导电胶粘剂的研究

文章综述了当前电子组装业中导电胶粘剂的研究情况,主要介绍国外正在重点研究的几大类导电胶粘剂及其组成,与传统锡铅焊料的对比,以及它们的电性能、机械性能、热性能等。同时简要介绍其发展趋势。     

高性能非银导电胶粘剂研究及应用

介绍了ＧＳＤ－Ｔ型铜粉导电胶粘剂各组分的选择，特殊铜粉的制备、配方和使用工艺条件，还列举了各种性能的测试数据。该导电胶粘剂在电子产品和厢式通信车上得到了初步应用。能满足使用要求。为电子产品的导电连接的通信车的电磁屏蔽提供了一种新的材料。     

薄膜开关用导电碳浆的研究

研究了薄膜开关用导电碳浆的基本配方和工艺过程;实验表明:胶粘剂树脂柔韧性的选择至关重要,以满足柔性线路的基本要求;导电载体应使用质量比为6:4的石墨和炭黑的混合体,适当的分散剂可使电阻率降低1/2,碳浆研磨次数为4次;采用本研究方法制出涂料的成膜方阻为12 ?□。     

透视导电胶

导电型胶粘剂，简称导电胶，是一种既能有效地胶接各种材料，又具有导电性能的胶粘剂。导电胶粘剂包括两大类，各向同性均质导电胶粘剂(ICA)和各向异性导电胶粘剂(ACA)。ICA是指各个方向均导电的胶粘剂；ACA则不一样，如Z-轴ACA是指在Z方向导电的胶粘剂，而在X和Y方向则不导电。当前的研究主要集中在ICA。     

导电聚合物及其在隐身技术中的应用

介绍了导电聚合物的种类和性质,叙述了复合型导电聚合物和电子导电型聚合物的组成结构、导电机理及其制备方法,论述了导电聚合物在隐身技术中的研究和应用情况,简要总结了导电聚合物在隐身技术领域的发展方向．     

红胶、贴片胶、贴片红胶常见问题和对策

UNINWELL国际作为世界高端电子胶粘剂的领导品牌。公司开发的导电银胶、导电银浆、贴片胶、底部填充胶、TUFFY胶、LCM密封胶、UV胶、太阳能电池组件密封胶八大系列光电胶粘剂具有最高的产品性价比,     

用导电油墨制造印刷电路板的可行性分析

化工原材料价格上涨和电子整机产品价格不断下调，对印制电(线)路板及覆铜板行业造成很大冲击：人们对环保的要求使该行业必须开发出符合环保要求的新产品：本文详细介绍了导电油墨、导电胶粘剂和印刷电路板用酚醛纸层压板的性能、用法：讨论了在低端电子产品(如电子玩具、简单的家电产品和部分仪器仪表的控制线路等)中，用导电油墨制造印刷电路板的可行性。     

电子封装无铅化趋势及瓶颈

欧盟通过法令限制电子用品中铅等有害物质的使用．含铅电子产品不久将退出市场．电子封装的无铅化已成必然趋势。焊料的无铅化是无铅封装的关键．目前无铅焊料的研究集中在Sn基焊料和导电胶粘剂两个方向文中介绍了三种典型无铅焊料体系的不足之处以及银导电胶研究中的三个难题．另外关于无铅焊料还没有一个统一的标准     

柔性透明导电氧化物薄膜的制备及其应用

柔性透明导电氧化物薄膜以其重量轻、不易碎、成本低等独特的优点而备受青睐,在塑料液晶显示、可折叠太阳能电池等领域得到广泛的应用.文章介绍了目前制备柔性透明导电氧化物薄膜的主要技术及其优缺点,总结了近年来对柔性衬底的处理方法,最后对柔性透明导电氧化物薄膜在各个领域的开发应用和未来的重点研究方向进行了展望.     

P型透明导电材料及器件应用研究进展

基于透明器件广阔的应用前景,P型透明导电材料及器件应用成为该领域研究的热点,并在近年来取得了令人瞩目的进展.综述了P型ZnO基氧化物、P型含铜氧化物、P型硫族化合物等透明导电材料及其器件应用的研究现状,重点介绍了近年来出现的P型掺杂的新方法、新机制及新材料的性能,并指出了今后的发展趋势和研究重点.     

导电胶研究现状及其在LED产业中的应用

伴随中国战略性新兴LED产业的迅猛发展,LED芯片与基板之间的连接材料—导电胶,也成为了当前学术界和产业界的研究热点之一。分别从导电胶主要成分方面阐述了导电胶近年来的研究成果,为导电胶研发过程中的成分选择及优化处理提供参考。并展望了今后导电胶的发展趋势和应用前景。     

金属粉末-聚合物复合导电胶研究进展

随着电子封装工艺的发展,越来越多的人们致力于研发更高性能、环境友好的新连接材料,以聚合物为基体的复合导电胶在电子封装领域的应用也由此越来越广泛。文章介绍了导电胶的分类和组成,以及改善导电胶性能的方法与技术,从宏观和微观角度对导电机理进行了探讨并对研究前景做了展望。     

导电胶性能对器件分层的影响

近年来客户对器件可靠性要求越来越高,而分层对可靠性的影响至关重要。跟分层密切相关的两种主要封装材料分别为塑封料和导电胶,文中重点对LQFP类导电胶进行性能比较、分层试验和相关性分析,明确了导电胶的相关性能对器件分层的影响程度,从而选择合适的导电胶来改善和提高器件的可靠性。     

