联苯四甲酸二酐异构体对聚酰亚胺性能的影响

采用4-PEPA(4-苯乙炔基苯酐)为封端剂,4,4′-ODA(4,4′-二氨基二苯醚)为胺源,通过控制s-BPDA(3,3′,4,4′-联苯四甲酸二酐)和α-BPDA(2,3,3′,4′-联苯四甲酸二酐)两种二酐单体的比例,合成了五种苯乙炔基封端的聚酰亚胺低聚物,对其化学结构、热性能及粘接性能进行了研究。研究结果表明:低聚物均具有较高的玻璃化转变温度(Tg),α-BPDA的引入减弱了分子链结晶倾向;当s-BPDA等时,常温剪切强度为15.3 MPa;而当两者用量比为67∶33时,高温剪切强度相对较高,同时保持了较好的耐热性能。     

BAMPM基高可溶高透光聚酰亚胺的制备及表征

将3,3',5,5'-四甲基-4,4'-二胺基苯基-4'-甲基甲苯(BAMPM)与均苯四甲酸二酐(PMDA)、联苯四甲酸二酐(BPDA)、联苯醚二酐(ODPA)、六氟二酐(6FDA)通过一步高温缩聚法制备了四种新型聚酰亚胺(PI)。所得聚酰亚胺在普通有机溶剂中具有优异的溶解性。聚酰亚胺的玻璃化转变温度(Tg)超过332℃,10%热失重温度为530～537℃。溶液浇铸法制备的聚酰亚胺薄膜具有高光学透明性,UV截止波长为312～366 nm,80%透过率波长为382～436 nm。该薄膜的拉伸强度为60.5～84.7 MPa,弹性模量为1.7～2.4 GPa,断裂伸长率为5.9%～10.2%。     

2L-FCCL用聚酰亚胺复合膜的制备与性能

采用2,2′-双[4-(4-氨基苯氧基)苯基]丙烷(BAPP)、4,4′-二氨基二苯醚(ODA)和3,3′,4,4′-二苯酮四酸二酐(BTDA)合成BAPP/ODA/BTDA型聚酰亚胺(PI)的前驱体聚酰胺酸(PAA)溶液,将该溶液涂覆于3,3′,4,4′-联苯四甲酸二酐(BPDA)/ODA型PI基膜上,通过去溶剂和热亚胺化制备PI复合膜,将复合膜的热塑面与铜箔复合,热压制得二层挠性覆铜板(2L-FCCL)。研究了BAPP/ODA/BTDA型PI、BPDA/ODA型PI、PI复合膜及2L-FCCL的性能。结果表明:BAPP/ODA/BTDA型PI薄膜的玻璃化转变温度为238℃,耐热性能优异,PI复合膜在280℃,15MPa下与铜箔层压50~60min制得的2F-FCCL剥离强度大于0.8N/mm,且经360℃焊锡浴测试未分层、未起泡,耐热性能和剥离强度均满足工业要求。     

3,3’,4,4’-联苯四甲酸二酐的合成

介绍了各种3,3’,4,4’-联苯四甲酸二酐的合成路线,包括4-氯(溴)-邻苯二甲酸(酐、酯、盐)的脱卤偶联法、邻苯二甲酸二甲酯的氧化偶联法、对苯二甲酰氯偶联法及其工艺特点,详细阐述了由钯催化对苯二甲酰氯与二硅烷直接一步反应制得3,3’,4.4’-联苯四甲酸二酐的方法,以及1,2-二氯四甲基二硅烷的主要制备方法,其中1,2-二氯四甲基二硅烷是合成3,3’,4,4’-联苯四甲酸二酐的重要试剂。     

干法纺丝聚(苯并咪唑-酰亚胺)纤维的制备及性能研究

以3,3',4,4'-联苯四甲酸二酐为二酐单体,对苯二胺和2-(4-氨基苯基)-5-氨基苯并咪唑为二胺单体,在非质子溶剂中合成前驱体聚酰胺酸,采用干法纺丝、热环化及热拉伸制备聚(苯并咪唑-酰亚胺)(简称聚酰亚胺)纤维(PI纤维),研究了不同拉伸倍数下的PI纤维的结构及性能。结果表明:PI纤维表面光滑致密,截面为肾形;随着拉伸倍数提高,PI纤维的取向度和力学性能提高;当拉伸倍数为6.35时,其取向因子为0.81,拉伸强度为2.31 GPa,拉伸模量达到117.0 GPa;随着拉伸倍数提高,PI纤维的玻璃化转变温度(T_g)逐渐降低,T_g为324~342℃;PI纤维在500℃以上开始热分解,具有良好的热稳定性能。     

