Mass spectral studies of some epoxy resin precursors

The mass spectra were determined of three epoxy resin precursors: N,N-bis-(2,3-epoxypropyl)-N′,N′-dimethyl-4,4′-diaminodiphenylenemethane (G2A); N,N′-bis-(2,3-epoxypropyl)-N,N′-dimethyl-4,4′-diaminodiphenylene methane (G2S); and N′,N′,N′,N′-tetrakis-(2,3-epoxypropyl)-4,4′-diaminodiphenylene methane (TGDDM); and of three related model compounds: N,N-dimethylaniline (DMA); N-methyl-N-glycidylaniline (MGA) and N,N-digrycidylaniline (DGA). The results helped to confirm the structure of the resin precursors and are intended to pave the way for subsequent thermal degradation studies of cured resin samples. Despite the similarity in chemical structure of the compounds studied there are quite large differences in the mass spectral results obtained.     

Epoxy systems with improved water resistance,and the non-fickian behaviour of epoxy systems during water ageing

N,N-Bis (2, 3-epoxypropyl) aniline and 4,4′-methylenebis-[N,N-bis (2,3-epoxypropyl) aniline] containing bromo, chloro, trifluoromethyl or polyfluoroalkoxy substituents were synthesised and cured with aromatic diamines in order to investigate the effect of substituted halogen on water absorption. Significant improvements were achieved: thus use of 4,4′-methylenebis-[N, N-bis (2, 3-epoxypropyl)-3, 5-dichloroaniline] and 4,4′-methylenebis-[N,N-bis (2,3-epoxypropyl)-3-(trifluoromethyl) aniline] instead of 4,4′-methylenebis-[N,N-bis (2,3-epoxypropyl) aniline] reduced the water absorption by about a half. Departures from Fickian behaviour were observed during water immersion ageing at room temperature and were a general feature of the epoxy systems examined. Plots of water absorption against the Fickian parameter (√t/d) usually showed at least mild sigmoid character and were not independent of specimen thickness. Further, slow continued uptake of water occurred during long-term ageing, and evidence is provided that the associated network distortions are reversible.     

Structure and properties relationships of epoxy resins part 1: Crosslink density of cured resin: (I) model resins synthesis

Two model epoxy resin precursors based on the N-glycidyl derivatives of 4.4'-diaminodiphenylene methane (DDM) were prepared: N,N bis-(2,3-epoxypropyl)-N′,N″-dimethyl-4.4'-diaminodiphenylene methane (G2A); N.N′ bis-(2,3-epoxypropyl)-N,N′-dimethyl-4,4'-diaminodiphenylene methane (G2S). To prepare these, aniline or N-methyl aniline was reacted with epichlorohydrin, using acetic acid as catalyst. The products were coupled via acid-catalysed condensations in the presence of formaldehyde or with N,N-dimethylaminobenzyl alcohol. The coupled chlorohydrins formed were then dehydrochlorinated to form the desired product. All reactions were monitored and purifications of the crude products were effected by high pressure liquid chromatographic techniques. The products were characterised by proton and carbon-13 nuclear magnetic resonance, infrared and mass spectroscopy, elemental and titrametric analysis. Results were compared with those obtained for tetra-N-glycidyl-4,4'-diaminodiphenylene methane (TGDDM). All the data confirmed the structures of the model resins. These, together with TGDDM. will be used to prepare epoxy resin networks of controlled crosslink density and chemical homogeneity.     

Some Effects of Structure,Composition and Cure on the Water Absorption and Glass Transition Temperature of Amine-cured Epoxies

The effect of structure, composition, and cure on the water absorption and T_g of amine-cured epoxies was investigated. Water absorption is considered to depend on the polar group concentration and type, and on the amount of free volume in the polymer network. The contribution of polar groups in terms of their hydrogen bonding capabilities is reflected by the effect of meta (with respect to the diglycidylamino group) chloro, bromo, and methyl substituents on the water absorption of bis[N,N-bis(2,3-epoxypropyl)-4-aminophenyl]methane cured with 4,4′-diaminodiphenylsulphone. The observed water absorptions are in line with the expected electronic effects of the substituents on the basicity of the amine group. Substituents in the ortho position adversely affect the hydrogen bonding capability of the amine group and limit the extent of reaction by steric interference. Examination of four O-glycidyl systems (Epon 825, Epon 1153/114, Epon 1031, and Dow XD-7342) cured with 4,4′-diaminodiphenylsulphone has revealed quite a good linear relationship between the equilibrium water absorption and T_g for a particular hardener concentration irrespective of the epoxy compound employed. Networks ranged from those of low T_g (110°C) and water absorption (1.3%) to those of high values (300°C and 6.1%) for these parameters. Differences in slope for low (50-65%) and high (100%) stoichiometric amounts of hardener are attributed to differences in the relative importance of OH/epoxy and NH₂ or NH/epoxy reactions. The theoretical polar group concentrations and polar group type are much the same for these different systems and thus, free volume is considered to be a function of T_g and to play an important part in determining the level of water absorption.     

