Cure kinetics of multifunctional epoxies with 2,2′‐dichloro‐4,4′‐diaminodiphenylmethane as hardener

The curing behavior of the epoxy resin N,N,N′,N′‐tetraglycidyldiaminodiphenyl methane (TGDDM) with triglycidyl p‐aminophenol as a reactive diluent was investigated using 2,2′‐dichloro‐4,4′‐diaminodiphenylmethane (DCDDM) as the curing agent. The effect of the curing agent on the kinetics of curing, shelf‐life, and thermal stability in comparison with a TGDDM‐diaminodiphenylsulfone (DDS) system was studied. The results showed a lesser activation energy at the lower level of conversion with a broader cure exotherm for the epoxy‐DCDDM system in comparison with the epoxy‐DDS system, although the overall activation energy for the two systems was comparable. TGA studies showed more stability in the epoxy‐DCDDM system than in the epoxy‐DDS system. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 2097–2103, 2000     

An investigation of cure and thermal stability of poly(amide‐amidic acid) modified tetraglycidyl 4,4′‐diaminodiphenylmethane/4,4′‐diaminodiphenylsulfone

In this work, poly(amide‐amidic acid) (PAA) was used to modify tetraglycidyl 4,4′‐diaminodiphenylmethane (TGDDM)/4,4′‐diaminodiphenylsulfone (DDS) system. Results of non‐isothermal differential scanning calorimetry analysis indicated that PAA played a role of catalyst during the process of the curing reaction. The curing mechanism was studied by Fourier transform infrared spectroscopy, showing that the PAA acted as a co‐curing agent in the system. The glass transition temperature decreased firstly and then increased with the increase of the PAA content. PAA equally rendered TGDDM more fire resistant with higher char yield. On examining the fracture surface morphology using scanning electron microscopy, it was observed that there was no obvious phase separation when the content of PAA was less than 20 phr (per hundred weight of TGDDM/DDS resin), however, phase separation was observed when the content of PAA was 25 and 30 phr. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Thermal characterization of carbon‐nanofiber‐reinforced tetraglycidyl‐4,4′‐diaminodiphenylmethane/4,4′‐diaminodiphenylsulfone epoxy composites

The thermal properties of carbon nanofibers (CNF)/epoxy composites, composed of tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM) resin and 4,4′‐diaminodiphenylsulfone (DDS) as a curing agent, were investigated with differential scanning calorimetry (DSC), thermogravimetric analysis, and dynamic mechanical thermal analysis. DSC results showed that the presence of CNF had no pronounced influence on the heat of the cure reaction. However, the incorporation of CNF slightly improved the thermal stability of the epoxy. Furthermore, the storage modulus of the TGDDM/DDS epoxy was significantly enhanced, whereas the glass‐transition temperature was not significantly affected, upon the incorporation of CNFs. The storage modulus of 5 wt % CNF/epoxy composites at 25°C was increased by 35% in comparison with that of the pure epoxy. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 295–298, 2006     

Glass fiber-reinforced epoxy composites

Glass fiber-reinforced epoxy composites were prepared from the matrix resins tetraglycidyl diaminodiphenylmethane

1 Systematic name: N,N,N′,N′-Tetrakis(2,3-epoxypropyl)-4,4′-diaminodiphenylmethane.

(TGDDM) and tetraglycidyl bis(o-toluidino)-methane

2 Systematic name: N,N,N′,N′-Tetrakis(2,3-epoxypropyl)-4,4′-bis(o-toluidino)methane.

(TGMBT) using various amines like 4,4′-diaminodiphenylmethane (DDM), 4,4′-diaminodiphenylsulfone (DDS) and diethylene triamine (DETA) as curing agents. The fabricated laminates were evaluated for their mechanical and dielectrical properties and chemical resistance. The composites prepared using an epoxy fortifier (20 phr) showed significant improvement in the mechanical properties.     

