Blue photoluminescence from continuous freestanding β-SiC/SiOxCy/Cfree nanocomposite films with polycarbosilane (PCS) precursor

Novel continuous freestanding β-SiC/SiO_xC_y/C_free nanocomposite films, namely, β-SiC nano-crystals in amorphous SiO_xC_y and free C cluster matrix material, were fabricated by melt spinning the polycarbosilane (PCS) precursor. Effects of oxidation curing time and sintering temperatures on the photoluminescence (PL) properties of nanocomposite films were investigated. The PL spectra show two strong blue emissions at 416 nm and 435 nm, which are unchanged neither with oxygen content nor with β-SiC crystallite size. The PL intensity of the films is enhanced by increasing curing time when sintered at 1200 °C. However, a reversed trend is identified after the films were sintered at 1300 °C. Spectroscopy and microscopy studies indicate that the radiative recombination of carriers is ascribed to the oxygen mono- and di-vacancy from SiO_xC_y at the surfaces of β-SiC nano-crystals, whereas the photogeneration of carriers occurs in the β-SiC nano-crystals cores. The obtained results are expected to have important applications in advanced optoelectronic devices.     

Low temperature formation of Si1 − x − yGexSny-on-insulator structures by using solid-phase mixing of Ge1 − zSnz/Si-on-insulator substrates

We proposed the low temperature formation technique of strain-relaxed Si_{1 − x − y}Ge_xSn_y-on-insulator (SGTOI) structures. We found that the solid-phase reaction and the formation of single and uniform Si_{1 − x − y}Ge_xSn_y layer on an insulator after annealing SiO₂/Ge_1 − zSn_z/SOI structures even at a temperature as low as 400 °C. We characterized the crystalline structure of SGTOI, and investigated the effects of annealing, Sn incorporation, and a SiO₂ cap layer on the solid-phase reaction between Ge_1 − zSn_z and SOI layers. The solid-phase reaction is enhanced with a higher Sn content and a thicker SiO₂ cap layer, and then Si_{1 − x − y}Ge_xSn_y layers are more rapidly formed. The SGTOI layer exhibits very low mosaicity and have good crystallinity.     

Composite SiOx/hydrocarbon plasma polymer films prepared by RF magnetron sputtering of SiO2 and polyethylene or polypropylene

Composite SiO_x/hydrocarbon plasma polymer films have been prepared by RF sputtering of silica and hydrocarbon polymer (polyethylene (PE) or polypropylene (PP)) targets placed on two balanced magnetrons. The morphology and composition of the composite films have been analysed by means of AFM, RBS/ERDA, FTIR, and XPS. The obtained films demonstrated wide range of wettability and hardness in dependence on the preparation conditions. When the ratio of RF powers delivered to the individual targets P_SiO2/P_PE(P_PP) changed from 0.1 to 10 the static contact angles of water varied from 75° to 25° and from 80° to 33° for composite films obtained from PE and PP, respectively. The hardness of the composite films varied from 2400 to 3400 N/mm² and from 1600 to 2000 N/mm² for the above-mentioned cases, respectively. Peculiar properties of the composite SiO_x/hydrocarbon plasma polymer films have been discussed with respect to the elemental composition and nature of the chemical bonds established on the surface of the films.     

High-frequency magneto-electrical properties of Zn1 − x − yAlxCoyO thin films

The Al doping effects on high-frequency magneto-electric properties of Zn_{1 − x − y}Al_xCo_yO (x = 0-10.65 at.%) thin films were systematically studied. In the current work, the Zn_{1 − x − y}Al_xCo_yO thin films were deposited by magnetron co-sputtering onto quartz substrates. The magneto-impedance spectra of the thin films were measured by an impedance analyzer. Among all the doped films studied, the thin film with 6.03 at.% Al-doping showed the highest ac conductivity and relaxation frequency. To characterize the relaxation mechanism underlying the magneto-electric properties, a Cole-Cole impedance model was applied to analyze the impedance spectra. The analyzed result showed that the magneto-impedance of the Zn_{1 − x − y}Al_xCo_yO is contributed by multiple processes of magnetization dynamics and dielectric relaxation. The results imply that Zn_{1 − x − y}Al_xCo_yO may be applicable for high-frequency magneto-electric devices.     

