共查询到18条相似文献,搜索用时 578 毫秒
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2.5D多芯片高密度封装中,多热源复杂热流边界、相邻热源热耦合增强,高精准的热阻测试与仿真模拟验证是封装热设计的关键。设计开发了基于百微米级发热模拟单元的热测试验证芯片(TTC),并基于多热点功率驱动电路系统和多通道高速采集温度标测系统,实现了2.5D多芯片实际热生成的等效模拟与芯片温度的多点原位监测。通过将实际热测试结构函数导入热仿真软件,实现了仿真模型参数的拟合校准,采用热阻矩阵法表征多芯片封装热耦合叠加效应,实现了多热源封装热阻等效表征。结果表明,多芯片封装自热阻和耦合热阻均随着芯片功率密度的增加而提高,芯片的热点分布对封装热阻值的影响更为显著,因此模拟实际芯片发热状态、建立等效热仿真模型是实现高精准封装热仿真和散热结构设计的关键。 相似文献
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SiC器件相比于Si器件,具有更高的功率密度,表现出高的器件结温和热阻。为了提高SiC功率模块的散热能力,提出了一种基于石墨嵌入式叠层DBC的SiC功率模块封装结构,并建立封装体模型。通过ANSYS有限元软件,对石墨层厚度、铜层厚度和导热铜柱直径进行分析,研究各因素对散热性能的影响,并对封装结构进行优化以获得更好的热性能。仿真结果表明,石墨嵌入式封装结构结温为61.675℃,与传统单层DBC封装相比,结温降低19.32%,热阻降低27.05%。各影响因素中石墨层厚度对封装结温和热阻影响最大,其次是铜柱直径和铜层厚度。进一步优化后,结温降低了2.1%,热阻降低了3.4%。此封装结构实现了优异的散热性能,为高导热石墨在功率模块热管理中的应用提供参考。 相似文献
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提出了一种具有强耦合作用的新型镇流电阻器网络,该镇流电阻器网络为树形拓扑结构,对其工作原理进行了详细分析.基于COMSOL MULTIPHYSICS软件的仿真结果表明:该镇流电阻器网络具有自适应功能,通过其耦合作用可以自动调整HBT并联阵列中晶体管的电流,使高温HBT的热量向低温HBT传递,获得更为均匀的温度分布,较好... 相似文献
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Codecasa L. D'Amore D. Maffezzoni P. Batty W. 《Components and Packaging Technologies, IEEE Transactions on》2004,27(1):87-95
In this paper, the multipoint moment matching method for model order reduction of discretized linear thermal networks is extended to distributed linear thermal networks. As a result, from the analytical canonical forms of distributed linear thermal networks, reduced thermal networks are derived analytically. This direct construction of the reduced network, from the exact analytical solutions, avoids the inevitable inaccuracies inherent in conventional surface and volume meshing. It allows nearly exact reduced thermal network construction by domain decomposition for arbitrarily complicated structures. 相似文献
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Polymer‐based thermal interface materials (TIMs) with excellent thermal conductivity and electrical resistivity are in high demand in the electronics industry. In the past decade, thermally conductive fillers, such as boron nitride nanosheets (BNNS), were usually incorporated into the polymer‐based TIMs to improve their thermal conductivity for efficient heat management. However, the thermal performance of those composites means that they are still far from practical applications, mainly because of poor control over the 3D conductive network. In the present work, a high thermally conductive BNNS/epoxy composite is fabricated by building a nacre‐mimetic 3D conductive network within an epoxy resin matrix, realized by a unique bidirectional freezing technique. The as‐prepared composite exhibits a high thermal conductivity (6.07 W m?1 K?1) at 15 vol% BNNS loading, outstanding electrical resistivity, and thermal stability, making it attractive to electronic packaging applications. In addition, this research provides a promising strategy to achieve high thermal conductive polymer‐based TIMs by building efficient 3D conductive networks. 相似文献