Resin micromachining by roller hot embossing

The roller hot embossing is an efficient process of manufacture in which patterns are continuously transcribed on film, etc. Recently, the application of the embossing roll to the manufacturing processes of micro parts is paid attention. In this paper, we examined the development of the embossing roll with patterns of micron level and we tried to make the embossing roll mold by using the LIGA process. In this study, instead of producing embossing patterns directly on the roll surface, we fabricated a flexible thin mold with micro-patterns, which was then wrapped onto a cylinder to form an embossing roll, and tested the soft-mold roller hot embossing method. First, by optimizing UV exposure conditions of UV lithography, we prepared a resist pattern of numerous dots with a diameter of 10 μm, a sag height of 8 μm and a pitch of 20 μm. By Ni-electroforming this pattern, a 50 μm-thick thin mold was successfully fabricated. The 50 μm-thick mold was then wrapped onto a cylinder to form an embossing roll. In the roller hot embossing process, the 10 μm-diameter dot shape was successfully replicated on PET sheets.     

Low cost method for hot embossing of microstructures on PMMA by SU-8 masters

Polymer based microfabrication technologies are used extremely in Bio-MEMS, especially in Microfluidic devices in recent years. In this paper, a novel method for fabrication of microstructures on a polymeric material using hot embossing lithography process is presented. The proposed method involves usage of low cost materials and procedure with respect to previous methods and can be processed in a short time. The master is made from SU-8 on an inexpensive glass substrate which is patterned by standard lithography. The embossing pressure can be increased in our master as the glass substrate used in this paper is more robust than Silicon. Master robustness and SU-8 to glass adhesion is optimized by some substrate pretreatments and SU-8 baking time and temperatures. Microchannels are replicated on a Polymethylmetacrylate (PMMA) stamp which is a plexiglass sheet with thickness of 1 mm. Significant embossing parameters including temperature, pressure and time are discussed and optimum values are determined. Microchannels are imprinted by depth of 50 μm and minimum width of 15 μm and aspect ratio more than 3. The microchannels are sealed by a PMMA cap using thermal annealing bonding.     

Micromachining of electroformed nickel mold using thick photoresist microstructure for imprint technology

In order to fabricate polymer-based microstructures with feature sizes on the order of micrometers, we have been developing a microimprint technology with a fine nickel (Ni) mold instead of a conventional photolithography technique. The Ni mold was successfully fabricated by electroforming using a positive thick photoresist microstructure patterned on a silicon substrate as a replication master. The photoresist microstructure with excellent edge quality can be obtained under irradiation with single wavelength (g line) selected from a high-pressure mercury lamp. In addition, its sidewall angle in the range of 65° to 84° can be controlled precisely by varying the distance between a photomask and a photoresist surface. On the structured photoresist master, Ni was electroplated up to a thickness of about 110 μm, and then removed from the master. In this process, two-step electroplating at different current densities was carried out in order to prevent deformation of the photoresist master due to stress generated in a Ni electrodeposit. With the Ni mold, fine patterns with a width of 10 or 30 μm and a depth of 24 μm were almost completely transferred to polymetric materials (PMMA). The geometrical dimensions of the fabricated PMMA microstructures were found to be only about 10% reduction against the Ni mold.     

Two-axis micro fluxgate sensor on single chip

We present a two-axis micro fluxgate sensor on single chip for electronic compassing function. To measure X- and Y-axis magnetic fields, functional two fluxgate sensors were perpendicularly aligned and connected each other. The fluxgate sensor was composed of square-ring shaped magnetic core and solenoid excitation and pick-up coils. The solenoid coils and magnetic core were separated by benzocyclobutane which had high insulation and good planarization characters. Copper coil patterns of 10 μm width and 6 μm thickness were electroplated on Ti (300 Å)/Cu (1,500 Å) seed layers. 3 μm thick Ni_0.8Fe_0.2 (permalloy) film for the magnetic core was also electroplated under 2,000 gauss. Excellent linear response over the range of ?100 μT to +100 μT was obtained with the sensitivity of ～280 V/T. Actual chip size was 3.1×3.1 mm². The sine and cosine signals of two-axis fluxgate sensor had a good function of azimuth compass.     

