MoNb薄膜直流磁控溅射制备及性能研究

以Mo-10%Nb(10%为粒子数分数)合金为靶材,采用直流磁控溅射法在钠钙玻璃基板上制备了MoNb薄膜。采用台阶仪、四探针电阻仪和AFM分别测试了Mo Nb薄膜的厚度、方块电阻及表面形貌。研究了功率密度、工艺气压及衬底温度对MoNb薄膜性能及其生长特性的影响。实验结果表明:功率密度增加2倍时,MoNb薄膜的沉积速率提升1.8倍,而电阻率降低2.3倍;工艺气压增大4倍时,MoNb薄膜的沉积速率提升1.5倍,其电阻率增大13倍。同时发现:衬底温度增加了135℃时,MoNb薄膜的表面粗糙度增加0.567nm,颗粒大小增加3.36nm。     

ZnO薄膜的射频磁控溅射制备及性能研究

采用射频磁控溅射法在玻璃衬底上制备出高质量的ZnO薄膜.对薄膜的结构和性能进行了研究.所制备的ZnO是具有六角纤锌矿结构的多晶薄膜,最佳择优取向为(002)方向.ZnO薄膜的霍尔迁移率和载流子浓度分别为8×104m2/(V·s)和11.3×1020 cm-3.     

直流磁控溅射法制备ZnO:W透明导电薄膜及其性能表征

利用直流磁控溅射法成功地在室温玻璃衬底上制备出了电阻率低、透光率高的掺钨氧化锌（ZnO:W）透明导电薄膜。沉积压强在12-21 Pa之间变化。X射线衍射结果表明实验制备的ZnO:W为六方纤锌矿结构的多晶薄膜,具有垂直于衬底方向的c轴择优取向。沉积压强对ZnO:W薄膜的晶化程度、形貌和电阻率有很大影响,而对其透光率和光学带隙及折射率影响不大。当沉积压强为21 Pa,溅射功率为130 W时,所制备薄膜的电阻率达到最小值1.5×10-4 Ω·cm,其方块电阻、可见光透过率分别为6.8 Ω/□和91.3%。     

磁控溅射法在LiNbO3衬底上制备ZnO薄膜及性能研究

采用磁控溅射法在(001)LiNbO3衬底上制备了ZnO薄膜,并对其进行了退火处理.利用X射线衍射仪(XRD)、紫外一可见光谱仪和光致发光谱(PL)对ZnO薄膜的结构和光学性能进行了分析.结果表明,ZnO薄膜具有(002)的择优取向,退火后ZnO薄膜的(002)衍射峰的强度增强,半高宽减小,(002)峰向高角度方向移动.退火后样品可见光透过率增加,光学带隙发生红移.退火后的样品,紫外发光峰强度增强,可见光发光峰强度相对减弱.     

RF磁控溅射制备AZO透明导电薄膜及其性能

室温下采用RF磁控溅射技术在石英衬底E制备了多晶ZnO:Al(AZO)透明导电薄膜,通过XRD,AFM,AES,Hall效应及透射光谱等测试研究了RF溅射功率、氩气压强对薄膜的结构、电学和光学性能的影响.分析表明:在最优条件下(溅射功率为250W,氩气压强为1.2Pa时),180nm AZO薄膜的电阻率为2.68×10-3 Ω·cm,可见光区平均透射率为90%,适合作为发光二极管和太阳能电池的透明电极.所制备的AZO薄膜具有c轴择优取向,晶粒问界中的O原子吸附是限制薄膜电学性能的主要因素.     

RF磁控溅射制备AZO透明导电薄膜及其性能

室温下采用RF磁控溅射技术在石英衬底上制备了多晶ZnO: Al (AZO）透明导电薄膜,通过XRD,AFM,AES,Hall效应及透射光谱等测试研究了RF溅射功率、氩气压强对薄膜的结构、电学和光学性能的影响. 分析表明:在最优条件下（溅射功率为250W,氩气压强为1.2Pa时）, 180nm AZO薄膜的电阻率为2.68E-3 Ω· cm,可见光区平均透射率为90%,适合作为发光二极管和太阳能电池的透明电极. 所制备的AZO薄膜具有c轴择优取向,晶粒间界中的O原子吸附是限制薄膜电学性能的主要因素.     

