Chemical nanotechnology for transparent conducting coatings on thin‐glass and plastic‐foil substrates

Abstract— The properties of wet‐deposited transparent conducting oxide coatings (TCO) prepared by sol‐gel and nanoparticle processing are presented, showing their potentials and limits for display applications. The electrical properties to a large extent are determined by their porous morphology and the resulting grain boundaries, leading to a conductivity which is a factor 10 to 50 lower compared to similar PVD and CVD coatings. Though sol‐gel coatings like antimony‐doped tin oxide (ATO) can be deposited at very low cost, they always require a high‐temperature heat treatment limiting the choice of substrate. For a low‐temperature curing of the coatings, instead, the use of crystalline conducting nanoparticles of indium tin oxide (ITO) in combination with a chemical binder offers considerable application potential. This processing not only allows the preparation of coatings with a sheet resistance of 1 to 2 kΩ/□ but also a direct patterning by a fast UV curing. Typical applications for wet‐deposited coatings are demonstrated including the adjustment of the properties of sputtered ITO coatings, as well as electrodes and antistatic properties on plastics substrates with a moderate conductivity in the lower kΩ/□ range.     

Temporal signatures of resistivity in bending of indium tin oxide‐coated flexible transparent conductive films for flexible electronics: Influence of coating thickness and bending radius

The study is focused on the fundamental understanding of behaviors of polymer films coated with indium tin oxide (ITO) of varying thicknesses and thus various conductivities/transparencies in repeated bending by tracking the electrical resistivity real‐time using a specially designed multi‐purpose flexing system. The results show that temporal increases of resistance provide important clues as to the initiation and progress of failure. In tension, the resistance typically remains flat unless a critical minimum radius of curvature is breached that leads to progressive cracking of ITO coating bringing rapid rise of resistance. This critical minimum radius of curvature increases with the increase of ITO coating thickness making the higher conductivity films more susceptible to damage. In compression mode, similar temporal signature can be found when bent to a curvature below a critical minimum radius. When cracks form in both modes, the resistance signature changes to one of oscillation and the high and low values observed at each cycle progressively increase with more cycles leading ultimately to catastrophic failure.     

Investigation on fracture and conductivity of flex-on-film flexible bonding using anisotropic conductive film considering repeated bending

Microsystem Technologies - This study conducts an experimental investigation into the bending behavior and electrical resistance properties of Flex (PI with Cu)-On-Film (ITO–coated PET)...     

The effect of the crystallization of indium tin oxide on indium tin oxide wet etching based on gate line with the structure of copper/indium tin oxide

In thin film transistor-liquid crystal display (TFT-LCD), the copper/indium tin oxide (Cu/ITO) layer was often used to be gate line. In this event, the patterning of ITO is necessary and important. However, the high temperature generated during Cu deposition will cause ITO to crystallize, which is not conducive to ITO etching. In this paper, the ITO films prepared by radio frequency (RF) magnetron sputtering were annealed according to the monitoring results of production line to simulate and study the effect of crystallization on the etching properties of ITO film. When the annealing temperature was less than 200°C, no large size grains were detected in ITO films, and the ITO films could be easily etched by etchant. However, the ITO films transformed from amorphous structure to polycrystalline structure after being annealed more than 200°C. After wet etching experiments, the polycrystalline ITO films could be hardly removed by etchant. The X-ray photoelectron spectroscopy (XPS) results showed that high temperature annealing induced a large amount of Sn⁴⁺ on ITO films surface. The Sn⁴⁺ was difficult to be dissolved by acid under normal conditions, which might be the most important factors that led to the greatly decreased etching rate for polycrystalline ITO films.     

Effects of ITO film annealing temperature on hybrid solar cell performance

The effects of indium tin oxide (ITO) film annealing temperature on the performance of organic solar cells are investigated. The roughness of the ITO film surface morphology increased with increasing annealing temperature. The optical penetration and rate of exciton generation both increased with increasing ITO film annealing temperature, enhancing the short-circuit current density. The maximum efficiency (2.62 %) was obtained with an annealing temperature of about 500 °C. The incident-photon-to-current efficiency value for a hybrid photovoltaic device with an ITO film annealed temperature at 500 °C was 45 % at 475 nm.     

