垂直晶界钢双晶体的循环形变行为

本文通过对取向近垂直晶界铜双晶体进行塑性应变控制循环变形,在表面滑移形貌及饱和位错组态观察的基础上,研究了其循环应力－应变响应．结果表明该铜双晶体循环应力－应变（CSS）曲线具有两个饱和轴向应力基本不变的平台区．即在塑性应变范围1．80×10-4－1．35×10-3对应于饱和应力幅62—64MPa及在塑性应变范围2．04×10-3—2．56×10-3对应于饱和应力幅70—71MPa．讨论了组元晶体的相对取向对其滑移形貌、饱和位错组态及CSS曲线的影响。     

垂直晶界铜双晶体的循环形变行为

本文通过对取向近垂直晶界铜双晶体进行塑性应变控制循环变形,在表面滑移形貌及饱和位错组态观察的基础上,研究了其循环应力－应变响应．结果表明该铜双晶体循环应力－应变（CSS）曲线具有两个饱和轴向应力基本不变的平台区．即在塑性应变范围1．80×10-4－1．35×10-3对应于饱和应力幅62—64MPa及在塑性应变范围2．04×10-3—2．56×10-3对应于饱和应力幅70—71MPa．讨论了组元晶体的相对取向对其滑移形貌、饱和位错组态及CSS曲线的影响。     

铜晶体的疲劳损伤微观机制

对Cu单晶体、双晶体和多晶体疲劳损伤微观机制的总结结果表明：在中、低应变范围Cu单晶体的疲劳裂纹主要沿驻留滑移带萌生,而在高应变范围则沿粗大形变带萌生;Cu双晶体中疲劳裂纹总是优先沿大角度晶界萌生和扩展,而小角度晶界则不萌生疲劳裂纹;对于Cu多晶体,疲劳裂纹主要沿大角度晶界萌生,有时也沿驻留滑移带萌生,而孪晶界面两侧由于滑移系具有相容的变形特征而未观察到疲劳裂纹萌生．     

纯铝双晶体交变形变损伤断裂过程中晶界的作用机制

从同一块纯名双晶体截取试样，分别垂直或平行于其晶界面进行对称拉压疲劳实验，结果表明，在这两种加载方式下，晶界在晶体交变形变损伤断裂过程中的作用及机制有明显区别，横向晶界在变形过程中形成明显的不均匀形变带及多层次的影响区，比较容易萌生裂纹，而纵向晶界变形极小，只发现沿主滑移带的变形及微裂纹形核。     

复杂应力状态下镍基单晶合金低周疲劳寿命预测模型

镍基单晶合金的低周疲劳（ＬＣＦ）晶体取向相关性和其弹塑性的晶体取向相关性有密切关系,基于所建晶体取向各向异性弹塑性晶体滑移模型,本文推导了复杂应力状态下镍基单晶合金低周疲劳寿命预测模型,结论为ＬＣＦ寿命与修正的滑移应变呈指数关系。在详细分析薄壁圆筒试样受拉－扭载荷下应力应变分布规律的基础上,利用不同拉－扭载茶下的低周疲劳寿命数据,对本文所提模型进行了成功的考核。     

Al双晶体的晶界疲劳效应SCIEI

通过Al双晶体疲劳试验,研究了晶界对循环变形和疲劳裂纹扩展的影响。实验结果表明,晶界疲劳效应集中体现于晶界影响区,表现为不相容塑性应变在该区内产生内应力,并由此可激发次级滑移,甚至产生晶界裂纹;在常幅循环应力下,随超Ⅰ阶段裂纹逐渐接近晶界,裂纹分叉、前沿碎裂,扩展速率降低,直至在晶界影响区中央达到一最小值。本文提出了晶界诱发裂纹顶端屏蔽机制,并以此解释了上述超Ⅰ阶段裂纹对微观组织敏感的扩展行为。     

镶嵌晶粒和晶界对铜双晶体循环变形行为的影响

比较了含镶嵌晶粒铜双晶体及其基体单晶体的循环变形行为,结果表明,双晶体的循环应力总是高于基体单晶体,结合表面滑移形成貌饱和位错组态,分别讨论了镶嵌晶粒和环绕晶界对双晶体循环变形行为的影响。     

