Mechanical properties of a-C:H and a-C:H/SiOx nanocomposite thin films prepared by ion-assisted plasma-enhanced chemical vapor deposition

a-C:H and a-C:H/SiO_x nanocomposite thin films were deposited on silicon, aluminum and polyimide substrates at 25 °C in an asymmetric 13.56 MHz r.f.-driven plasma reactor under heavy ion bombardment. Fourier transform infrared spectra of the films indicate that the nanocomposite filmsappears to consist of an atomic scale random network of a-C:H and SiO_x. Raman spectroscopy revealed that the sp² carbon fraction in the nanocomposite film was reduced compared with the a-C:H film. The intrinsic stress of both films increased with increasing negative bias voltage (−V_dc) at the substrate. However, the nanocomposite films exhibited lower intrinsic stress compared w with a-C:H-only films. Especially, a thin SiO_x-rich interlayer was very effective in reducing the film stress and enhancing the bonding strength at the interface. The interlayer allowed deposition of thick films of up to 5 μm. Also, the nanocomposite films were stable in 0.1 M NaOH solution and showed good microhardness.     

High aspect ratio contact hole etching using relatively transparent amorphous carbon hard mask deposited from propylene

In this study, a high aspect ratio contact pattern, beyond 70 nm technology, in a very-large-scale integrated circuit, was achieved using hydrogenated amorphous carbon (a-C:H) film as the dry etching hard mask. The effect of temperature on the a-C:H deposits prepared by plasma enhanced chemical vapor deposition was studied. The a-C:H films resulting from propylene (C₃H₆) decomposition exhibited high transparency incorporated rich hydrogen concentration with a decreasing deposition temperature. A matrix of dispersed cross-linked sp³ clusters in a-C:H films, which has an increasing optical band gap and higher hydrogen content, is attributed to reduce the defect density of status and obtain high transmittance rate. Moreover, the higher transparency of a-C:H films could afford lithographic aligned capability as well as compressive stress and dry etching resistance. These explorations provided insights into the role of hydrogen in a-C film and also into the practicality of its future nano-scale device applications.     

Fluorohydrogenated amorphous carbon (a-C:H, F) films prepared by the r.f. plasma decomposition of 1,3-butadiene and carbon tetrafluoride

Amorphous fluorohydrogenated carbon films (a-C:H, F) were prepared by the r.f. glow discharge decomposition of a hydrocarbon (C₄H₆) diluted with a fluorocarbon (CF₄). An increase in the CF₄ content of the deposition gas mixture was accompanied by a corresponding increase in the fluorine content and a decrease in the hydrogen content of the films. The IR spectra indicate fluorine incorporation in the film primarily via the monofluoride mode. No absorption owing to CF₂ and CF₃ could be detected. The film density and optical bandgap stayed fairly constant until about 40–50% dilution with CF₄. Further dilution of the hydrocarbon with CF₄ resulted in a large drop in the deposition rate, film density, optical bandgap, oxygen plasma etch resistance and thermal stability. These film properties differ from those of a-C:H, F films obtained by the r.f. plasma decomposition of substituted benzenes (Sah et al., Appl. Phys. Lett., 46 (1992) 739).     

Photoluminescence in amorphous carbon thin films and its relation to the microscopic properties

The photoluminescence properties of amorphous hydrogenated carbon (a-C:H) films grown using a r.f. plasma have been investigated. It is found that the photoluminescence (PL) spectra exhibit a red shift, accompanied by a sharp decrease in PL efficiency and an increase in electron spin density as the applied r.f. power increases. The results can be interpreted by a model in which the a-C:H films consist of two phases with π-bonded clusters embedded in an sp³-bonded amorphous matrix. The excitation and the recombination of electron hole pairs are believed to take place in the π-bonded clusters. As a result of the confinement effect of electron hole pairs in these clusters, the cluster size becomes an important parameter in understanding the PL properties of a-C:H films.     