基于间苯二甲胺单体的聚酰亚胺的合成与性能

以间苯二甲胺（MXDA）为二胺单体分别与五种芳香族二酐：4,4''-氧双邻苯二甲酸酐 （ODPA）、3,3'',4,4''-二苯甲酮四甲酸二酐（BTDA）、3,3'',4,4''-联苯四羧酸二酐（BPDA）、4,4''-（六氟异丙烯）二酞酸酐（6FDA）和4,4''-(4,4''-异亚丙基二苯氧基)双(邻苯二甲酸酐)（BPADA）在间甲酚中通过一步法合成了五种聚酰亚胺（PI）。采用FTIR、1HNMR分析了聚合物的分子结构，用DSC、TGA、UV-Vis等仪器研究了聚合物的性能。结果表明，所制备的PI特性黏数在0.36~1.44 dL/g，在酚类溶剂中均具有良好的溶解性；PI的玻璃化转变温度（Tg）在184~243 ℃之间，氮气气氛下5%热失重温度为485~538 ℃，热稳定性优异；PI薄膜在400 nm处的透过率为24%~85%，500 nm的透过率可达69%~88%，截止波长区间308~367 nm，具有良好的透明性；PI薄膜的拉伸强度、杨氏模量和断裂伸长率分别在41.1~85.3 MPa、1.7~2.1 GPa和2.5~8.7%的范围内，具有良好的机械性能。     

基于异构三苯二醚二酐的热塑性共聚酰亚胺的合成

以2,2′,3,3′–三苯二醚四甲酸二酐(3,3′–HQDPA)、3,3′,4,4′–三苯二醚四甲酸二酐(4,4′–HQDPA)为二酐单体,邻苯二甲酸酐为封端剂,与4,4′–二氨基二苯醚(4,4′–ODA)进行无规共聚。通过改变二酐的比例,用两步法制备了一系列热塑性共聚酰亚胺粉料,并对其热性能、溶解性能、熔体性能等进行了表征,与均聚酰亚胺进行了比较。结果表明,聚合物均具有良好的热稳定性,热分解5%的温度在空气中为500~521℃,在氮气中为507~538℃;随着3,3′–HQDPA含量的增加,玻璃化转变温度(Tg)由223℃升高至257℃,溶解性也逐渐提高。与均聚物相比,共聚物的熔体流动性有了显著地提高。可以通过调控异构二酐的比例来调控共聚酰亚胺的Tg、溶解性和熔体流动性,满足材料在不同应用上的要求,当二酐的比例为1∶1时,共聚酰亚胺的熔体流动性最好,可作为高性能、易加工的热塑性工程塑料使用。     

BPDA/ODA和PMDA/ODA共混聚酰亚胺薄膜

采用3,3′,4,4′-联苯四甲酸二酐/4,4′-二氨基二苯醚（BPDA/ODA）和1,2,4,5-均苯四甲酸二酐（PMDA）/ODA聚酰胺酸共混的方法制备了聚酰亚胺（PI）薄膜,研究了共混体系中共混比对薄膜的力学性能、动态力学性能、介电性能等的影响。用万能材料试验机、动态力学分析仪和阻抗分析仪研究了其力学性能、热性能和电性能与共混比例之间的关系。结果表明,这种共混PI薄膜可以保持良好的力学性能,特别是当选择了合适的共混比例时,PI薄膜的断裂伸长率会得到明显的提高,同时仍然保持其良好的耐热性能,介电损耗陡升温度在250 ℃以上,有望在240级以上漆包线的生产中得到广泛应用。     

以BAPP为原料的热塑性PI薄膜的合成及性能

以芳香长链二胺2,2-双[4-(4-氨基苯氧基)苯基]丙烷(BAPP)为二胺原料,与最具商业价值的四种酸酐均苯四甲酸二酐(PMDA)、3,3′,4,4′-联苯四酸二酐(BPDA)、3,3′,4,4′-二苯酮四酸二酐(BTDA)、3,3′,4．4′-二苯醚四酸二酐(ODPA)为二酸酐原料,采用二步溶液缩聚法制得了一系列均聚和共聚聚酰亚胺薄膜。利用FTIR表征了聚酰亚胺的结构,并用DSC、TOA、TMA DMA等手段测得了不同聚酰亚胺的Tg、5%与10%热失重温度、线膨胀系数、拉伸强度、断裂延伸率、热压粘接T型剥离强度等性能数据。     

