Superplastic Forming and Diffusion Bonding for Sandwich Structure of Ti-6Al-4V Alloy

Superplastic forming and diffusion bonding (SPF/DB) is a well-established process for the manufacture of components almost exclusively from Ti-6AI-4V sheet material. The sandwich structure of Ti-6AI-4V alloy is investigated. The effects of the microstructure on the SPF/DB process were discussed. The microstructure at the interfaces and the distribution of thickness were researched.     

Ti/Nb/Cu作缓冲层的TiC金属陶瓷/304不锈钢扩散连接

采用Ti/Nb/Cu复合中间层在连接温度为925℃、保温时间20min、焊接压力8MPa的条件下对TiC金属陶瓷和304不锈钢进行真空扩散连接。通过光学金相显微镜(OM)、扫描电镜(SEM)、能谱(EDS)及X射线衍射(XRD)分析观察接头微观组织、断口形貌、反应界面元素分布、断面的物相组成。结果表明:在TiC金属陶瓷和304不锈钢之间形成一个明显的转变过渡区,界面反应产物主要为[Ti,Nb]固溶体+Ti+NbTi4,Nb和剩余Cu+[Cu,Fe]固溶体+Cr。接头抗剪强度达到84.6MPa,断裂发生在TiC和Ti之间的位于TiC上的扩散反应层上。Nb对接头残余应力的改善起到关键作用,界面强度高于因残余应力作用而弱化了的陶瓷基体强度。     

Different Diffusion Behavior of Cu and Ni Undergoing Liquidesolid Electromigration

The diffusion behavior of Cu and Ni atoms undergoing liquidesolid electromigration（L-S EM） was investigated using Cu/Sn/Ni interconnects under a current density of 5.0 103A/cm2 at 250℃. The flowing direction of electrons significantly influences the cross-solder interaction of Cu and Ni atoms, i.e., under downwind diffusion, both Cu and Ni atoms can diffuse to the opposite interfaces; while under upwind diffusion,Cu atoms but not Ni atoms can diffuse to the opposite interface. When electrons flow from the Cu to the Ni, only Cu atoms diffuse to the opposite anode Ni interface, resulting in the transformation of interfacial intermetallic compound（IMC） from Ni3Sn4into（Cu,Ni）6Sn5and further into [（Cu,Ni）6Sn5t Cu6Sn5], while no Ni atoms diffuse to the opposite cathode Cu interface and thus the interfacial Cu6Sn5 remained.When electrons flow from the Ni to the Cu, both Cu and Ni atoms diffuse to the opposite interfaces,resulting in the interfacial IMC transformation from initial Cu6Sn5into（Cu,Ni）6Sn5and further into[（Cu,Ni）6Sn5t（Ni,Cu）3Sn4] at the anode Cu interface while that from initial Ni3Sn4into（Cu,Ni）6Sn5and further into（Ni,Cu）3Sn4at the cathode Ni interface. It is more damaging with electrons flowing from the Cu to the Ni than the other way.     

Preparation of super-hydrophobic Cu/Ni coating with micro-nano hierarchical structure

Micro-nano hierarchical structured Cu/Ni multilayer coating was prepared by a simple two-step method combined with electroless and electro deposition. Structure and morphology of the as-prepared Cu/Ni multilayer coating were analyzed by X-ray diffractometer and field emission scanning electron microscopy. Results show that micro-nano Cu/Ni coating is well-crystallized and exhibits sea cucumber-like microstructure with Ni nanocone arrays uniformly dispersed perpendicular to the circular conical surface of Cu cone. Static contact angles were measured to investigate the surfaces' wettability. The result reveals that the Cu/Ni multilayer coating is super-hydrophobic, of which the static contact angle with test liquid (water) was 156°(> 150°).Due to its super-hydrophobic property and unique shape, Cu/Ni multilayer coating is expected to have extensive practical applications.     