Forced torsional properties of PMR composites with varying nadic ester concentrations and processing histories

PMR polyimide resin was prepared from 4,4′-methylenedianiline (MDA), the dimethyl ester of 3,3′,4,4′- benzophenonetetracarboxylic acid (BTDE) and the monomethyl ester of 5-norbornene-2,3-dicarboxylic acid (NE). The NE group serves as a chain terminator and crosslinking site. PMR/Celion 6000 composites were fabricated from resins having varying NE concentrations using two molding processes, and the laminates characterized in forced torsion. Glass transition temperatures (T_g) of 360–390°C were observed in the crosslinked resins, as compared with the literature value of 284°C reported for the uncrosslinked systemT_g did not decrease with decreasing NE concentrations over the range from 2.0 to 1.25 moles. Stoichiometry, within the range studied, showed little influence on shear properties; however, a 25% variation in matrix shear modulus with processing was observed. The G₁₂ values determined in forced torsion were in excellent agreement with those reported from tensile tests of ±45° laminates. A branching and possible secondary crosslink mechanism is proposed based on dynamic mechanical behavior and infrared spectra of the composites.     

Epoxy resin based on 4,4′-dihydroxydiphenysulfone. I. Synthesis and reaction kinetics with 4,4′-diaminodiphenylmethane and 4,4′-diaminodiphenylsulfone

Epoxy resins based on 4,4′-dihydroxydiphenylsulfone (DGEBS) and diglycidyl ether of bisphenol A (DGEBA) were prepared by alkaline condensation of 4,4′-dihydroxydiphenylsulfone (bisphenol S) with epichlorohydrin and by recrystallization of liquid, commercial bisphenol A-type epoxy resin, respectively. Curing kinetics of the two epoxy compounds with 4,4′-diaminodiphenylmethane (DDM) and with 4,4′-diaminodiphenylsulfone (DDS) as well as T_g values of the cured materials were determined by the DSC method. It was found that the ? SO₂? group both in the epoxy resin and in the harener increases T_g values of the cured materials. DGEBS reacts with the used hardeners faster than does DGEBA and the curing reaction of DGEBS begins at lower temperature than does the curing reaction of DGEBA when the same amine is used. © 1994 John Wiley & Sons, Inc.     

Glass fiber-reinforced epoxy composites

Glass fiber-reinforced epoxy composites were prepared from the matrix resins tetraglycidyl diaminodiphenylmethane

1 Systematic name: N,N,N′,N′-Tetrakis(2,3-epoxypropyl)-4,4′-diaminodiphenylmethane.

(TGDDM) and tetraglycidyl bis(o-toluidino)-methane

2 Systematic name: N,N,N′,N′-Tetrakis(2,3-epoxypropyl)-4,4′-bis(o-toluidino)methane.

(TGMBT) using various amines like 4,4′-diaminodiphenylmethane (DDM), 4,4′-diaminodiphenylsulfone (DDS) and diethylene triamine (DETA) as curing agents. The fabricated laminates were evaluated for their mechanical and dielectrical properties and chemical resistance. The composites prepared using an epoxy fortifier (20 phr) showed significant improvement in the mechanical properties.     

The role of network architecture on the glass transition temperature of epoxy resins

A series of epoxy networks were synthesized in which the molecular weight between crosslinks (M_c) and crosslink functionality were controlled independent of the network chain backbone composition. The glass transition temperature (T_g) of these networks was found to increase as M_c decreased. However, the rate at which T_g increased depended on crosslink functionality. The dependency of M_c on T_g is well described by two models, one based on the concept of network free volume while the other model is based on the principle of corresponding states. Initially, neither model could quantitatively predict the effect of crosslink functionality in our networks. However, our tests indicated that both the glass transition and the rubbery moduli of our networks were dependent on M_c and crosslink functionality, while the glassy state moduli were independent of these structural variables. The effect of crosslink functionality on the rubbery modulus of a network has been addressed by the front factor in rubber elasticity theory. Incorporation of this factor into the glass transition temperature models allowed for a quantitative prediction of T_g as a function of M_c and crosslink functionality. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 66: 387–395, 1997     

