基于切片轮廓重投影的锥束CT射束硬化校正方法

根据锥束CT射束硬化机理.提出一种基于切片轮廓重投影的锥束CT射束硬化校正新方法.该方法从原始投影图像重建的序列切片图像中得到中心切片和斜切片的轮廓信息,然后根据实际扫描时的锥束CT成像系统参数建立重投影坐标系,通过射线与切片轮廓重投影到平板探测器上的求交计算,得到射线穿越物体长度与投影灰度之间的对应关系,最后拟合射束硬化曲线并校正射束硬化伪影.仿真与实际校正结果均表明,该方法可简单有效地消除锥束CT的射束硬化伪影.     

数字X光影像不均匀性的线性校正方法

针对数字X光成像仪(CR)中光纤排不均匀性引起的图像畸变,提出了一种线性校正方法.该方法采用典型的线性校正因子对图像畸变部分的灰度值进行校正,使原畸变图像在灰度值较小的地方,乘上一个大于1的校正因子;在灰度值较大的地方,乘上一个小于1的校正因子,校正因子的大小与该处灰度值偏离理想灰度值的大小成反比.实验结果表明,该方法能够使光纤排不均匀引起的图像畸变得到很好的校正.     

光子计数三维成像激光雷达反转误差的校正

实施光子飞行时间测量法时,光子飞行时间测量值受激光回波信号能量的影响会出现测量反转误差,从而影响系统三维成像的精度.本文描述了一种光子计数三维成像激光雷达系统反转误差的校正方法及其实验.提出的反转误差校正方法包含先验模型标定和反转误差校正两个步骤.首先,通过标定法得到系统反转误差相对于激光脉冲响应率的函数关系,建立系统的反转误差预测函数.然后,由系统反转误差函数预测出原始三维图像的反转误差图像并实现原始三维图像的反转误差校正.实验搭建了光子计数三维成像激光雷达系统,采用盖格-雪崩光电二极管(Gm-APD)作为光子探测器,由高速扫描振镜二维扫描获取三维图像.通过时间相关记录仪获取光子到达时间分布,分别得到原始三维图像和激光脉冲响应率.在反转误差校正的测试实验中,系统的测量均方差由校正前的33.2 mm提高至8.1 mm.实验结果表明,该反转误差校正方法可以有效降低光子计数三维成像激光雷达的反转误差.     

多TDI-CCD拼接相机成像非均匀性的校正

针对多TDI-CCD拼接相机存在成像非均匀性问题,开展了对拼接相机输出图像的片内及片间综合校正算法研究.结合CCD相机特性介绍了TDI-CCD的工作原理以及拼接相机成像非均匀性的产生机理.然后,分别对拼接相机片内及片间非均匀性校正的原理进行分析,提出了片内采用两点法校正,片间采用比值平均综合法校正.最后,对片内及片间综合非均匀性校正的参数标定及校正方法进行了探讨.实验结果表明,对存在8.4%非均匀性的原拼接输出图像,采用片内与片间综合校正法校正后,图像非均匀性达到了2.7%,表明该校正方法可基本满足TDI-CCD拼接相机对成像非均性校正的要求,其算法有效实用.     

圆柱曲面透视投影失真的图像校正

针对机器视觉系统中透视投影导致的钢管、桥梁拉索等圆柱表面缺陷测量不准的问题,提出了一种圆柱曲面透视投影失真的图像校正方法。该方法在提取圆柱成像区域、明确横向和轴向方向的基础上,基于圆柱曲面的透视投影特性,将产生的失真分解为轴向变形和横向变形,利用系统成像参数和圆柱半径建立校正图像与原图像的坐标对应关系,通过最邻近插值法进行像素映射实现透视投影失真校正。实验结果表明,该方法对不同直径圆柱的图像均有良好的校正效果,校正后的图像消除了圆柱曲面“近大远小”透视变形和倾斜投影变形;进行棋盘格模拟校正时,6个圆柱棋盘格边长的测量误差从校正前最高的14.9%降低至校正后的1.2%;进行划痕测量时,两种直径的原图像的最大误差分别为78.0%与61.8%,经本文方法校正后,两种直径的最大误差仅为5.9%与5.5%,校正效果显著。     

