电磁场对水平双辊铸轧Ti/Al/Cu复合板界面结合强度的影响

利用水平双辊铸轧技术制备Ti/Al/Cu复合板，通过在铸轧过程中施加脉冲电场和电磁振荡场，研究不同外场对铸轧复合板界面结合强度的影响。结果表明：电磁场对铸轧过程的稳定性没有影响。施加脉冲电场和电磁振荡场后，Ti/Al界面和Cu/Al界面的扩散层厚度增加，界面结合强度显著提高。施加电磁振荡场后，在铸轧区的液穴内产生交变的电磁体积力。在电磁体积力的作用下，铝熔体内部产生震荡效应并对金属带表面进行冲刷，使金属带表面新形成的晶核脱离。此外，震荡效应使得金属带与铝熔体接触处的温度梯度降低，凝固速度减慢从而延长固-液接触时间。这些作用使得熔体在金属带表面铺展湿润更加充分，促进了原子间的互扩散，从而产生了更多的冶金结合区域并增大了冶金结合的强度。     

铝-钢复合板结合界面研究

用显微硬度计、透射电镜、扫描电镜及能谱仪对铝-钢复合板结合界面进行了研究.结果表明,铝-钢复合板结合界面呈准正弦波形;结合界面两侧的铝元素和铁元素相互扩散,扩散的深度在微米数量级,爆炸后结合界面显微硬度增加,漩涡区的硬度增加为基体金属的3-6倍;结合界面由铝和铁的金属间化合物(FeAl、FeAl2、FeAl3、Fe24...     

铜铝层状复合材料的研究进展

介绍了铜铝层状复合材料的固-液复合法铸轧工艺特点,并从原子扩散和反应扩散两方面客观地分析了铸轧复合的界面结合机理。阐述了铜铝层状复合材料过渡层中金属间化合物的形成规律和铝基体化学成分变化对界面扩散的影响,从分子动力学模型和耦合模型的角度,综述了数值模拟技术在铜铝层状复合材料研究中的发展现状,提出其发展趋势。     

界面微合金化对钢/铝复合板性能影响的研究

研究了微合金化和温度对钢/铝复合板结合强度的影响.通过光学显微镜和X射线衍射仪观察、检测了结合界面的微观结构,并进行剥离强度的测试.结果表明钢铝复合界面扩散反应生成的化合物为Fe2Al5,温度对复合板的界面结合强度影响极大,界面微合金化能显著提高钢/铝复合板界面性能.     

热处理对冷轧铜铝复合板材界面扩散层结构的影响

用SEM、TEM、微区XRD等手段分析了复合板界面扩散层的形貌和结构,研究了热处理工艺对冷轧铜铝复合板材界面扩散层结构的影响,讨论界面扩散层形成规律。研究表明,冷轧铜铝复合板经过扩散热处理后,在复合界面形成具有扩散性质的界面层,随着热处理时间的延续,界面扩散层由最初的单层逐渐生长为三层,进一步延长热处理时间,界面层的层数不变,厚度略有增加;界面层含有q(Al2Cu)相、h2(AlCu)相和g2(Al4Cu9)相等金属间化合物;界面扩散层结构为:铝侧的Al-Cu固溶体与q(Al2Cu)相复合层、h2(AlCu)相层和铜侧的Cu-Al固溶体与g2(Al4Cu9)相复合层。     

固溶处理冷却方式对Cu/Al复合板界面微观组织的影响

利用光学显微镜、扫描电镜、X射线衍射等手段研究了冷却方式(水冷、空冷和炉冷)对Cu/Al复合板界面微观组织的影响,利用显微硬度仪测试了冷却方式对铸轧Cu/Al复合板力学性能的影响。实验结果表明:铸轧复合板界面形成Al_2Cu、AlCu、Cu_9Al_4、AlCu_3四种金属间化合物,经500℃×2 h固溶处理后,界面扩散层厚度增加,形成Al_2Cu、AlCu、Al_2Cu_3、Cu_9Al_4、AlCu_3五种金属间化合物。水冷和空冷界面扩散层产生孔洞,炉冷孔洞基本消失,解释了孔洞形成原因及变化过程,孔洞等缺陷会削弱界面层的结合强度。铸轧复合板界面扩散层厚度小、硬度低;经固溶处理后,界面扩散层厚度和硬度均增加,并随冷却速度的减小,厚度和硬度进一步增加。剥离过程中,铸轧复合板靠近Al基体断裂,而经固溶处理后的复合板断裂在界面扩散层。随冷却速度的下降,裂纹扩展能力减弱,过厚的金属间化合物不利于复合板的结合。     