Development and evaluation of bend‐testing techniques for flexible‐display applications

Abstract— Two different approaches to automated bend testing of flexible substrates for display applications were implemented and characterized: a conventional collapsing radius geometry and a novel technique called the “X‐Y‐θ” geometry. Indium tin oxide (ITO) coated polymer substrates were used to compare the performance of the two automated systems by in‐situ electrical‐resistance measurements. Manual bending on fixed‐diameter mandrels was used to help interpret the results. The advantages and drawbacks of the two systems for providing information of practical use to flexible display R&D are discussed.     

Modeling and optimization of ITO/Al/ITO multilayer films characteristics using neural network and genetic algorithm

In this paper, ITO/Al/ITO multilayer films are fabricated with the variations of Al film thickness and annealing temperature. The effects of Al film thickness and annealing temperature on sheet resistance, optical transmittance, and the figure of merit are analyzed in the aid of the artificial neural network (NNet) models. In order to verify the fitness of NNet model, the root mean square error (RMSE) of training and testing data are calculated. The NNet models well represent the measured sheet resistance, optical transmittance, and the figure of merit. After NNet model is established, genetic algorithm (GA) is used to find the optimum process condition for the ITO/Al/ITO multilayer films to obtain maximum figure of merit in the design space.     

Reliability of transparent conducting substrates for rollable displays: A cyclic loading investigation

Abstract— Failure mechanisms for flexible conducting substrates are investigated herein in the context of rollable/flexible display applications. Cyclic loading experiments (substrates subjected to multiple cycles of tensile strain) were carried out on both ITO‐coated PET and PEDOT:PSS‐coated PET substrates. The resistance was measured after each bending cycle. The resistance increased with the number of cycles and was not reversible. Even when the tensile strain on the ITO/PET was below the virgin cracking threshold (～2%) previously reported [Appl Phys Lett ⁷⁶, 1425 (2000)], slight increases in resistance were measurable after just a few cycles.     

Indium tin oxide anode modification for enhanced polymer light‐emitting devices

Abstract— Effort has been focused on exploring indium tin oxide (ITO) anode modification for enhanced performance of polymer light‐emitting diodes (PLEDs). It was found that oxidative treatment, e.g., a commonly used oxygen plasma, modifies ITO surface effectively to produce a low‐conductivity oxygen‐rich region. As a consequence, oxygen plasma‐treated ITO behaves somewhat similarly to specimens where there is an ultra‐thin insulating layer on its surface. It shows that the presence of such an ultra‐thin insulating interlayer between the ITO and the polymer layer favors the efficient operation of the PLEDs. The result of this effort provides an insight to better understand optimal anode contact for enhanced PLED performance.     

Enhancement of metal coil quality on selective p-silicon based planar electromagnetic coil by thermal annealing process

In this paper we report an optimization of metal quality of planar MEMS electromagnetic coil through thermal annealing process. The study aims to see the effects of annealing process on the quality of metal layer deposited on localized p-type silicon regions. Two annealing process parameters namely isothermal (annealing under time variations in constant temperature) and isochronal (annealing under temperature variations at constant time) were performed on metal contact on highly doped Si substrate and characterized using transfer length method method by measuring the specific contact resistance ρ _C of the metal traces. The measurement results showed that the annealing process have significant influence on physical and electrical characteristics of the metal layer. Analysis showed that the quality of metal layer was significantly improved through the annealing process after treatment at temperature variations between 425–550 °C. An optimum annealing at 525 °C for 15 min was observed and the contact resistance can be reduced significantly up to 400 %. The results also showed that the surface roughness improves while metal contact resistance decreases 40 times when the metal is annealed for more than 10 min. The planar coil structure was designed to reduce the device density of a compact magnetic micro-sensor system.     