Characterisation of SiOxCyHz thin films deposited by low-temperature PECVD

SiO_xC_yH_z thin films were deposited from hexamethyldisiloxane (HMDSO)/O₂ mixtures in a parallel plate, capacitively coupled, RF plasma reactor. Polyethylene terephthalate (PET), Si(1 0 0) wafers and KBr tablets were chosen as substrates. Effect of HMDSO/O₂ ratio, total treatment pressure and power input on the properties of the deposited films were investigated. The structure and bondings were studied by means of Fourier transform infrared spectroscopy and X-ray photoelectron spectroscopy. Wettability characteristics of the deposited thin films were investigated by means of water droplet contact angle measurements. Surface morphology was investigated with atomic force microscopy. Barrier properties of the SiO_xC_yH_z thin films were investigated by measuring the water vapour transmission rate of the coated PET substrates. Correlations between the characteristics of the deposited film and their barrier properties were discussed.     

Formation of CuIn1 − xAlxSe2 thin films studied by Raman scattering

CuIn_1 − xAl_xSe₂ (CIAS) thin films (x = 0.06, 0.18, 0.39, 0.64, 0.80 and 1) with thicknesses of approximately 1 μm were formed by the selenization of sputtered Cu―In―Al precursors and studied via X-ray diffraction, inductively coupled plasma mass spectrometry and micro-Raman spectroscopy at room temperature. Precursor films selenized at 300, 350, 400, 450, 500 and 550 °C were examined via Raman spectroscopy in the range 50-500 cm^− 1 with resolution of 0.3 cm^− 1. Sequential formation of In_xSe_y, Cu_2 − xSe, CuInSe₂ (CIS) and CIAS phases was observed as the selenization temperature was increased. Conversion of CIS to CIAS was initiated at 500 °C. For all CuIn_1 − xAl_xSe₂ products, the A₁ phonon frequency varied nonlinearly with respect to the aluminum composition parameter x in the range 172 cm^− 1 to 186 cm^− 1.     

Formation of size-controlled silicon nanocrystals in plasma enhanced chemical vapor deposition grown SiOxNy/SiO2 superlattices

Size controlled silicon nanocrystals (SiNC) in silicon oxynitride matrix were prepared using plasma enhanced chemical vapor deposition. The as-deposited superlattices (SLs) and the corresponding bulk films were treated by thermal annealing. Hydrogen effusion was performed during the heating up by choosing a sufficiently low heating ramp. The phase separation of the layers into SiNCs and surrounding oxynitride matrix was studied at temperatures of up to 1150 °C. The influence of the annealing temperature on SiO_xN_y/SiO₂ - SLs with varying SiO_xN_y layer thickness was investigated by several analytical techniques including variable angle spectroscopic ellipsometry, photoluminescence (PL) spectroscopy, x-ray photoelectron spectroscopy, Fourier transform infrared spectrometry (FTIR) and transmission electron microscopy (TEM). Before annealing FTIR investigations show in addition to the expected Si-O bonds also the formation of nitrogen and hydrogen related bonds. The shift of the Si-O-Si stretching vibration to higher wave numbers after annealing indicates phase separation. The disappearance of the hydrogen related bonds indicates the hydrogen effusion. The PL signal is rising significantly with increasing annealing temperature and the PL peak position is strongly related to the thickness of the SiO_xN_y sublayers due to quantum confinement effects. TEM investigations confirm the size-controlled growth of SiNCs within the oxynitride matrix. The role of incorporated nitrogen and hydrogen is discussed.     

Ion sputtering rates of C, CrxCy, and Cr at different Ar ion incidence angles

To study the ion sputtering of a layered structure with different layer densities and ion sputtering yields a trilayer structure of C-graphite(46 nm)/Cr_xC_y(60 nm)/Cr(69 nm) was sputter deposited onto smooth silicon substrates. The ion sputtering rates of amorphous carbon, amorphous Cr_xC_y and polycrystalline Cr were determined by means of Auger electron spectroscopy depth profiling as a function of the angle of incidence of two symmetrically inclined 1 keV Ar⁺ ion beams in the range between 22° and 82°. The sputtering rates were calculated from the known thicknesses of the layers and the sputtering times necessary to remove the individual layers. It was found that the sputtering rates of C-graphite, Cr_xC_y carbide and Cr were strongly angle dependent. The experimental sputtering yields were in agreement with the theoretical results obtained by calculation of the transport of ions in solids, but the sputtering yields of C-graphite measured at ion incidence angles larger than 29° were smaller than the simulated ones.     

