共查询到20条相似文献,搜索用时 453 毫秒
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研究了水冷式散热方法对半导体冰箱制冷性能的提高.以常用的半导体小冰箱为实例,分别测试了在风冷、循环水和恒温水条件下小冰箱的制冷性能.结果表明,水冷制冷效果明显优于传统风冷式,且其制冷性能与冷却水的温度有关.水温越低,半导体制冷器的制冷效率越高,制冷温度越低.当冷却水温度为171 ℃时,水冷半导体小冰箱很快达到冷冻.建立了水冷式半导体冰箱的制冷模型,计算分析了在不同恒定冷却水温度下半导体制冷器冷端温度随时间的变化关系,并将理论结果与实验测量结果进行了拟合分析,发现理论模型与实验测量结果一致.研究结果为水冷式半导体冰箱制冷性能的提高提供了实验和理论依据. 相似文献
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对二甲醚(DME)用作冰箱制冷剂进行理论分析,比较制冷剂DME与冰箱制冷剂HFC134a和HC600a的基础热物理性质。对它们的冰箱标准工况制冷循环性能和变工况制冷循环性能进行理论计算及分析。分析表明:制冷剂DME的制冷性能与HFC134a和HC600a的制冷性能基本相似,性能系数(COP)却优于HFC134a和HC600a。并且,二甲醚具有环保、无毒和与材料兼容的特点。因此,二甲醚适合做新一代的冰箱制冷剂。 相似文献
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弹热制冷通过单轴应力驱动弹热工质发生相变而产生制冷作用,由于其具有较高的理论制冷效率且温室效应为零,因此被认为是一种替代传统蒸气压缩式制冷的新型固态相变制冷技术。本研究团队从提升弹热原型机紧凑型角度出发,已研发了两代基于拉伸镍钛丝的弹热冰箱。为进一步提升弹热冰箱的制冷性能,本文使用镍钛片替换镍钛丝作为弹热工质,设计了第三代弹热冰箱,并构建系统仿真模型。通过仿真预测了第三代弹热冰箱的性能,结果表明:相较于前两代弹热冰箱,性能均有提升。在绝热工况下,第三代弹热冰箱将能够实现12℃的制冷温差,在热端散热工况下,弹热冰箱能实现11.4℃的冷端温降以及零温差下0.59 W/g的制冷功率。通过增加拉伸应变、更换潜热更大厚度更薄的弹热工质以及增大电机转速,弹热冰箱在32℃环温条件下能够维持10.7℃的冷藏温度。 相似文献
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制冷压缩机是冰箱、空调器制冷系统的心脏,它的性能优劣直接影响到冰箱、空调器的性能。在60年代以前冰箱和空调器普遍使用往复式压缩机(冰箱多采用滑管式压缩机)。60年代开始旋转压缩机在美国研制成功,接着日本亦迅速发展 相似文献
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本文从热力学第二定律出发。给出了制冷循环的熵分析方法;分别以HFC—134a和CFC—12作为制冷工质。讨论了家用冰箱制冷循环的不可逆性;并根据熵分析结果,计算了循环的性能系数,与性能系数的理论值进行了比较。 相似文献
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吸收式制冷在冰箱制冷技术的产品中占有不太大的比例,各国产品数量约占其总产量的5~10%。欧洲现在每年生产的吸收式冰箱超过130万台。吸收式冰箱生产厂家大部分在西欧,主要厂家有瑞典的叶列克托柳克斯,瑞士的西比尔 相似文献
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湖北省黄石市制冷设备厂从意大利阿斯贝拉公司引进冷藏柜和大规格冰箱用“E”系列制冷压缩机全套生产加工设备,可生产7种规格压缩机,制冷量范围在147W至388W。该厂生产的QD90(E1116C)制冷压缩 相似文献
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《Cement and Concrete Composites》2001,23(2-3):237-246
This paper discusses the usefulness of image analysis techniques in order to assess the characteristics of the air-void system in concrete. Test results indicate that such a technique can correctly assess the air-void characteristics as defined in ASTM C 457 Standard test method. However, the accuracy of the test results is not significantly improved as compared with the manual technique and the image analysis method must be very carefully validated before being used as a routine procedure. Test results also indicate that the image analysis technique failed to correctly assess the size-distribution of air voids and, for that reason, this technique cannot be used to provide a better estimate of the real spacing of air voids than the commonly used ASTM C 457 spacing factor. 相似文献
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结合某型高推重比涡扇发动机试车合测试系统的研制,介绍了该系统的技术指标、数据采集技术、显示技术和试车仿真原理。为提高系统测量精度和使用性能,提出并应用了测量参数非线性修正、多模式显示、实时发动机参数整理等技术。 相似文献
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Impression creep tests have been performed on a 316-stainless steel at 600°C, for which conventional uniaxial creep test data are available. It is shown that the technique, based on the reference stress approach, for converting impression creep test data to equivalent uniaxial creep data, is accurate. The results show that the impression creep technique can be used for obtaining creep properties for materials which have high creep resistance at high temperature and test pressure conditions. The difficulties and limitations associated with such situations are described and methods of dealing with them are outlined. 相似文献