Effect of annealing and temperature on the NO2 sensing properties of tellurium based films

Influences of temperature and annealing on the electrical and sensing properties toward NO₂ of tellurium based films were investigated. The annealing at temperatures more than 100 °C causes a sharp decrease both of electrical resistance and sensitivity of the films. SEM analyzes indicated that annealing induced structural evolution of the films, including growth of large crystals in the matrix. Temperature-dependent electrical conductivity is strongly affected by presence of an NO₂ environment. The sensitivity toward NO₂, being controlled by gas concentration, decreases with operating temperature increase. On the other hand, the increase of operating temperature leads to a reduction of response–recovery times.

The results are discussed taking into consideration the contributions of grain boundary as well as grain bulk and surface resistance to the total conductivity. It is assumed the surface, including grain boundary, hole-enriched region is formed as a result of dangling bond chalcogen’s lone-pair electron interaction. Chemisorption of NO₂ molecules is accompanied by hole enrichment of the surface and grain boundary region, due to interaction of these molecules with lone-pair electrons.     

Finite element analysis of crack closure in plate bending

The effect of crack closure in plate bending is studied using the finite element method. Elastic plates containing through-wall-thickness stationary cracks under transverse pressure loading are considered with different plate thicknesses and boundary conditions, respectively. Crack closure on the compression side is modeled two different ways: line closure and surface closure models. A plate bending element degenerated from a three-dimensional solid element is used to model such crack closure. Effects of crack closure are compared using the line or surface closure model for different plate thicknesses and boundary conditions, respectively.     

Experimental and numerical investigation of flexibility of ITO electrode for application in flexible electronic devices

For flexible electronic devices, the transparent conductive electrode (TCE) is the most important material for determining the flexibility of devices. Due to the brittleness of the indium tin oxide (ITO) electrode, several alternative TCEs have been developed. However, it is still difficult to successfully achieve quality as good as ITO. In this study, the flexibility of the ITO electrode was investigated with strain and fracture analysis. Effects of thickness of the ITO and the substrate on the flexibility of ITO were investigated by bending tests, numerical simulation and theoretical analysis. Flexibility of ITO electrode can be increased by reducing the thickness of ITO and substrate material. An ITO electrode with a substrate less than 50 μm could be bent to less than 4 mm without failure, and used in flexible electronics. Effects of different substrate materials on the flexibility of ITO were also investigated based on fracture analysis. We investigated the effects of PEDOT [poly(3,4-ethylenedioxythiophene)] as a buffer layer to improve flexibility. Higher flexibility of the ITO/PEDOT hybrid electrode compared to ITO was attributed to the PEDOT layer, which smoothened ITO surface and decreased the density of pinholes or voids of ITO, resulting in higher crack resistance.

     

基于XFEM的折弯片断裂仿真

采用Abaqus的XFEM功能对折弯片的断裂问题进行仿真,断裂区为转角处的过渡区域.转角处圆弧的半径影响裂纹的开裂时间.裂纹的扩展路径具有任意性,细化网格下裂纹扩展方向不稳定,会超出断裂区.1阶单元和1阶减缩积分单元的分析结果比较接近.通用静态分析比动态隐式分析效率更高一些.在端部压力的作用下,折弯片约在1 ms内开裂,8 ms完全断开.Cohesive element算法的裂纹路径较LEFM方法更平滑一些.     

Au纳米粒子修饰纳米片状结构衬底的SERS研究

通过电化学共沉积和化学脱合金处理在金属W片上制备了纳米片状基底,将Au纳米粒子通过等离子溅射到纳米片状基底上得到表面增强拉曼散射(SERS)衬底。采用扫描电子显微镜(FE-SEM)、能谱仪(EDX)对复合纳米衬底进行表征,罗丹明6G作为探测分子对SERS衬底的拉曼表面增强效果进行检测。通过实验发现:三维空间结构的纳米片状结构具有拉曼表面增强效应,溅射Au纳米颗粒得到的Au纳米片衬底信号增强效果显著。     

Conformable displays based on polymer‐dispersed liquid‐crystal materials on flexible substrates