含氰基聚酰亚胺的合成

通过对3,3′,4,4′-联苯四甲酸二酐(BPDA)进行酯化、溴代、氰基取代、水解以及脱水闭环系列反应,合成了侧链含氰基的新型对称二酐——2,2′-二氰基联苯四甲酸二酐,将其与4,4′-二氨基二苯醚(ODA)通过两步法制备了侧链含氰基的聚酰亚胺(PIDC).PIDC的结构与性能由傅里叶变换红外光谱仪、差示扫描量热仪和热重分析仪表征.结果表明:直接由BPDA和ODA通过两步法制备的聚酰亚胺在大多数有机溶剂中不溶,而室温下PIDC在极性非质子溶剂N-甲基吡咯烷酮、二甲基亚砜、N,N-二甲基甲酰胺、N,N-二甲基乙酰胺中溶解性能良好;氰基的引入使聚酰业胺的玻璃化转变温度由266℃增至303℃,氮气氛围下失重5％的温度提高至523℃.     

新型非对称聚酰亚胺的合成与性能研究

通过对4,4’-双(N-甲基联苯酰亚胺)的单硝化反应、亲核取代反应、水解反应和闭环脱水反应,成功合成了2-邻甲基苯氧基4,4’,5,5’-联苯四甲酸二酐。将这种新型非对称酸酐与4,4’-二氨基二苯醚和对苯二胺进行高温聚合反应制得了非对称聚酰亚胺。聚酰亚胺的特性黏度分别为0.55dL/g和0.89dL/g,它们在有机溶剂中的溶解性能较好,同时具有优良的热稳定性和热氧稳定性。     

Preparation and properties of novel fluorinated polyimides based on 2,2′,6,6′-tetrafluorobenzidine

Fluorinated polyimides were prepared from 2,2′,6,6′-tetrafluorobenzidine and four conventional dianhydride monomers by a solution polycondensation reaction followed by a chemical imidization. Polyimide based on 2,2′,6,6′-tetrafluorobenzidine and hexafluoroisopropylidene bis(3,4-phthalic anhydride) (6FDA) is soluble in organic solvents such as NMP, DMA, DMF, THF, chloroform, and acetone while those based on 2,2′,6,6′-tetrafluorobenzidine and pyromellitic dianhydride (PMDA), benzophenone-3,3′,4,4′-tetracarboxylic acid dianhydride (BTDA), diphenylether-3,3′,4,4′-tetracarboxylic acid dianhydride (ETDA) are not. Polyimide from 2,2′,6,6′-tetrafluorobenzidine and 6FDA possesses high optical transparency at 350–700 nm and has a in-plane refractive index of 1.558 at 632.8 nm. All polyimides exhibit glass transition temperatures above 350°C. They also possess very high thermal stability. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 70: 1605–1609, 1998     

Residual stress and mechanical properties of polyimide thin films

Four different structure polyimide thin films based on 1,4‐phenylene diamine (PDA) and 4,4′‐oxydianiline (ODA) were synthesized by using two different dianhydrides, pyromellitic dianhydride (PMDA) and 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), and their residual stress behavior and mechanical properties were investigated by using a thin film stress analyzer and nanoindentation method. The residual stress behavior and mechanical properties were correlated to the morphological structure in polyimide films. The morphological structure of polyimide thin films was characterized by X‐ray diffraction patterns and refractive indices. The residual stress was in the range of ?5 to 38 MPa and increased in the following order: PMDA‐PDA < BPDA‐PDA < PMDA‐ODA < BPDA‐ODA. The hardness of the polyimide films increased in the following order: PMDA‐ODA < BPDA‐ODA < PMDA‐PDA < BPDA‐PDA. The PDA‐based polyimide films showed relatively lower residual stress and higher hardness than the corresponding ODA‐based polyimide films. The in‐plane orientation and molecularly ordered phase were enhanced with the increasing order as follows: PMDA‐ODA < BPDA‐ODA < BPDA‐PDA ～ PMDA‐PDA. The PDA‐based polyimides, having a rigid structure, showed relatively better‐developed morphological structure than the corresponding ODA‐based polyimides. The residual stress behavior and mechanical properties were correlated to the morphological structure in polyimide films. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Synthesis and properties of polyimides derived from diamine monomer containing bi-benzimidazole unit

