Thin‐film barriers using transparent conducting oxides for organic light‐emitting diodes

Abstract— This study covers thin‐film barriers using inorganic barriers of transparent conducting oxides (TCOs) such as zinc oxide (ZnO) and indium tin oxide (ITO). The TCOs were fabricated using a sputtering method with a process gas of pure argon at room temperature. ITO showed better properties as a barrier than the ZnO and exhibited the electronic performance necessary to perform additional functions. The ITO has superior barrier performance because it has a lower crack density due to its partial amorphous phase. For organic/inorganic multilayer barriers, the organic underlayer decreased the water‐vapor transmission rate (WVTR) more than the organic upper layer, indicating that the planarization effect was important in reducing the WVTRs. The results of this organic/ITO multilayer barrier study are expected to be useful in finding a practical solution to OLED encapsulation.     

Process study and optimization for fabrication of poly‐Si thin‐film transistors on plastic substrates

Abstract— A complete poly‐Si thin‐film transistor (TFT) on plastic process has been optimized to produce TFT arrays for active‐matrix displays. We present a detailed study of the poly‐Si crystallization process, a mechanism for protecting the plastic substrate from the pulsed laser used to crystallize the silicon, and a high‐performance low‐temperature gate dielectric film. Poly‐Si grain sizes and the corresponding TFT performance have been measured for a range of excimer‐laser crystallization fluences near the full‐melt threshold, allowing optimization of the laser‐crystallization process. A Bragg reflector stack has been embedded in the plastic coating layers; its effectiveness in protecting the plastic from the excimer‐laser pulse is described. Finally, we describe a plasma pre‐oxidation step, which has been added to a low‐temperature (<100°C) gate dielectric film deposition process to dramatically improve the electrical properties of the gate dielectric. These processes have been integrated into a complete poly‐Si TFT on plastic fabrication process, which produces PMOS TFTs with mobilities of 66 cm² /V‐sec, threshold voltages of ?3.5 V, and off currents of approximately 1 pA per micron of gate width.     

Letter: Solution‐processed flexible zinc‐tin oxide thin‐film transistors on ultra‐thin polyimide substrates

In this letter, solution‐processed flexible zinc‐tin oxide (Z_0.35T_0.65O_1.7) thin‐film transistors with electrochemically oxidized gate insulators (AlOx:Nd) fabricated on ultra‐thin (30 µm) polyimide substrates are presented. The AlOx:Nd insulators exhibited wonderful stability under bending and excellent insulating properties with low leakage current, high dielectric constant, and high breakdown field. The device exhibited a mobility of 3.9 cm²/V · s after annealing at 300 °C. In addition, the flexible device was able to maintain the electricity performance under various degrees of bending, which was attributed to the ultra‐thin polyimide substrate.     

Novel top‐gate zinc oxide thin‐film transistors (ZnO TFTs) for AMLCDs

Abstract— High‐performance top‐gate thin‐film transistors (TFTs) with a transparent zinc oxide (ZnO) channel have been developed. ZnO thin films used as active channels were deposited by rf magnetron sputtering. The electrical properties and thermal stability of the ZnO films are controlled by the deposition conditions. A gate insulator made of silicon nitride (SiN_x) was deposited on the ZnO films by conventional P‐CVD. A novel ZnO‐TFT process based on photolithography is proposed for AMLCDs. AMLCDs having an aperture ratio and pixel density comparable to those of a‐Si:H TFT‐LCDs are driven by ZnO TFTs using the same driving scheme of conventional AMLCDs.     

A course on thin‐film transistor circuit design for modern displays

A new subject‐specific course on thin‐film transistor (TFT) circuit design is introduced, covering related knowledge of display technologies, TFT device physics, processing, characterization, modeling and circuit design. A design project is required for students to deepen the understanding even more and get hands‐on design experience. This course can be an intense 1‐week course to offer a full training of design engineers in an organized way to meet the ever‐increasing needs in display industry for TFT circuit design specialists. It can also be organized in one semester for electrical engineering Master's and Ph.D. students.     

a‐InGaZnO thin‐film transistors for AMOLEDs: Electrical stability and pixel‐circuit simulation

Abstract— Inverted‐staggered amorphous In‐Ga‐Zn‐O (a‐InGaZnO) thin‐film transistors (TFTs) were fabricated and characterized on glass substrates. The a‐InGaZnO TFTs exhibit adequate field‐effect mobilities, sharp subthreshold slopes, and very low off‐currents. The current temperature stress (CTS) on the a‐InGaZnO TFTs was performed, and the effect of stress temperature (TSTR), stress current (ISTR), and TFT biasing condition on their electrical stability was investigated. Finally, SPICE modelling for a‐InGaZnO TFTs was developed based on experimental data. Several active‐matrix organic light‐emitting‐display (AMOLED) pixel circuits were simulated, and the potential advantages of using a‐InGaZnO TFTs were discussed.     