Adherent amorphous hydrogenated carbon films on metals deposited by plasma enhanced chemical vapor deposition

This paper reports the findings of a study of the structural, mechanical, and tribological properties of amorphous hydrogenated carbon (a-C:H) coatings for industrial applications. These thin films have proven quite advantageous in many tribological applications, but for others, thicker films are required. In this study, in order to overcome the high residual stress and low adherence of a-C:H films on metal substrates, a thin amorphous silicon interlayer was deposited as an interface. Amorphous silicon and a-C:H films were grown by using a radio frequency plasma enhanced chemical vapor deposition system at 13.56 MHz in silane and methane atmospheres, respectively. The X-ray photoelectron spectroscopy technique was employed to analyze the chemical bonding within the interfaces. The chemical composition and atomic density of the a-C:H films were determined by ion beam analysis. The film microstructure was studied by means of Raman scattering spectroscopy. The total stress was determined through the measurement of the substrate curvature, using a profilometer, while micro-indentation experiments helped determine the films' hardness. The friction coefficient and critical load were evaluated by using a tribometer. The results showed that the use of the amorphous silicon interlayer improved the a-C:H film deposition onto metal substrates, producing good adhesion, low compressive stress, and a high degree of hardness. SiC was observed in the interface between the amorphous silicon and a-C:H films. The composition, the microstructure, the mechanical and tribological properties of the films were strongly dependent on the self-bias voltages. The tests confirmed the importance of the intensity of ion bombardment during film growth on the mechanical and tribological properties of the films.     

Effect of deposition temperature and thermal annealing on the dry etch rate of a-C: H films for the dry etch hard process of semiconductor devices

The effect of deposition and thermal annealing temperatures on the dry etch rate of a-C:H films was investigated to increase our fundamental understanding of the relationship between thermal annealing and dry etch rate and to obtain a low dry etch rate hard mask. The hydrocarbon contents and hydrogen concentration were decreased with increasing deposition and annealing temperatures. The I(D)/I(G) intensity ratio and extinction coefficient of the a-C:H films were increased with increasing deposition and annealing temperatures because of the increase of sp² bonds in the a-C:H films. There was no relationship between the density of the unpaired electrons and the deposition temperature, or between the density of the unpaired electrons and the annealing temperature. However, the thermally annealed a-C:H films had fewer unpaired electrons compared with the as-deposited ones. Transmission electron microscopy analysis showed the absence of any crystallographic change after thermal annealing. The density of the as-deposited films was increased with increasing deposition temperature. The density of the 600 °C annealed a-C:H films deposited under 450 °C was decreased but at 550 °C was increased, and the density of all 800 °C annealed films was increased. The dry etch rate of the as-deposited a-C:H films was negatively correlated with the deposition temperature. The dry etch rate of the 600 °C annealed a-C:H films deposited at 350 °C and 450 °C was faster than that of the as-deposited film and that of the 800 °C annealed a-C:H films deposited at 350 °C and 450 °C was 17% faster than that of the as-deposited film. However, the dry etch rate of the 550 °C deposited a-C:H film was decreased after annealing at 600 °C and 800 °C. The dry etch rate of the as-deposited films was decreased with increasing density but that of the annealed a-C:H films was not. These results indicated that the dry etch rate of a-C:H films for dry etch hard masks can be further decreased by thermal annealing of the high density, as-deposited a-C:H films. Furthermore, not only the density itself but also the variation of density with thermal annealing need to be elucidated in order to understand the dry etch properties of annealed a-C:H films.     

Deposition of hydrogenated amorphous carbon films from CH4/Ar plasmas: Ar dilution effects

Hydrogenated amorphous carbon (a-C:H) films were deposited, at room temperature, from a CH₄/Ar plasma produced by a radio frequency (r.f.) glow discharge system at 13.56 MHz, and different power values. Two different characterisation techniques, Raman and FTIR spectroscopies, have been used to investigate correlations between deposition conditions and properties of hydrogenated amorphous carbon films. The composition of the initial gaseous mixture and the r.f. power input are shown to affect significantly both mechanical and microstructural properties of deposited films. As the fraction of argon in the feed gas is increased, the deposition rate increases and the deposited film shows a higher friction coefficient, thus suggesting the production of a softer material. On the other hand, Raman measurements suggest the occurrence of a lower degree of structural order in the sp² lattice. Experimental findings are discussed in terms of the different chemical composition of the plasma.     

