Degradation of InGaAs/InP double heterojunction bipolar transistorsunder electron irradiation

The dc characteristics of InGaAs/InP double heterojunction bipolar transistors (DHBTs) are studied under high-energy (~1 MeV) electron irradiation up to a fluence of 14.8×10¹⁵ electrons/cm ². The devices show an increase in common-emitter current gain (h_fe) at low levels of dose (<10¹⁵ electrons/cm²) and a gradual decrease in h_fe and an increase in output conductance for higher doses. The decrease in h _fe is as much as ~80% at low base currents (~10 μA) after a cumulative dose of 14.8×10¹⁵ electrons/cm². The observed degradation effects in collector current-voltage (I-V) characteristics are studied quantitatively using a simple SPICE-like device model. The overall decrease in h_fe is attributed to increased recombination in the emitter-base junction region caused by radiation-induced defects. The defects introduced in the collector-base junction region are believed to be responsible for the observed increase in the output conductance     

Degradation of DC characteristics of InGaAs/InP singleheterojunction bipolar transistors under electron irradiation

The effects of high-energy (~1 MeV) electron irradiation on the dc characteristics of InGaAs/InP single heterojunction bipolar transistors (SHBT's) are investigated. The device characteristics do not show any significant change for electron doses <10¹⁵/cm². For higher doses, devices show a decrease in collector current, a degradation of common-emitter current gain, an increase in collector saturation voltage and an increase in the collector output conductance. A simple SPICE-like device model is developed to describe the dc characteristics of SHBT's. The model parameters extracted from the measured dc characteristics of the devices before and after irradiation are used to get an insight into the physical mechanisms responsible for the degradation of the devices     

Ultra-high-speed InP/InGaAs heterojunction bipolar transistors

We report on the microwave performance of InP/In_0.53Ga _0.47As heterojunction bipolar transistors (HBT's) utilizing a carbon-doped base grown by chemical beam epitaxy (CBE). The f_T and f_max of the HBT having two 1.5×10 μm² emitter fingers were 175 GHz and 70 GHz, respectively, at I_C=40 mA and V_CE=1.5 V. To our knowledge, the f _T of this device is the highest of any type of bipolar transistors yet reported. These results indicate the great potential of carbon-doped base InP/InGaAs HBT's for high-speed applications     

High-speed InP/InGaAs heterojunction bipolar transistors

Very-high-performance common-emitter InP/InGaAs single heterojunction bipolar transistors (HBTs) grown by metalorganic molecular beam epitaxy (MOMBE) are reported. They exhibit a maximum oscillation frequency (f_T) of 180 GHz at a current density of 1×10⁵ A/cm². this corresponds to an (R_BC_BC)_eff=f _T/(8πf²_max) delay time of 0.12 ps, which is the smallest value every reported for common-emitter InP/InGaAs HBTs. The devices have 11 μm² total emitter area and exhibit current gain values up to 100 at zero base-collector bias voltage. The breakdown voltage of these devices is high with measured BV_CEO and BV_CEO of 8 and 17 V, respectively     

Be diffusion in InGaAs/InP heterojunction bipolar transistors

Classic signatures of Be diffusion were observed in InAlAs/InGaAs HBT's after elevated temperature bias stress, i.e., a positive shift in the Gummel plot, higher collector ideality, and higher offset voltage. An activation energy of 1.57 eV was calculated. Lifetimes of 3.3×106 h and 37000 h were extrapolated for low and high power operation, respectively. In contrast, an InP/InGaAs HBT with a C doped base showed no signatures of C diffusion. The results show that Be diffusion is manageable at lower power. They also support the idea that C is more stable than Be in this material system     

Magnetotransport characterization of surface-treated InP/InGaAs heterojunction bipolar transistors

The results of surface modification induced effects on InP/InGaAs single heterojunction bipolar transistors, as revealed by magnetotransport experiments, are described here. The surface treatments included both sulphur-based surface passivation and ion bombardment-induced surface damage. The former is known to improve device characteristics and the latter to degrade device operation. In this work the aim was to assess these techniques for tailoring device performance for surface sensing applications. Device characteristics were found to be sensitive to surface preparation prior to measurements. Measurements revealed that surface treatments that improve device performance also reduce sensitivity to external magnetic fields while treatments that degrade performance make devices more sensitive to externally applied magnetic fields.     