Improvement of Joint Strength of SiCp/Al Metal Matrix Composite in Transient Liquid Phase Bonding Using Cu/Ni/Cu Film Interlayer

The compact oxide on the surface of SiCp/Al metal matrix composite （SiCp/Al MMC） greatly depends on the property of the joint. Inlaid sputtering target was applied to etch the oxide completely on the bonding surface of SiCp/Al MMC by plasma erosion. Cu/Ni/Cu film of 5μm in thickness was prepared by magnetron sputtering method on the clean bonding surface in the same vacuum chamber, which was acted as an interlayer in transient liquid phase （TLP） bonding process. Compared with the same thickness of single Cu foil and Ni foil interlayer, the shear strength of 200 MPa was obtained using Cu/Ni/Cu film interlayer during TLP bonding, which was 89.7% that of base metal. In addition, homogenization of the bonding region and no particle segregation in interfacial region were found by analysis of the joint microstructure. Scanning electron microscopy （SEM） was used to observe the micrograph of the joint interface. The result shows that a homogenous microstructure of joint was achieved, which is similar with that of based metal.     

Joining of Zirconia and Ti-6Al-4V Using a Ti-based Amorphous Filler

Polycrystalline ZrO2-3 mol.%Y2O3 was brazed to Ti-6Al-4V by using a Ti47Zr28Cu14Ni11(at.%) amorphous ribbon at 1123-1273 K in a high vacuum. The influences of brazing temperature on the microstructure and shear strength of the joints were investigated. The interfacial microstructures can be described as ZrO2/TiO+TiO2+Cu2Ti4O+Ni2Ti4O/α-Ti+(Ti,Zr)2(Cu,Ni) eutectic/acicular Widmanst¨aten structure/Ti-6Al-4V alloy. With the increase in the brazing temperature, the thickness of the TiO+TiO2+Cu2Ti4O+Ni2Ti4O layer reduced, the content of the α-Ti+(Ti,Zr)2(Cu,Ni) eutectic phase decreased, while that of the coarse α-Ti phase gradually increased. The shear strength of the joints did not show a close relationship with the thickness of the TiO+TiO2+Cu2Ti4O+Ni2Ti4O layer. However, when the coarse (Ti,Zr)2(Cu,Ni) phase was non-uniformly distributed in the α-Ti phase, or when α-Ti solely situated at the center of the joint, forming a coarse block or even connecting into a continuous strip, the shear strength greatly decreased.     

Al2O3/Ti6Al4V diffusion bonding joints using Ag–Cu interlayer

Ceramic materials, such us alumina, are widely used for wear resistant and industrial components as in aircraft applications. On the other hand, Ti6Al4V is commonly used for aeronautical applications, due to its superplasticity, low weight and high mechanical resistance but has poor wear resistance because of its low resistance to plastic shearing. For these reasons numerous techniques have been developed to improve its wear resistance including joining to ceramic materials. Ceramics and alloys can be joined by several different processes and the use of an interlayer can further facilitate this process. In the present work Al₂O₃ and Ti6Al4V alloy have been diffusion bonded using a (Ag–Cu) interlayer. Identification of intermetallic phases formed within the bonded region enables the mechanical behaviour of the joints to be explained. These intermetallic phases are related to the bonding conditions applied (750 °C, 3 MPa with bonding times varied from 10 to 60 min).     

Diffusion kinetics of explosively treated and plasma nitrided Ti-6Al-4V alloy

Ti-6Al-4V alloys, which were exposed to an explosive shock process, were nitrided in nitrogen plasma in the temperature range of 700-900°C for 3-12 h. During the plasma nitriding, the surface layer consisted of TiN (δ), Ti₂N (ε) and nitrogen solid solution layers (α-Ti). The growth rate of nitride and solid solution layers were found to be controlled by the diffusion of nitrogen. An effective nitriding was achieved due to high dislocation density and vacancy concentration. Based on the present layer growth data, an analytical model for multiphase diffusion was used to estimate the effective nitrogen atom diffusion coefficient in the nitride layers. The interface velocity equations were derived from Fick's law and a numerical method has been used to compute the diffusion coefficients of nitrogen in a binary multiphase Ti-TiN system. Depending on temperature and layer thickness, the activation energies of nitrogen in TiN and Ti₂N phases were found to be 18,950 (±2116) and 27,925 (±1105) cal/mole, respectively.     