Effects of applied power on hydrogenated amorphous carbon (a-C:H) film deposition by low frequency (60 Hz) plasma-enhanced chemical vapor deposition (PECVD)

Hydrogenated amorphous carbon (a-C:H) films were deposited onto glass substrates using low frequency (60 Hz) plasma-enhanced chemical vapor deposition and the effects of the applied power on a-C:H films deposition were investigated. During deposition, the electron temperature and the density of CH₄-H₂ plasma were 2.4-3.1 eV and about 10⁸ cm⁻³, respectively. The main optical emission peak of the carbon species observed in the CH₄-H₂ plasma is shown to be excited carbon CH* at 431 nm. The sp³/sp² ratio, band gap, hydrogen content, and refractive index of a-C:H films gradually increased up to a power of 25 W and then saturated at higher power. This tendency is similar to the variation of plasma parameters with varying applied power, thereby indicating that a strong relationship exists between the properties of the films and the plasma discharge.     

Hydrogenated amorphous carbon and carbon nitride films deposited at low pressure by plasma enhanced chemical vapor deposition

Hydrogenated amorphous carbon (a-C:H) films were deposited by plasma enhanced chemical vapor deposition from methane, argon diluted methane, and nitrogen diluted methane at 26.7 Pa with a 13.56 MHz RF power supply. In this pressure regime, multiple-scattering of carbon species within the plasma phase is expected during the transport to the substrates placed on both the driven and the earthed electrodes. These films were analyzed using UV-VIS optical transmittance, monochromatic ellipsometry, Raman spectroscopy and current-voltage measurements. From these results, the effect of the plasma conditions and the effective flux of the carbon species controlled by the input power through the negative self bias are found to be important in the deposition process. The growth conditions at the higher pressure regime are important to synthesize a-C:H films from low energetic carbon species, since it reduces the defect density and improves the quality of the films. Furthermore, the effect of nitrogen on the growth conditions of a-C:H:N films is observed.     

Effects of applied substrate bias during reactive sputter deposition of nanocomposite tantalum carbide/amorphous hydrocarbon thin films

Nanocomposite tantalum carbide/amorphous hydrocarbon (TaC/a-C:H) thin film composition, structure, and mechanical properties depend on the direct current bias voltage (V_b) level applied to the substrate during reactive sputter deposition. A set of TaC/a-C:H films was deposited across the range V_b = 0 to − 300 V with all other deposition parameters held constant except substrate temperature, which was allowed to reach its steady state during the depositions. Effects of V_b on film composition and structure were explored, including TaC crystallite size and dispersion using X-ray diffraction and high resolution transmission electron microscopy. In addition, the dependency of stress and hardness on V_b was studied with an emphasis on relationships to a-C:H phase structure.     

Dielectric response and structure of amorphous hydrogenated carbon films with nitrogen admixture

The optical properties and structure of a-C:H films were modified by addition of nitrogen into the CH₄/H₂ deposition mixture. Three films prepared in capacitively coupled rf discharge were compared: (a) hydrogenated diamond like carbon film with hydrogen content of 34% and indentation hardness of 21.7 GPa, (b) hard a-C:H:N film with nitrogen content of 13% and indentation hardness of 18.5 GPa and (c) soft a-C:H:N film with nitrogen content of 10% and indentation hardness of 6.7 GPa. It is shown how the parametrized density of states model describing dielectric response of electronic interband transitions can be applied to modified a-C:H:N and how it can be combined with correct treatment of transmittance measured in infrared range using additional Gaussian peaks in joint density of phonon states. This analysis resulted in determination of film dielectric function in wide spectral range (0.045-30 eV) and provided also information about the density of states of valence and conduction bands and lattice vibrations.     

Effects of annealing temperature on the optical, bonding, structural and electrical properties of nitrogenated amorphous carbon thin films grown by surface wave microwave plasma chemical vapor deposition

We have studied the effects of annealing temperature (AT) on the properties of nitrogenated amorphous carbon (a-C:N) films grown at room temperature (RT) on quartz substrates by surface wave microwave plasma chemical vapor deposition (SWMP-CVD) using camphor alcohol gas as carbon plasma sources. The thickness, optical, bonding, structural and electrical properties of the as-grown (RT) and anneal-treated in range from 100 to 500°C of a-C:N films were measured and compared. The film thickness is decreased rapidly with increasing AT above 350°C. The wide range of optical absorption characteristics is observed depending on the AT. The optical band gap of as-grown a-C:N films is approximately 2.8 eV, gradually decreased to 2.5 eV for the films anneal-treated at 300°C and beyond that it decreased rapidly up to 0.9 eV at 500°C . Visible-Raman Spectroscopy (Raman) revealed the amorphous structure of as-grown a-C:N films and, the growth of nanocrystallinity of a-C:N films upon increase of AT. Raman and Fourier transform infrared spectroscopy (FTIR) analyses respectively shown the structural and composition of the films can be tuned by optimizing the AT. The change of optical, bonding, structural and electrical properties of SWMP-CVD grown a-C:N films with higher AT was attributed due to the fundamental changes in the bonding and band structure of the a-C:N films.     