Reversible crosslinking in epoxy resins. II. New approaches

Epoxy resins of varying epoxy equivalent weight were crosslinked with 4,4*-dithiodianiline (DTDA) at a 2/1 mole ratio. Resin of equivalent weight 190 (Epon 828) was cured with DTDA at mole ratios varying from 2/1 to 1.25/1. Properties of cured resins were evaluated and their reduction was investigated. Under the conditions used, reduction to the point of complete solubilization was possible providing crosslink density did not exceed a threshold value tentatively established as M_c = 400 ?; 500. Recurring of reduced resins was accomplished by oxidation and by reaction of thiol groups with polyfunctional reagents, including bismaleimides and polyepoxides.     

Studies on the curing kinetics and thermal stability of the novel tetrafunctional epoxy resin N,N,N′N′-tetrakis(2,3-epoxypropyl)-4,4′-(1,4-phenylenedioxy)dianiline

A novel tetrafunctional epoxy resin, namely N,N,N′N′-tetrakis(2,3-epoxypropyl)-4,4′-(1,4-phenylenedioxy)dianiline, has been synthesized. The curing kinetics has been studied by differential scanning calorimetry (DSC) using various amine curing agents. Thermal stabilities of the cured products have been investigated by thermogravimetric (TG) analyses. The overall activation energies for the curing reactions are observed to be in the range 63.6–196.7 kJ·mol^–1. The cured products have good thermal stability.     

Biobased thermosetting resins composed of L‐lysine methyl ester and bismaleimide

Lysine methyl ester (LME), which was generated in situ by the reaction of lysine methyl ester dihydrochloride and triethylamine in dimethyl sulfoxide (DMSO), was prepolymerized with 4,4′‐bismaleimidodiphenylmethane (BMI) at 80°C for 2 h in DMSO. Then, the formed prepolymer was precipitated in water. The obtained LME/BMI prepolymers with molar ratios of 2:2, 2:3, and 2:4 were compression‐molded at a final temperature of 230°C for 2 h to produce cured lysine methyl ester/4,4′‐bismaleimidodiphenylmethane resins (cLBs; cLB22, cLB23, and cLB24, respectively). Fourier transform infrared (FTIR) analyses revealed that the Michael addition reaction of amino groups to the C?C bonds of the maleimide group occurred in addition to the homopolymerization of the maleimide group. The glass‐transition temperature (T_g) and 5% weight loss temperature (T₅) of the cured resin increased with increasing BMI feed content, and cLB24 showed the highest T_g (343°C) and T₅ (389°C). The flexural strengths (131–150 MPa) and moduli (3.0–3.6 GPa) of the cLBs were comparable to those of the conventionally cured resins of BMI and 4,4′‐diaminodiphenylmethane. Field emission scanning electron microscopy analysis revealed that there was no phase separation for all of the cured resins. Although cLB23 and cLB24 were not biodegradable, cLB22 had a biodegradability of 8.5% after 30 days in an aerobic aqueous medium containing activated sludge. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40379.     

Trifunctional quinoxaline-based maleimide and its polymer alloys with benzoxazine: Synthesis,characterization, and properties

Novel quinoxaline-based trismaleimide (2,3-di[3-maleimido]phenyl-6- maleimidoquinoxaline, namely TQMI) and its polymer alloys with 3-phenyl-3,4-dihydro-2H-1,3-benzoxazine (P-a) were successfully prepared and characterized. Differential scanning calorimetry investigation of TQMI exhibited distinct double exothermic peaks, which implied that the curing behavior of different type of maleimide group was discrepant. The curing temperature of P-a/TQMI prepolymers was lower than that of both neat TQMI and P-a monomer. The temperatures at 5% (T₅) and 10% (T₁₀) weight loss and the char yield (Y_c) of cured TQMI at 800°C reached 513°C, 524°C, and 63.5%, respectively, which were much higher than the record of traditional 4,4′-bismaleimideodiphenylmethane (BMDPM) resin as well as most of other reported bismaleimide resins. Moreover, the addition of TQMI enhanced thermal stability, glass transition temperature (T_g), and limiting oxygen index of benzoxazine resin dramatically. Attractively, the T_g value of P-a/TQMI copolymer at 30 wt% TQMI loadings was approximately 20°C higher than that of P-a/BMDPM copolymer owing to the bulky quinoxaline group.     

