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1.
A fully integrated dual-mode CMOS transceiver tuned to 2.4 GHz consumes 65 mA in receive mode and 78 mA in transmit mode from a 3-V supply. The radio includes all the receive and transmit building blocks, such as frequency synthesizer, voltage-controlled oscillator (VCO), and power amplifier, and is intended for use in 802.11b and Bluetooth applications. The Bluetooth receiver uses a low-IF architecture for higher level of integration and lower power consumption, while the 802.11b receiver is direct conversion. The receiver achieves a typical sensitivity of -88 dBm at 11 Mb/s for 802.11b, and -83 dBm for Bluetooth mode. The receiver minimum IIP3 is -8 dBm. Both transmitters use a direct-conversion architecture, and deliver a nominal output power of 0 dBm, with a power range of 20 dB in 2-dB steps.  相似文献   

2.
A BiCMOS transceiver intended for spread spectrum applications in the 2.4-2.5 GHz band is described. The IC contains a low-noise amplifier (LNA) with 14 dB gain and 2.2 dB NF in its high-gain mode, a downconversion mixer with 8 dB gain and 11 dB NF, and an upconversion mixer with 17 dB gain and P-1 dB of +3 dBm out. An on-chip local oscillator (LO) buffer accepts LO drive of -10 dBm with a half-frequency option allowed by an on-chip frequency doubler. Power consumption from a single 3-V supply is 34 mA in transmit mode, 21 mA in receive mode, and 1 μA in sleep mode  相似文献   

3.
This paper presents a fully integrated 0.18-/spl mu/m CMOS Bluetooth transceiver. The chip consumes 33 mA in receive mode and 25 mA in transmit mode from a 3-V system supply. The receiver uses a low-IF (3-MHz) architecture, and the transmitter uses a direct modulation with ROM-based Gaussian low-pass filter and I/Q direct digital frequency synthesizer for high level of integration and low power consumption. A new frequency shift keying demodulator based on a delay-locked loop with a digital frequency offset canceller is proposed. The demodulator operates without harmonic distortion, handles up to /spl plusmn/160-kHz frequency offset, and consumes only 2 mA from a 1.8-V supply. The receiver dynamic range is from -78 dBm to -16 dBm at 0.1% bit-error rate, and the transmitter delivers a maximum of 0 dBm with 20-dB digital power control capability.  相似文献   

4.
5-GHz SiGe HBT monolithic radio transceiver with tunable filtering   总被引:1,自引:0,他引:1  
A wide-band CDMA-compliant fully integrated 5-GHz radio transceiver was realized in SiGe heterojunction-bipolar-transistor technology with on-chip tunable voltage controlled oscillator (VCO) tracking filters. It allows for wide-band modulation schemes with bandwidth up to 20 MHz. The receiver has a single-ended single-sideband noise figure of 5.9 dB, more than 40 dB on-chip image rejection, an input compression point of -22 dBm, and larger than 70 dB local-oscillator-RF isolation. The phase noise of the on-chip VCO is -100 and -128 dBc/Hz at 100 kHz and 5 MHz offset from the carrier, respectively. The transmitter output compression point is +10 dBm. An image rejection better than 40 dB throughout the VCO tracking range has been demonstrated in the transmitter with all spurious signals 40 dB below the carrier. The differential transceiver draws 125 mA in transmit mode and 45 mA in receive mode from a 3.5-V supply  相似文献   

5.
A 1.9-GHz Single-Chip CMOS PHS Cellphone   总被引:1,自引:0,他引:1  
A single-chip CMOS PHS cellphone, integrated in a 0.18-mum CMOS technology, implements all handset functions including radio, voice, audio, MODEM, TDMA controller, CPU, and digital interfaces. Both the receiver and transmitter are based on a direct conversion architecture. The RF transceiver achieves -106 dBm receive sensitivity and +4 dBm EVM-compliant transmit power. The local oscillator, based on a sigma-delta fractional-N synthesizer, has a phase noise of -118 dBc/Hz at 600kHz offset and settling time of 15 mus. The current consumption for the receiver, transmitter and synthesizer are 32 mA, 29 mA, and 25 mA, respectively, from a 3.0 V supply  相似文献   