Effects of gate‐bias stress on ZnO thin‐film transistors

Abstract— The effects of gate‐bias and thermal stress on the stability issues of zinc oxide thin film transistors (ZnO TFTs) deposited on glass substrates were investigated. The shift in threshold voltage for devices undergoing various post‐growth annealing conditions using a stretched‐exponential formalism was analyzed. The analysis indicated that the extracted parameters such as the time constant and the effective energy barrier (E^τ) can be correlated to the device trap states associated with the annealing conditions. Improvement in the channel conductance and interface quality, hence the resultant device stability, can therefore be resumed when subject to a thermal treatment at 400°C for 30 minutes compared with those annealed for a shorter time.     

Uniformity and bias‐temperature instability of bottom‐gate zinc oxide thin‐film transistors (ZnO TFTs)

Abstract— Short‐range uniformity and bias‐temperature (BT) instability of ZnO TFTs with SiO^x/SiN^x stacked gate insulators which have different surface treatments have been investigated. The short‐range uniformity of ZnO TFTs was drastically improved by N²O plasma treatment of the gate insulator. The variation in the gate voltage where a drain current of 1‐nA flows (Vgs at an Ids of 1 nA) was dramatically reduced from ±1.73 V to ±0.07 V by N²O plasma treatment of the gate insulator. It was clarified that the variations in the subthreshold characteristics of the ZnO TFTs could be reduced by N²O plasma treatment of the gate insulator due to a decrease in the variation of trap densities in deep energy levels from 0.9–2.0 × 10¹⁷ to 1.2–1.3×10¹⁷ cm^?3‐eV^?1. From the BT stress tests, a positive shift of Vgs at an Ids of 1 nA could be reduced by N²O plasma treatment of the gate insulator due to a decrease in the charge traps in the gate insulator. When the gate‐bias stress increases, state creation occured in the ZnO TFTs in addition to the charge trapping in the gate insulator. However, N²O plasma treatment of the gate insulator has little effect on the suppression of the state creation in ZnO TFTs under BT stress. The surface treatment of the gate insulator strongly affects the short‐range uniformity and the BT instability of Vth in the ZnO TFTs.     

Multioutputs single‐stage gate driver on array with wide temperature operable thin‐film‐transistor liquid‐crystal display for high resolution application

A hydrogenated amorphous silicon (a‐Si:H) thin‐film transistor (TFT) gate driver with multioutputs (eight outputs per stage) for high reliability, 10.7‐inch automotive display has been proposed. The driver circuit is composed of one SR controller, eight driving TFTs (one stage to eight outputs) with bridging TFTs. The SR controller, which starts up the driving TFTs, could also prevent the noise of gate line for nonworking period. The bridging TFT, using width decreasing which connects between the SR controller and the driving TFT, could produce the floating state which is beneficial to couple the gate voltage, improves the driving ability of output, and reaches consistent rising time in high temperature and low temperature environment. Moreover, 8‐phase clocks with 75% overlapping and dual‐side driving scheme are also used in the circuit design to ensure enough charging time and reduce the loading of each gate line. According to lifetime test results, the proposed gate driver of 720 stages pass the extreme temperature range test (90°C and ?40°C) for simulation, and operates stably over 800 hours at 90°C for measurement. Besides, this design is successfully demonstrated in a 10.7‐inch full HD (1080 × RGB×1920) TFT‐liquid‐crystal display (LCD) panel.     

Highly transparent and conductive CdO thin films as anodes for organic light‐emitting diodes: Film microstructure and morphology effects on performance

Abstract— Highly conductive and transparent CdO thin films have been grown on glass and on single‐crystal MgO(100) by MOCVD at 400°C and were used as transparent anodes for fabricating small‐molecule organic‐light emitting diodes (OLEDs). Device response and applications potential have been investigated and compared with those of control devices based on commercial ITO anodes. It is demonstrated that highly conductive CdO thin films of proper morphology can efficiently inject holes into such devices, rendering them promising anode materials for OLEDs. Importantly, this work also suggests the feasibility of employing other CdO‐based TCOs as anodes for high‐performance OLEDs.     