铝/钢爆炸复合界面的显微分析

通过金相显微镜与电子探针对铝/钢复合板的界面进行了显微分析.结果表明,铝、钢爆炸复合过程中不易形成波状界面,复合界面呈平直状,界面处金属发生了冶金反应;爆炸焊接过程中,铝/钢复合界面处的基体金属发生了熔化,界面处的晶粒发生了严重的塑性变形,并且在铝/钢直接结合的界面两侧存在着距离约为5μm的扩散.分析认为爆炸焊接的工艺特点及铝、钢的物理性质决定了铝/钢界面的显微特点.并据此探讨了影响铝/钢复合强度的因素.     

高性能钛/铝复合板的关键制备技术

目的 研究TA2纯钛/6061铝合金复合界面的微观组织和力学性能,以及热处理对复合板组织和力学性能的影响.方法 在1×10-2 Pa高真空度下,对钛/铝复合坯进行搅拌摩擦焊封装,并在轧制温度为426℃和总压下率为80％下进行热轧复合;然后,对复合板进行T6热处理,即在540℃固溶及177℃时效5 h.随后,对热处理前后的复合界面进行扫描电镜和电子探针分析,明确元素扩散机制,并对复合板进行拉剪性能测试.结果 热轧后复合板的界面平直,无气孔、裂纹等缺陷,界面剪切强度为94.2 MPa.热处理后复合板铝基体力学性能提高,界面剪切强度达141.2 MPa.结论 采用真空轧制复合技术制备出了板形好、无缺陷的钛/铝复合板,经T6热处理后,钛/铝复合板的界面结合性能大幅改善,提高约50％.     

钛网添加对镁/铝复合板微观组织和力学性能影响研究

目的 有效抑制镁/铝复合板界面处金属间化合物的形成。以钛网为中间金属夹层,研究它对镁/铝复合板微观组织和力学性能的影响。方法 利用复合轧制技术制备以钛网为中间金属夹层的镁/铝-钛复合板,采用扫描电子显微镜(SEM)、电子背散射衍射仪(EBSD)、万能试验机等对复合板退火前后的微观组织和力学性能进行表征和分析,系统研究中间层钛网对轧制态和退火态复合板微观组织、织构、拉伸性能、界面结合强度的影响规律。结果 中间层钛网均匀分布在镁/铝-钛复合板界面处,钛网的添加能有效抑制复合板退火过程中镁-铝金属间化合物的连续生长,减少金属间化合物的数量。与镁/铝复合板相比,钛网的添加对轧制态和退火态复合板中镁层和铝层的平均晶粒尺寸和织构类型的影响较小。与镁/铝复合板相比,钛网的添加降低了轧制态复合板的界面剪切强度和延伸率,但极大提升了退火态复合板的界面剪切强度、拉伸强度和延伸率。结论 中间层钛网的添加可有效减少复合板界面处金属间化合物的数量,提升退火态复合板的综合力学性能。     

铝/钛/铝三层复合板热轧工艺及微观组织研究

钛/铝层状复合材料具有两种材料优异的特性,能够满足一些特殊工程需要。开发了热轧复合技术,成功制备了铝(1100)/钛(TA2)/铝(1100)三层复合板。研究了复合板轧制过程中的关键轧制技术参数(临界压下率和轧制复合工艺条件)。利用光学显微镜和SEM观察了钛/铝复合板及结合界面形貌,分析了不同退火温度对复合板力学性能的影响。基于实验结果,描述了影响复合板质量和有助于提高复合板结合强度的关键工艺过程。     