Abstract— We have developed a process that enables one to conform polymer‐dispersed liquid‐crystal (PDLC) displays into a particular shape indefinitely. Planar PDLC displays are first fabricated between indium tin oxide (ITO) coated polyethylene terephthalate (PET) substrates. This fully functional display can then be conformed to a particular shape by heating above the glass‐transition temperature of PET and then allowing it to cool down to room temperature. The display retains its shape and is fully functional after processing. We have created spiral‐and wave‐like samples and have demonstrated their operation after the conformal process. The stress is relieved in the substrate by conforming. Temperature effects on polymer substrates were investigated for two types of polymer films (PET/ITO substrates and a conducting polymer PEDOT:PSS/PET substrate) to analyze the effects of temperature on the resistance and mechanics of the films under an applied uniaxial strain. We have found a decrease in contrast of the PDLC after conforming, but surprisingly, a reduced threshold voltage and reduced hysterisis occurs.     

Micromechanics-based FEM simulation of fiber-reinforced cementitious composite components

Fiber bridging along cracks is an important mechanism governing the fracture toughness and the pseudo-ductility of fiber-reinforced brittle materials and structures. This paper attempts to predict structural behavior of fiber-reinforced cementitious composite (FRCC) components using the finite-element procedure with micromechanics-based constitutive modeling of the stress-displacement relation along the crack. The tensile stress-displacement relation along a Mode I (opening) crack is established based on fiber pullout curves derived from a micromechanical model. A statistical model is used to account for random fiber distribution. Two-dimensional finite-element simulations of beam behavior are performed with the finite-element package ADINA. Using the discrete crack approach, strain softening truss elements are placed along the crack to simulate the fiber bridging effect. Experiments of beams under four-point bending are performed with specimens containing different fiber volume fractions (up to 1.5%). The numerical results for the load vs deformation behavior of the beams agree well with the experimental results. The FEM procedure for micromechanics-based design and analysis of FRCC components is therefore established. Simulation of component behavior to identify the most cost-effective design can, hence, be carried out.     

基于数字图像处理的表面裂纹检测算法

本文提出了一种基于数字图像处理技术的表面裂纹检测算法。运用这种算法能精确的检测裂纹的位置、长度等特征，将这种裂纹检测算法运用到裂纹自动检测系统以及裂纹扩展行为监测中不仅大大降低了劳动时间和劳动强度，而且提高了测量的准确性。     

Electrical and morphological characterization of platinum thin-films with various adhesion layers for high temperature applications

In this paper we report on the morphological and electrical properties of platinum (Pt) thin-films with Titanium (Ti) and, alternatively, Titanium dioxide (TiO₂) as adhesion layers for high temperature applications. All films were sputter deposited on silicon substrates and afterwards annealed in air up to 800 °C. The results show that Ti diffuses into Pt grain boundaries forming oxide precipitates (TiO_x) in the Pt grain boundaries. The resistivity of Pt/Ti thin-films increased continuously with annealing temperature up to 500 °C and decreases again continuously above 500 °C. In contrast, TiO₂ demonstrates a dense stable oxide layer after annealing. Pt/TiO₂ thin-films show a continuous decrease in the sheet resistance with increasing the annealing temperature. Accordingly, TiO₂ thin-film is the preferable adhesive layer for Pt over Ti thin-films for high temperature applications.

     

Thin‐film barriers using transparent conducting oxides for organic light‐emitting diodes

Abstract— This study covers thin‐film barriers using inorganic barriers of transparent conducting oxides (TCOs) such as zinc oxide (ZnO) and indium tin oxide (ITO). The TCOs were fabricated using a sputtering method with a process gas of pure argon at room temperature. ITO showed better properties as a barrier than the ZnO and exhibited the electronic performance necessary to perform additional functions. The ITO has superior barrier performance because it has a lower crack density due to its partial amorphous phase. For organic/inorganic multilayer barriers, the organic underlayer decreased the water‐vapor transmission rate (WVTR) more than the organic upper layer, indicating that the planarization effect was important in reducing the WVTRs. The results of this organic/ITO multilayer barrier study are expected to be useful in finding a practical solution to OLED encapsulation.