6.
A single-chip 2.4-GHz CMOS radio transceiver with integrated baseband processing according to the IEEE 802.15.4 standard is presented. The transceiver consumes 14.7 mA in receive mode and 15.7 mA in transmit mode. The receiver uses a low-IF topology for high sensitivity and low power consumption, and achieves -101 dBm sensitivity for 1% packet error rate. The transmitter topology is based on a PLL direct-modulation scheme. Optimizations of architecture and circuit design level in order to reduce the transceiver power consumption are described. Special attention is paid to the RF front-end design which consumes 2.4mA in receive mode and features bidirectional RF pins. The 5.77 mm2 chip is implemented in a standard 0.18-mum CMOS technology. The transmitter delivers +3 dBm into the 100-Omega differential antenna port  相似文献   

7.
Attaching a tire pressure monitoring system (TPMS) on the inner liner of a tire allows sensing of important additional technical parameters, such as vehicle load or tire wearout. The maximum weight of the sensor is limited to 5 grams including package, power supply, and antenna. Robustness is required against extreme levels of acceleration. The node size is limited to about 1 cm3 to avoid high force-gradients due to device-deformation and finally, a long power supply lifetime must be achieved. In this paper a low-power FSK transceiver is presented. Exploiting BAW resonators the use of a bulky and shock-sensitive crystal and a PLL can be avoided. This makes the system more robust and radically reduces the start-up time to 2 ?s from few ms as in state-of-the-art crystal oscillator based systems. The current consumption of the transceiver is 6 mA in transmit mode with a transmit output power of 1 dBm and 8 mA in receive mode with a sensitivity of -90 dBm at a data rate of 50 kBit/s and a bit error rate of 10-2. The transceiver ASIC and a microcontroller ASIC, a MEMS sensor, and a BAW die are arranged in a 3-D chip stack for best compactness, lowest volume, and highest robustness. The sensor node allows sensing of pressure, acceleration, supply voltage and temperature.  相似文献   

8.
This paper describes a 0.18-mum CMOS direct-conversion dual-band triple-mode wireless LAN transceiver. The transceiver has a concurrent dual-band low-noise amplifier for low power consumption with a low noise figure, a single widely tunable low-pass filter based on a triode-biased MOSFET transconductor for multi-mode operation with low power consumption, a DC-offset compensation circuit with an adaptive activating feedback loop to achieve a fast response time with low power consumption, and a SigmaDelta-based low-phase-noise fractional-N frequency synthesizer with a switched-resonator voltage controlled oscillator to cover the entire frequency range for the IEEE WLAN standards. The transceiver covers both 2.4-2.5 and 4.9-5.95 GHz and has extremely low power consumption (78 mA in receive mode, 76 mA in transmit mode-both at 2.4/5.2 GHz). A system noise figure of 3.5/4.2 dB, a sensitivity of -93/-94 dBm for a 6-Mb/s OFDM signal, and an error vector magnitude of 3.2/3.4% were obtained at 2.4/5.2 GHz, respectively  相似文献   

9.
A low-power fullband 802.11a/b/g WLAN transceiver in 0.15-mum CMOS technology is described. The zero-IF transceiver achieves a receiver noise figure of 4.4/4 dB for the 2.4-GHz/5-GHz bands, respectively. The corresponding sensitivity at 54-Mb/s operation is -72 dBm for 802.11g and -74 dBm for 802.11a using actual PER measurement. An on-chip PA delivers 20 dBm output P1-dB. A new I/Q compensation scheme is implemented in local oscillator (LO) and an image rejection of better than 52 dB is observed. The transmitter delivers 10/1.5 dBm (2.4-/5-GHz) EVM-compliant output power for a 64-QAM OFDM signal at 54-Mb/s. The power consumption is 117/135 mW (1.8-V) in the receive mode and 570/233.1 mW in the transmit mode for 2.4/5 GHz, respectively. The low power consumption, high integration and robustness (-40 to 140degC) make this transceiver suitable for portable applications  相似文献   

10.
This paper reports on our development of a dual‐mode transceiver for a CMOS high‐rate Bluetooth system‐on‐chip solution. The transceiver includes most of the radio building blocks such as an active complex filter, a Gaussian frequency shift keying (GFSK) demodulator, a variable gain amplifier (VGA), a dc offset cancellation circuit, a quadrature local oscillator (LO) generator, and an RF front‐end. It is designed for both the normal‐rate Bluetooth with an instantaneous bit rate of 1 Mb/s and the high‐rate Bluetooth of up to 12 Mb/s. The receiver employs a dualconversion combined with a baseband dual‐path architecture for resolving many problems such as flicker noise, dc offset, and power consumption of the dual‐mode system. The transceiver requires none of the external image‐rejection and intermediate frequency (IF) channel filters by using an LO of 1.6 GHz and the fifth order on‐chip filters. The chip is fabricated on a 6.5‐mm2 die using a standard 0.25‐μm CMOS technology. Experimental results show an in‐band image‐rejection ratio of 40 dB, an IIP3 of ?5 dBm, and a sensitivity of ?77 dBm for the Bluetooth mode when the losses from the external components are compensated. It consumes 42 mA in receive π/4‐diffrential quadrature phase‐shift keying (π/4‐DQPSK) mode of 8 Mb/s, 35 mA in receive GFSK mode of 1 Mb/s, and 32 mA in transmit mode from a 2.5‐V supply. These results indicate that the architecture and circuits are adaptable to the implementation of a low‐cost, multi‐mode, high‐speed wireless personal area network.  相似文献   