Microstructure and properties of diffusion bonded Ti-6Al-4V parts using brazing-assisted hot isostatic pressing

Ti-6Al-4V couples have been diffusion bonded by hot isostatic pressing (HIPping) after vacuum brazing was used to seal the periphery of the bonding samples so that no encapsulation was required during HIPping. Analytical scanning electron microscopy was used to assess the microstructure of the HIPped interface and tensile and fatigue properties of bonded samples were compared with those of the bulk starting material. The tensile properties of the bonds were shown to be comparable with those of the bulk material, but the fatigue life was slightly downgraded. The fatigue fractures were initiated by inclusions on the bonding interface, caused by contamination before bonding, but the fatigue cracks did not propagate along the bonding interface indicating a strong bond. It is concluded that this technique of vacuum brazing plus HIPping could be used for encapsulation-free HIPping to produce complex-shaped components.     

Diffusion bonding of Zr55Cu30Ni5Al10 bulk metallic glass to Cu with Al as transition layer

In this work we demonstrate the diffusion bonding of Zr₅₅Cu₃₀Ni₅Al₁₀ bulk metallic glass (BMG) to aluminum and copper alloy. The process parameters including temperature, pressure and time are investigated experimentally, and we obtain appropriate ones for accomplishing diffusion bonding of the BMG to aluminum alloy successfully. Then we present a two-step diffusion bonding process to bond the BMG to copper alloy by using aluminum alloy as transition layers, and achieve a five-layer bonded joint of BMG/Al/Cu/Al/BMG. The mechanical properties of the multilayer joint are examined. The hardness of the BMG in the joint is enhanced while the bending strength decreases significantly compared with the as-received BMG. Besides, the crystalline metals alleviate and block the extension of cracks in the BMG, which results in the joint fracturing in an explosion-proof glass manner, dissimilar to rupturing in a catastrophic manner that is always happened in the BMGs. Therefore, diffusion bonding of BMG to crystalline metals is a promising way to extend its application.     

用纯金属Ni作中间层扩散连接铝基复合材料

采用纯金属Ni作中间层扩散连接氧化铝颗粒增强铝基复合材料(Al2O3P/6061Al),探究了连接温度和保温时间对接头显微结构与力学性能的影响.结果表明,连接温度610～620℃时,连接区主要由Al3Ni和Ni在Al中固溶体组成,Al3Ni含量随连接温度升高、保温时间延长而减少;连接温度630℃时,连接区主要由Al2O3颗粒和Ni在Al中固溶体组成,Al2O3颗粒偏聚于接头中心.连接温度620℃、保温时间5～120min条件下,接头抗剪强度68～93MPa,断裂于连接区与母材界面;连接温度630℃、保温时间5～120min条件下,接头抗剪强度93～97MPa,断裂于增强相偏聚区.     

Effect of Ni interlayer on strength and microstructure of diffusion-bonded Mo/Cu joints

Mo and Cu were bonded successfully by means of diffusion bonding using a Ni interlayer. The tensile strength of the joint increases firstly and then decreases with the bonding temperature or holding time increases. Compared with 79 MPa which was the maximum value of Mo/Cu joint, the maximum tensile strength of joint with Ni interlayer was 97 MPa. The interfacial structure of the joints was studied by SEM, EPMA, EDS and XRD, the results showed that the different atoms diffused to each other in the bonding process and no intermetallic compound appeared. MoNi and NiCu solid solutions formed in the joint. The fracture of the joint had taken place in the Mo/Ni interface rather than in the Ni/Cu interface and the fracture way of the joints was brittle fracture.     