Solution‐processed and low‐temperature metal oxide n‐channel thin‐film transistors and low‐voltage complementary circuitry on large‐area flexible polyimide foil

High‐performance solution‐based n‐type metal oxide thin‐film transistors (TFTs), fabricated directly on polyimide foil at a post‐annealing temperature of only 250 °C, are realized and reported. Saturation mobilities exceeding 2 cm²/(Vs) and on‐to‐off current ratios up to 10⁸ are achieved. The usage of these oxide n‐type TFTs as the pixel drive and select transistors in future flexible active‐matrix organic light‐emitting diode (AMOLED) displays is proposed. With these oxide n‐type TFTs, fast and low‐voltage n‐type only flexible circuitry is demonstrated. Furthermore, a complete 8‐bit radio‐frequency identification transponder chip on foil has been fabricated and measured, to prove that these oxide n‐type TFTs have reached already a high level of yield and reliability. The integration of the same solution‐based oxide n‐type TFTs with organic p‐type TFTs into hybrid complementary circuitry on polyimide foil is demonstrated. A comparison between both the n‐type only and complementary elementary circuitry shows the high potential of this hybrid complementary technology for future line‐drive circuitry embedded at the borders of flexible AMOLED displays.     

Temporal signatures of resistivity in bending of indium tin oxide‐coated flexible transparent conductive films for flexible electronics: Influence of coating thickness and bending radius

The study is focused on the fundamental understanding of behaviors of polymer films coated with indium tin oxide (ITO) of varying thicknesses and thus various conductivities/transparencies in repeated bending by tracking the electrical resistivity real‐time using a specially designed multi‐purpose flexing system. The results show that temporal increases of resistance provide important clues as to the initiation and progress of failure. In tension, the resistance typically remains flat unless a critical minimum radius of curvature is breached that leads to progressive cracking of ITO coating bringing rapid rise of resistance. This critical minimum radius of curvature increases with the increase of ITO coating thickness making the higher conductivity films more susceptible to damage. In compression mode, similar temporal signature can be found when bent to a curvature below a critical minimum radius. When cracks form in both modes, the resistance signature changes to one of oscillation and the high and low values observed at each cycle progressively increase with more cycles leading ultimately to catastrophic failure.     

In‐pixel temperature sensor for high‐luminance active matrix micro‐light‐emitting diode display using low‐temperature polycrystalline silicon and oxide thin‐film‐transistors

We propose an in‐pixel temperature sensor using low‐temperature polycrystalline silicon and oxide (LTPO) thin‐film transistor (TFTs) for high‐luminance active matrix (AM) micro‐light‐emitting diode (LED) displays. By taking advantage of the different off‐current characteristics of p‐type LTPS TFTs and n‐type a‐IGZO TFTs under temperature change, we designed and fabricated a temperature sensor consists of only LTPO TFTs without additional sensing component or material. The fabricated sensor exhibits excellent temperature sensitivity of up to 71.8 mV/°C. In addition, a 64 × 64 temperature sensor array with 3T sensing pixel and integrated gate driver has also been fabricated, which demonstrates potential approach for maxing out the performance of high‐luminance AM micro‐LED display with real‐time in‐pixel temperature monitoring.     

Influence of channel‐deposition conditions and gate insulators on performance and stability of top‐gate IGZO transparent thin‐film transistors

Abstract— Amorphous‐oxide‐semiconductor thin‐film transistors (TFTs) have gained wide attention in recent years due to their many merits. In this paper, a series of top‐gate transparent thin‐film transistors (TFTs) based on amorphous‐indium—gallium—zinc—oxide (a‐IGZO) semiconductors have been fabricated and investigated. Specifically, low‐temperature SiNx and SiOx were used as the gate insulator and different Ar/O² gas‐flow ratios were used for a‐IGZO channel deposition to study the influences of gate insulators and channel‐deposition conditions. In addition to the investigation of device performance, the stability of these TFTs was also examined by applying constant‐current stressing. It was found that a high mobility of 30‐45 cm²/V‐sec and small threshold‐voltage shift in constant‐current stressing can be achieved using SiNx with suitable hydrogen‐content stoichiometry as the gate insulator and the carefully adjusted Ar/O² flow ratio for channel deposition. These results may be associated with hydrogen incorporation into the channel, the lower defect trap density, and the better water/oxygen barrier properties (impermeability) of the low‐temperature SiNx.     

