类金刚石薄膜对多孔硅发光的钝化作用

介绍了类金刚石薄膜对多孔硅发光的钝化作用.类金刚石薄膜隔绝了外界对多孔硅表面的影响,使硅氢键不易断裂,从而减少了非辐射复合中心,稳定了多孔硅的发光性能.通过在类金刚石薄膜中掺氮还可以进一步提高钝化效果,因为氮使多孔硅表面更多的悬空键被钝化形成Si-N键,从而提高了发光强度.     

钝化多孔硅的光致发光

选用含有胺基的正丁胺 (CH3CH2 CH2 CH2 - NH2 )作碳源 ,采用射频辉光放电法制备碳膜对多孔硅进行碳膜钝化 ,其光致发光谱和存放实验表明 :正丁胺对多孔硅进行钝化是一种十分有效的多孔硅后处理途径 .研究了钝化多孔硅的光致发光谱随钝化温度和钝化时间的变化关系 ,其结果显示 :通过调节钝化条件可实现钝化多孔硅最大的发光效率和所需要的发光颜色     

Rapid thermal oxidation of porous silicon for surface passivation

Rapid thermal oxidation with dry oxygen has been carried out on porous silicon (PS) films formed by electrochemical etching. The purpose of the paper was to investigate the surface passivation capability of the oxidized PS layers and to understand the oxidation mechanism. Rutherford back scattering (RBS) and X-ray photoemission spectroscopy (XPS) analyses confirmed the formation of a stoichiometric quasi-silicon dioxide. Besides, elastic recoil diffusion analysis (ERDA) demonstrated that a high concentration of hydrogen is still present in the PS film even after oxidation. RTO resulted in a good surface passivation effect at high temperature (>1000°C) as seen by internal quantum efficiency analysis. However, lifetime in bulk silicon is affected by the RTO process.     

制备及钝化条件对多孔硅发光性能的影响

研究了氧化电流密度对多孔硅（PS）PL谱的影响。结果表明，随着氧化电流密度增大，PS的微晶Si平均尺寸减小，且尺寸的微晶Si数量也减少，说明制备条件对钝化PS的发光有影响；PS经适当的高温氧化处理后，其PL谱会发生明显变化；选用含有胺基的正丁胺，采用射频辉光放电法对PS进行钝化处理，在一定程度上提高了PS的发射强度伴随发光峰值的较大蓝移；其钝化PS的荧光谱随钝化温度和钝化时间变化，说明钝化条件对钝化PS的发光有直接影响。由此，可以通过调节制备和钝化条件来获得最大的发光效率和所需要的发光颜色。     

Use of porous silicon antireflection coating in multicrystallinesilicon solar cell processing

The latest results on the use of porous silicon (PS) as an antireflection coating (ARC) in simplified processing for multicrystalline silicon solar cells are presented. The optimization of a PS selective emitter formation results in a 14.1% efficiency multicrystalline (5×5 cm²) Si cell with evaporated contacts processed without texturization, surface passivation, or additional ARC deposition. Specific attention is given to the implementation of a PS ARC into an industrially compatible screen-printed solar cell process. Both the chemical and electrochemical PS ARC formation method are used in different solar cell processes, as well as on different multicrystalline silicon materials. Efficiencies between 12.1 and 13.2% are achieved on large-area (up to 164 cm² ) commercial Si solar cells     

Effects of surface passivation in porous silicon as H2 gas sensor

This paper investigates the effects of surface passivation in porous silicon (PS) as a hydrogen gas sensor. Two types of sample have been prepared, one with typical HF anodizing solution and the other with the presence of peroxide (H₂O₂) in the solution. The Fourier transform infrared (FT-IR) measurements on the PS layer on the Si substrate showed that the typical PS surface is characterized by chemical species like Si–H and Si–O. Samples anodized with peroxide based (H₂O₂) solution showed a PS structure with higher porosity (～80%) and better surface passivation (higher concentration of Si–O and Si–H species) compared to those not treated with peroxide. Peroxide based PS sample fabricated as an H₂ gas sensor showed better electrical (I–V) sensitivity compared to those without peroxide, which has been associated with good surface passivation. Surface passivation in peroxide based PS is also maintained at higher temperatures (100 °C).     