磁控溅射二氧化硅薄膜的制备工艺

研究了在半绝缘ＧａＡｓ衬底上磁控溅射ＳｉＯ＿２薄膜的工艺技术。对影响生长薄膜的因素进行了实验分析，给出了生长速率、腐蚀速率及组分等参数与工艺条件的关系。实验证明，和其它镀膜技术相比，磁控溅射可以在更低的温度下制作致密、均匀、重复性好的ＳｉＯ＿２膜。     

磁控溅射法制备ITO薄膜的结构及光电性能 磁控溅射法制备ITO薄膜的结构及光电性能

本文采用直流磁控溅射法在基板温度100 ℃、100%Ar气氛中制备了光电性能优良的铟锡氧化物（In2O3:SnO2= 90:10, 质量百分比）薄膜。利用XRD、AFM、SEM、多功能光栅光谱仪和四探针电阻测试仪对薄膜的结构、表面形貌、透光率和方阻进行了测定和分析,研究了溅射功率对薄膜透光率的影响。结果表明：ITO薄膜的方阻随溅射功率的增加而下降;经过热处理,ITO薄膜可见光透光率从60.4%增加到88.3%;ITO薄膜在360 nm到380 nm的紫光区域透光率最低,760 nm到800 nm的红光区域透光率达到最高。     

用磁控溅射技术制备氮化铝薄膜

报道了用磁控溅射制备氮化铝薄膜的工艺过程和实验结果.给出了氮化铝薄膜的光学常数与氩气、氮气压强之间的关系.结果表明,氮化铝薄膜的光学性质,很大程度上取决于氮气和氩气之间的压强比.     

用直流磁控溅射法制备的ＩＴＯ薄膜的光电性能研究

用直流磁控溅射法将ＩＴＯ薄膜制备在玻璃基片上以作为太阳电池的透明电极。通过改变溅射功率、基片温度和工作气压来研究它们对所沉积的ITO薄膜的透过率和电导率的影响。实验结果表明：当溅射功率从30W增加到90W时,薄膜的透过率和电阻率都将减小;当基片温度从25℃ 增加到 150℃时,透过率稍微有点增大但电阻率减小;当工作气压从0.4Pa 增大到2.0Pa时,透过率减小,但电阻率增大。因此,在溅射功率为30W、基片温度为150℃、工作气压为0.4Pa 时,ITO薄膜有比较好的光电性能,其电阻率小于10-4 Ω•cm ,在可见光波段的透过率大于80%,适合于作为太阳电池的透明电极。     

Photoelectric properties of ITO thin films deposited by DC magnetron sputtering

As anti-reflecting thin films and transparent electrodes of solar cells,indium tin oxide（ITO） thin films were prepared on glass substrates by DC magnetron sputtering process.The main sputtering conditions were sputtering power,substrate temperature and work pressure.The influence of the above sputtering conditions on the transmittance and conductivity of the deposited ITO films was investigated.The experimental results show that, the transmittance and the resistivity decrease as the sputtering power increases from 30 to 90 W.When the substrate temperature increases from 25 to 150℃,the transmittance increases slightly whereas the resistivity decreases.As the work pressure increases from 0.4 to 2.0 Pa,the transmittance decreases and the resistivity increases.When the sputtering power,substrate temperature and work pressure are 30 W,150℃,0.4 Pa respectively,the ITO thin films exhibit good electrical and optical properties,with resistivity below 10^-4Ω·cm and the transmittance in the visible wave band beyond 80%.Therefore,the ITO thin films are suitable as transparent electrodes of solar cells.     

直流磁控溅射法制备非晶态氧化钒薄膜光学特性研究

研究了直流反应磁控溅射工艺中衬底温度对氧化钒(V2O5)薄膜性能的影响,利用X射线光电子能谱(XPS)、扫描电子显微镜(SEM)、X射线衍射(XRD)和紫外-可见光分光光度计(UV1700)分别对薄膜进行了表征.实验结果表明,除了组分和晶态,薄膜的形貌和光学性能受衬底温度的影响很大.随着衬底温度的升高,膜表面变得粗糙,膜厚减小.光学特性测试表明,当衬底温度从160℃升高到320 ℃,光学带隙从2.39 eV下降到2.18 eV.     

Properties of transparent conductive ZnO:Al thin films prepared by magnetron sputtering

Middle-frequency alternative magnetron sputtering was used to deposit transparent conductive ZAO (ZnO:Al) thin films with ZAO (98 wt%ZnO+2 wt%Al₂O₃) ceramic target on glass and Si wafers. The influences of the various deposition parameters on the structural, optical and electrical performances of ZAO films have been studied. The structural characteristics of the films were investigated by the X-ray diffractometer and atomic force microscope, while the visible transmittance, carrier concentration and Hall mobility were studied by UV-VIS and the Hall tester, respectively. The lowest resistivity obtained in the work was 4.6×10⁻⁴ Ω cm for the film with average transmittance of 90.0% within the visible wavelength range and sheet resistance of 32 Ω, which was deposited at 250 °C and 0.8 Pa.     