Phase separation of poly(ether sulfone imide) modified epoxy resin

Poly(ether sulfone imide)s (PEI) with molecular weight M_n ∼ 10⁴ were synthesized from 3,3′,4,4′-benzophenone tetracarboxylic dianhydride and amine terminated poly(ether sulfone) having molecular weights ranging from M_n ∼ 400 to M_n ∼ 4000. Thus, the PEIs had the same molecular weight but various imide and ether sulfone contents. The PEIs were mixed with a stoichiometric mixture of diglycidyl ether bis-phenol-A (DGEBA)/diamino diphenyl sulfone (DDS). The effect of PEI on the curing reaction of DGEBA/DDS and the morphology of the polymer blend were studied by differential scanning calorimetry (DSC) and optical microscopy. In the DGEBA/DDS/PEI blend with a fixed PEI molecular weight and PEI concentration but with various imide content, the experimental data revealed the PEI with a higher content of ether sulfone had a lower T_g and a better compatibility with solvents and epoxy resins; the curing reaction rate of DGEBA/DDS/PEI was faster for PEI with a higher imide content; the DSC data of cured DGEBA/DDS/PEI showed two T_gs, indicating phase separation between PEI and cured epoxy resins; and the data of optical microscopy showed that the compatibility of PEI with epoxy resins increased with the content of ether sulfone in PEI. © 1996 John Wiley & Sons, Inc.     

Shrinkage and internal stress during curing of epoxide resins

The shrinkage and internal stress of bisphenol-type epoxide resins cured with aliphatic α,ω-diamines, H₂N? (CH₂)_m′? NH₂(m′ = 2, 4, 6, and 12), were investigated by measuring the change of density and the strain of the steel ring embedded in the cured resins. Internal stress was found to be induced by the shrinkage occurring in the cooling process from the glass transition temperature (T_g) to room temperature. Shrinkage and internal stress increased with increase in the concentration of network chains and T_g of the cured systems, and then with a decrease in m′ of the curing agents. It appears that the reductions in the concentration of network chains and T_g were necessary to reduce the shrinkage and internal stress caused by the curing.     

Toughening of Epoxy Resins with Thermoplastics: 3. An Investigation into the Effects of Composition on the Properties of Epoxy Resin Blends

Three different epoxy resins, based on the diglycidylether of bisphenol A (DGEBA), triglycidyl-p-aminophenol (TGPAP) and tetra-glycidyldiaminodiphenylmethane (TGDDM), which are di-, tri- and tetrafunctional, respectively, were mixed in varying proportions and cured with both 3,3′-diaminodiphenylsulphone and 4,4′-[1,4-phenylene(1-methylethylidene)]bis(2,6-dimethylbenzenamine) (EPON 1062-M from Shell). All the blends could be satisfactorily cured and gave homogeneous materials. The dynamic mechanical and fracture properties of the cured materials were measured. It was found that the glass transition temperature varied with composition systematically, whereas values of the strain energy release rate (G_1c) and the stress intensity factor (K_1c) showed relatively small variations with the blend composition. Toughened epoxy resins were prepared by adding a polyetherimide (PEI), in varying proportions, to the resin mixture. The ‘toughenabilities’ of different resins, or resin mixtures, were compared. This showed that the 75/25 TGPAP/DGEBA resin mixture was the most toughenable. Adding 20% of PEI led to a more than three-fold increase of the G_1c value. © of SCI.     

Amorphous polyamide coating resins from sugar-derived monomers

In this article, the synthesis of bio-based polyamides for powder coating applications and their evaluation in a solventborne coating system are reported. The M _n values of the resins were between 3000 and 4000 g mol^?1 and the resins displayed T _g values from 60 to 80°C. Both amine and carboxylic acid functionalities (total ~0.6 mmol g^?1) were introduced for curing purposes. The resins were cured with triglycidyl isocyanurate (TGIC) or N,N,N′,N′-tetrakis(2-hydroxyethyl)adipamide (Primid XL-552). The curing reaction was followed using rheology which indicated that TGIC achieved higher reaction rates and higher gel contents. The DSC analysis of the cured disks showed that all cured samples were amorphous as is desired for the targeted coating application. The resins required a curing temperature higher than 150°C. Aluminum panels were coated using a solventborne approach and the coatings were cured at 180°C during 1 h. Dewetting was observed on all panels. Network formation was adequate for an amine-functional resin cured with TGIC as indicated by solvent resistance testing. In conclusion, the developed bio-based polyamide resins are promising materials to be used as binder resins in powder coating applications.     