Letter: A new compensation pixel circuit with metal oxide thin‐film transistors for active‐matrix organic light‐emitting diode displays

This paper presents a novel compensation pixel circuit for active‐matrix organic light‐emitting diode displays, in which the coupling effect mask technology is developed to compensate the threshold voltage of driving thin‐film transistor whether it is positive or negative. Twenty discrete compensation pixel circuits have been fabricated by In‐Zn‐O thin‐film transistors process. It is measured that the non‐uniformity of the proposed pixel circuit is significantly reduced with an average value of 8.6%. Furthermore, the organic light‐emitting diode emission current remains constant during 6 h continuous operation, which also confirms the validity of the proposed pixel circuit.     

Properties and characterization of carbon‐nanotube‐based transparent conductive coating

Abstract— Transparent and electrically conductive coatings and films have a variety of fast‐growing applications ranging from window glass to flat‐panel displays. These mainly include semiconductive metal oxides such as indium tin oxide (ITO) and polymers such as poly(3,4‐ethylenedioxythiophene) doped and stabilized with poly(styrenesulfonate) (PEDOT/PSS). In this paper, we show alternatives to ITO and conducting polymers, using single‐wall carbon nanotubes (SWNT). These CNT‐based technologies offer conducting substrates having a broad range of conductivity, excellent transparency, neutral color tone, good adhesion, abrasion resistance, and flexibility. Additional benefits include ease of both processing and patterning. This paper reports on optoelectronic properties and structure characterization of these materials.     

Photoluminescent ZnS:Cu phosphor films made with atomic‐layer chemical vapor deposition and thermal evaporation

Photoluminescent (PL) ZnS:Cu thin films were prepared by atomic‐layer chemical vapor deposition (ALCVD) and by thermal evaporation. The deposition, structure, and PL properties of the films were investigated, as well as the effect of heat treatment on photoluminescence.     

Instability of light illumination stress on amorphous In–Ga–Zn–O thin‐film transistors

Amorphous In–Ga–Zn–O thin‐film transistors (TFTs) have attracted increasing attention due to their electrical performance and their potential for use in transparent and flexible devices. Because TFTs are exposed to illumination through red, green, and blue color filters, wavelength‐varied light illumination tests are required to ensure stable TFT characteristics. In this paper, the effects of different light wavelengths under both positive and negative V_GS stresses on amorphous In–Ga–Zn–O TFTs are investigated. The TFT instability that is dependent on optical and electrical stresses can be explained by the charge trapping mechanism and interface modification.     

Flexible active‐matrix OLED displays: Challenges and progress

Abstract— Organic light‐emitting‐device (OLED) devices are very promising candidates for flexible‐display applications because of their organic thin‐film configuration and excellent optical and video performance. Recent progress of flexible‐OLED technologies for high‐performance full‐color active‐matrix OLED (AMOLED) displays will be presented and future challenges will be discussed. Specific focus is placed on technology components, including high‐efficiency phosphorescent OLED technology, substrates and backplanes for flexible displays, transparent compound cathode technology, conformal packaging, and the flexibility testing of these devices. Finally, the latest prototype in collaboration with LG. Phillips LCD, a flexible 4‐in. QVGA full‐color AMOLED built on amorphous‐silicon backplane, will be described.     

In situ tribometry with real-time imaging for assessing durability and wear mechanisms of easy-to-clean coatings on glass for touchscreen substrates

Touchscreens are now commonplace around the world, and easy-to-clean (ETC) coatings are integral in ensuring an enhanced usability and interactivity with these devices. In the present work, we evaluate the durability and study the wear mechanisms of a fluorine-containing easy-to-clean coating on glass using an in situ tribometer (TribTik). The TribTik is equipped with a microscope lens and camera system that allows one to image, in real time, the contact area between the glass substrate and the abrading counterpart. Through this unique combination, the instantaneous coefficient of friction and the contact area’s status can be monitored and correlated in situ. The in situ monitoring enables one to stop the abrasion cycles at critical stages of the wear process so that the morphology and composition of the wear tracks can be examined in an effort to understand the wear mechanisms of the ETC. We demonstrate that changes in the instantaneous coefficient of friction (COF) are correlated with changes in the in situ images. Critical stages of wear evolution are also identified via optical microscopy, scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDS) and Raman analyses. The evolution of the ETC wear mechanism, from start to finish, was found to be described by the following sequence: (1) generation of unconsolidated debris, (2) formation of a layered tribofilm, (3) cracking of the tribofilm, and (4) general failure of the ETC and subsequent damage to the underlying glass substrate. Our study shows that, TribTik, a tribometry system with real-time imaging capability, is a powerful tool to characterize the tribological properties of coatings on touchscreens and/or display substrates.