Tertiary‐amine‐free,non‐planar,sulfone‐containing,tetrafunctional epoxy and its application as a high temperature matrix

Non‐amine‐derived tetrafunctional epoxies have several advantages over the amine‐derived N,N,N′,N′‐tetraglycidyl‐4,4′‐diaminodiphenyl methane (TGDDM) in high temperature applications. Although two non‐amine‐derived tetrafunctional epoxies were developed in our laboratory, further improvements in toughness using less loading amount is still desirable. Thus, a tertiary‐amine‐free, non‐planar and triphenylmethane‐containing tetrafunctional epoxy (STFE) with a sulfone spacer was synthesized. When it was mixed with diglycidyl ether of bisphenol A (DGEBA) and cured with 4,4′‐diaminodiphenylsulfone (DDS), both thermal and mechanical performances outperformed TGDDM. Moreover, STFE modified system shows the highest toughness (35.7 kJ m^–2) among three amine‐free and triphenylmethane‐containing epoxies at merely 5 wt% loading. Molecular simulation and thermomechanical analysis results suggest that the improved mechanical properties could be related to the geometry of the molecule and larger free volume. Despite a marginal drop in T_g, the thermal degradation temperature is better than that of TGDDM/DDS. In addition, the moisture resistance of STFE/DGEBA/DDS is much better than that of TGDDM/DDS. Thus, STFE modified DGEBA could be a potential replacement for TGDDM in some high temperature applications. © 2020 Society of Chemical Industry     

Miscibility and mechanical properties of tetrafunctional epoxy resin/phenolphthalein poly(ether ether ketone) blends

Phenolphthalein poly(ether ether ketone) (PEK‐C) was found to be miscible with uncured tetraglycidyl 4,4′‐diaminodiphenylmethane (TGDDM), which is a type of tetrafunctional epoxy resin (ER), as shown by the existence of a single glass transition temperature (T_g) within the whole composition range. The miscibility between PEK‐C and TGDDM is considered to be due mainly to entropy contribution. Furthermore, blends of PEK‐C and TGDDM cured with 4,4′‐diaminodiphenylmethane (DDM) were studied using dynamic mechanical analysis (DMA), Fourier‐transform infrared (FTIR) spectroscopy, and scanning electron microscopy (SEM). DMA studies show that the DDM‐cured TGDDM/PEK‐C blends have only one T_g. SEM observation also confirmed that the blends were homogeneous. FTIR studies showed that the curing reaction is incomplete due to the high viscosity of PEK‐C. As the PEK‐C content increased, the tensile properties of the blends decreased slightly and the fracture toughness factor also showed a slight decreasing tendency, presumably due to the reduced crosslink density of the epoxy network. SEM observation of the fracture surfaces of fracture toughness test specimens showed the brittle nature of the fracture for the pure ER and its blends with PEK‐C. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 79: 598–607, 2001     

Effect of chlorine substitution in 4,4′‐diaminodiphenylmethane hardener on shelf life and mechanical properties of epoxies

Curing of N,N,N′,N′‐tetraglycidyldiaminodiphenylmethane with new curing agents like 3,3′‐dichloro‐4,4′‐diaminodiphenylmethane and 2,2′‐dichloro‐4,4′‐diaminodiphenylmethane in comparison with diaminodiphenylmethane and 4,4′‐diaminodiphenylsulphone (DDS) was carried out using dynamic differential scanning calorimetry. The shelf life of various epoxy formulations was evaluated by the residual cure exotherm method. The glass‐transition temperatures of cured epoxy formulations were determined using dynamic mechanical analysis. The mechanical properties such as the tensile strength, tensile modulus, flexural strength, and Izod impact strength were also evaluated and compared. The activation energy, frequency factor, and shelf life of chloro‐substituted hardener formulations were high as compared to those of unsubstituted hardener formulations. The marginal differences in the glass‐transition temperature, tensile strength, tensile modulus, and flexural strength and the small decrement in the Izod impact strength values were interpreted in terms of chlorine substitution. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 3082–3088, 2002; DOI 10.1002/app.2337     

Curing behavior and thermal and mechanical properties enhancement of tetraglycidyl‐4,4′‐diaminodiphenylmethane/4,4′‐diaminodiphenylsulfone using a liquid crystalline epoxy

A thermosetting resin system, based on tetraglycidyl‐4,4′‐diaminodiphenylmethane, has been developed via copolymerization with 4,4′‐diaminodiphenylsulfone in the presence of a newly synthesized liquid crystalline epoxy (LCE). The curing behavior of LCE‐containing resin system was evaluated using curing kinetics method and Fourier transform infrared spectroscopy. The effect of LCE on the thermal and mechanical properties of modified epoxy systems was studied. Thermogravimetric analysis indicated that the modified resin systems displayed a high T_0.05 and char yield at lower concentrations of LCE (≤5 wt%), suggesting an improved thermal stability. As determined using dynamic mechanical analysis and differential scanning calorimetry, the glass transition value increased by 9.7% compared to that of the neat resin when the LCE content was 5 wt%. Meanwhile, the addition of 5 wt% of LCE maximized the toughness with a 175% increase in impact strength. The analysis of fracture surfaces revealed a possible effect of LCE as a toughener and showed no phase separation in the modified resin system, which was also confirmed by dynamic mechanical analysis. © 2016 Society of Chemical Industry     

