integrated multi-stage symmetrical structure chargepump and its application to a multi-value voltage-to-voltage converterfor on-chip EEPROM programming are presented. The multi-valuevoltage-to-voltage converter is designed to offer two output voltages,power supply and triple power supply alternatively, which is neededfor a memory array. A dynamic analysis of the multi-stage symmetricalstructure charge pump and an optimization design in terms of circuitarea are also given. The circuit is implemented in a 1.2 CMOSprocess and the measurement results show that a voltage pulse as shortas 5 s with a rise time of 3 s is obtained. For a 5 V powersupply and with a resistive charge of 100 k, the programmingoutput voltage can reach as high as 11 V and output current forprogramming is over 110 A, which are high enough to program thememory cell.     

Low-Power Low-Voltage Class-AB Linear OTA for HF Filters with a Large Tuning Range

This letter presents a new low-voltage class-AB differential linear OTA. The proposed transconductor uses a novel scheme based on two cross-coupled class-AB pseudo-differential pairs biased by a Flipped Voltage Follower [1]. The transconductor has been designed using a 0.8 m CMOS technology to operate at 2 V supply voltage with only 260 W of quiescent power consumption. Simulation results show 90 MHz bandwidth with more than two decades of transconductance tuning range.     

Low-Voltage Low-Power Integrated Phase-Shifter as Resistive Sensor Transducer

In this paper, we present a CMOSlow-voltage low-power phase shiftertopology, to be used as an integratedresistive sensor interface for portableapplications. The circuit furnishes an outputsquare wave whose time delay and shift arelinear with the value of the sensorresistance. Shifter non-idealities havebeen also considered. The circuit can be alsotransformed into an oscillator by a simpleterminal connection. In this case, theoscillation frequency is inverselyproportional to the same resistance. The proposed topology has been designed andfabricated in CMOS Mietec 0.5 technologyand can operate at supply voltages lowerthan 3 V. The minimum operating supplyvoltage is 1.2 V, the power consumptionbeing only 1 W for the shifter. Thecircuit shows good insensitivity to both thesupply voltage and temperature variations,so it can be applied as an alternativetopology for portable-system integratedinterfaces for typical resistive sensors ofM range.     

Synthesis of Log-Domain Filters from First-Order Building Blocks

Log-domain filters are an important class of current-mode circuits having large-signal linearity and increased tuning range over voltage-mode filter circuits of similar complexity. In this paper we describe synthesis of a single-ended, first-order filter circuit from static and dynamic translinear circuit principles, and show how higher-order filters can be easily constructed from the first-order building block. We address additional issues related to low-frequency (audio-frequency) filter design and present results measured from test circuits and a complete 15-channel filterbank system fabricated in 2 m and 1.2 m BiCMOS processes.     

A 640 by 480 Pixels Readout Circuit for IR Imaging

A readout circuit for a 640 × 480 pixels FPA (focal plane array) has been successfully designed, fabricated and tested. The circuit solution is based on a per pixel source-follower direct injection (SFDI) pre-amplifier. Signal multiplexing is performed in both X and Y direction. The pixel size is 25 m × 25m. The chip is optimized for a QWIP (quantum well infrared photodetector) operating at a temperature of 70 K. The circuit has been realized in a standard 0.8 m CMOS process.     

CMOS Front-end Amplifier Dedicated to Monitor Very Low Amplitude Signal from Implantable Sensors

We describe in this paper a low-noise, low-power and low-voltage analog front-end amplifier dedicated to very low amplitude signal recording and processing applications. Our main focus is acquiring action potentials from peripheral nerves to recuperate lost functions in paralyzed patients. Low noise and low DC offset are realized using Chopper stabilization (CHS) technique. In addition, due to the use of a rail-to-rail input stage, low power supply (1.8 V) and wide common mode input range (0–1.8 V) are achieved also. It features a gain of 51 dB and a bandwidth of 4.5 kHz. The equivalent input noise is about 56 nV/ . The proposed preamplifier includes a matching clock generator, a 4th order continuous-time low-pass filter and an instrumentation amplifier. The proposed design has been implemented in 0.35 m double-poly n-well CMOS process with an active die area of 450 × 1150 m². The total data acquisition device consumes only 775 W.     