11.
林昊  姚常飞 《微波学报》2023,39(4):62-65
基于混合微波集成电路技术(Hybrid Microwave Integrated Circuit, HMIC)设计了一款Ka 波段多通道 收发组件。该收发组件由四路接收链路、两路发射链路、衰减控制模块、锁相介质振荡器(Phase-locked Dielectric Resonator Oscillator, PLDRO)和电源模块组成。测试表明,该组件发射功率可达36 dBm,接收增益最大可达70 dB,接 收链路可以实现0~62 dB 的增益调控,发射链路可以实现0~31 dB 的增益调控,通道间隔离度可以达到80 dBc,实 现了大功率、高增益、大动态增益范围的技术要求,具有较高的工程应用价值。  相似文献   

12.
This paper presents the experimental results of a low‐power low‐cost RF transceiver for the 915 MHz band IEEE 802.15.4b standard. Low power and low cost are achieved by optimizing the transceiver architecture and circuit design techniques. The proposed transceiver shares the analog baseband section for both receive and transmit modes to reduce the silicon area. The RF transceiver consumes 11.2 mA in receive mode and 22.5 mA in transmit mode under a supply voltage of 1.8 V, in which 5 mA of quadrature voltage controlled oscillator is included. The proposed transceiver is implemented in a 0.18 μm CMOS process and occupies 10 mm2 of silicon area.  相似文献   

13.
In this work, the determination of receiver selectivity and transmit frequency using a common resonator is presented for a 5.3 GHz transceiver employing a time division duplex, on-off keyed modulation format. The microstrip circuit is fabricated on Rogers RO4003(R) , a high frequency laminate. In receive mode, a 3 dB passband of 35 MHz and a small-signal gain of 26 dB has been achieved. In transmit mode, an output power of +7 dBm for the fundamental, -15.0 dBm for the second harmonic, -18.0 dBm for the third harmonic, and -35.0 dBm for the fourth harmonic has been achieved  相似文献   

14.
This paper presents a 1 V RF transceiver for biotelemetry and wireless body sensor network (WBSN) applications, realized as part of an ultra low power system-on-chip (SoC), the Sensiumtrade. The transceiver utilizes FSK/GFSK modulation at a data rate of 50 kbit/s to provide wireless connectivity between target sensor nodes and a central base-station node in a single-hop star network topology operating in the 862-870 MHz European short-range-device (SRD) and the 902-928 MHz North American Industrial, Scientific & Medical (ISM) frequency bands. Controlled by a proprietary media access controller (MAC) which is hardware implemented on chip, the transceiver operates half-duplex, achieving -102 dBm receiver input sensitivity (for 1E-3 raw bit error rate) and up to -7 dBm transmitter output power through a single antenna port. It consumes 2.1 mA during receive and up to 2.6 mA during transmit from a 0.9 to 1.5 V supply. It is fabricated in a 0.13 mum CMOS technology and occupies 7 mm2 in a SoC die size of 4 times 4 mm2.  相似文献   

15.
A low voltage CMOS RF front-end for IEEE 802.11b WLAN transceiver is presented. The problems to implement the low voltage design and the on-chip input/output impedance matching are considered, and some improved circuits are presented to overcome the problems. Especially, a single-end input, differential output double balanced mixer with an on-chip bias loop is analyzed in detail to show its advantages over other mixers. The transceiver RF front-end has been implemented in 0.18 um CMOS process, the measured results show that the Rx front-end achieves 5.23 dB noise figure, 12.7 dB power gain (50 ohm load), −18 dBm input 1 dB compression point (ICP) and −7 dBm IIP3, and the Tx front-end could output +2.1 dBm power into 50 ohm load with 23.8 dB power gain. The transceiver RF front-end draws 13.6 mA current from a supply voltage of 1.8 V in receive mode and 27.6 mA current in transmit mode. The transceiver RF front-end could satisfy the performance requirements of IEEE802.11b WLAN standard. Supported by the National Natural Science Foundation of China, No. 90407006 and No. 60475018.  相似文献   