Composite SiOx/fluorocarbon plasma polymer films prepared by r.f. magnetron sputtering of SiO2 and PTFE

Composite films SiO_x/fluorocarbon plasma polymers were prepared by r.f. sputtering from two balanced magnetrons equipped with polytetrafluoroethylene (PTFE) and silica (SiO₂) targets. Argon was used as the working gas. The obtained films were characterised by means of XPS, RBS, FTIR, AFM, TEM, microhardness and static contact angle measurements. The obtained SiO_x/fluorocarbon plasma polymer films reveal different wettability (static contact angle of water ranges from 68° to 40°) and hardness (ranges from 720 to 3200 N/mm²) when the volume fraction ratio (filling factor) of SiO₂ changes from 0.01 to 0.7. The concentration of elements determined by RBS/ERDA varies strongly over this range of filling factors. The heterogeneous structure of the composite films is indicated by TEM at high SiO_x contents.     

Morphotropic phase boundary in high temperature ferroelectric xBi(Zn1/2Ti1/2)O3 − yPbZrO3 − zPbTiO3 perovskite ternary solid solution

A bismuth and lead oxide based perovskite ternary solid solution xBi(Zn_1/2Ti_1/2)O₃ − yPbZrO₃ − zPbTiO₃ (xBZT − yPZ − zPT) was investigated as an attempt to develop a high T_C ferroelectric material for piezoelectric sensor and actuator applications. A morphotropic phase boundary (MPB) between rhombohedral and tetragonal phases was determined through an XRD study on a pseudobinary line 0.1BZT − 0.9[xPT − (1 − x)PZ] for composition 0.1Bi(Zn_1/2Ti_1/2)O₃ − 0.5PbZrO₃ − 0.4PbTiO₃. Enhanced piezoelectric and ferroelectric activities were observed for MPB composition with dielectric constant ε_r′ ~ 23,000 at Curie temperature (T_C) ≈ 320 °C, remanent polarization (P_r) = 35 μC/cm², piezoelectric coefficient (d₃₃) = 300 pC/N, unipolar strain = 0.15%, and electromechanical coupling coefficient (k_P) = 0.45.     

Ni silicide formation on epitaxial Si1 − yCy/(001) layers

The formation of Ni silicides on Si_1 − yC_y (y = 0.01 and 0.018) epilayers grown on Si(001) has been investigated. The presence of C atoms was found to significantly retard the growth kinetics of NiSi and enhances the thermal stability of thin NiSi films. For Ni(11 nm)/Si_0.982C_0.018 samples, the process window of NiSi was shifted and extended to 450-700 °C. Moreover, there was an additional strain introduced into the Si_1 − yC_y epilayers during Ni silicidation. This work shows the potential of Ni silicidation on Si_1yC_y for device applications.     

Synthesis of Al-Cr-O-N thin films in corundum and f.c.c. structure by reactive r.f. magnetron sputtering

Advanced PVD coatings for metal cutting applications must exhibit a multifunctional property profile including high hardness, chemical inertness and high temperature stability. Recently, ternary Al-Cr-O thin films with mechanical properties similar or superior to conventional aluminium oxide thin films have been suggested as potential materials meeting such demands. These coatings can be deposited at moderate temperatures in PVD processes. In this work, new quaternary Al-Cr-O-N coatings are suggested as alternative for offering thin film materials of high strength, hardness and even toughness. A combinatorial approach to the synthesis of Al-Cr-O-N thin films by means of reactive r.f. magnetron sputtering is presented. A thorough phase analysis of deposited coatings covering a wide range of elemental compositions revealed a well-defined phase transition from a corundum-type α-(Al_1 − x,Cr_x)_2 + δ(O_1 − y,N_y)₃ structure to a CrN-type f.c.c.-(Al_1 − x,Cr_x)_1 + θ(O_1 − y,N_y) structure as a function of the Al/Cr ratio and the nitrogen gas flow ratio. Detailed results on the coatings composition, constitution and microstructure are discussed compared to ternary Al-Cr-O thin films deposited by reactive r.f. magnetron sputtering under nearly identical conditions.     