Structure and viscoelastic properties of epoxy resins prepared from four-nuclei novolacs

The relation between the structure and the viscoelastic properties of seven kinds of epoxy resins was studied. Seven tetraglycidylethers were synthesized from four-nuclei novolacs in which the positions of methylene linkage or number of kind of substituents were different. These epoxy compounds were cured with diaminodiphenylmethane as a hardener. From the viscoelastic properties of the fully cured resins with the hardener, characteristic properties such as glass transition temperature (T_g), average molecular weight between crosslinking points (M̄_c), and front factor (ϕ) were obtained. It was concluded that higher linearity in the main chain of epoxy resins gave a cured resin with a higher T_g, a smaller M̄_c, and a larger ϕ.     

Curing behavior of epoxy resin having hydroxymethyl group and different molecular weight distribution

o-Cresol novolac-type epoxy resins having hydroxymethyl group were synthesized. These epoxy resins were cured with a mixture of 4,4′-diaminodiphenylmethane and m-phenylenediamine (molar ratio, 6:4) as a hardener. Effects of molecular weight distribution of epoxy resins on curing behavior were studied. Curing behavior of epoxy resins with hardener were examined by differential scanning calorimetery (DSC), and cure reaction parameters were obtained. Viscoelastic properties of the cured epoxy resins were studied by dynamic mechanical analyzer. It was found that the lower the average molecular weight of the epoxy resin, that is, the higher the concentration of hydroxymethyl group, the shorter the onset time of exothermal reaction, the higher the rate constant (k), and the lower the activation energy (E_a) were. It was also found that glass transition temperature (T_g) of fully cured epoxy resins was higher than those of fully cured general novolac-type epoxy resins.     

Properties of crosslinked polyurethanes synthesized from 4,4′‐diphenylmethane diisocyanate and polyester polyol

Polyurethanes were synthesized using the high functional 4,4′‐diphenylmethane diisocyanate (MDI), polyester polyol, and 1,4‐butane diol. The synthesized polyurethanes were analyzed using differential scanning calorimeter (DSC), dynamic mechanical thermal analysis (DMTA), Fourier transform infrared (FTIR) spectrometer, and swelling measurement using N,N′‐dimethylformamide. From the result of thermal analysis by DSC and DMTA, single T_gs were observed in the polyurethane samples at all the formulated compositions. From this result, it is suggested that the polyurethanes synthesized in this study have crosslinked structure rather than the phase‐separated segmented structure because of the high functionality (f = 2.9) of the MDI. By annealing the polyurethane samples using DSC, the T_gs were increased by 4.7∼16.0°C at the various annealing temperatures. From the results of FTIR and swelling measurement of polyurethanes, it is suggested that the increase of T_g of the polyurethanes by annealing is not due to increase of the hydrogen bond strength but mainly due to the increase of the crosslink density. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 78: 624–630, 2000     

Curing behavior,thermal, and mechanical properties of epoxy resins cured with a novel liquid crystalline dicarboxylic acid curing agent

A novel di‐carboxylic acid curing agent (DACA) was successfully synthesized and cured with three different epoxy resins: glycidyl end‐capped poly(bisphenol‐A‐co‐epichlorohydrin) (pDGEBA, M_n = 377), N,N‐diglycidyl‐4‐glycidyloxyaniline (TGAP), and 4,4′‐methylenebis(N,N‐diglycidylaniline) (TGDDM). The cured epoxy exhibited excellent thermal stability, which was indicated by high initial degradation temperature (T_id) and char yield. The T_id values of cured epoxy were in the range of 327–338°C, and the char yields increased with increasing epoxy functionality. The char yields of cured DACA/pDGEPA, DACA/TGAP, and DACA/TGDDM samples were 21.1, 60.4, and 66.9%, respectively. In addition, the cured epoxy samples also showed low coefficients of thermal expansion and high storage moduli (E′), which were around 60 ppm/°C and 2800 MPa, respectively. The failure surfaces were ductile and rough, so the cured epoxy samples are expected to have high fracture toughness and impact strength. POLYM. ENG. SCI., 54:695–703, 2014. © 2013 Society of Plastics Engineers