基于SolidWorks的真空灭弧室零件参数化系统的研究

以三维造型软件SolidWorks2005为平台，采用参数化的设计思想，以VisualBasic6．0为开发工具，建立了真空灭弧室零件参数化系统。系统给每一个零件创建了一个单独的设计界面，方便用户对真空灭弧室的每一个零件使用本系统进行参数的输入、确认，生成零件的三维模型，供用户后期的处理。通过使用本系统，必将极大地提高真空灭弧室设计过程中零件造型的速度，提高零部件设计的效率。     

大容量真空灭弧室的设计

结合一个具有典型参数的真空灭弧室,介绍了大容量的真空灭弧室的设计思路.     

轴承端盖零件的参数化系统设计及NC加工仿真

轴承端盖零件在机械行业中使用非常广泛,但是其种类繁多,设计及绘图非常烦琐,效率低下。从参数化的设计技术出发,基于Pro/ENGINEER软件平台,应用Pro/Toolkit和VC++对其进行二次开发,建立了轴承端盖零件三维参数化造型系统。该系统能够通过修改相应尺寸参数生成不同的零件模型,再根据生成的零件模型利用Pro/Engineer设计出对应的模具,并采用Mastercam软件对已经设计好的模具进行数控加工仿真。     

真空灭弧室的设计

真空灭弧室是真空开关的最重要的部件，被誉为真空开关的心脏，因此，真空灭板室的设计至为重要，本文介绍真空灭板室的最新设计，其中包括真空灭弧室的基本要求，触头材料及几何形状，波纹管，屏蔽，真空壳体的设计以及真空灭弧室的总体设计等。真空灭板室用于真空断路器，真空接触器以及真空负荷开关等，它对整机的机电性能影响很大，因此，精心设计和制造性能优异的真空灭弧室以满足各种使用场合不同用户要求，这是摆在设计和制造     

真空灭弧室的正确使用

讨论了真空灭弧室的使用环境、类别和参数选择的原则,提出了正确的安装和维护方法、使用寿命的判别依据,并推荐了使用真空灭弧室的电路保护措施.     

新一代真空灭弧室

在2003年国际配电网会议上，Alstom公司介绍了该公司使用“环保设计法”设计的新一代真空灭弧室。新一代真空灭弧室为VG型，其参数可达额定电压40．5kV，额定电流3150A，额定短路开断电流63kA。     

具有自诊断功能的真空断路器

本发明所提供的真空断路器每一相至少包括一只真空灭弧室，这些真空灭弧室装在一个密闭内，体和真空灭弧室外壳装有传感纤维，纤维连接到断路器外的光电器件上。     

中压真空开关领域的最新研究成果

本文从实际应用的角度出发，系统地论述了目前真空开关技术领域里的最新研究成果，包括对真空开关的两个主要部分的研究：1、操动机构部分（为开关操作提供动能的部分，称为操动机构，AM）。2、开断部分（真空灭弧室，VI）。对真空开关进行整体设计时，还必须考虑以上两个部分的相互依赖性。对于操动机构的研究，源于单稳态永磁操动机构（MMA）概念的应用。采用单稳态永磁操动机构的断路器，能将机构的零件数降至最少，从而最大限度地消除影响真空断路器可靠性的主要原因。对于真空灭弧室部分，主要研究集中在两个关键部位，一是触头系统，二是真空密封。触头系统中纵磁场的应用加上特殊触头材料的使用，显著地提高了灭弧室的开断性能使用寿命。但真空灭弧室的使用寿命还与它的波纹管性能密切相关，传统的密封波纹管采用锻压工艺制造，而采用特殊焊接工艺能改善波纹管的受力结构，焊接波纹管可实现非常可观的操作次数，显著延长灭弧室的使用寿命。操动机构和真空灭弧室这两个主要部件的研究成果，为研制新一代小型化、轻便型的真空断路器产品提供了必要的条件，进一步拓展了真空断路器的应用领域，成为中压开关技术领域发展方向的代表。     

真空断路器内部气体压强的诊断方法

真空断路器体操小且极少维修。然而使用几年后,需要对真空灭弧室进行检测以保证真空室内具有足够的真空度。超过一定阀值的内部压强的升高将会降低电流开断容量和绝缘性能。普遍的做法是在工厂内对新地真空灭弧室进行压强测量。常用的测量系统是众所周知的磁控管原理。然而,使用多年后的真空断路器中真空度检验和新生产出的真空灭弧室的压强测量需要不同的测试程序和诊断技术。真空断路器的使用者对适用于现场使用的能否检测出超过     