中频交流磁控溅射制备AZO薄膜及退火工艺

以锌铝合金为靶材,采用工业生产设备,用中频交流磁控溅射法在玻璃衬底上制备出了铝掺杂氧化锌(AZO)透明导电薄膜,研究了氩氧比、退火温度、退火时间对薄膜结构、光学和电学性能的影响。结果表明,氩气和氧气体积流量比为3:1时常温下得到薄膜的方阻值最低,400℃真空退火1 h后薄膜可见光平均透过率由84.0%上升到86.7%,方阻值由5 000Ω/□下降到108Ω/□。     

直流磁控溅射制备非晶硅薄膜的研究

非晶硅薄膜（a-Si）是目前重要的光敏材料,在很多领域得到广泛应用。直流磁控溅射具有工艺简单．沉积温度低等优点,是制备薄膜的一种重要技术。采用直流磁控溅射工艺在玻璃基板上沉积薄膜,并对样品进行了退火处理。研究了沉积速率与溅射功率的关系。结果表明薄膜的沉积速率与溅射功率近似有线性关系。利用X射线衍射（XRD）对薄膜进行了分析鉴定,结果表明溅射的薄膜是非晶硅薄膜。利用扫描电子显微镜（SEM）对非晶硅薄膜的表面形貌进行了观察和分析,与X射线衍射测试的结果一致。所以．利用直流磁控溅射工艺能在常温下能快速制备出良好的非晶硅薄膜。     

Study of amorphous Ta2O5 thin films by DC magnetron reactive sputtering

The dc magnetron reactive sputtering deposition of tantalum pentoxide (Ta₂O₅) thin films was investigated. By combining Schiller's criterion and Reith’s “target preoxidation” procedure, high quality Ta₂O₅ thin films were prepared at a high deposition rate of about lOOÅ;/min. The deposited films were amorphous, with a refractive index around 2.07 and a dielectric constant of 20. An optical transmit-tance of 98.6% was obtained for a 4500Â thick film. The leakage current density is 5 × 10^?9 A/cm² at an electric field strength of 1 MV/cm and its breakdown field strength is above 2 MV/cm. The temperature coefficient of capacitance for capacitors fabricated using the deposited films is approximately +230 ppm/°C. X-ray photoelectron spectroscopy shows that the films are stoichiometric tantalum pentoxide, Ta₂O₅, and exhibit good stability.     

Electrical characterization and morphological properties of AlN films prepared by dc reactive magnetron sputtering

Aluminum nitride (AlN) films were deposited by dc reactive magnetron sputtering on p-Si-(1 0 0) substrate in Ar-N₂ gas mixtures. The effects of nitrogen concentration and sputtering power on AlN films deposition rate, crystallographic orientation, refractive index, and surface morphology are investigated by means of several characterization techniques. The results show that AlN films reasonably textured in (0 0 2) orientation with low surface roughness can be obtained with the deposition rate as high as 70 nm/min by the control of either target power or N₂ concentration in the gas mixture. Increasing the dc discharge power, Al atoms are not completely nitridized and the Al phases appear, as well as the AlN phases. MIS (Metal-Insulator-Semiconductor) structures were fabricated and electrically evaluated by I-V (current-voltage) and C-V (capacitance-voltage) measurements at high frequency (1 MHz). The results obtained from C-V curves indicate that charges at the dielectric/semiconductor interface occur, and the dielectric constant values (extracted under strong accumulation region) are compatible with those found in literature.     

The influence of sequence of precursor films on CZTSe thin films prepared by ion-beam sputtering deposition

The CuZnSn(CZT) precursor thin films are grown by ion-beam sputtering Cu, Zn, Sn targets with different orders and then sputtering Se target to fabricate Cu₂ZnSnSe₄(CZTSe) absorber thin films on molybdenum substrates. They are annealed in the same vacuum chamber at 400℃. The characterization methods of CZTSe thin films include X-ray diffraction(XRD), energy dispersive spectroscopy(EDS), scanning electron microscopy(SEM), and X-ray photoelectron spectra(XPS) in order to study the crystallographic properties, composition, surface morphology, electrical properties and so on. The results display that the CZTSe thin films got the strongest diffraction peak intensity and were with good crystalline quality and its morphology appeared smooth and compact with a sequence of Cu/Zn/Sn/Se, which reveals that the expected states for CZTSe are Cu¹⁺, Zn²⁺, Sn⁴⁺, Se²⁺. With the good crystalline quality and close to ideal stoichiometric ratio the resistivity of the CZTSe film with the sequence of Cu/Zn/Sn/Se is lower, whose optical band gap is about 1.50 eV.