垂直晶界和倾斜晶界Cu双晶的疲劳开裂行为及其机制

用扫描电镜（ＳＥＭ）研究了一种垂直晶界和两种倾斜晶界Ｃｕ双晶的疲劳开裂行为及其机制。这三种双晶组元晶体的取向均为「１３４」。结果表明,沿晶界的疲劳开裂是Ｃｕ双晶疲劳破坏的主要形式,但垂直晶界和倾斜晶界双晶疲劳裂纹萌生的机制有所不同。垂直晶界双晶沿晶疲劳裂纹主要由驻留滑移带撞击晶界面产生,而倾斜晶界双晶疲劳裂纹的萌生是由晶界两侧晶粒的滑移台阶而引起的应力集中所致。造成这种差别的原因同两种双晶的活动滑     

孪晶片层厚度对纳米孪晶Cu疲劳性能的影响

通过恒应力幅控制拉--拉疲劳实验, 比较了脉冲电解沉积制备的不同孪晶片层厚度纯Cu样品的疲劳寿命和疲劳耐久极限. 结果表明: 在应力疲劳下, 样品的疲劳寿命与疲劳耐久极限均随孪晶片层厚度的减小而提高. 疲劳样品的宏观表面变形形貌(SEM观察)和微观结构(TEM观察)表明:
当平均孪晶片层厚度为85 nm时, 材料的塑性形变由位错滑移和剪切带共同承担, 进而疲劳裂纹沿剪切带萌生; 而当平均孪晶片层厚度为32 nm时, 材料的塑性形变由位错--孪晶界交互作用主导, 从而导致疲劳裂纹沿孪晶界形成.     

计算机模拟晶界位向对双晶体循环形变行为的影响

在实验基础上,用晶体细观力学方法模拟研究了纯铝双晶体在应力轴与晶界面分别垂直或平行时的循环形变过程。计算显示,在这两种加载方式下晶界区微观应力应变分布均有显著的变化,而它们各自晶界区微观应力应变分布又有明显不同,这和实验发现晶界区的形变损伤比晶内其它区域更大,以及这两种加载方式下晶界及晶界区形变损伤有很大差异的结果是一致的。利用计算得到的瞬时滑移系开动及分布情形对有关实验观测结果进行分析,能够满意     

非同轴取向Cu三晶体及双晶体的循环形变行为比较

采用逐级增幅方式研究了Ｃｕ三晶及双晶试样的循环硬化及饱和行为。实验结果表明,对于组元晶粒为单滑移取向的倾斜晶界双晶试样,其循环应力应变曲线（ＣＳＳＣ）存在平台或准平台区域。而三晶试样的ＣＳＳＣ无平台区出现。表面滑移形貌观察表明。     

Effect of crystallographic orientation and grain boundary character on fatigue cracking behaviors of coaxial copper bicrystals

Four coaxial copper bicrystals were employed to study the slip morphologies and fatigue cracking behaviors during cyclic deformation. Three of them had high-angle grain boundaries (GBs) with nearly the same misorientation and one bicrystal had a twin boundary (TB). Different slip bands (SBs) operated near the GBs and TB, generating different dislocation arrangements, which are mainly determined by the crystallographic orientations of the component grains. The GBs suffered impingement or shear damage caused by slip difference from both sides. It is suggested that there is an energy increase in the interfaces between matrix and persistent slip bands (PSBs), GBs and TBs per cycle during cyclic deformation due to the accumulation of lattice defects, which would make the interface unstable. After a certain number of cycles, fatigue cracks initiated firstly at GBs for some bicrystals while fatigue cracking occurred preferentially at PSBs for the others. It is confirmed that the energy growth rate is an increasing function of the shear stress, strain amplitude and strain incompatibility, which results from slip differences on both sides of the interfaces. Interfaces with different energies and strain incompatibilities have different fatigue cracking resistance. It is found that GBs with defective and complex structure, and hence high interfacial energy accompanied by high modulus of the residual GB dislocation (GBD), are preferential sites for fatigue cracking, while the fatigue cracking appeared predominantly at PSBs when the modulus of the residual GBD is lower than that of a perfect dislocation with simple GB structure and low interfacial energy. The present model for the energy can predict well which kind of interface would form cracks preferentially during cyclic deformation in one coaxial bicrystal and which GB would need more cycles to initiate fatigue cracking between coaxial bicrystals with different GB characters.     