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This paper summarises the work undertaken to develop a salt deposition technique that can be utilised for hot corrosion and high temperature corrosion-fatigue testing of high performance alloys for gas turbine application. The optimisation process has yielded a new method of application of a sodium sulphate based solution to various test piece geometries. The technique employs the use of a micro-pipette to deposit a pre-calculated solution, consisting of methanol, water, Na2SO4–NaCl onto preheated specimens, in preparation for corrosion testing. This optimised salting technique has reduced the variability in the salting of test specimens, when compared with existing salt spray methods and has therefore enabled test repeatability along with an associated significant reduction in scatter within high temperature corrosion-fatigue results. 相似文献
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Shaft-loaded blister test technique is used as an effective quantitative tool to measure adhesion strength. Investigation on conductive adhesive was done by modified blister test. It is found that shaftloaded blister test can be a good solution for the debonding of thin film adhesion. The intrinsic stable interface debonding process has been proved an attractive alternative to the conventional adhesion measurement techniques. In our study, epoxy matrix adhesive was studied using blister test technique in comparison with the traditional test-lap shear test. Adhesion strength was studied as a function of surface treatment and the metallization of substrate. It was found that surface conditions of substrate have significant impact on adhesion behaviour. The oxidation of surface is responsible for the poor adhesion. Activating chemical treatment and Plasma cleaning on substrate surface has been found to be a way of dreamatically improving adhesion strength of electronic conductive adhesive. 相似文献
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Yurkin MA Maltsev VP Hoekstra AG 《Journal of the Optical Society of America. A, Optics, image science, and vision》2006,23(10):2592-2601
We propose an extrapolation technique that allows accuracy improvement of discrete dipole approximation computations. The performance of this technique was studied empirically on the basis of extensive simulations for five test cases using many different discretizations. The quality of the extrapolation improves with refining discretization, reaching extraordinary performance especially for cubically shaped particles. A 2-order-of-magnitude decrease of error is demonstrated. We also propose estimates of the extrapolation error, which are proven to be reliable. Finally, we propose a simple method to directly separate shape and discretization errors and illustrate this for one test case. 相似文献
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主要介绍20.4K低温氦气经过加温后给液氧贮箱增压的试验技术。对试验设备、试验方法、试验过程及试验结果做了简要的介绍。 相似文献
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三种方法检测水中总大肠菌群的比较探讨 总被引:2,自引:0,他引:2
采用多管发酵法、滤膜法及酶底物法三种方法同时检测水中总大肠菌群,并对结果进行比较分析,结果表明三种方法各有优劣,我们在实际检测工作中,应根据需要,采用不同的检测方法,使结果更加准确可靠。 相似文献
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The equipment and associated methodology of a new technique for checking the susceptibility of plastic-encapsulated ICs to moisture ingress is presented. The basis of the new technique is to immerse unbiased ICs in a salt solution and to subject them to high temperatures (in the range 120°C to 175°C) and to high pressures (2 to 9 atmospheres). At the highest temperature, results can be obtained within a few hours, although a 20 h test at 165°C is suggested as a screen for components. The test is extremely simple to carry out and a testing facility can be quickly established. Using CMOS components from five different vendors, good agreement has been obtained between the results from the new test and the results from a biased 85°C/85 percent RH test. 相似文献