Reaction kinetics and thermal properties of epoxidised cresol novolac/4,4′‐diglycidyl (3,3′,5,5′‐tetramethylbiphenyl) epoxy resin composite cured with aromatic diamine

A series of novel composites based on different ratios of epoxidised cresol novolac (ECN) and 4,4′‐diglycidyl(3,3′,5,5′‐tetramethylbiphenyl) epoxy resin (TMBP) have been prepared with the curing agent 4,4′‐methylenediamine (DDM) and 4,4′‐diaminodiphenylsulfone (DDS), respectively. The investigation of cure kinetics was performed by differential scanning calorimetry using an isoconversional method. The high thermal stabilities of the cured samples were also studied by thermogravimetric analysis. In addition, no phase separation was observed for cured ECN/DDM and ECN/DDS blending with different amounts of TMBP by dynamic mechanical analysis and scanning electron microscopy. Moreover, the cured systems also exhibited excellent impact properties and low moisture absorption. All the results indicate that the ECN/TMBP/DDM and ECN/TMBP/DDS systems are promising materials in electronic packaging. Copyright © 2011 Society of Chemical Industry     

New tetrafunctional epoxy resin system with increased shelf life

Chlorine‐ and methyl‐substituted aromatic diamines based on diaminodiphenylmethane were epoxidized and characterized. The effect of different substituents on epoxidation was studied. The cure studies of the two new tetrafunctional resins in comparison with unsubstituted resin N,N,N′,N′‐tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM) was carried out by DSC with 3,3′‐dichloro‐4,4′diaminodiphenylmethane (o‐DCDDM; 30% w/w) as a common curing agent. The mechanical properties such as flexural, Izod impact, heat distortion temperature (HDT), of such cured neat resins were also studied. The results of the cure studies indicate that the substitution of the α‐hydrogen of the resin by chlorine or methyl group decreases the reactivity of the resin leading to an increase in the shelf life. This study also indicates that the functionality of the resin plays a pivotal role in the reactivity and thus the shelf life of an epoxy resin system. The results of the mechanical properties of the neat resin casts obtained by subjecting to a common cure schedule when compared with the unsubstituted resin showed a decrease in impact strength, which is obvious because of the presence of a bulky pendant group but the impact strength was higher than that of the TGOS30 resin system. Results of flexural strength of the different substituted neat resin casts did not show much of a deviation from that of the unsubstituted resin system. The HDT results indicate no significant difference in the values of the unsubstituted resin vis‐a‐vis with substituted resin systems. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 93: 2790–2801, 2004     

Hydrodynamic properties for N,N,N′,N′‐tetraalkyl diglycolamides dissolved in n‐dodecane system

N,N,N′,N′‐tetraoctyl diglycolamide (TODGA) and N,N,N′,N′‐tetra(2‐ethylhexyl) diglycolamide (T2EHDGA) have been identified as promising extractants for actinide partitioning from high‐level nuclear waste. These extractants are proposed to be used along with suitable phase modifiers, viz. N,N‐dihexyl octanamide (DHOA), tri‐n‐butyl phosphate (TBP) and 2‐decanol dissolved in n‐dodecane. Hydrodynamic parameters, viz. density, viscosity and interfacial tension (IFT) are important for optimisation of hydrometallurgical process to ensure that there is no emulsion formation and to achieve desired phase disengagement rate. Densities and viscosities of the two extractants, viz. TODGA and T2EHDGA along with different phase modifiers have been measured over different range of compositions and temperatures (298–333 K). The viscosity data have been used to calculate the activation energy for viscous flow for each composition of solvents. The IFT values have also been measured for different solvent compositions. The viscosity and IFT data of TODGA and T2EHDGA with 2‐decanol as phase modifier appears suitable under hydrometallurgical conditions proposed for actinide partitioning. © 2011 Canadian Society for Chemical Engineering     

Low moisture absorptive epoxy formulations for Gr/Ep laminates

The incorporation of 2-undecyl-imidazole (C₁₁Z) and chromium acetylacetonate (Cr(acac)₃) additives into N, N, N′, N′-tetraglycidyl diaminodiphenylmethane (TGDDM)/diaminodiphenylsulfone (DDS) epoxy formulations was found to significantly decrease the moisture absorption of their prepared graphite/epoxy laminates. However, the same additions did not much affect the moisture absorption of the cured TGDDM/DDS neat resins. Thus, the former case was attributed to the processing effects in view of the fact that C₁₁Z pre-reacting with TGDDM during lay-up process produced the ether-linkage polymer chains in the epoxy networks and raised the viscosity. The following compacting stage of laminates was believed to squeeze the small molecules such as unreacted TGDDM, DDS and Cr(acac)₃, toward the surface of carbon fibers and increase the chance of Cr(acac)₃ to block the hydroxyl groups in the epoxy networks produced by the reactions between TGDDM and DDS. Some evidence was provided to support the above hypothesis in this study.     