国外微电子组装用导电胶的研究进展

介绍导电胶的组成、分类、较之于传统共晶锡铅焊料的优点以及导电胶的研究现状。重点阐述国外在导电胶导电机理研究、可靠性研究及新型高性能导电胶研制方面的现状和进展。     

基于导电性能退化数据的导电胶可靠性评估

性能退化表征的是产品的工作能力随时间逐渐降低的现象。提出用指数退化模型来描述导电胶导电性能退化过程,并根据退化数据给出了一个某型导电胶在任意时河的性能特征值的分布模型。根据这个分布模型,提出了两种可靠性评估的方法：1）相对于传统的寿命分布模型,所推导的可靠度函数中的参数易以通过实时跟踪测量性能参数时间序列数据估计得到;2）给出了针对不同样本量时的可靠性评估方法,且简便易行。最后通过试验数据对导电胶在使用环境下的可靠性进行了评估。     

Formulation and characterization of anisotropic conductive adhesive paste for microelectronics packaging applications

There has been a steadily increasing interest in using electrically conductive adhesives as interconnecting materials in electronics manufacturing. In this paper, several anisotropic conductive adhesive (ACA) pastes were formulated, which consist of diglycidyl ether of bisphenol F or diglycidyl ether of bisphenol A as polymer matrix, imidazoles as curing agents, and different sizes of silver (Ag) powders or gold (Au)-coated polymer spheres as conductive particles. The effects of ACA resin and different curing agents, as well as different conductive particles, on flexible substrate of the flip-chip joint were studied. The results show that the size and type of different conductive particles have very limited influence on an ACA flip-chip joint. The ACA resin as well as the curing agent can affect the reliability of the joint. The same results can be applied for the failure analysis of ACA flip-chip technology.     

A study of electrically conductive adhesives as a manufacturing solder alternative

Soldering processes using tin/lead solder are standard interconnection technologies for electronic manufacturing. These processes are currently under threat from the Waste Electrical and Electronic Equipment and the Restriction of Hazardous Substances (RoHS) environmental directives, issued by the European Union in 2000. These directives explain that solder is to be free from lead by 1986, as lead has been recognized by the European Union as an environmentally harmful material. One solder alternative that has been investigated by the electronics industry is the area of electrically conductive adhesives (ECAs). This paper outlines the electrical and mechanical analysis of two isotropic conductive adhesives where the main properties of joint resistance and adhesive strength were examined before and after different environmental treatments. Joint resistance was measured with a four-probe tester and adhesive strength was examined with the use of shear testing. Cross-sectional and scanning electron microscopy analyses were used to determine problems such as oxidation and moisture absorption that may have an affect on the adhesive properties of the connection. An experimental design was carried out to examine the adhesives on a standard production line. Taguchi analysis was used to determine the build parameters required to produce an optimal adhesive joint. The results show that although ECAs can pass a functionality test, the electrical properties of ECAs are inferior to that of solder with ECAs having a high joint resistance. They also exhibit poor mechanical strength when shear or drop tested and illustrate that current visual inspection techniques used to examine solder joints are not applicable to conductive adhesives.     

Highly Conductive,Flexible, Polyurethane‐Based Adhesives for Flexible and Printed Electronics

Flexible interconnects are one of the key elements in realizing next‐generation flexible electronics. While wire bonding interconnection materials are being deployed and discussed widely, adhesives to support flip‐chip and surface‐mount interconnections are less commonly used and reported. A polyurethane (PU)‐based electrically conductive adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of ≈1.0 × 10^?5 Ω cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU‐ECA enables various interconnection techniques in flexible and printed electronics: it can serve as a die‐attach material for flip‐chip, as vertical interconnect access (VIA)‐filling and polymer bump materials for 3D integration, and as a conductive paste for wearable radio‐frequency devices.     

电子封装无铅化趋势及瓶颈

欧盟通过法令限制电子用品中铅等有害物质的使用,含铅电子产品不久将退出市场,电子封装的无铅化已成必然趋势。焊料的无铅化是无铅封装的关键,目前无铅焊料的研究集中在Sn基焊料和导电胶粘剂两个方向。文中介绍了三种典型无铅焊料体系的不足之处,以及银导电胶研究中的三个难题。另外,关于无铅焊料还没有一个统一的标准。     

Rational Design of a Printable,Highly Conductive Silicone‐based Electrically Conductive Adhesive for Stretchable Radio‐Frequency Antennas

Stretchable radio‐frequency electronics are gaining popularity as a result of the increased functionality they gain through their flexible nature, impossible within the confines of rigid and planar substrates. One approach to fabricating stretchable antennas is to embed stretchable or flowable conductive materials, such as conductive polymers, conductive polymer composites, and liquid metal alloys as stretchable conduction lines. However, these conductive materials face many challenges, such as low electrical conductivity under mechanical deformation and delamination from substrates. In the present study, a silicone‐based electrically conductive adhesive (silo‐ECA) is developed that have a conductivity of 1.51 × 10⁴ S cm^?1 and can maintain conductivity above 1.11 × 10³ S cm^?1, even at a large stain of 240%. By using the stretchable silo‐ECAs as a conductor pattern and pure silicone elastomers as a base substrate, stretchable antennas can be fabricated by stencil printing or soft‐lithography. The resulting antenna's resonant frequency is tunable over a wide range by mechanical modulation. This fabrication method is low‐cost, can support large‐scale production, has high reliability over a wide temperature range, and eliminates the concerns of leaking or delamination between conductor and substrate experienced in previously reported micro‐fluidic antennas.