InP/InGaAs heterojunction bipolar transistors with different g-bridge structures

Several μ-bridge structures for InP-based heterojunction bipolar transistors (HBTs) are reported. The radio frequency measurement results of these InP HBTs are compared with each other. The comparison shows that μ-bridge structures reduce the parasites and double μ-bridge structures have a better effect. Due to the utilization of the double μ-bridges, both the cutoff frequency f_T and also the maximum oscillation frequency f_(max) of the 2×12.5 μm~2 InP/InGaAs HBT reach nearly 160 GHz. The results also show that the μ-bridge has a better effect in increasing the high frequency performance of a narrow emitter InP HBT.     

Predicted performance of high-speed integrated-injection logicusing InGaAs/InP heterojunction bipolar transistors

By the use of analytical expressions and SPICE simulation, the switching performance of integrated injection logic (I²L) using heterojunction bipolar transistors (HBTs) has been investigated. A proposed inverter configuration using InP/InGaAs HBTs which avoids saturation in the p-n-p injector has predicted propagation delays of 16 ps at only 3-mW power dissipation. Transient response analysis illustrates the importance of reducing parasitic resistances in the structure. Ring oscillator simulations indicate that switching speeds approaching those of emitter-coupled logic but with advantages in high density and low power are possible     

Millimetre-wave InP/InGaAs heterojunction bipolar transistors witha subpicosecond extrinsic delay time

We report the microwave characteristics of InP/InGaAs heterojunction bipolar transistors (HBTs) using a carbon-doped base grown by chemical beam epitaxy (CBE). An extrinsic delay time of 0.856 ps was achieved by nonequilibrium transport in a very thin base layer and extremely small emitter parasitic resistance through the use of silicon δ-doping in the emitter ohmic contact layer. To our knowledge, this is the shortest extrinsic delay time of any bipolar transistors reported. This result indicates the great potential of InP/InGaAs HBTs for applications requiring a very large bandwidth     

Low-base-resistance InP/InGaAs heterojunction bipolar transistors with a compositionally graded-base structure

To reduce base resistance of an InP/InGaAs heterojunction bipolar transistor grown by gas-source molecular beam epitaxy, the doping characteristics of carbon-doped InGaAs and the dependence of doping concentration on current gain were investigated. Using a thicker graded base was found to increase current gain significantly, resulting in increased doping level in the InGaAs: C-base layer. In particular, an 80-nm-thick graded base produces a base sheet resistance of 285 Ω/sq and maintains a practically useful current gain of 23 and a high cut-off frequency of 139 GHz.     

High-speed InAlAs/InGaAs heterojunction bipolar transistors

InAlAs/InGaAs heterojunction bipolar transistors fabricated from wafers grown by molecular beam epitaxy are discussed. A cutoff frequency of 32 GHz for a collector current of 20 mA is achieved in the emitter area of devices 6×10 μm². The use of heavily doped and nondoped InGaAs layers as the emitter cap and collector, respectively, results in a reduction of the emitter and collector charging times; this, in turn, leads to improved microwave performance     

Subpicosecond InP/InGaAs heterostructure bipolar transistors

Bipolar transistors with subpicosecond extrinsic delay are discussed. These InP/InGaAs heterostructure transistors show a unity-current-gain cutoff frequency f_$T=165 GHz and maximum oscillation frequency f_MAX=100 GHz at room temperature. The authors model shows that an f_$T beyond 386 GHz is obtainable by further vertical scaling. Ring oscillators implemented with nonthreshold logic (NTL) and transistors having f_MAX=71 GHz show a propagation delay of 14.7 ps and 5.4 mW average power consumption per stage     

Selfaligned InGaAs/InP heterostructure bipolar transistors

InGaAs/InP heterostructure bipolar transistors have been realised using a new selfaligned process. Transistor wafers were grown by chemical beam epitaxy. Ideality factors close to unity were measured for emitter-base and collector-base diodes. The resulting devices exhibit nearly constant gain over four orders of magnitude of collector current densities, from j=1.5*10/sup -4/ A/cm/sup 2/ to 1.5 A/cm/sup 2/.<>     

Pseudomorphic AlInP/InP heterojunction bipolar transistors

Novel InP-based heterojunction bipolar transistors (HBTs) using an AlInP pseudomorphic emitter, together with an InP base and collector, have been fabricated. By using InP as both base and collector, the advantage of high electron velocity and high breakdown field of InP collectors are obtained without the problem associated with the energy barrier between the more standard InGaAs/InP base and collector heterojunction. Epitaxial layers were grown by gas-source molecular beam epitaxy (GSMBE). The 200 Å pseudomorphic emitter had an aluminium fraction of 15%, sufficiently suppressing hole injection from the base. The DC gain for 40×40 μm² devices reached 18. The breakdown voltage BV_CEO of 10 V is an improvement over devices with InGaAs base and collector layers     

A 10 Gbit/s OEIC photoreceiver using InP/InGaAs heterojunction bipolar transistors