Characterization,Removal and Evaluation of Oxide Film in the Diffusion Bonding of Zr55Cu30Ni5Al10 Bulk Metallic Glass

The composition of oxide film of ZrssCu3oNi5Al10 bulk metallic glass was identified by X-ray photoelectron spectroscopy. In addition, the relatively sound joints of bulk metallic glass without macroscopic deformation were obtained by removing the oxide film before diffusion bonding. The joint interfaces were observed by scanning electron microscopy and atomic force microscopy. The hardness of joints near the interface was higher than that far away from the interface, which is attributed to the difference of structural relaxation. According to the result of micro-focused X-ray diffractometry and transmission electron microscopy, the joints retained the amorphous structure when the holding time is less than 20 min. The surface area fraction of oxide film on the interface of joints was detected by ultrasonic inspection. Moreover, the surface area fraction of oxide film is in excellent agreement with the theoretical value calculated by shear strength. The result indicated that surface oxide film is the dominant barrier on the diffusion bonding of bulk metallic glass rather than low atomic diffusion coefficient.     

Characterization of Al/Ni multilayers and their application in diffusion bonding of TiAl to TiC cermet

The Al/Ni multilayers were characterized and diffusion bonding of TiAl intermetallics to TiC cermets was carried out using the multilayers. The microstructure of Al/Ni multilayers and TiAl/TiC cermet joint was investigated. The layered structures consisting of a Ni₃(AlTi) layer, a Ni₂AlTi layer, a (Ni,Al,Ti) layer and a Ni diffusion layer were observed from the interlayer to the TiAl substrate. Only one AlNi₃ layer formed at the multilayer/TiC cermet interface. The reaction behaviour of Al/Ni multilayers was characterized by means of differential scanning calorimeter (DSC) and X-ray diffraction. The initial exothermic peak of the DSC curve was formed due to the formation of Al₃Ni and Al₃Ni₂ phases. The reaction sequence of the Al/Ni multilayers was Al₃Ni → Al₃Ni₂ → AlNi → AlNi₃ and the final products were AlNi and AlNi₃ phases. The shear strength of the joint was tested and the experimental results suggested that the application of Al/Ni multilayers improved the joining quality.     

Effects of cold metal transfer mode on the reaction layer of wire and arc additive-manufactured Ti-6Al-4V/Al-6.25Cu dissimilar alloys

Components of Ti and Al dissimilar alloys were obtained by wire and arc additive manufacturing using two cold metal transfer (CMT) modes.Direct current CMT (DC-CMT) mode was used for Ti alloy deposition,and DC-CMT or CMT plus pulse (CMT + P) mode was used for the Al alloy deposition.During deposition of the first Al alloy layer,little and a significant amount of Ti alloy were melted using DC-CMT and CMT +P mode,respectively.TiAl3 formed in the reaction layer when DC-CMT mode was used,while TiAl3,TiAl,and Ti3Al formed in the reaction layer when CMT + P mode was used.Compared to using DC-CMT mode,more cracks occurred when using CMT + P.The nanohardness of the reaction layer was between that of the Al and Ti alloys,irrespective of the CMT modes.The average tensile strengths of the samples us ingDC-CMT and CMT + P mode were 108 MPa and 24 MPa,respectively.DC-CMT mode was more suitable for the wire and arc additive manufacturing of Ti/Al dissimilar alloys.     

Influence of various metal powder mixed dielectric on micro-EDM characteristics of Ti-6Al-4V

Ti-6Al-4V, an advanced engineering material is difficult-to-machine using conventional machining process due to its high strength. It has properties like low weight ratio, outstanding corrosion resistance along with high level of reliable performance in micro components. Micro-electro-discharge machining (Micro-EDM), a popular nontraditional machining process has been identified as the most appropriate machining process for such material. In this paper, the effect of various conducting powders such as copper, nickel and cobalt with different concentrations are mixed with deionized water dielectric, on various responses such as material removal rate (MRR), tool wear rate (TWR), overcut (OC) and taper has been presented. Also, principal component analysis (PCA) has been applied to select the optimal parametric combination of micro-EDM process to achieve optimal values of MRR, TWR, OC and taper during micro-through hole machining. The optimal process parametric setting obtained from the proposed approach is peak current (I_p) of 1.5 A and cobalt (Co) powder concentration of 4 g/L so as to obtain the desired responses. It is also observed from the SEM image that the machined profile and surface topography obtained through the multi-objective optimal parametric combination based on PCA is quite satisfactory and can be applied to achieve geometrically more accurate micro-through holes on Ti-6Al-4V.     