Interfacial Structure of Steel-Mushy Al-20Sn Bonding Plate

Fe-AI compound at the interface of steel-mushy AI-20Sn bonding plate was studied quantitatively. The relationship between ratio of Fe-AI compound at interface and bonding parameters (such as preheat temperature of steel plate, solid fraction of AI-20Sn slurry and rolling speed) was established by artificial neural networks perfectly. The results show that when the bonding parameters are 505℃ for preheat temperature of steel plate, 34.3% for solid fraction of AI-20Sn slurry and 10 mm/s for rolling speed, the reasonable ratio of Fe-AI compound corresponding to the largest interfacial shear strength of bonding plate is obtained. Its value is 72%. This reasonable ratio of Fe-AI compound is a quantitative criterion of interfacial embrittlement, that is, when the ratio of Fe-AI compound at interface is larger than 72%, interfacial embrittlement will occur.     

Study on Steel-Mushy Al-20Sn Alloy Bonding

Steel-mushy Al-20Sn alloy bonding was studied for the first time. The relationship model about preheat temperature of steel plate, solid fraction of Al-20Sn alloy mushy, rolling speed and interfacial shear strength of bonding plate could be established by artificial neural networks perfectly. This model could be optimized with a genetic algorithm. The optimum bonding parameters were: 505℃ for preheat temperature of steel plate, 34.3% for solid fraction of Al-20Sn alloy mushy and 10 mm/s for rolling speed, and the largest interfacial shear strength of bonding plate was 71.2 MPa.     

三价铈离子掺杂氯化钾的光致发光性能

采用水热蒸发法制备了KCl∶Ce3+荧光粉。测量并分析了材料在室温下的真空紫外激发光谱及相应的发射光谱。结果表明激发谱显示6个峰,峰位分别为149、194、206、219、233和251nm。其中149nm的激发峰是基质吸收引起的;194、206、219、233和251nm是Ce3+离子的4f→5d跃迁引起的。发射峰显示双峰结构,峰位分别是311和326nm。此峰对应于Ce3+离子的5d→4f(2F5/2,2F7/2)跃迁。     

Influence of Solid Fraction on Gravity Segregation of Sn in Al-20Sn Alloy Casting

The influence of solid fraction of Al-20Sn alloy mushy on gravity segregation of Sn in casting was studied and, the relationship between solid fraction and the temperature of alloy mushy and that between solid fraction of alloy mushy and size of Sn particle in ingot were determined. The results show that the relationship between solid fraction and the temperature of alloy mushy was fs=1683-4.86t+0.0035t2. The extent of gravity segregation of Sn in casting reduced gradually with the increasing of solid fraction of alloy mushy. When solid fraction of alloy mushy was arger than 40%, the gravity segregation of Sn in casting could be removed basically, and the relationship between solid fraction of alloy mushy and size of Sn particle in ingot was s=-0.64fs+70.8.     

Influence of solid fraction on gravity segregation of Sn in A1-20Sn alloy casting

1. IntroductionIn Al-Sn alloys Sn has excellellt lubricating property and Al has perfect thermal conductivity, so AISn alloy is the ideal material of lubricating layer ofsteel-backed bearing[1]. If Sn particles distribute inAl substrate evenly, Sn can play a lubricating role atthe whole colltact surface and reduce the abrasion ofAl substrate, and the friction heat can be led out byAl substrate rapidly. Otherwise, if Sn particles distribute in Al substrate unevenlyt in Sn--lean region,Al …     

Lithium–Graphite Paste: An Interface Compatible Anode for Solid‐State Batteries

All‐solid‐state batteries (ASSBs) with ceramic‐based solid‐state electrolytes (SSEs) enable high safety that is inaccessible with conventional lithium‐ion batteries. Lithium metal, the ultimate anode with the highest specific capacity, also becomes available with nonflammable SSEs in ASSBs, which offers promising energy density. The rapid development of ASSBs, however, is significantly hampered by the large interfacial resistance as a matched lithium/ceramic interface that is not easy to pursue. Here, a lithium–graphite (Li–C) composite anode is fabricated, which shows a dramatic modification in wettability with garnet SSE. An intimate Li–C/garnet interface is obtained by casting Li–C composite onto garnet‐type SSE, delivering an interfacial resistance as low as 11 Ω cm². As a comparison, pure Li/garnet interface gives a large resistance of 381 Ω cm². Such improvement can be ascribed to the experiment‐measured increased viscosity of Li–C composite and simulation‐verified limited interfacial reaction. The Li–C/garnet/Li–C symmetric cell exhibits stable plating/striping performance with small voltage hysteresis and endures a critical current density up to 1.0 mA cm^?2. The full cell paired with LiFePO₄ shows stable cycle performance, comparable to the cell with liquid electrolyte. The present work demonstrates a promising strategy to develop ceramic‐compatible lithium metal‐based anodes and hence low‐impedance ASSBs.     