用过氧化氢后处理多孔硅厚膜的一种新技术

提出使用过氧化氢后处理多孔硅厚膜.在乙醇、氢氟酸、过氧化氢溶液中,多孔硅样片做阴极施加电流密度为10mA/cm2,希望通过后处理增强多孔硅表面的稳定性、光滑度和机械强度.研究了厚度为20μm和70μm的多孔硅厚膜经过过氧化氢处理后的微结构.扫描电镜图显示经过过氧化氢处理后的多孔硅厚膜表面的光滑度有极大的提高,X光衍射光谱揭示经过过氧化氢后处理后多孔硅表面形成了一层氧化膜.     

O3有效钝化多孔硅的研究

开发了用O3氧化钝化多孔Si（PS）的实用工艺方法。O3的基本作用是对Si-Hx和Si悬挂键（DB）的充分氧化，经过随后158d贮存的老化实验，得到了表面Si—H，键完全被Si-O3膜和Si-烷基膜所替代并覆盖的PS，其光致发光（PL）强度达到稳定的增强，这归因于PS纳米晶粒的表面势垒高度的提高以及量子效率的提高。     

晶体硅太阳电池的双层结构钝化膜研究

针对目前基于p型硅片制备的单结太阳电池进一步提高表面钝化膜生产效率,利用氮化硅(SiNx)薄膜良好的钝化效果与价格低廉的二氧化钛(TiO2)膜,降低SiNx镀膜厚度减薄对少子寿命的影响。在单晶硅片表面先用PECVD法沉积SiNx薄膜,然后用热喷涂沉积TiO2薄膜。对比测试了热喷涂沉积TiO2薄膜前后电池的性能,结果表明在SiNx膜上增加TiO2膜层后少子寿命明显提高,这可能是TiO2膜结构内存在固定正电荷所致。这种双层结构封装后的太阳电池显示出了较好的光学与电学性能,对进一步改进太阳电池性能具有重要参考价值。     

High‐quality surface passivation of silicon solar cells in an industrial‐type inline plasma silicon nitride deposition system

We have studied the surface passivation of silicon by deposition of silicon nitride (SiN) in an industrial‐type inline plasma‐enhanced chemical vapor deposition (PECVD) reactor designed for the continuous coating of silicon solar cells with high throughput. An optimization study for the passivation of low‐resistivity p‐type silicon has been performed exploring the dependence of the film quality on key deposition parameters of the system. With the optimized films, excellent passivation properties have been obtained, both on undiffused p‐type silicon and on phosphorus‐diffused n⁺ emitters. Using a simple design, solar cells with conversion efficiencies above 20% have been fabricated to prove the efficacy of the inline PECVD SiN. The passivation properties of the films are on a par with those of high‐quality films prepared in small‐area laboratory PECVD reactors. Copyright © 2004 John Wiley & Sons, Ltd.     

Experimental testing of a random medium optical model of porous silicon for photovoltaic applications

We have developed a model for light propagation in porous silicon (PS) based on the theory of wave propagation in random media. The low porosity case is considered, with silicon being the host material assuming randomly distributed spherical voids as scattering particles. The specular and the diffuse part of the light could be determined and treated separately. The model is applied to the case in which porous silicon would be used as a diffuse back reflector in a thin‐film crystalline silicon solar cell realized in an ultrathin (1–3 μm) epitaxially grown Si layer on PS. Three layer structures (epi/PS/Si) have been fabricated by atmospheric pressure chemical vapor deposition (APCVD) of 150–1000 nm epitaxial silicon layers on silicon wafers of which 150–450 nm of the surface has been electrochemically etched. An excellent agreement is found between the experimentally measured reflection data in the 400–1000 nm wavelength range and those calculated using the proposed model. The values of the layer thickness agree, within a reasonable experimental error, with those obtained independently by cross sectional transmission electron microscopy (XTEM) analysis. This provides an experimental verification of the random medium approach to porous silicon in the low porosity case. The analysis shows that the epitaxial growth process has led to appreciable porosity decrease of an initially high porosity layer from about 60% to 20–30%. Copyright © 2001 John Wiley & Sons, Ltd.     