16.
In this paper, a low-power low-IF receiver and a direct-conversion transmitter (DCT) suitable for the IEEE standard 802.15.4 radio system at the 2.4-GHz band are presented in 0.18-mum deep n-well CMOS technology. By using vertical NPN (V-NPN) bipolar junction transistors in the baseband analog circuits of the low-IF receiver, the image rejection performance is improved and the power consumption is reduced. In addition, by applying the V-NPN current mirrored technique in a DCT, the carrier leakage is reduced and the linearity performance is improved. The receiver has 10 dB of noise figure, -15 dBm of third-order input intercept point, and 35 dBc of image rejection. The transmitter has more than -2 dBm of transmit output power, -35 dBc of local oscillator leakage, and -46 dBc of the transmit third harmonic component. The receiver and transmitter dissipate 6 and 9 mA from a 1.8-V supply, respectively  相似文献   

17.
Migration towards higher data rates and higher capacities for multimedia applications, and provision of various services (text, audio, video) from different wireless standards with the same device require integrated designs that work across multiple standards, can easily be reused, and achieve maximum hardware share at minimum power consumption. This can be achieved by using adaptive circuits that are able to trade off power consumption for performance. The design of an adaptive multimode image-reject downconverter (oscillator and two mixers) is presented in this paper. In the highest performance mode, the image-reject downconverter (the quadrature mixers) has an IIP3 of +5.5 dBm, a single-side band noise figure of 13.9dB and a conversion gain of 1.4 dB, while drawing 10mA from a 3 V supply. The adaptive oscillator achieves -123 dBc/Hz phase noise at 1MHz offset from a 2.1 GHz carrier with a bias current of 6 mA in the highest performance mode. Adaptivity in the downconverter is achieved by trading off RF performance for current consumption, ranging from 10 mA for the relaxed mode (e.g., DECT) to 20 mA in the highest performance mode (e.g., DCS1800) of operation  相似文献   

18.
This paper presents a fully integrated 0.13 μm CMOS MB‐OFDM UWB transmitter chain (mode 1). The proposed transmitter consists of a low‐pass filter, a variable gain amplifier, a voltage‐to‐current converter, an I/Q up‐mixer, a differential‐to‐single‐ended converter, a driver amplifier, and a transmit/receive (T/R) switch. The proposed T/R switch shows an insertion loss of less than 1.5 dB and a Tx/Rx port isolation of more than 27 dB over a 3 GHz to 5 GHz frequency range. All RF/analog circuits have been designed to achieve high linearity and wide bandwidth. The proposed transmitter is implemented using IBM 0.13 μm CMOS technology. The fabricated transmitter shows a ?3 dB bandwidth of 550 MHz at each sub‐band center frequency with gain flatness less than 1.5 dB. It also shows a power gain of 0.5 dB, a maximum output power level of 0 dBm, and output IP3 of +9.3 dBm. It consumes a total of 54 mA from a 1.5 V supply.  相似文献   

19.
This 0.5-/spl mu/m SiGe BiCMOS polar modulator IC adds EDGE transmit capability to a GSM transceiver IC without any RF filters. Envelope information is extracted from the transmit IF and applied to the phase-modulated carrier in an RF variable gain amplifier which follows the integrated transmit VCO. The dual-band IC supports all four GSM bands. In EDGE mode, the IC produces more than 1 dBm of output power with more than 6 dB of margin to the transmit spectrum mask and less than 3% rms phase error. In GSM mode, more than 7 dBm of output power is produced with noise in the receive band less than -164 dBc/Hz.  相似文献   

20.
This paper describes the results of an implementation of a Bluetooth radio in a 0.18-/spl mu/m CMOS process. A low-IF image-reject conversion architecture is used for the receiver. The transmitter uses direct IQ-upconversion. The VCO runs at 4.8-5.0 GHz, thus facilitating the generation of 0/spl deg/ and 90/spl deg/ signals for both the receiver and transmitter. By using an inductor-less LNA and the extensive use of mismatch simulations, the smallest silicon area for a Bluetooth radio implementation so far can be reached: 5.5 mm/sup 2/. The transceiver consumes 30 mA in receive mode and 35 mA in transmit mode from a 2.5 to 3.0-V power supply. As the radio operates on the same die as baseband and SW, the crosstalk-on-silicon is an important issue. This crosstalk problem was taken into consideration from the start of the project. Sensitivity was measured at -82 dBm.  相似文献   

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