Effects of oxygen addition on electrochromic properties in low temperature plasma-enhanced chemical vapor deposition-synthesized MoOxCy thin films for flexible electrochromic devices

Electrochromic organomolybdenum oxide (MoO_xC_y) films are deposited onto 60 Ω/□ flexible polyethylene terephthalate/indium tin oxide substrates by low temperature plasma-enhanced chemical vapor deposition (PECVD) using a precursor of molybdenum carbonyl vapor, which is carried by argon gas, mixed with oxygen gas and synthesized by radio frequency power at room temperature (23 °C). The MoO_xC_y films with modified surface morphology and compositions of varying oxygen contents are proven to offer noteworthy electrochromic performance. Porous surface of the MoO_xC_y film (398 nm thick) provides Li⁺ ion diffusion coefficient value of 1.7 × 10^− 10 cm²/s for Li⁺ de-intercalation at a potential scan rate of 2 mV/s. High x/y value at high surface composition of oxygen to carbon in the MoO_xC_y film offers light modulation with transmittance variation of up to 63% and coloration efficiency of 36 cm²/C at a wavelength of 800 nm for 200 cycles of Li⁺ intercalation and de-intercalation. PECVD-synthesized MoO_xC_y thin films show promising electrochromic properties for applications in flexible electrochromic devices.     

Growth of silicon carbide thin films by hot-wire chemical vapor deposition from SiH4/CH4/H2

Silicon carbide (SiC) thin films were prepared by hot-wire chemical vapor deposition from SiH₄/CH₄/H₂ and their structural properties were investigated by X-ray diffraction, Fourier transform infrared absorption and Raman scattering spectroscopies. At 2 Torr, Si-crystallite-embedded amorphous SiC (a-Si_1 − xC_x:H) grew at filament temperatures (T_f) below 1600 °C and nanocrystalline cubic SiC (nc-3C-SiC:H) grew above T_f = 1700 °C. On the other hand, At 4 Torr, a-Si_1 − xC_x:H grew at T_f = 1400 °C and nc-3C-SiC grew above T_f = 1600 °C. When the intakes of Si and C atoms into the film per unit time are almost the same and H radicals with a high density are generated, which takes place at high T_f, nc-3C-SiC grows. On the other hand, at low T_f the intake of Si atoms is larger than that of C atoms and, consequently, Si-rich a-Si_1 − xC_x:H or Si-crystallite-embedded a-Si_1 − xC_x:H grow.     

Band alignment of Cd(1 − x)ZnxS produced by spray pyrolysis method

Cd_(1 − x)Zn_xS thin films have been grown on glass substrates by the spray pyrolysis method using CdCl₂ (0.05 M), ZnCl₂ (0.05 M) and H₂NCSNH₂ (0.05 M) solutions and a substrate temperature of 260 °C. The energy band gap, which depends on the mole fraction × in the spray solution used for preparing the Cd_(1 − x)Zn_xS thin films, was determined. The energy band gaps of CdS and ZnS were determined from absorbance measurements in the visible range as 2.445 eV and 3.75 eV, respectively, using Tauc theory. On the other hand, the values calculated using Elliott-Toyozawa theory were 2.486 eV and 3.87 eV, respectively. The exciton binding energies of Cd_0.8Zn_0.2S and ZnS determined using Elliott-Toyozawa theory were 38 meV and 40 meV, respectively. X-ray diffraction results showed that the Cd_(1 − x)Zn_xS thin films formed were polycrystalline with hexagonal grain structure. Atomic force microscopy studies showed that the surface roughness of the Cd_(1 − x)Zn_xS thin films was about 50 nm. Grain sizes of the Cd_(1 − x)Zn_xS thin films varied between 100 and 760 nm.     

Enhancing epitaxial SixC1 − x deposition by adding Ge

In this work, a possible way to enhance the epitaxial growth of metastable, tensile strained Si_xC_1 − x layers by the addition of germanium is demonstrated. During ultra-high vacuum chemical vapor deposition growth, the co-mixing of germane to the Si_xC_1 − x precursors was found to enhance the growth rate by a factor of ~ 3 compared to the growth of pure Si_xC_1 − x. Furthermore, an increase of the amount of substitutional incorporated carbon has been observed. Selective Si_xGe_yC_{1 − x − y} deposition processes utilizing a cyclic deposition were developed to integrate epitaxial tensile strained layers into source and drain areas of n-channel transistors.     

Amorphous Si1−xCx:H films prepared by hot-wire CVD using SiH3CH3 and SiH4 mixture gas and its application to window layer for silicon thin film solar cells

B-doped hydrogenated amorphous silicon carbon (a-Si_1−xC_x:H) films have been prepared by hot-wire CVD (HWCVD) using SiH₃CH₃ as the carbon source gas. The optical bandgap energy and dark conductivity of the film are about 1.94 eV and 2 × 10^− 9 S/cm, respectively. Using this film as a window layer, we have demonstrated the fabrication of solar cells having a structure of the textured SnO₂(Asahi-U)/a-Si_1−xC_x:H(p)/a-Si_1−xC_x:H(buffer)/a-Si:H(i)/μc-Si:H(n)/Al. The conversion efficiency of the cell is found to be 7.0%.     