On the chemistry at the Si,Ti-doped a-C:H/TiC interface

Silicon-titanium-doped a-C:H, deposited via plasma assisted chemical vapor deposition and its chemistry at the titanium carbide interface has been studied via X-ray photoelectron spectroscopy. In the a-C:H film, as well as at the interface, the carbide species TiSiC is formed. Thermal treatment of Si,Ti-a-C:H films on TiC causes an increase in TiSiC at the interface leading to a better adhesion performance.     

Mid-frequency deposition of a-C:H films using five different precursors

The plasma-enhanced chemical vapour deposition (PECVD) of amorphous hydrogenated carbon films from pulsed discharges with frequencies in the range from 50 kHz to 250 kHz was investigated. Five different hydrocarbons (acetylene C₂H₂, isobutene C₄H₈, cyclopentene C₅H₈, toluene C₇H₈ and cycloheptatriene C₇H₈) were probed as film growth precursors. In addition, two types of pulse-generators with somewhat different waveforms were used to power the discharges in the so called mid-frequency range. The a-C:H films deposited in a parallel-plate reactor were characterised for their thickness/deposition rate, hardness and hydrogen content. The hydrogen concentration in the films varied between 19 at.-% and 37 at.-%. With the substrate temperature held constant, it is roughly in inverse proportion to the hardness. The film with the highest hardness of 25 GPa was formed at a deposition rate of 0.8 μm/h in the C₂H₂ discharge at the lowest investigated pressure of 2 Pa. With increasing molecular mass of the precursor mostly weaker films were deposited. Relatively high values of both deposition rate and hardness were achieved using the precursor isobutene: a hardness of 21 GPa combined with a deposition rate of 4.1 μm/h. From the probed precursors, isobutene is also most advantageous for a-C:H deposition at higher pressures (up to 50 Pa investigated). But, as an over-all trend, the a-C:H hardness decreases with increasing deposition rate.     

Mid-frequency deposition of a-C:H films using five different precursors

The plasma-enhanced chemical vapour deposition (PECVD) of amorphous hydrogenated carbon films from pulsed discharges with frequencies in the range from 50 kHz to 250 kHz was investigated. Five different hydrocarbons (acetylene C₂H₂, isobutene C₄H₈, cyclopentene C₅H₈, toluene C₇H₈ and cycloheptatriene C₇H₈) were probed as film growth precursors. In addition, two types of pulse-generators with somewhat different waveforms were used to power the discharges in the so called mid-frequency range. The a-C:H films deposited in a parallel-plate reactor were characterised for their thickness/deposition rate, hardness and hydrogen content. The hydrogen concentration in the films varied between 19 at.-% and 37 at.-%. With the substrate temperature held constant, it is roughly in inverse proportion to the hardness. The film with the highest hardness of 25 GPa was formed at a deposition rate of 0.8 μm/h in the C₂H₂ discharge at the lowest investigated pressure of 2 Pa. With increasing molecular mass of the precursor mostly weaker films were deposited. Relatively high values of both deposition rate and hardness were achieved using the precursor isobutene: a hardness of 21 GPa combined with a deposition rate of 4.1 μm/h. From the probed precursors, isobutene is also most advantageous for a-C:H deposition at higher pressures (up to 50 Pa investigated). But, as an over-all trend, the a-C:H hardness decreases with increasing deposition rate.     