Biaxial deformation of Ti-6Al-4V and Ti-6Al-4V/TiC composites by transformation-mismatch superplasticity

Gas-pressure bulge forming of unreinforced Ti-6Al-4V and TiC-reinforced Ti-6Al-4V was performed while cycling the temperature around the allotropic transformation range of the alloy (880–1020 °C). The resulting domes exhibited very large strains to fracture without cavitation, demonstrating for the first time the use of transformation-mismatch superplasticity under a biaxial state of stress for both an alloy and a composite. Furthermore, much faster deformation rates were observed upon thermal cycling than for control experiments performed under the same gas pressure at a constant temperature of 1000°C, indicating that efficient superplastic forming of complex shapes can be achieved by transformation-mismatch superplasticity, especially for composites which are difficult to shape with other techniques. However, the deformation rate of the cycled composite was lower than for the alloy, most probably because the composite exhibits lower primary and secondary isothermal creep rates. For both cycled materials, the spatial distribution of principal strains is similar to that observed in domes deformed by isothermal microstructural superplasticity and the forming times can be predicted with existing models for materials with uniaxial strain rate sensitivity of unity. Thus, biaxial transformation-mismatch superplasticity can be modeled within the well-known frame of biaxial microstructural superplasticity, which allows accurate predictions of forming time and strain spatial distribution once the uniaxial constitutive equation of the material is known.     

Infrared brazing Ti-6Al-4V and SP-700 alloys using the Ti-20Zr-20Cu-20Ni braze alloy

Great efforts have been made in brazing high-strength α-β titanium alloys below their beta-phase transformation temperature in order to obtain optimized mechanical properties. The brazing temperature of the cold roll-bonded Ti-20Zr-20Cu-20Ni foil is roughly 70 °C lower than that of Ti-15Cu-15Ni filler metal. Moreover, the detrimental Cu-Ni and Cu-Ni-Zr rich Ti phases can be greatly reduced or eliminated by properly choosing the brazing thermal cycle. This research demonstrates the potential application of Ti-20Zr-20Cu-20Ni foil in brazing titanium alloys.     

Growth mechanism of compound at interface of Ti-6Al-4V joint brazed with 72Ag-28Cu filler alloy

Abstract

The growth process of Ti-Cu compound at the interface of a Ti-6Al-4V/72Ag-28Cu (wt-%) joint was analysed using X-ray diffraction, SEM, and energy diffraction spectra. According to the investigated results, when the joint was brazed for a relatively short holding time, atoms of Ti and Cu diffused into the interface would combine into Ti₂Cu by eutectoid reaction during the cooling stage. As the holding time is beyond the critical brazing time, Ti₂Cu compound decomposed owing to a large amount of Ti in the base metal dissolving into the brazing zone and the relatively gentle concentration gradient of Cu, thus resulted in the solid dissolving of Cu into Ti. In this case, the resulting joints exhibited high strengths. On the basis of the analysis mentioned above, a concept 'critical brazing time' was proposed.     

XRD and TEM Analysis in the Interface of Diffusion Bonding for Fe3Al/Q235 Dissimilar Materials

Phase structure characteristics near the interface of Fe3Al/Q235 diffusion bonding are investigated by means of X raydiffraction (XRD), transmission electronic microscope (TEM) and electron diffraction, etc. The test results indicatedthat obviously a diffusion transition zone forms near the interface of Fe3Al/Q235 under the condition of heatingtemperature 1050~1100℃, holding time 60 min and pressure 9.8 MPa, which indicated that the diffusion interfaceof Fe3Al/Q235 was combined well. The diffusion transition zone consisted of Fe3Al and a-Fe(Al) solid solution.Microhardness near the diffusion transition zone was HM 480~540. There was not brittle phase of high hardness inthe interface transition zone. This is favorable to enhance toughness of Fe3Al/Q235 diffusion joint.