A new aromatic heterocyclic diamine monomer containing bi-benzimidazole unit, 2,2-bis(4′-aminophenyl)-5,5-bi-1H-benzimidazole, was synthesized from 2,2-bis(4′-nitrophenyl)-5,5-bi-1H-benzimidazole (BNPBBI) prepared via the reaction of 3,3′,4,4′-biphenyltetramine and p-nitrobenzaldehyde with a high yield. Their compositions and chemical structures containing polybenzimidazole backbone were characterized by FTIR, ¹H NMR and elemental analysis. A series of aromatic polyimides containing the heterocyclic moiety in the main chain were prepared by the reaction of BAPBBI with various aromatic dianhydrides of 3,3′,4,4′-biphenyltetracarboxylic dianhydride, 4,4′-oxydiphthalic anhydride or pyromellitic dianhydride. The polymers possess a high glass transition temperature of >415 °C and a good thermal stability up to 566 °C with a 5 % weight loss. The combination of polybenzimidazole and polyimide via introducing BAPBBI into the main chains provides the rigid structure, and macromolecular interactions are thus enhanced, resulting in the outstanding mechanical properties. These polyimides exhibit the strong tensile strength of 201 to 327 MPa, and the ultrahigh tensile moduli of 10.7 to 15.5 GPa without post stretching.     

High-strength–high-modulus polyimide fibers II. Spinning and properties of fibers

The polyimides based on 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA) described in Part I of this series were dissolved in p-chlorophenol and spun into fibers using a coagulating bath of ethanol. The fibers as spun had in general low tenacities and low moduli, but a heat treatment at 300–500°C under tension produced a remarkable increase in strength and modulus, and fibers with a tensile strength of 26 g/den (3.1 GPa) and an initial modulus higher than 1,000 g/den (120 GPa) could be obtained. Thus, the annealed fibers of polyimides are comparable to aramid fibers in mechanical properties. To heating in air and in the saturated steam, the polyimide fibers showed higher resistance than the aramid fibers. The polyimide fibers surpassed the aramid fibers in resistance to acid treatment and ultraviolet (UV) irradiation, but were inferior in resistance to alkali treatment. The annealed fibers of polyimides displayed distinct X-ray diffraction patterns. The chain repeat distance of 20.5 Å determined on the fibers of polyimide prepared from BPDA and o-tolidine, and 20.6 Å determined on the fibers of polyimide derived from BPDA and 3,4′-diaminodiphenyl ether are reasonable when the dimensions of monomeric units and the shapes of the molecular chains are considered. The X-ray reflections of both polyimide fibers were indexed satisfactorily on the basis of postulated unit cells.     

Preparation and Properties of Cyano-Containing Polyimide Films Based on 2,6-Bis(4-aminophenoxy)- benzonitrile

Summary A series of cyano-containing polyimides were synthesized from 2,6-bis(4-amino- phenoxy)benzonitrile and some aromatic dianhydride monomers by solution polycondensation. The poly(amic acid) films could be obtained by solution-cast from N-methyl-2-pyrrolidinone solutions and thermally converted into tough polyimide films. Structure and physical properties of thin films of those polyimides were measured by FTIR, TGA, dynamic mechanical analysis and LCR hitester et al. Results showed that the polyimides prepared from 2,6-bis(4-aminophenoxy)- benzonitrile and 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride or 4,4’-(hexafluoropropylidene)diphthalic anhydride exhibited more excellent energy-damping characteristic and excellent solubility in NMP, DMF, DMAc, DMSO, THF and CHCl₃, whereas the polyimides from 2,6-bis(4-aminophenoxy)benzonitrile and 3,3’,4,4’-biphenyltetracarboxylic dianhydride or Pyromellitic dianhydride were insoluble in polar and nonpolar organic solvents. All polyimides indicated higher glass transition temperatures, excellent thermal stability and tensile properties. Incorporating a nitrile group into the polyimide backbone would enhance the dielectric constant of the polyimide films.     

一类含甲基结构高透明聚酰亚胺的合成与性能研究

以2,6-二氨基甲苯、3,3'',4,4''-联苯四甲酸二酐、3,3'',4,4''-二苯醚四甲酸二酐为原料，间甲酚作为溶剂，经一步法高温共缩聚，制备一系列可溶性共聚型聚酰亚胺(MPI)。利用红外光谱（FTIR）、核磁共振波谱（1H NMR）、差式扫描量热仪（DSC）、热重分析仪（TGA）和紫外-可见光分度计（UV）等测试仪器对MPI进行结构与性能表征。结果表明：红外与核磁的数据说明成功合成了含甲基结构的聚酰亚胺；该系列的含甲基聚酰亚胺在室温下可溶于N-甲基吡咯烷酮（NMP）、N,N-二甲基乙酰胺（DMAc）、二氯甲烷（CH2Cl2）三氯甲烷（CHCl3）、二甲基亚砜（DMSO）等有机溶剂，具有良好的溶解性和成膜性，并随着联苯酐的含量增加溶解性降低；同时该系列MPI制得的薄膜具有良好的光学透过性能，在紫外光波长450 nm时的透过率均在74%以上，截止波长在350 nm左右；该系列MPI的起始分解温度均大于457 ℃，800 ℃氮气氛围中的焦炭产率均大于63%，玻璃化转变温度在260 ℃~285 ℃之间，表现出优异的热学性能。此外，MPI-1~MPI-4薄膜还具有良好的机械性能，其弹性模量在1.7~2.1 GPa，拉伸强度在89.7~120.6 MPa，断裂伸长率在19.7%~28.4%。     