MEMS CAD系统 IMEE的研究和开发

IMEE是一个自主研发的MEMS CAD 系统,它包括节结点化的系统设计功能、工艺编辑、设计和三维模拟功能、参数化版图单元的版图设计功能等.该系统的最大特点是以工艺为主线,贯穿整个设计过程,重点解决MEMS设计与工艺脱节的问题,实现MEMS工艺设计和在线模拟.另外,该系统是跨平台的,即适用于UNIX也适用于WINDOWS操作系统,对其他MEMS CAD软件具有很好的兼容性,还支持用户自主扩展其他功能模块.     

CMP中真空供应系统的设计

针对CMP在低生产量及实验室条件下对真空供应系统的特别要求：（1）持续稳定的真空供应;（2）能够及时处理倒流液体;（3）真空电机不易长时间连续工作的要求,从气动性、硬件电路和软件流程图进行全面设计：增加独立的真空槽体和排液槽体,在正常运行情况下二者串联增加真空供应容积,并且自主收集倒流废液,而排液中依然可保证真空稳定供...     

线源金属原子蒸气发生装置的研制

介绍了一套线源金属原子蒸气发生装置。该装置由以下几部分组成 :不锈钢真空蒸发腔体 ;真空获得系统 ;电子枪 ;坩埚 ;能产生均匀磁场的磁极及线圈 ;推拉式内置工作平台 ;循环水冷却系统 ;电源、测量仪器及控制电路。经安装、调试和试运行试验 ,性能良好 ,已达到原设计指标。真空度达到 3× 10 - 3Pa ,对钆金属材料 ,能产生熔池的表面面积为 2 2mm× 4mm。利用此装置可开展电子枪蒸发、离子引出等多项实验研究。     

?620 mm口径地基反射镜组件优化设计

为了获得620 mm口径地基反射镜组件的最优设计方案,建立了反射镜及其支撑系统的参数化模型,并基于该模型对镜体厚度、支撑点位置和柔性支撑结构的设计参数进行多目标优化设计。首先,阐述了620 mm口径地基主反射镜支撑系统的运动学约束设计原理。然后,从理论角度推导出柔性支撑的柔度矩阵和结构热变形的等效力,建立了便于优化迭代的反射镜组件参数化模型,对比了参数化模型与体单元组成的详尽有限元模型在多种静力学工况下的RMS值和系统的前6阶模态值,计算结果误差在10%以内,验证了参数化模型的有效性。最后,基于径向基函数的近似模型理论,在Isight环境下对参数化模型进行多目标优化处理。得到了多目标优化的Pareto front前沿,目标值权衡处理后得到系统的最优的设计方案。提出的优化设计方法具有较好的工程适用性,可为同类型的反射镜组件优化设计提供参考。     

真空管雷达发射机监控系统模块化设计

本文介绍一种基于CPLD的真空管发射机监控系统的模块化设计.以某毫米波气象雷达为例,从系统设计、硬件及软件的电磁兼容性设计、可编程电路软件实现等方面详细介绍了监控系统,根据不同类型的真空管发射机,调整相应CPLD部分程序,即可完成监控系统的设计.实践应用结果证明它可以把真空管发射机的监控系统统一起来,实现模块化设计.     

Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach

The low cost tin–lead solders have been widely used in electronic industries for many years, but it is also well known to be one of the major factors for environmental pollution risk. Today, several kinds of lead-free soldered alloy have been developed as a choice for replacement of the high lead solders. However, because of the shortage of the facilitated experiment data for the thermal mechanical kinetics characterisations of these alloy, only very few parts of the parametric influence on reliability of the lead-free soldered flip chip package have been realized. In order to launch a further investigation on this issue, a numerical simulation-based parametric study on a flip chip is implemented in this paper by using the probabilistic designing approach. It combines the response surface strategy and the Monte Carlo random simulation method. The peak values of the inelastic strain and hydrostatic stress in solder joints, as well as the peel stress and the shear stress in the interface between silicon and underfill are investigated and used as response parameters. The response surface approximate functions between the output stress/strain values and the major packaging parameters are produced in the design of experiment (DOE) procedure of the numerical simulations. Statistical results of the parametric influence on lead-free soldered flip chip are also acquired by the Monte Carlo random simulation process. The results of our studies have shown that the different packaging parameters will influence the output stress/strain state of the lead-free soldered flip chip package in a very different way and degree. It is indicated that the substrate thickness is a major factor that should be taken into account for the lead-free package optimization design.     