基于投影图像特征匹配的微纳CT焦点漂移校正

微纳CT射线源焦点热漂移是影响图像清晰度的重要因素之一。通过理论和仿真实验分析了射线源焦点漂移对图像清晰度的影响。利用实际微纳CT系统,实验发现焦点漂移主要是缓慢热漂移,漂移量与X射线源功率正相关,且焦点漂移具有一定随机性。据此,提出一种基于投影图像特征匹配的焦点漂移校正方法。首先,在实际CT扫描后快速采集少量参考投影,根据实际CT投影和参考投影自适应特征匹配结果求取特定角度下的焦点漂移量;其次,采用样条插值获取CT扫描过程所有的焦点漂移量;最后,根据焦点漂移量修正实际投影数据,重建得到校正后的图像。实验表明,该方法定位精度高,可大幅度减少图像畸变,图像清晰度提高近10%。     

多TDI-CCD拼接相机非均匀性校正方法

针对多TDI-CCD拼接相机成像存在非均匀性问题,开展了对拼接相机输出图像片内及片间综合校正算法的研究。首先,结合CCD相机特性,介绍了TDI-CCD的工作原理以及拼接相机非均匀性的产生机理。然后,分别对拼接相机片内及片间非均匀性校正的原理进行分析,提出了片内采用两点法校正、片间采用比值平均校正的综合校正算法。最后,对片内及片间综合非均匀性校正的参数标定及校正方法进行了探讨;实验结果表明,在原拼接输出图像存在8.4%非均匀性的条件下,采用片内与片间综合校正法校正后,图像非均匀性达到2.7%。该校正方法基本满足了对TDI-CCD拼接相机非均性校正的指标要求,算法有效实用。     

一种红外图像非均匀性校正新方法的DSP实现

TMS320DM642是一款新型高速数字信号处理器,本文以TMS320DM642为主要元件构建了红外图像处理系统,并采用新的非均匀性校正方法--"曲线-直线"法,实现了对红外图像的实时校正."曲线-直线"具有计算公式简单、计算量小、校正精度高的优点.实验结果表明,图像处理系统运行稳定可靠,在该系统上实现"曲线-直线"校正算法完全满足实时性要求,使用"曲线-直线"校正法校正后的平均非均匀度可降低至1%,具有比两点校正法更高的实用价值.     

共振扫描显微成像中的图像畸变校正

设计了一种校正算法用于校正双光子荧光显微镜等高速扫描成像系统中共振振镜扫描导致的图像畸变。首先对共振振镜的扫描运动建立模型,推导出非线性扫描的运动公式,进而得到图像畸变公式;然后对一块朗奇光栅样品扫描成像,设计了多峰高斯拟合算法得到光栅所有条纹的宽度变化并通过最小二乘法将条纹宽度数据拟合成一条畸变曲线;最后利用畸变曲线对图像进行校正。结果表明:采用提出的校正算法可使系统最大畸变减小到传统正弦校正方法的1/3,相对畸变减小到1/5,校正效果比传统的正弦校正法提高了2倍。由于提出的曲线拟合校正算法不用增加额外的光路,且不需要切割边缘图像,故显示了极好的图像使用效率和校正效果。     

基于工业计算机断层成像技术的三维CAD模型重构方法

为解决复杂形状产品的三维计算机辅助设计模型的重构难题,提出了一种基于工业计算机断层成像技术的三维计算机辅助设计模型的重构方法.首先用工业计算机断层成像技术对产品进行扫描,得到产品切片图像,然后通过切片图像获取体数据;在采用高斯滤波对体数据进行预处理后,使用移动立方体算法重建三维表面,并用顶点删除法和二次误差测度算法简化三维表面;在采用Laplacian算法平滑三维表面后,将三维表面模型保存为STL格式的文件;最后,将STL格式的文件导入到UG中,重构出产品的三维计算机辅助设计模型.实际应用验证了该方法的有效性和正确性.     