Metal organic molecular beam epitaxy (MOMBE) was successfully used for the first time to realise a high speed monolithic photoreceiver. Incorporating an InGaAs pin photodetector followed by a transimpedance preamplifier circuit implemented with InP/InGaAs heterojunction bipolar transistors (HBTs), the OEIC photoreceiver had a bandwidth of 6 GHz and a midband transimpedance of 350 Omega . In a system experiment performed at 10 Gbit/s, the receiver exhibited a sensitivity of -15.5 dBm for a bit error rate of 10/sup -9/ at a wavelength of 1.53 mu m. This is the first demonstration of operation of a long wavelength OEIC photoreceiver at this speed.<>     

Metamorphic InP/InGaAs heterojunction bipolar transistors on GaAssubstrate: DC and microwave performances

High-performance InP/In_0.53Ga_0.47As metamorphic heterojunction bipolar transistors (MHBTs) on GaAs substrate have been fabricated using In_xGa_1-xP strain relief buffer layer grown by solid-source molecular beam epitaxy (SSMBE). The MHBTs exhibited a dc current gain over 100, a unity current gain cutoff frequency (f_T) of 48 GHz and a maximum oscillation frequency (f_MAX) of 42 GHz with low junction leakage current and high breakdown voltages. It has also been shown that the MHBTs have achieved a minimum noise figure of 2 dB at 2 GHz (devices with 5×5 μm ² emitter) and a maximum output power of 18 dBm at 2.5 GHz (devices with 5×20 μm² emitter), which are comparable to the values reported on the lattice-matched HBTs (LHBTs). The dc and microwave characteristics show the great potential of the InP/InGaAs MHBTs on GaAs substrate for high-frequency and high-speed applications     

InP/InGaAs heterojunction bipolar transistors grown by gas-sourcemolecular beam epitaxy with carbon-doped base

The first N-p-n InP/InGaAs heterojunction bipolar transistors (HBTs) with p-type carbon doping in InGaAs are reported. P-type carbon doping in the InGaAs base has been achieved by gas-source molecular beam epitaxy (GSMBE) using carbon tetrachloride (CCl₄) as the dopant source. The resulting hole concentration in the base was 1×10¹⁹ cm^-3. HBTs fabricated using material from this growth method display good I-V characteristics with DC current gain above 500. This verifies the ability to use carbon doping to make a heavily p-type InGaAs base of an N-p-n HBT     

High-gain InGaAlAs/InGaAs heterojunction bipolar transistors andphototransistors

The characteristics of InGaAlAs/InGaAs heterojunction bipolar transistors (HBTs) grown by molecular beam epitaxy are described. A current gain of 15600 at a current density of ~10⁴ A/cm² and an emitter-base heterojunction ideality factor of 1.02 were measured. Appropriately designed InGaAlAs/InGaAs HBTs, when operated as phototransistors, also had high gains. A current gain of 1000 for a collector current of only 10 μA was obtained for phototransistors. Such high gains are due to low recombination currents as a consequence of the good crystalline quality of the InGaAlAs bulk and InGaAlAs/InGaAs interface     

InGaAs/InP composite collector heterostructure bipolar transistors

A high speed bipolar transistor with high breakdown voltage BV/sub CEO/ is described. The structure uses a composite collector of InGaAs and InP. A common emitter gain of 65 is obtained with a base doping of 7*10/sup 19/ cm/sup -3/ and a breakdown voltage in excess of 10 V. The f/sub T/=64 GHz was reached at a collector-emitter voltage of 2 V and a current density of 52 kA/cm/sup 2/. The potential of this structure for very high speed applications is demonstrated by the extracted intrinsic transit time of 0.4 ps.<>     

Comparative investigation of InP/InGaAs abrupt, setback, and heterostructure-emitter heterojunction bipolar transistors

In this paper, the characteristics of InP/InGaAs abrupt, setback, and heterostructure-emitter heterojunction bipolar transistors (HBTs) are comparatively investigated by twodimensional simulation analysis. In the setback (heterostructure-emitter) HBT, a thin 50 ? undoped In_0.53Ga_0.47As (n-In_0.53Ga_0.47As) layer is inserted between n-InP emitter and p ⁺-InGaAs base layers to lower the energy band at emitter side for decreasing the collector-emitter offset voltage. The simulated results exhibits that the abrupt HBT has the largest current gain, the largest collector-emitter offset voltage, and the smallest unity gain cutoff frequency. While, the setback and heterostructure-emitter HBTs exhibit the smallest current gain and offcet voltage, respectively. Consequentially, the demonstration and comparison of the three-type HBTs provide a promise for design in circuit applications.