A 70-MHz Continuous-Time CMOS Band-Pass ΣΔ Modulator for GSM Receivers

A 70-MHz continuous-time CMOS band-pass modulator for GSM receivers is presented. Impulse-invariant-transformation is used to transform a discrete-time loop-filter transfer function into continuous-time. The continuous-time loop-filter is implemented using a transconductor-capacitor (G _m -C) filter. A latched-type comparator and a true-single-phase-clock (TSPC) D flip-flop are used as the quantizer of the modulator. Implemented in a MOSIS HP 0.5-m CMOS technology, the chip area is 857 m × 420 m, and the total power consumption is 39 mW. At a supply voltage of 2.5 V, the maximum SNDR is measured to be 42 dB, which corresponds to a resolution of 7 bits.     

A nonvolatile analog neural memory using floating-gate MOS transistors

Simple floating-gate transistors fabricated by a conventional double-polysilicon process show excellent programming and charge-retention characteristics. A five-transistor synapse cell achieves 8-bit resolution and at least 6-bit accuracy for analog neural computation. It occupies 67 m×73 m in a 2-m CMOS process and can retain charge accuracy for over 25 years.This research was partially supported by DARPA under Contracts MDA972-90-C-0037 and MDA972-88-C-0048 and by TRW, Inc.     

A Very Low Power Consumption, Low Noise Analog Readout Chip for Capacitive Detectors with a Power Supply of 3.3 V

An analog frontend block of a VLSI readout chip, dedicated to high spatial resolution X or beta ray imaging, using capacitive silicon detectors, is described. In the present prototype, an ENC noise of 343 electrons at 0 pF with a noise slope of 28 electrons/pF has been obtained for a peaking time of 10 s, a 37 mV/fC conversion gain, a 3.5 V power supply and a 150 W/channel power consumption.     

A CMOS Voltage Comparator with Rail-to-Rail Input-Range

A simple new continuous-time CMOS comparator circuit with rail-to-rail input common-mode range and rail-to-rail output is presented. This design uses parallel complementary decision paths to accommodate power-supply-valued inputs. The 2 decision results are combined at a current summing node, converted to a voltage, and buffered to drive voltage loads. The circuit has been realized in an area of 416 m×221 m in a MOSIS 2-micron CMOS technology. Average delay of about 63 ns has been measured at 3 V (1.3 mA), and about 89 ns at 5 V (1.1 mA).     

Design and Analysis of Built-In Testers for CMOS Switched-Current Circuits

This paper presents the design and analysis of a built-in tester circuit for MOS switched-current circuits used in low-voltage/low-power mixed-signal circuits/systems. The use of the tester can reduce the test length significantly. The developed tester is comprised of a current comparator, a voltage window comparator, and a digital latch. The current comparator is required to have high-accuracy, low-power consumption, simple structure with small chip area, and moderate speed. Results show that the developed current comparator circuit is developed with a small offset current, 0.1 nA, low power consumption, 20 W, and a layout area of 0.01 mm², where the circuit is simulated with the MOSIS SCN 2 m CMOS process parameters and 2 V supply voltage.     

Surface-Photovoltage Measurement of Volume Electron Lifetime in p-Si Wafers

The problem of estimating the volume lifetime _v of minority carriers in p-type Si wafers by surface-photovoltage measurements is addressed. An experiment is conducted in order to ascertain the relationship between measured and actual values of _v. The measurements are carried out on circular specimens whose thickness is reduced from about 2000 to 450 m by stepwise etching. The specimens are cut from a Czochralski-grown rod, their actual values of _v ranging from 10 to 300 s. The surface recombination rate of minority carriers is determined on both sides of the specimens covered with native oxide, the sides differing in surface finish. The results of the experiment allow one to determine _v up to about 400 s.