XPS study of the a-C:H/Ti and a-C:H/a-Si interfaces

In this study ultrathin hydrogenated amorphous carbon (a-C:H) films have been grown onto the titanium and amorphous silicon (a-Si) overlayers by direct ion beam deposition using acetylene gas as a hydrocarbon source. X-ray photoelectron spectroscopy (XPS) was used for study of the DLC-Ti and DLC-Si interfaces. It was revealed that a-Si is a good interlayer for improvement of adhesion in the case of diamond-like carbon film deposition onto the steel substrate at room temperature. a-C:H film growth without substantial intermixing occurred on the a-Si. On the other hand, adhesion between the Ti interlayer and the diamond like carbon film was very sensitive to the deposition conditions (presence of the pump oil) as well as structure and stress level of the Ti film. It was explained by strong intermixing between the growing carbon film and Ti. Bad adhesion between the growing DLC film and Ti interlayer was observed despite formation of the TiC. At the same time, formation of the TiO_x was not an obstacle for good adhesion. It is shown that composition of the used hydrocarbon gas, structure of the Ti thin film and mechanical stress in it had greater influence on adhesion with a-C:H film than elemental composition of the Ti interlayer surface.     

Preparation of various DLC films by T-shaped filtered arc deposition and the effect of heat treatment on film properties

Different types of diamond-like carbon (DLC) films (ta-C, a-C, ta-C:H and a-C:H) were prepared on super hard alloy (WC-Co) substrate using a T-shape filtered arc deposition (T-FAD) system. At first, the film properties, such as structure, hydrogen content, density, hardness, elastic modulus, were measured. Ta-C prepared with a DC bias of −100 V showed the highest density (3.1 g/cm³) and hardness (70-80 GPa), and the lowest hydrogen content (less than 0.1 at. %). It was found that the hardness of the DLC film is proportional to approximately the third power of film density. The DLC films were then heated for 60 min in an electric furnace at 550 °C in N₂. Only the ta-C film hardly change its structure, although other films were graphitized. The 200-nm thick ta-C film was then heated for 60 min through the temperature range from 400 to 800 °C in N₂ with 2 vol.% of O₂ and the film structure found to be stable up to 700 °C. The substrate was oxidized at 800 °C, indicating the ta-C film had a thermal barrier function up to that temperature.     

Plasma enhanced chemical vapor deposition of nanocrystalline silicon films from SiF4-H2-He at low temperature

A high degree of crystallinity is obtained in nc-Si:H films deposited by r.f. PECVD, produced from SiF₄-H₂-He mixtures. The amorphous-to-nanocrystalline transition is favored because of the presence of F atoms, which preferentially etch the amorphous phase. The addition of He to the SiF₄-H₂ gas mixture gives an increase of F and H atoms in the plasma, thus inducing higher crystallinity. A further improvement in the nc-Si:H film structure and properties is obtained by adjusting the r.f. power and the deposition temperature. Under optimized plasma conditions, substrate temperatures as low as 120°C can be reached for the deposition of nc-Si:H having 100% of crystallinity.     

Mechanical properties of a-C:H thin films deposited by r.f. PECVD method

Internal stress, hardness and deposition rate were evaluated for hydrogenated amorphous carbon (a-C:H) films prepared by conventional r.f. plasma-enhanced chemical vapour deposition. The internal stress, hardness and deposition rate of 0.9, 18 and 58 nm/min, respectively, achieved at 40 Pa gas pressure for negative self-bias voltages (V_b) window (from −370 to −550 V). It was found that the negative self-bias voltage window was associated with the existence of two turning points, which shift to higher wavenumber of G band peak position of Raman spectroscopy (Raman) at different V_b in relation to the internal stress and hardness, and rapid decreasing of the relative total peak areas of Fourier Transform Infra-red absorption spectroscopy (FT-IR).The internal stress relaxed from approximately 35 eV ion energy when the energy is increased and rapidly decreased in comparison with the stress relaxation equation.     

流量比对等离子体基团分布和薄膜结构的影响

使用光强标定的发射光谱(AOES)测量了CHF3／C6H6混合气体的微波电子回旋共振(ECR)放电等离子体中基团的分布状态。实验发现随着CHF3流量的增加，成膜基团CF、CF2、CH等的相对密度增大，而刻蚀基团F的密度也会增加，从而使得a—C：F薄膜的沉积速率降低。同时红外吸收谱(IR)分析表明，在高CHF3流量下沉积的a—C：F薄膜中含有更高的C—F键成分。可见在a—C：F薄膜的制备中CHF3／(CHF3 C6H6)流量比是重要的控制参量。