Cyclic deformation behavior of non-isoaxial copper tricrystals and bicrystals

The cyclic hardening and saturation behaviors of copper tricrystals and bicrystals were investigated in strain-controlled multiple step tests. The results show that, for the inclined grain boundary (GB) bicrystal with single slip components, the cyclic stress strain (CSS) curve exhibits a plateau or quasi-plateau region, while the CSS curve of tricrystals shows no plateau. Observations of surface morphologies indicated that owing to the strain incompatibility of three grains, at lower strain amplitude the triple junction (TJ) retards obviously the primary slip in grains and makes deformation near it smaller than that near the bicrystal GB, while at higher strain amplitude slip can be distributed near the TJ homogeneously. The probability of crack initiation at the same TJ is closely related to the loading direction. The saturation dislocation structures of tricrystal specimens under the strain amplitude of the last step were explored by the electron channeling contrast technique in SEM (ECC-SEM). Loop patches with persistent slip band (PSB) ladders embedded were found even in the TJ vicinity for all grains. Dislocation-free zones (DFZ) occurred in the vicinity of TJ and GB, and the difference in shapes between them is due to the difference in internal stress field. Misoriented cell structure and dislocation wall structure were found near the crack tip, and the formation of them is associated with the cooperative action of crack tip, GB, grain orientation and the applied strain amplitude.     

垂直晶界铜双晶的拉伸变形行为

利用数字图像相关法研究了垂直晶界铜双晶试样的拉伸变形行为,获得了拉伸过程中试样表面的全场变形分布。结果表明:试样整体变形呈"双颈缩"现象,试样表面的应变分布不均匀,晶界附近的应变水平低于晶粒内部的,试样总是在软取向的晶粒内首先发生塑性变形并断裂。借助扫描电镜(SEM)原位拉伸实验观察到在拉伸过程中滑移带不能穿过晶界。以上结果说明,铜双晶试样拉伸变形行为与组元晶粒的晶体取向和晶界的属性有关,软取向的晶粒更容易发生塑性变形,而大角度晶界在拉伸过程中具有强化效应,对晶粒的滑移变形有阻碍作用。     

循环变形铜单晶体的滞后回线形状变化与驻留滑移带的萌生

本文系统测量并总结了不同类型双滑移取向铜单体循环变形中滞后回线性形状参数ＶＨ随循环周次Ｎ的变化关系,结果表明,与单滑移晶体不同晶体取向双滑移晶体的滞后回线形状变化趋势有显著的影响,ＶＨ与驻留滑移带（ＰＳＢ）的形成有无明业对应关系与该取向单晶体的循环应力－应变（ＣＳＳ）曲线有无平台区或准平台区出现密切相关,ＶＨ随Ｎ的变化关系反映了晶体在循环变形中的微观组织结构的不同变化,通过ＶＨ确定了不同类型双滑移     

晶粒组元沿晶界旋转的铜双晶在循环变形中的滑移形貌与位错组态

对晶粒组元因晶体生长时沿晶界发生旋转的铜双晶体进行了恒定塑性应变幅下的循环形变研究,塑性应变幅为1.5X10-3通过扫描电子显微镜-电子通道衬度技术（SEM-ECC）对滑移形貌和位错组态的演化进行了观察,发现由于晶粒内部的几何效应使沿晶界的位错组态随着晶粒的旋转方向的变化也相应发生变化,逐渐表现为由滑移带与晶界的相互作用过渡到形变带与晶界的相互作用.形变带Ⅱ（DB Ⅱ）对于主滑移有着明显的阻碍作用.晶界无位错区（DFZ）伴随着形变带Ⅱ在晶界的出现而产生.胞状结构的形成是由于次滑移系的开动使形变带Ⅱ中的位错墙结构先破坏而后形成.     

等径弯曲通道制备的超细晶铜的疲劳性能

研究了等径弯曲通道(ECAP)变形后的超细晶T3铜在恒应力幅控制条件下的疲劳寿命和循环形变行为.通过扫描电镜观察了疲劳试样表面的滑移带,并利用电子背散射技术观察了疲劳前、后晶粒尺寸的变化.结果表明,超细晶T3铜具有较高的疲劳极限(σ-1=153 Mpa),是粗晶铜疲劳极限的2倍.在低周疲劳域内表现出疲劳软化,而在高周疲劳域内表现比较稳定的疲劳行为,甚至出现疲劳硬化.类似驻留滑移带(PSB)的剪切带与最后一次挤压的剪切面一致,剪切带的形成和晶界滑移是疲劳裂纹形核和疲劳断裂的主要原因.     

Cu双晶的循环形变行为与疲劳裂纹萌生：Ⅱ.疲劳裂纹萌生与早期扩展

用扫描电镜观察了受应变疲劳载荷作用的Ｃｕ双晶物的表面形貌，发现晶界是疲劳形变双晶是有利的裂纺萌生地点，在滑移带撞击晶界的地方，特别是在几条粗滑移带共同撞击晶界的地方观察到许多疲劳微裂纹；并且发现与平行晶界双晶相比，垂直晶界双晶有有利于疲劳裂纹沿晶界作早期扩展。