Physico-chemical, structural and physical properties of hydrogenated silicon oxinitride films elaborated by pulsed radiofrequency discharge

Films prepared by radiofrequency pulsed plasma enhanced chemical vapor deposition from a mixture of silane (SiH₄) and nitrous oxide (N₂O) were studied. Variation of operating conditions (flow rate, deposition temperature ...) resulted in films with chemical compositions changing from hydrogenated silicon oxynitride (SiO_xN_y:H) to silicon oxide (SiO_x:H). Infrared and Rutherford backscattering spectroscopy studies of the as-deposited films revealed different SiO_x arrangements disturbed by Si-N bonds and H-Si ≡ Si_(3 − x)O_x clusters depending on the substrate temperature and the N₂O/SiH₄ ratio. For films obtained using low N₂O/SiH₄ rations and annealed at temperature higher than 1273 K, Raman spectroscopy and microscopy analyses revealed the presence of silicon nanocrystals embedded in a matrix containing Si, O, and N. Spectroscopic ellipsometry revealed the presence of silicon nanocrystals along with two other amorphous phases (SiO_xN_y and SiO₂) in annealed samples. The electrical characteristics of annealed films obtained from capacitance-voltage measurements indicated a stable charge trapping in ultra-thin SiO_xN_y layers. These preliminary results suggest that Si-nc containing silicon oxynitride layers can be potential candidates to be used in the floating gate fabrication of memory devices.     

Dielectric and pyroelectric anisotropy in melt-quenched BaBi2(Nb1 − xVx)2O9 ceramics

The (0 0 l) textured BaBi₂(Nb_1 − xV_x)₂O₉ (where x = 0, 0.03, 0.07, 0.1 and 0.13) ceramics were fabricated via the conventional melt-quenching technique followed by high temperature heat-treatment (800-1000 °C range). The influence of vanadium content and sintering temperature on the texture development and relative density were investigated. The samples corresponding to the composition x = 0.1 sintered at 1000 °C for 10 h exhibited the maximum orientation of about 67%. The Scanning electron microscopic studies revealed the presence of platy grains having the a-b planes perpendicular the pressing axis. The dielectric constant and the pyroelectric co-efficient values in the direction perpendicular to the pressing axis were higher. The anisotropy in the dielectric constant is about 100 (at 100 kHz) at the dielectric maximum temperature and anisotropy in the pyroelectric co-efficient is about 50 μC cm⁻² °C⁻¹ in the vicinity of pyroelectric anomaly for the sample corresponding to the composition x = 0.1 sintered at 1000 °C. Higher values of the dielectric loss and electrical conductivity were observed in the direction perpendicular to the pressing axis which is attributed to the high oxygen ion conduction in the a-b planes.     

CexAlyOz/TiN stack analysis for Metal-Insulator-Metal applications: Effect of annealing and the metal electrode deposition method

Ce_xAl_yO_z thin films were deposited on TiN metal electrode by metalorganic chemical vapour deposition method at 400 °C. The detailed physical characterization on Ce_xAl_yO_z/TiN stack upon annealing at different temperatures (600 °C and 850 °C) and for different deposition methods (Atomic vapour deposition (AVD) and Physical vapour deposition (PVD)) of electrode material were done for possible Metal-Insulator-Metal applications. X-ray diffraction results exhibited that the dielectric and TiN(AVD) are amorphous while TiN(PVD) is crystalline for the as deposited stacks. Annealing on Ce_xAl_yO_z/TiN(AVD) at 600 °C, initiates CeO₂ crystallization in the dielectric with composition of Ce:Al = 0.5 as obtained by X-ray photoelectron spectroscopy. In Ce_xAl_yO_z/TiN(PVD) stack, the dielectric remains in its amorphous state until 850 °C. However, TiO₂ crystallization is formed at 600 °C in Ce_xAl_yO_z/TiN(PVD). Time of flight secondary ion mass spectroscopy depth profiling data proves that the annealing at 600 °C caused the oxidation of both the metal electrodes and the inter-diffusion of Ti from the bottom metal electrode through the dielectric layer.