基于制造的产品创新与工艺创新的关联因素系统分析

基于系统的观点,对制造业企业产品创新与工艺创新的协同发展及其对产品创新与工艺创新活动的影响进行了研究,找出了产品创新与工艺创新的关联因素。在此基础上,针对产品创新与工艺创新的关联因素所组成的灰色系统,进行了产品创新与工艺创新关联因素的灰色关联分析,给出了分析过程和步骤,并进行了关联度的排序,得出了影响制造业企业产品创新与工艺创新协同发展的各关联因素的重要程度排序。     

Nanometer edge and surface imaging using optical scatter

Imaging of edges to nanometer resolution using a novel non-contact technique is presented. This technique relies on positioning an optical beam to the edge, and simultaneously scanning, and measuring differential changes in off-specular scatter. Data may be used to calculate the radius at the edge to high accuracy. The experimental apparatus is capable of producing diffraction images of features on surfaces arising from processes used in sample preparation. Images of the cleaved edge of an optical fiber, an Au pad on Si, and cleaved quartz measured on this apparatus are presented. This technique could also be utilized to analyze cleaved laser diodes, micro-optics, MEMS devices, and diamond cutting tools.     

Imaging periodic surface relief structures

Because of shadowing, multiple scatter and polarization effects, the interpretation of images of gratings with fine periods, isolated deep structures, and multiple scattering volume objects is seriously complicated. In this paper a review of the methods used to model such effects is presented. Periodic surface relief gratings are of particular current importance because of the possibility of producing calibration samples using them. Several examples which illustrate electromagnetic volume effects are examined. General trends which help in validating the use of Fourier-transform-based scalar transmittance theory are then indicated. The angular spectrum approach, which can be used, together with a scatter function generated using the rigorous electromagnetic theory, to calculate coherent, partially coherent and confocal images of volume objects, is also discussed.     

Application of the scatter diagram technique to the scanning electron microscope: preliminary results from diamond

Using primary beam energies E0 ranging from 0.2 to 15 keV and an in-lens detector, a series of images of the same region of an artificial microstructured diamond sample have been acquired in scanning electron microscopy. Next, the images were analysed by using a scatter diagram technique to underline the topographic contrast change and contrast reversal. The results obtained from 0.5 to 15 keV are discussed with the help of an expression derived from the constant loss model for the secondary electron yield delta of diamond, but including the respective roles of the angle of incidence, i, and of the angle of detection, alpha. More surprising is the quality of images obtained at a beam energy as low as 0.2 keV, and more difficult to explain is the significant contrast change between 0.2 keV and 0.5 keV. For the first time, scatter diagrams are used as a diagnostic tool in scanning electron microscopy, and after some improvements it is hoped that the experimental approach followed here may lead to quantitative estimates of the local tilts of a specimen surface.     

Scatter diagrams in energy analysed digital imaging: application to scanning Auger microscopy

In order to improve methods for the systematic characterization of inhomogeneous materials the procedures of multi-spectral imaging and scatter diagram construction have been deployed. Although the techniques described are relevant to all instruments which detect signals on several different information channels (e.g. wavelength or energy analysed optical, X-ray or electron imaging), they are illustrated with scanning Auger microscopy (SAM). The construction and use of bivariate correlation diagrams is described by reference to simple samples consisting of patterns of Al film upon Si substrates. The method is then applied to LaNi₅ and GaInAs samples each with different signal/noise ratios and chemical characteristics. The software windowing of scatter diagrams by computer combined with presentation of false colour images is demonstrated. The multi-spectral Auger mapping (MUSLAM) procedure thus evolved is demonstrated to be a powerful, general analytical technique for characterizing the number, abundance and chemistry of each type of region in the surface of an inhomogeneous solid.     

Application of a Double Scanning Method in Ultrasonic Nondestructive Testing to Improve the Quality of Flaw Images

An algorithm for obtaining flaw images by a double scanning method for application in ultrasonic nondestructive testing, in which a radiator and a receiver move independently along parallel straight lines, is considered. A formula for reconstruction of flaw images is presented. The advantages and drawbacks of the double scanning method are discussed in comparison with the method of projection in the spectral space (PSS), which is also used for a coherent reconstruction of flaw images. The efficiency of the double scanning technique in suppressing the phantom images produced by transformed and rescattered pulses is shown in numerical and model experiments. The immunity of this method to the distortions introduced by an irregular measurement surface and the higher noise immunity compared to the PSS method are also demonstrated.     