Morphologies and mechanical properties of polyethersulfone modified epoxy blends through multifunctional epoxy composition

Thermoplastic polyethersulfone (PES) modified multifunctional tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM) and triglycidyl para‐aminophenol (TGAP) epoxy prepolymers cured with 4,4′‐diaminodiphenylsulfone (44DDS) were prepared using a continuous reactor method and their reaction‐induced phase separated morphologies and mechanical properties were measured and correlated with chemical compositions. ¹H nuclear magnetic resonance (¹H NMR) and near‐infrared spectroscopy (NIR) were used to quantify the chemical network formation. Atomic force microscopy (AFM) with nanomechanical mapping was employed to resolve the nanoscale phase‐separated morphologies. The extent of phase separation in cured networks and resultant domain sizes were determined to be controllable depending upon the multifunctional epoxy compositions. The results obtained from mechanical studies further indicated that tensile modulus was not largely affected by multifunctional epoxy compositions while fracture toughness increased with increase of TGAP content. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44775.     

Curing,compatibility, and fracture toughness for blends of bismaleimide and a tetrafunctional epoxy resin

The curing, compatibility, and fracture toughness of blends of 4,4 ′-bismaleimidodiphenylmethane (BDM)/tetraglycidyl diamino-diphenyl methane (TGDDM) were investigated. Diamino-diphenyl sulfone (DDS) was used as a curing agent. BDM alone could be both homopolymerized (at a lower temperature) and could also undergo Michael addition reactions with the primary amine of DDS. The secondary amine of DDS did not react with BDM. However, the network produced by homopolymerization was not miscible with that produced by the latter reactions. Curing of TGDDM with DDS took place almost at the same temperature as that of the homopolymerization of BDM, but well below the temperature of the Michael addition reaction. When a BDM/TGDDM mixture was cured with DDS in the stoichiometric ratio, the miscibility of the cured system increased with the amount of TGDDM. This was attributed to the fact that the network produced by Michael addition reactions was diminished. When DDS reacted entirely with TGDDM, the BDM/TGDDM/DDS cure yielded only a TGDDM/DDS network and a BDM homopolymerized network, which were not only miscible, but are also interpenetrating. The superior interpenetrated network, as indicated by the highest fracture toughness, was found at BDM/TGDDM = 40/60 weight ratio in the BDM/TGDDM/DDS curing systems.     

Studies on the curing kinetics and thermal stability of the novel tetrafunctional epoxy resin N,N,N′N′-tetrakis(2,3-epoxypropyl)-4,4′-(1,4-phenylenedioxy)dianiline

A novel tetrafunctional epoxy resin, namely N,N,N′N′-tetrakis(2,3-epoxypropyl)-4,4′-(1,4-phenylenedioxy)dianiline, has been synthesized. The curing kinetics has been studied by differential scanning calorimetry (DSC) using various amine curing agents. Thermal stabilities of the cured products have been investigated by thermogravimetric (TG) analyses. The overall activation energies for the curing reactions are observed to be in the range 63.6–196.7 kJ·mol^–1. The cured products have good thermal stability.     

Effect of type of substitution in 4,4′‐bis‐(diaminodiphenyl) methane hardener on cure kinetics,mechanical, and flame retardant properties of tetrafunctional epoxy resins

The nature of the substituent in 4,4′‐bis‐(diaminodiphenyl) methane (DDM) hardener on the cure kinetics, mechanical, and flame retardant properties of N,N,N′,N′‐tetraglycidyl diaminodiphenyl methane (TGDDM) resin is investigated in comparison with unsubstituted DDM and widely used 4,4′‐bis‐(diaminodiphenyl) sulfone hardeners. Dynamic differential scanning calorimetry (DSC) and cure rheology studies showed that the substitution decreased the reactivity of the amine. An electron‐withdrawing chlorine substituent was found to be more effective than an electron‐releasing methyl group in reducing the amine reactivity. Substituted and unsubstituted DDM hardeners showed two peaks in their DSC thermograms that were due to steric hindrance in the former and deficiency of amine in the latter. Substitution showed its effect on the mechanical properties and glass‐transition temperature. The flexural modulus was increased; however, the Izod impact and glass‐transition temperature were decreased in substituted amine systems. The limiting oxygen index results showed higher flame retardancy in the chlorine substituted hardener system compared to other hardener systems that were studied. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 480–491, 2006     