Failure analysis of a martensitic stainless steel (CA-15M) roll manufactured by centrifugal casting. Part I: Material and fractographic characterization

The failure analysis of a martensitic stainless steel (CA-15M) roll manufactured by centrifugal casting and used in cast glass rolling was carried out by means of traditional characterization techniques (optical metallography, SEM, EDX microanalysis, tensile testing and XRD). The roll was in the as-cast condition and its microstructure featured large proportion of δ ferrite (between 20% and 27%) in a martensitic (α′) matrix, with the δ/α′ interfaces presenting an intergranular network of M₂₃C₆ carbides. The crack propagation began in the internal surface of the roll, with δ/α′ intergranular and transgranular cleavage in the “equiaxed region” of the casting, progressing to δ/α′ intergranular ductile fracture in the “columnar” and “chilled regions”. Tensile thermal stresses in the internal surface of the roll associated with microstructural embrittlement (network of interfacial carbide and microporosities) are thought to be the main causes for the premature failure of the roll. Finally, materials selection was performed to replace the CA-15M stainless steel with another class of stainless steel for centrifugal casting.     

Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process

The early interfacial reaction and premelting characteristics of the Sn/Cu and Sn/Ag soldering systems, and the formation and morphology transition of interfacial intermetallic compounds in the two systems during the reflow soldering process were investigated by using a differential scanning calorimeter. Results show that the initial interfacial eutectic reaction arising from atomic interdiffusion in solid-state Sn/Cu and Sn/Ag systems results in the premelting at each interface of the two systems at a temperature 4.9 and 10.6?°C respectively lower than the actual melting point of pure tin, and consequently both of the Sn/Cu and Sn/Ag soldering systems exhibit morphology change of the intermetallic compound (IMC) as the solder experiences a transition from solid-state to liquid-state in a very small temperature range. The change in the interfacial energy between the solid (or liquid) Sn-rich phase and IMC phase is the essential factor leading to the morphology transition of the interfacial IMC in the Sn/Cu and Sn/Ag soldering systems.     

层合板层间断裂分析的组合界面单元及其特性

提出了一种由刚性元和零厚度的内聚力单元组合而成的新型界面单元,该界面单元嵌在板壳结构界面之间,可用来模拟界面损伤的起始和演化,能考虑板壳的平动和转动对分层损伤的作用。该界面单元具有有限厚度,八个结点,每个结点有五个自由度,通过刚性元将板壳单元结点的位移和结点力转换到内部零厚度的内聚力单元上,界面损伤通过内聚力单元的损伤演化体现出来。采用板壳单元和新型界面单元建立有限元模型,对混合弯曲(MMB)试验和双悬臂梁(DCB)弯曲试验进行了计算模拟,计算结果能很好地模拟结构的界面损伤过程。相比传统的用内聚力单元和三维实体单元组成的模型,建模方便,在精度相当的前提下,可以使单元尺寸增大一倍,减少裂尖内聚力区域(cohesive zone)内的单元数量,缩小计算规模,提高计算效率。     

常规铸造工艺条件下SiCp/Al-Si复合材料中的界面反应

采用搅拌复合法制备了10%SiC／Al—5Si—Mg，10%SiC／Al—7Si—Mg(体积分数)复合材料，研究了在常规铸造工艺条件下重熔后复合材料中的界面反应。通过透射电镜和能谱分析可知，SiC界面基本上都是单一的SiC／Al及SiC／Si界面，部分界面上有MgAl2O4颗粒相形成，由于基体合金中Si的存在，生成Al2C3的有害界面化学反应得到了抑制。对不同文献中抑制Al4C3产生所需临界Si含量实验测定结果的差异进行了分析。