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《现代电子技术》2015,(24):128-131
金属氧化物半导体(MOS)器件的缩放技术使集成电路芯片面临着严重的静电放电(ESD)威胁,而目前采用的ESD保护电路由于电流集边效应等原因,普遍存在着抗静电能力有限、占用较大芯片面积等问题。根据全芯片ESD防护机理,基于SMIC 0.18μm工艺设计并实现了一种新型ESD保护电路,其具有结构简单、占用芯片面积小、抗ESD能力强等特点。对电路的测试结果表明,相对于相同尺寸栅极接地结构ESD保护电路,新型ESD保护电路在降低35%芯片面积的同时,抗ESD击穿电压提升了32%,能够有效保护芯片内部电路免受ESD造成的损伤和降低ESD保护电路的成本。 相似文献
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CMOS VLSI ESD保护电路设计技术 总被引:4,自引:0,他引:4
本文对CMOSVLSI芯片ESD失效现象及其ESD事件发生机理进行了分析,介绍了CMOSVLSIESD保护电路设计技术。使用具有大电流放电性能的MOS器件构成的ESD电路,以及采用周密的版图布局布线技术,可实现良好的ESD保护性能。 相似文献
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静电放电(ESD)一直是电子产品的重大威胁,严重的还会造成芯片失效。在设计阶段需对芯片受ESD冲击后的耦合情况进行预测评估,并为芯片设计有效的ESD防护,实现系统级高效ESD设计(SEED)成为发展趋势。文章研究了瞬态抑制二极管(TVS)对静电的响应情况,并将TVS分为回滞型与非回滞型,分别建立了SPICE模型。提出了一种新的ESD发生器电路模型和全波模型,所得电流波形与实测数据吻合较好。两种模型的电流特征值与IEC 61000-4-2:2008要求的偏差较小。为复现完整的系统级ESD测试环境提供了支持,也为探索芯片在系统级ESD测试下的行为模式打下基础。 相似文献
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电容式触摸感应检测按键电路是一类对静电特别敏感的电路,因此静电放电(ESD)保护结构的选择问题对这一类电路显得特别重要。一方面要确保所选择的ESD保护结构有足够的抗静电能力,另一方面这种ESD保护结构又不能使芯片的面积和成本增加太多,基于此要求,介绍了3种应用在电容式触摸感应检测按键电路中的ESD保护结构。主要描述了这3种结构的电路形式和版图布局,着重阐述了为满足电容式触摸感应检测按键电路的具体要求而对这3种结构所作的改进。列出了这3种改进过后的ESD保护结构的特点、所占用芯片面积以及抗静电能力测试结果的比较。结果表明,经过改进后的3种ESD保护结构在保护能力、芯片面积利用率以及可靠性等方面都有了非常好的提升。 相似文献
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Ming-Dou Ker Chung-Yu Wu Tao Cheng Hun-Hsien Chang 《Very Large Scale Integration (VLSI) Systems, IEEE Transactions on》1996,4(3):307-321
Capacitor-couple technique used to lower snapback-trigger voltage and to ensure uniform ESD current distribution in deep-submicron CMOS on-chip ESD protection circuit is proposed. The coupling capacitor is realized by a poly layer right under the wire-bonding metal pad without increasing extra layout area to the pad. A timing-original design model has been derived to calculate the capacitor-couple efficiency of this proposed ESD protection circuit. Using this capacitor-couple ESD protection circuit, the thinner gate oxide of CMOS devices in deep-submicron low-voltage CMOS ASIC can be effectively protected 相似文献
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HBM ESD tests on two types of 0.6 μm DRAM devices showed that internal circuit or output driver failures would occur after the input or I/O pins were ESD stressed negative with respect to Vcc at ground. These failures occurred at lower than expected ESD stress voltages due to power-up circuit interactions that either turned-on unique internal parasitic ESD current paths or disrupted the normal operation of the output pin’s ESD protection circuit. ESD analysis found there exists a set of power-up sensitive circuits and if placed near a Vcc bond pad can result in low voltage ESD failures. 相似文献
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A review on RF ESD protection design 总被引:3,自引:0,他引:3
Wang A.Z.H. Haigang Feng Rouying Zhan Haolu Xie Guang Chen Qiong Wu Guan X. Zhihua Wang Chun Zhang 《Electron Devices, IEEE Transactions on》2005,52(7):1304-1311
Radio frequency (RF) electrostatic discharge (ESD) protection design emerges as a new challenge to RF integrated circuits (IC) design, where the main problem is associated with the complex interactions between the ESD protection network and the core RFIC circuit being protected. This paper reviews recent development in RF ESD protection circuit design, including mis-triggering of RF ESD protection structures, ESD-induced parasitic effects on RFIC performance, RF ESD protection solutions, as well as characterization of RF ESD protection circuits. 相似文献