Textured silicon surface passivation by high‐rate expanding thermal plasma deposited SiN and thermal SiO2/SiN stacks for crystalline silicon solar cells

Expanding thermal plasma (ETP) deposited silicon nitride (SiN) with optical properties suited for the use as antireflection coating (ARC) on silicon solar cells has been used as passivation layer on textured monocrystalline silicon wafers. The surface passivation behavior of these high‐rate (>5 nm/s) deposited SiN films has been investigated for single layer passivation schemes and for thermal SiO₂/SiN stack systems before and after a thermal treatment that is normally used for contact‐firing. It is shown that as‐deposited ETP SiN used as a single passivation layer almost matches the performance of a thermal oxide. Furthermore, the SiN passivation behavior improves after a contact‐firing step, while the thermal oxide passivation degrades which makes ETP SiN a better alternative for single passivation layer schemes in combination with a contact‐firing step. Moreover, using the ETP SiN as a part of a thermal SiO₂/SiN stack proves to be the best alternative by realizing very low dark saturation current densities of <20 fA/cm² on textured solar‐grade FZ silicon wafers and this is further improved to <10 fA/cm² after the anneal step. Optical and electrical film characterizations have also been carried out on these SiN layers in order to study the behavior of the SiN before and after the thermal treatment. Copyright © 2008 John Wiley & Sons, Ltd.     

Physical structure of light-emitting porous polycrystalline silicon thin films

This paper reports the surface electronic structure of light-emitting porous polycrystalline silicon (PPS) using X-ray photoelectron spectroscopy (XPS). We find that the PPS films with strong photoluminescence (PL) effect can only be observed in thin film with trace amount of silicon nanoclusters and the luminescence can be enhanced remarkably with proper passivation of the PPS surface. Incomplete oxidation of silicon (Si³⁺ or Si²⁺) does not lead to visible PL. We further estimate that the average size of silicon nanoclusters is in the range of 20–30 Å in the sample having PL emission.     

Effect of annealing on photoluminescence of passivated porous silicon

Photoluminescence (PL) of annealed porous silicon (PS) without and with nitrogen passivation has been investigated. The un-nitridated PS emits intense blue and green light, while that with passivation, emits only blue light and its intensity increases obviously. It is found that the PL intensity of the nitrified PS decreases with increasing temperature from 300 °C to 700 °C, but increases drastically after annealing at 800 °C and 900 °C, which might be due to the formation of Si–N bonds that passivates the non-radiative centers (Si dangling bonds) on the surface of PS samples. However, the intensity of the un-nitridated PS decreases continuously with increasing temperature from 300 °C to 900 °C, which might be due to desorption of hydrogen.     

Photoluminescence enhancement of porous silicon prepared with ammonium sulfide pre-treated silicon

As-grown porous silicon prepared with ammonium sulfide pre-treated silicon show stable photoluminescence characteristics due to high Si–N/PS interface quality and less damage PS with Si–N passivation. After aging in air for 6 months, it shows much stronger photoluminescence intensity and stable wavelength due to higher Si–ON/PS interface quality and less damage of PS with Si–O–N passivation from the oxidation of Si–N.     

Effects of DC power on the properties of DLC coatings on the OPC drum

Diamond-like carbon (DLC) films were deposited on the organic photoconductor (OPC) drum of the laser printer using the dc-remote plasma enhancement chemical vapor deposition (RPECVD) method. Only methane (CH₄) was used as a source gas for DLC coating. The transmittance of the DLC coatings is over 90% and the hardness of the DLC film (130 nm thick) coated OPC drum is higher than 1,000 H_v. Effects of dc-power on the physical properties of the DLC film and the electrophotographic properties of the DLC coated OPC drum were investigated. The hardness and the deposition rate of the DLC film deposited on the OPC drum increased but the transmittance and the surface roughness nearly did not change with increasing the dc power of the dc-RPECVD. The residual potential, the acceptance voltage, and the dark decay rate significantly increase but the photodischarge rate decreases with increasing the dc power of the RPECVD. The optimum dc power is 8.6 kW (950 V, 6A). The friction coefficient of the OPC drum is also lowered by DLC coating. In addition, it was found that the DLC deposition rate could be doubled by imposing magnetic fields around the cathode.     