2-DOF vibratory gyroscope fabricated by SU-8 based UV-LIGA process

This paper reports fabrication of 2-DOF vibratory gyroscope using SU-8 based UV-LIGA process. The device structure is designed to be symmetrical in order to match the resonance frequencies of drive and sense mode oscillators and also to minimize their relative temperature dependent drift. The overall arrangement is such that the two vibration modes do not affect each other and therefore, mechanical decoupling is achieved which helps in minimizing bias drift. The design is optimized to be compatible with the UV-LIGA process having 10 μm thick electroformed nickel as structural layer. Photolithography to create 11 μm thick SU-8 molds for electroforming sacrificial copper and structural nickel layer is optimized using multiple exposure technique that ensures near vertical side walls. Since the highly cross-linked SU-8 remaining after development is difficult to remove reliably from high aspect ratio structures without damage or alteration to the electroformed metals, a 2.45 GHz MW plasma etching process is developed with CF₄/O₂ mixes. The fabricated device is checked for off-plane misalignment between the stationary and movable comb fingers using white light interferometry and it is found to be almost negligible. Also, the prototype device is characterized for amplitude and phase spectral responses using Polytec MSA-500 Micro System Analyzer. The drive and sense mode resonance frequencies are observed at 7.3 and 7.1 kHz respectively against the mode matched designed frequency of 7.5 kHz.     

Resist-less patterning on SiO2 by combination of X-ray exposure and vapor HF etching

We succeeded in a resist-less patterning of SiO₂/Si substrates by a combination of X-ray exposure and vapor hydrogen fluoride (HF) etching. A 2 μm thick SiO₂ layer was formed on a Si substrate by employing a thermal oxidation process. An X-ray mask consisted of a 1 μm thick Ta absorber on a 2 μm thick Si₃N₄ membrane mounted on a 1 mm thick Si frame, and a honeycomb pattern where 640 nm diameter circle dots arranged in the corners of a hexagon with a pitch of 960 nm was processed. X-ray exposure experiments were carried out on a beamline BL-4 with a peak photon energy of 2 keV at the TERAS synchrotron radiation (SR) facility. When a dose energy was 750 mAh, the transfer of the patterns was confirmed, although irradiations with different dose energy were also conducted. Moreover, heating temperatures and total etching times of SiO₂/Si substrates in vapor HF etching were changed, and the shapes of etched patterns were observed by scanning electron microscope. It was learnt that an appropriate etching time existed between 30 and 60 min. Moreover, we observed discoloration of irradiated area by SR; and this seemed to be caused by changes in the etching rate of SiO₂/Si substrates that led to the development of resist-less patterning technique.     

Using silicon molds for ultrasonic embossing on Polymethyl Methacrylate (PMMA) substrates

This paper presents ultrasonic embossing using silicon molds to replicate microstructures on Polymethyl Methacrylate (PMMA) substrates. The pattern of the silicon mold consists of micro grooves with different sizes. The molds were fabricated by wet etching, and both concave and convex types were fabricated. The effects of the processing parameters on replication quality, including average microstructure depth, uniformity and the location-related replication depth were investigated via orthogonal experiments. The results show that the ultrasonic amplitude is the most important parameter for replication depth. The ultrasonic time benefits the accumulation of the heat, so it also influences replication depth. As for ultrasonic force, it has less influence on replication depth but significant influence on replication uniformity. The width of the grooves of the high density patterning molds ranged from 10 to 30 μm, and the center distance between the two microstructures from 20 to 50 μm in our experiments. The concave molds were intended to reach higher replication depth than that of convex molds with the same micro grooves. The average replication depth reached 98 %, and the uniformity on one chip reached 99 % with an area of 11 × 11 mm. All experiments were finished in 60 s, which is more efficient than the hot embossing technique, thus this paper provides a potential method for medium-sized bulk production and rapid fabrication for polymer microcomponents.     