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In the output stage of power ICs, large array devices (LAD) of MOSFETs are usually used to drive a considerable amount of current. Electrostatic discharge (ESD) self-protection capability of LAD is also required. ESD layout rules are usually adopted in low voltage CMOS transistors to improve the ESD performance but with a large layout area. In this paper, a modified RC gate-driven circuit with gate signal control circuit is developed to keep the minimum device layout rule while achieving ESD self-protection. Thus, it results in a very small layout area increment while keeps the LAD operates safely in normal operation and gains good ESD protection level. 相似文献
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一种高稳定连续可调半导体激光器驱动源 总被引:2,自引:0,他引:2
在连续变量相干光系统中,半导体激光器工作的稳定与否直接影响着检测结果。注入电流和工作温度是影响半导体激光器工作稳定的主要因素。因此激光器的驱动电源应是长时间、高稳定的恒流源,且带有恒温控制。采用电流串联负反馈技术,对控制量进行闭环控制,可实现高稳定和低纹波系数的驱动电流源,具有恒流特性好、纹波小、抗干扰能力强等优点。并采用自动温度控制电路对半导体激光器进行恒温控制,从而保证输出功率稳定,同时还采用了一系列的保护措施,实现半导体激光器的可靠运行。该系统采用单片机为主机,检测电路异常和控制保护电路,选择电压参数送入数字电压表显示,具有保护电路完善、操作直观的特点。 相似文献
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In order to design a robust electrostatic discharge (ESD) protected RF amplifier in InGaP/GaAs HBTs, a comprehensive assessment of device vulnerability to ESD events in both active transistors and passive components of the HBT technology is presented in this paper. The results include not only the intrinsic HBT's ESD robustness performance, but also its dependence on device layout, ballast resistor, and process. Acknowledging the ESD constraints imposed on InGaP/GaAs HBT technology, a 5.4-6.0-GHz power amplifier (PA) with a compact 2000 V/sub ESD/ (human body model) on-chip ESD protection circuit that has a low loading capacitance of less than 0.1 pF and that does not degrade RF and output power performance is developed for wireless local area network application. A diode triggered Darlington pair is implemented as the ESD protection circuit instead of the traditional diode string. Its operation principle, ESD protection performance, and PA performance are also illustrated in this paper. 相似文献
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《Solid-state electronics》1994,37(1):17-26
A robust CMOS on-chip ESD protection circuit is proposed, which consists of four parasitic lateral SCR devices with low ESD trigger voltages to protect NMOS and PMOS devices of the internal circuits against the ESD pulses with both positive and negative polarities with respect to either VDD or VSS(GND) nodes. For each ESD stress with positive or negative polarity, there is an efficient and direct shunt path generated by the SCR low-impedance latching state to quickly bypass the ESD current. Thus, this four-SCR ESD protection circuit can perform very efficient protection in a small layout area. Since there is no diffusion or polysilicon resistor in the proposed ESD protection circuit, the RC delay between each I/O pad and its internal circuits is very low and high-speed applications are feasible. The experimental results show that this four-SCR protection circuit can successfully perform very effective protection against ESD damage. Moreover, the proposed ESD protection circuit is fully process-compatible with n-well or p-well CMOS and BiCMOS technologies. 相似文献