Simulations of scanning electron microscopy imaging and charging of insulating structures

We present a three‐dimensional simulation of scanning electron microscope (SEM) images and surface charging. First, the field above the sample is calculated using Laplace's equation with the proper boundary conditions; then, the simulation algorithm starts following the electron trajectory outside the sample by using electron ray tracing. When the electron collides with the specimen, the algorithm keeps track of the electron inside the sample by simulating the electron scattering history with a Monte Carlo code. During this phase, secondary and backscattered electrons are emitted to form an image and primary electrons are absorbed; therefore, a charge density is formed in the material. This charge density is used to recalculate the field above and inside the sample by solving the Poisson equation with the proper boundary conditions. Field equation, Monte Carlo scattering simulation, and electron ray tracing are therefore integrated in a self‐consistent fashion to form an algorithm capable of simulating charging and imaging of insulating structures. To maintain generality, this algorithm has been implemented in three dimensions. We shall apply the so‐defined simulation to calculate both the global surface voltage and local microfields induced by the scanning beam. Furthermore, we shall show how charging affects resolution and image formation in general and how its characteristics change when imaging parameters are changed. We shall address magnification, scanning strategy, and applied field. The results, compared with experiments, clearly indicate that charging and the proper boundary conditions must be included in order to simulate images of insulating features. Furthermore, we shall show that a three‐dimensional implementation is mandatory for understanding local field formation.     

A simple method allowing DIC imaging in conjunction with confocal microscopy

Current optical methods to collect Nomarski differential interference contrast (DIC) or phase images with a transmitted light detector (TLD) in conjunction with confocal laser scanning microscopy (CLSM) can be technically challenging and inefficient. We describe for the first time a simple method that combines the use of the commercial product QPm (Iatia, Melbourne Australia) with brightfield images collected with the TLD of a CLSM, generating DIC, phase, Zernike phase, dark-field or Hoffman modulation contrast images. The brightfield images may be collected at the same time as the confocal images. This method also allows the calculation of contrast-enhanced images from archival data. The technique described here allows for the creation of contrast-enhanced images such as DIC or phase, without compromising the intensity or quality of confocal images collected simultaneously. Provided the confocal microscope is equipped with a motorized z-drive and a TLD, no hardware or optical modifications are required. The contrast-enhanced images are calculated with software using the quantitative phase-amplitude microscopy technique ( Barone-Nugent et al., 2002 ). This technique, being far simpler during image collection, allows the microscopist to concentrate on their confocal imaging and experimental procedures. Unlike conventional DIC, this technique may be used to calculate DIC images when cells are imaged through plastic, and without the use of expensive strain-free objective lenses.     

Deconvolution of scanning electron microscopy images

This paper describes a method of removing blurs in scanning electron microscopy (SEM) images caused by the existence of a finite beam size. Although the resolution of electron microscopy images has been dramatically improved by the use of high-brightness electron guns and low-aberration electron lenses, it is still limited by lens aberration and electron diffraction. Both are inevitable in practical electron optics. Therefore, a further reduction in resolution by improving SEM hardware seems difficult. In order to overcome this difficulty, computer deconvolution has been proposed for SEM images. In the present work, the SEM image is deconvoluted using the electron beam profile estimated from beam optics calculation. The results show that the resolution of the deconvoluted image is improved to one half of the resolution of the original SEM image.     

An electron beam lithography and digital image acquisition system for scanning electron microscopes

A low‐cost microcontroller based control and data acquisition unit for digital image recording of scanning electron microscope (SEM) images and scanning electron microscope based electron beam lithography (EBL) is described. The developed microcontroller low‐level embedded software incorporates major time critical functions for image acquisition and electron beam lithography and makes the unit an intelligent module which communicates via USB with the main computer. The system allows recording of images with up to 4096 × 4096 pixel size, different scan modes, controllable dwell time, synchronization with main power frequency, and other user controllable functions. The electron beam can be arbitrary positioned with 12‐bit precision in both dimensions and this is used to extend the scanning electron microscope capabilities for electron beam lithography. Hardware and software details of the system are given to allow its easy duplication. Performance of the system is discussed and exemplary results are presented.