Mechanism design with rotational and positioning calibrations for double-sided structure replication

This study is designing a mechanism with functions of rotational and positioning calibrations. This mechanism was applied to a hot embossing mold used for replications of double-sided structure. The hot embossed product was measured for double sided structures. The rotational and positioning alignment errors for both sides were measured by using a microscope. According to the results, the errors were calibrated wit this mechanism. The positioning and rotational resolutions of this mechanism are 40 μm and 0.5°, respectively. The results show that the mechanism has acceptable calibration accuracy. The average calibration accuracy for X-axis, Y-axis and C-axis were 92.5, 91.75 and 98.67 %, respectively. The small errors were induced by the large temperature difference between upper die and lower die during rapid cooling of a hot embossing process.     

A combinative technique to fabricate hot embossing master for PMMA tunneling sensors

A combinative approach of anisotropic bulk etching and modified plasma etching has been successfully employed in a single wafer to fabricate silicon masters for the hot embossing process. The masters hold both pyramid pits and positive profile sidewalls with smooth surfaces and steep angles. The SiO₂ layer is utilized as a etching mask with the aid of photoresist in three steps of photolithography patterning. The first polymethyl-methacrylate (PMMA)-based tunneling transducer with polymer membrane structures is fabricated by hot embossing replication with the silicon master. Consequently, the exponential relations between tunneling currents and applied deflection voltages are also reported.This work is partially supported by grants NSF/LEQSF (2001–04)-RII-02, DARPA DAAD19–02–1-0338, and NASA (2002)-Stennis-22.     

Fabrication of cone-like microstructure using UV LIGA-like for light guide plate application

The microlens array is usually formed by thermal reflow of polymer disks and can be one microstructure of the light guide plate (LGP). Here, we propose an ultraviolet (UV) backside exposure technology to fabricate the photoresist cone-like microstructure on the PMMA substrate at room temperature and then use UV LIGA-like process to transfer the microstructure for the application of 3.6 in. (72 mm × 57.5 mm) LGP. The electroforming was used to transfer UV master mold to the inverse cone-like microstructure of nickel metal mold and then hot embossing was used for one more pattern transfer to the same cone-like microstructure on PMMA substrate. The optical microscope and alpha-stepper profiler were used to examine the morphology and profile of LGP microstructure. The optical luminance and uniformity of LGP were measured using BM9 luminance meter in comparison with commercial product. The light uniformity and luminance of the cone-like LGP microstructure reach 75–80% and 2,800–3,000 cd/cm², respectively which meet the requirements of commercial LGP.     

Development and characterization of a microthermoelectric generator with plated copper/constantan thermocouples

This work reports the development and the characterization of a microthermoelectric generator (μTEG) based on planar technology using electrochemically deposited constantan and copper thermocouples on a micro machined silicon substrate with a SiO₂/Si₃N₄/SiO₂ thermally insulating membrane to create a thermal gradient. The μTEG has been designed and optimized by finite element simulation in order to exploit the different thermal conductivity of silicon and membrane in order to obtain the maximum temperature difference on the planar surface between the hot and cold junctions of the thermocouples. The temperature difference was dependent on the nitrogen (N₂) flow velocity applied to the upper part of the device. The fabricated thermoelectric generator presented maximum output voltage and power of 118 mV/cm² and of 1.1 μW/cm², respectively, for a device with 180 thermocouples, 3 kΩ of internal resistance, and under a N₂ flow velocity of 6 m/s. The maximum efficiency (performance) was 2 × 10^?3 μW/cm² K².     

Hot embossing of polymer nanochannels using PMMA moulds

A novel hot embossing method is developed to fabricate polymer nanochannels. The pattern on the silicon nanomould is transferred to polymethylmethacrylate (PMMA) plates, and then polyethylene terephthalate (PET) nanochannels are embossed by using the PMMA mould. The use of the PMMA intermediate mould can extremely increase the device yield of the expensive silicon nanomould. To avoid the use of nanolithography, a method based on UV-lithography techniques for fabricating silicon nanomoulds with sub-micrometer width was put forward. 1 PMMA mould can be used to repeatedly emboss at least 30 PET substrates without damage and obvious deformation. Good pattern fidelity of PET nanochannels was obtained at the optimized embossing temperature of 90 °C. For an 808 nm-wide and 195 nm-deep nanochannel, the variations in width and depth between PET nanochannels and PMMA moulds were 1.8 and 2.5 %, respectively. The reproducibility was also evaluated, and the relative standard deviations in width and depth of 5 PET nanochannels were 5.1 and 7.3 %, respectively.     