Parametric Characteristic Analysis for Generalized Frequency Response Functions of Nonlinear Systems

In order to explicitly reveal the relationship between system frequency response functions and model parameters which define system nonlinearities, and consequently unveil a direct connection from model parameters to system frequency response characteristics, a parametric characteristic analysis approach is proposed for Volterra systems described by a nonlinear differential equation (NDE). The parametric characteristics of the generalized frequency response functions (GFRFs) for the NDE model are established, and some important properties are discussed, which can explicitly reveal what model parameters contribute and how these parameters affect the GFRFs. Based on the parametric characteristic analysis, it is demonstrated how the system frequency domain characteristics are related to the system time domain model parameters and how the output frequency response function can now be determined explicitly with a detailed polynomial structure. These new results provide a significant and novel insight into the analysis and design of nonlinear systems in the frequency domain. Several examples are included to illustrate the results.     

Design of a six DOF reconfigurable gripper for flexible fixtureless assembly

In this paper, the design and development of a six degrees-of-freedom (DOF) reconfigurable gripper for implementation of robot based flexible fixtureless assembly (FFA) is described. FFA is a novel technique in which traditional fixtures used, for example, in automotive body assembly industries, are eliminated by the use of several robots, with multifinger grippers that are used to grasp and assemble parts. The objective of this work is to design, build, and test a reconfigurable gripper for the purpose of FFA. The gripper developed in this work is capable of precisely grasping parts of different geometries, rigidly holding the parts in space, and choosing different grasping points while allowing sufficient clearance for welding gun access. The overall design procedure, which is subdivided into the conceptual, configuration and parametric design, includes wrench system determination, kinematic and mechanism design. A novel three-finger gripper is developed. Each finger has two movable joints and two point-contacts with which to grasp the part. Finite element analysis is used to simulate deflections of the gripper components under load to determine critical design parameters. Finally, the workspace and the kinematic model of the reconfigurable gripper have been developed. The gripper was fabricated and tested in grasping experiments using several automotive body panels. The reconfigurable gripper is shown to achieve the objectives set out in this work.     

浅析纯3G室内分布式系统的造价模型

本文从室内分布系统的主要组成出发,分成主干、平层、电梯、干放的需求分析4大部分,从设计理念上分析各自相应的设计方案,并在此基础上建立纯3G室内分布系统的造价模型.工程实践表明,该模型在站点信息准确的情况下,误差很小.     

参量放大过程中的振幅K次方压缩及其独立性研究

本文研究了简并参量放大过程中产生光场振幅K次方压缩的条件,结果表明,参量放大过程可使真空产生振幅K次方压缩。并通过对一类光场迭加态的研究,发现光场振幅K次方压缩与通常的二阶压缩以及由Hong-Mandel定义的高阶压缩不等价,是一种新的光场非经典效应。     

Forecasting electronic part procurement lifetimes to enable the management of DMSMS obsolescence

Many technologies have life cycles that are shorter than the life cycle of the product or system they are in. Life cycle mismatches caused by the obsolescence of technology can result in large life cycle costs for long field life systems, such as aircraft, ships, communications infrastructure, power plant and grid management, and military systems. This paper addresses Diminishing Manufacturing Sources and Materials Shortages (DMSMS) obsolescence, which is defined as the loss of the ability to procure a technology or part from its original manufacturer. Forecasting when technologies and specific parts will become unavailable (non-procurable) is a key enabler for pro-active DMSMS management and strategic life cycle planning for long field life systems. This paper presents a methodology for generating algorithms that can be used to predict the obsolescence dates for electronic parts that do not have clear evolutionary parametric drivers. The method is based on the calculation of procurement lifetime using databases of previous obsolescence events and introduced parts that have not gone obsolete. The methodology has been demonstrated on a range of different electronic parts and for the trending of specific part attributes.