Structure–property relationship of polyimide fibers containing ether groups

The copolyimide (co‐PI) fibers with outstanding mechanical properties were prepared by a two‐step wet‐spinning method, derived from the design of combining 4,4′‐oxydianiline (ODA) with the rigid 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA)/p‐phenylenediamine (p‐PDA) backbone. The mechanical properties of PI fibers were drastically improved with the optimum tensile strength of 2.53 GPa at a p‐PDA/ODA molar ratio of 5/5, which was approximately 3.7 times the tensile strength of BPDA/p‐PDA PI fibers. Two‐dimensional wide‐angle X‐ray diffraction indicated that the highly oriented structures were formed in the fibers. Two‐dimensional small‐angle X‐ray scattering revealed the existence of the needle‐shaped microvoids aligned parallel to the fiber axis, and the introduction of ODA led to the reduction in the size of the microvoids. As a result, the significantly improved mechanical properties of PI fibers were mainly attributed to the gradually formed homogeneous structures. The co‐PI fibers also exhibited excellent thermal stabilities of up to 563°C in nitrogen and 536°C in air for a 5% weight loss and glass transition temperatures above 279°C. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42474.     

Synthesis and properties of organosoluble polyimides based on 2,2′-diphenoxy-4,4′,5,5′-biphenyltetracarboxylic dianhydride

A novel method for the preparation of 2,2′-diphenoxy-4,4′,5,5′-biphenyltetracarboxylic dianhydride have been investigated. This new dianhydride contains flexible phenoxy side chain and a twist biphenyl moiety and it was synthesized by the nitration of an N-methyl protected 3,3′,4,4′-biphenyltetracarboxylic dianhydride and subsequent aromatic nucleophilic substitution with phenoxide. The overall yield was up to 75%. The dianhydride was polymerized with five different aromatic diamines to afford a series of aromatic polyimides. The polyimide properties such as inherent viscosity, solubility, UV transparency and thermaloxidative properties were investigated to illustrate the contribution of the introduction of phenoxy group at 2- and 2′-position of BPDA dianhydride. The resulting polyimides possessed excellent solubility in the fact that the polyimide containing rigid diamines such as 1,4-phenylenediamine and 4,4′-oxydianiline were soluble in various solvents such as N-methyl-2-pyrrolidone, N,N-dimethylacetamide, dimethyl sulfoxide and chloroform. The glass-transition temperatures of the polymers were in the range of 255-283 °C. These polymers exhibited good thermal stability with the temperatures at 5% weight loss range from 470 to 528 °C in nitrogen and 451 to 521 °C in air, respectively. The polyimide films were found to be transparent, flexible, and tough. The films had a tensile strength, elongation at break, and Young's modulus in the ranges 105-168 MPa, 15-51%, 1.87-2.38 GPa, respectively.     

Synthesis and characterization of polyamide-imides

A series of thermally stable, tough, linear polyimides containing amide linkages was prepared. The new polyamide-imides were synthesized by reacting a group of isomers of diaminobenzanilide (DABA) with various dianhydrides, such as 4,4′-oxydiphthalic anhydride (ODPA), 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), and 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride (6FDA). The resulting polyamide-acids were thermally or chemically converted to the polyamide-imide (PAI). Twelve polyimides were synthesized from unsubstituted and N-methyl substituted amide diamines and their properties were compared with previously made polyamide-imides and the polyimide LARC-TPI. These polyimides exhibited high inherent viscosities and glass transition temperatures. They were made into tough, flexible films of which some showed good thermal stability and resistance to organic solvents. Overall, the mechanical properties of the PAI films were comparable to those of LARC-TPI with the 4,4′-systems exhibiting exceptional properties and crystallinity. These materials have potential as high temperature films, coatings and fibers, as well as molding and laminating resins.