A polymer-metal hybrid flexible mould and application for large area hot roller embossing

In this paper, we report a novel approach to fabricate a low cost, large area and flexible mould and its applications in large area roller embossing. A liquid crystal polymer (LCP) film, which had a high glass transition temperature of 280°C, was clad with copper foils on both sides, was used as a starting material for mould fabrication. The LCP film and the copper foils were 50 and 36 μm thick, respectively. The LCP-Cu flexible mould was obtained through photolithographic patterning and wet etching of the copper foil on top surface of the LCP film. Using this proposed method, a polymer-metal hybrid flexible mould with an area of 150 mm × 150 mm was fabricated. The fabricated mould has a minimum feature size of 25 μm, and has been successfully used to demonstrate large area micro roller embossing. Micro channels, micro dots and micro mixers were embossed on polymeric as well as ceramic green substrates.     

Nickel stamp fabrication and hot embossing for mass-production of micro/nano combined structures using anodic aluminum oxide

Recently, “micro/nano combined structure” has attracted many researchers’ attentions due to its high potential in various research fields and applications such as biomimetics, tissue engineering, micro systems for biochemical analysis and so forth. The present paper proposes a simple and promising method for mass-production of the micro/nano combined structure, in particular, nano dimple array with micro structures with cost-effective procedures. Three major procedures of (a) master template fabrication; (b) nickel electroforming onto the master template; (c) replication by hot embossing process, are employed: the master template is fabricated by utilizing an anodic aluminium oxide (AAO) process and UV lithography technique; nickel stamp is then obtained by means of electroforming onto the master template; finally, micro/nano combined structures are moulded on a polymethyl methacrylate (PMMA) substrate using the nickel stamp via hot embossing. So replicated micro/nano combined structures turns out to be quite successful according to experimental observation via scanning electron microscope (SEM) and atomic force microscope (AFM).     

Submicron-scale surface acoustic wave resonators fabricated by high aspect ratio X-ray lithography and aluminum lift-off

A submicron-scale surface acoustic wave (SAW) resonator fabricated by high-aspect-ratio X-ray lithography (XRL) and metal lift-off that operates at microwave frequencies is presented. We demonstrate that XRL is especially well suited for SAW device templating, as long submicron-scale interdigitated transducer structures can be batch patterned with excellent structure quality. 0.4–2.0 μm thick PMMA layers were structured by X-ray lithography shadow projection using silicon nitride-based X-ray masks. Structures with a critical lateral feature size of down to 200–700 nm were processed. The polymer structures served as templates in a subsequent aluminum lift-off process. The metal electrodes were successfully tested as SAW resonators for high frequency applications, e.g. around 1.3 GHz, using calibrated 1-port RF wafer probing measurements. Compared with standard fabrication techniques, the high structure quality of submicron-scale polymer templates made of unusually thick PMMA layers offers additional possibilities to fabricate thicker metal transducers.     

Studies of polymer deformation and recovery in micro hot embossing

In large areas of micro hot embossing, process temperature plays a critical role to both the local-area fidelity and global uniformity of microstructure formation. Higher embossing temperature could improve structure fidelity, however, at the expense of demoulding easiness. Micro embossing at the lowest possible temperature with acceptable fidelity can improve global flatness after demoulding. This study focuses on polymer deformation and recovery in micro embossing when the process temperature is below the polymer glass transition temperature (Tg). PMMA (Polymethyl Methacrylate) substrates (Tg = 105°C) were employed with the process temperature ranging from 25°C to its Tg. At temperature below Tg −55°C, significant recovery occurred after processing, but permanent structures could still be formed with sufficiently high applied stress. With an increase in temperature, plastic deformation increased and was the dominant polymer deformation mode for permanent cavities formation. However, the formation of protrusive structures was not complete since there was little polymer flow. The polymer will lose its storage modulus at an even higher temperature and microstructures could be formed with high fidelity. A compromise between local fidelity of embossed patterns and global flatness of substrate has to be reached in micro hot embossing.     