双槽电化学腐蚀法制备多孔硅的孔隙率研究

采用双槽电化学腐蚀法制备多孔硅,主要研究了腐蚀条件及硅基体掺杂浓度对多孔硅孔隙率的影响,并且结合原子力显微镜(AFM)、扫描电子显微镜(SEM)技术对所制备的多孔硅的表面形貌和断面形貌进行了分析表征。研究发现,通过合理的选择工艺参数,可以制备具有特定孔隙率的多孔硅薄膜,可广泛的应用于微电子机械系统(MEMS)技术中。     

Evaluation of the influence of an embedded porous silicon layer on the bulk lifetime of epitaxial layers and the interface recombination at the epitaxial layer/porous silicon interface

Porous silicon plays an important role in the concept of wafer‐equivalent epitaxial thin‐film solar cells. Although porous silicon is beneficial in terms of long‐wavelength optical confinement and gettering of metals, it could adversely affect the quality of the epitaxial silicon layer grown on top of it by introducing additional crystal defects such as stacking faults and dislocations. Furthermore, the epitaxial layer/porous silicon interface is highly recombinative because it has a large internal surface area that is not accessible for passivation. In this work, photoluminescence is used to extract the bulk lifetime of boron‐doped (10¹⁶/cm³) epitaxial layers grown on reorganised porous silicon as well as on pristine mono‐crystalline, Czochralski, p⁺ silicon. Surprisingly, the bulk lifetime of epitaxial layers on top of reorganised porous silicon is found to be higher (~100–115 µs) than that of layers on top of bare p⁺ substrate (32–50 µs). It is believed that proper surface closure prior to epitaxial growth and metal gettering effects of porous silicon play a role in ensuring a higher lifetime. Furthermore, the epitaxial layer/porous silicon interface was found to be ~250 times more recombinative than an epitaxial layer/p⁺ substrate interface (S ≅ 10³ cm/s). However, the inclusion of an epitaxially grown back surface field on top of the porous silicon effectively shields minority carriers from this highly recombinative interface. Copyright © 2013 John Wiley & Sons, Ltd.     

非晶硅薄膜的基本性质及其在台面型硅器件上的钝化作用

利用非晶硅薄膜的半绝缘特性将它作为硅器件,尤其是台面型硅器件的钝化保护膜,经过长达两年的实验和生产上的试用,证实了它具有特殊的优点.α-Si:H薄膜中的氢能直接填补c-Si界面上的缺陷态,降低界面态密度,使器件反向漏电流大大下降,从而改善了硅器件的稳定性,提高了可靠性与成品率,具有明显的经济效益     

The application of polyimide/silicon nitride dual passivation to AlxGa1−xN/GaN high electron mobility transistors

PECVD silicon nitride passivation is quite frequently done at the end of AlGaN/GaN HEMT fabrication before substrate back-side lapping. However, the PECVD silicon nitride process is likely to produce pinholes in the passivation film. A very thick PECVD silicon nitride film may produce mechanical stress on the underlying device. Polyimide passivation has also been known to be effective for AlGaN/GaN HEMT and it can also serve as a stress buffer. However, polyimide can take up water while PECVD silicon nitride is a good diffusion barrier for water, etc. Thus it is expected that a dual PECVD silicon nitride/polyimide passivation will be a better choice than just a single layer of PECVD silicon nitride or polyimide. In this paper, we will demonstrate the application of a dual PECVD silicon nitride/polyimide passivation to AlGaN/GaN HEMT process.