Isothermal curing by dynamic mechanical analysis of three epoxy resin systems: Gelation and vitrification

Times to gelation (t_gel) and times to vitrification (t_vit) during isothermal curing for the epoxy systems diglycidyl ether of bisphenol A (DGEBA)/1,3‐bisaminomethylcyclohexane (1,3‐BAC), tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM)/4‐4′‐diaminodiphenylsulfone (DDS), and TGDDM/epoxy novolac (EPN)/DDS were measured at different curing temperatures. This article reports on a method to determine t_gel and t_vit by dynamic mechanical analysis (DMA). Gelation was determined at the onset of the storage modulus or by the peak of the loss factor. Vitrification was defined as the curve of the storage modulus as the curve reached a constant level (endset) in DMA tests. The experimental values obtained for t_gel and t_vit were compared with values obtained by other experimental methods and with theoretical values (t_gel's) or indirect determinations (t_vit's). From kinetic analysis by differential scanning calorimetry, conversions corresponding to gelation were obtained for the three systems; this yielded a constant value for each system that was higher than theoretical value. Values of the apparent activation energies of the DGEBA/1,3‐BAC, TGDDM/DDS, and TGDDM/EPN/DDS epoxy systems were obtained from plots of t_gel's against reciprocal temperatures. They were 53.2, 58.2, and 46.5 kJ/mol, respectively. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 78–85, 2002     

Epoxy resin based on 4,4′-dihydroxydiphenysulfone. I. Synthesis and reaction kinetics with 4,4′-diaminodiphenylmethane and 4,4′-diaminodiphenylsulfone

Epoxy resins based on 4,4′-dihydroxydiphenylsulfone (DGEBS) and diglycidyl ether of bisphenol A (DGEBA) were prepared by alkaline condensation of 4,4′-dihydroxydiphenylsulfone (bisphenol S) with epichlorohydrin and by recrystallization of liquid, commercial bisphenol A-type epoxy resin, respectively. Curing kinetics of the two epoxy compounds with 4,4′-diaminodiphenylmethane (DDM) and with 4,4′-diaminodiphenylsulfone (DDS) as well as T_g values of the cured materials were determined by the DSC method. It was found that the ? SO₂? group both in the epoxy resin and in the harener increases T_g values of the cured materials. DGEBS reacts with the used hardeners faster than does DGEBA and the curing reaction of DGEBS begins at lower temperature than does the curing reaction of DGEBA when the same amine is used. © 1994 John Wiley & Sons, Inc.     

Characterization of the cure of TGDDM/DDS epoxy resins by chemiluminescence I. Spectral and thermal analysis

The emission of weak visible chemiluminescence (CL) during the cure of a tetraglycidyl 4,4′-diaminodiphenyl methane (TGDDM)-based epoxy resin, with three different concentrations of 4,4′-diaminodiphenylsulfone (DDS) has been studied at 135°C. Spectral analysis indicates that the CL originates from trace oxidation of the TGDDM resin and the emission intensity is sensitive to the viscosity changes during cure. From thermal analysis data, sharp discontinuities in CL intensity are shown to occur at the gel point. The temperature dependence of CL from a cured resin also shows a sharp discontinuity at T_g. These results indicate that CL provides a sensitive monitor of both the kinetics of gelation and the network formation in this epoxy resin.     

Cure kinetic study of carbon nanofibers/epoxy composites by isothermal DSC

An investigation was carried out into the cure kinetics of carbon nanofibers (CNF)/epoxy composites, composed of tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM) resin and 4,4′‐diaminodiphenylsulfone (DDS) as a curing agent. The experimental data for both neat system and CNF/epoxy composites revealed an autocatalytic behavior. Analysis of DSC data indicated that the presence of carbon nanofibers had only a negligible effect on the cure kinetics of the epoxy. Kinetic analysis was performed using the phenomenological model of Kamal and two diffusion factors were introduced to describe the cure reaction in the latter stage. Activation energies and kinetic parameters were determined by fitting experimental data. Comparison between the two diffusion factors was performed, showing that the modified factor was successfully applied to the experimental data over the whole curing temperature range. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 96: 329–335, 2005