Driving characteristics of the electrowetting-on-dielectric device using atomic-layer-deposited aluminum oxide as the dielectric

Electrowetting on dielectric (EWOD) is useful in manipulating droplets for digital (droplet-based) microfluidics, but its high driving voltage over several tens of volts has been a barrier to overcome. This article presents the characteristics of EWOD device with aluminum oxide (Al₂O₃, ε _r  ≈ 10) deposited by atomic layer deposition (ALD), for the first time as the high-k dielectric for lowering the EWOD driving voltage substantially. The EWOD device of the single-plate configuration was fabricated by several steps for the control electrode array of 1 mm × 1 mm squares with 50 μm space, the dielectric layer of 1,270 Å thick ALD Al₂O₃, the reference electrode of 20 μm wide line electrode, and the hydrophobic surface treatment by Teflon-AF coating, respectively. We observed the movement of a 2 μl water droplet in an air environment, applying a voltage between one of the control electrodes and the reference electrode in contact with the droplet. The droplet velocity exponentially depending on the applied voltage below 15 V was obtained. The measured threshold voltage to move the droplet was as low as 3 V which is the lowest voltage reported so far in the EWOD researches. This result opens a possibility of manipulating droplets, without any surfactant or oil treatment, at only a few volts by EWOD using ALD Al₂O₃ as the dielectric.     

Low-cost polymer microfluidic device for on-chip extraction of bacterial DNA

A polymer microfluidic device for on-chip extraction of bacterial DNA has been developed for molecular diagnostics. In order to manufacture a low-cost, disposable microchip, micropillar arrays of high surface-to-volume ratio (0.152 μm⁻¹) were constructed on polymethyl methacrylate (PMMA) by hot embossing with an electroformed Ni mold, and their surface was modified with SiO₂ and an organosilane compound in subsequent steps. To seal open microchannels, the organosilane layer on top plane of the micropillars was selectively removed through photocatalytic oxidation via TiO₂/UV treatment at room temperature. As a result, the underlying SiO₂ surface was exposed without deteriorating the organosilane layer coated on lateral surface of the micropillars that could serve as bacterial cell adhesion moiety. Afterwards, a plasma-treated PDMS substrate was bonded to the exposed SiO₂ surface, completing the device fabrication. To optimize manufacturing throughput and process integration, the whole fabrication process was performed at 6 inch wafer-level including polymer imprinting, organosilane coating, and bonding. Preparation of bacterial DNA was carried out with the fabricated PDMS/PMMA chip according to the following procedure: bacterial cell capture, washing, in situ lysis, and DNA elution. The polymer-based microchip presented here demonstrated similar performance to Glass/Si chip in terms of bacterial cell capture efficiency and polymerase chain reaction (PCR) compatibility.     

The manufacturing of packaged capillary action microfluidic systems by means of CO2 laser processing

In this article we demonstrate a simple yet robust rapid prototyping manufacturing technique for the construction of autonomous microfluidic capillary systems by means of CO₂ laser processing. The final packaging of the microfluidic device is demonstrated using thermal lamination bonding and allows for a turnaround time of approximately 30 min to 3 h from activation of the laser system to device use. The low-cost CO₂ laser system is capable of producing repeatable microfluidic structures with minimum feature sizes superior than 100–150 μm over channel depths of more than 100 μm. This system is utilised to create capillary pump and valve designs within poly (methyl methacrylate) (PMMA) substrates. Such components are part of advanced systems that can self initiate and maintain the flow of various volumes of fluids from an input to a collection reservoir, whilst also controlling the progression of the flow through the various demonstrated valve type structures. The resulting systems could prove a very useful alternative to traditional, non-integrated, fluidic actuation and flow control systems found on-chip, which generally require some form of energy input, have limited portable capabilities and require more complex fabrication procedures.