Characterization of TiN/TiSi2 bilayer for application to ULSI

The properties of TiN/TiSi₂ bilayer formed by rapid thermal annealing (RTA) in an NH₃ ambient after the titanium film is deposited on the silicon substrate is investigated. It is found that the formation of TiN/TiSi₂ bilayer depends on the RTA temperature and a competitive reaction for the TiN/TiSi₂ bilayer occurs at 600°C. Both the TiN and TiSi₂ layers represent titanium-rich films at 600°C anneal. The TiN layer has a stable structure at 700°C anneal while the TiSi₂ layer has C₄₉ and C₅₄ phase. Both the TiN and TiSi₂ layers have stable structures and stoichiometries at 800°C anneal. When the TiN/TiSi₂ bilayer is formed, the redistribution of boron atoms within the TiSi₂ layer gets active as the anneal temperature is increased. According to secondary ion mass spectroscopy analysis, boron atoms pile up within the TiN layer and at the TiSi₂−Si interface. The electrical properties for n⁺ and p⁺ contacts are investigated. The n⁺ contact resistance increases slightly with increasing annealing temperature but the p⁺ contact resistance decreases. The leakage current indicates degradation of the contact at high annealing temperature for both n⁺ and p⁺ junctions.     

Laser processing of TiSi2 and CoSi2 thin films on silicon (100) substrates

We have investigated the formation of TiSi₂ and CoSi₂ thin films on Si(100) substrates using laser (wave length 248 nm, pulse duration 40 ns and repetition rate 5 Hz) physical vapor deposition (LPVD). The films were deposited from solid targets of TiSi₂ and CoSi₂ in vacuum with the substrate temperature optimized at 600° C. The films were characterized using x-ray diffraction, scanning electron microscopy (SEM), transmission electron microscopy (TEM) and four point probe ac resistivity. The films were found to be polycrystalline with a texture. The room temperature resistivity was found to be 16 μΩ-@#@ cm and 23 μΩ-cm for TiSi₂ and CoSi₂ films, respectively. We optimized the processing parameters so as to get particulate free surface. TEM results show that the silicide/silicon interface is quite smooth and there is no perceptible interdiffusion across the interface.     

Selective deposition of TiSi2 on oxide patterned wafers using low pressure chemical vapor deposition

The selective deposition of titanium disilicide was investigated using a cold-wall, low pressure chemical vapor deposition (LPCVD) technique with silane and titanium tetrachloride as the silicon and titanium sources, respectively. In-situ hydrogen plasma effectively cleaned the silicon wafer surface for deposition of C54 TiSi₂ at 760‡ C with full selectivity. A new method using a plasma only at the beginning of the deposition of the silicide further decreased the temperature to 680‡ C without losing selectivity. The result was a fine grained film probably due to the enhanced nucleation rate of the silicide. Cross-sectional TEM studies showed that the silicide grew into the silicon substrate, suggesting significant silicon consumption. The silicon substrate, consequently, seems to play a major role in the silicide formation. Silane, on the other hand, plays a minor role as a silicon source but does act as a scavenger of HC1 in the gas or on the silicide surface.     

Improved control of momentary rapid thermal annnealing for silicidation

Temperature control and wafer-to-wafer reproducibility during momentary annealing via rapid thermal annealing is critical for TiSi₂ Self-Aligned siLICIDE (SALICIDE) processing for deep submicron complementary metal oxide semiconductor. TiSi₂ must undergo a transformation from the high resistivity C49 phase to the low resistivity C54 phase for applications where it is used as a gate conductor. A process modification to achieve improved wafer-to-wafer and within wafer temperature reproducibility is demonstrated. It has the additional benefit to the TiSi₂ salicide process of enabling anneals of reduced duration, enhancing suicide transformation to the desired phase without leading to agglomeration.     

Shallow,small area,TiSi2 contacts to n+ and p+ silicon

Shallown ⁺ andp ⁺ doped source/drain contacts to silicon as small as 300 × 200 nm have been fabricated using an optimized silicided (TiSi₂) contact technology. Well behaved structural and electrical characteristics were found. The electrical series resistance through two of such contacts from metal to metal through the semiconductor contacts increases rapidly for contact sizes below the transfer length of the contact (about 0.5 μm). This resistance increase is critically dependent on the contact resistivity and three-dimensional current flow patterns.     

Optical characterization of as-prepared and rapid thermal oxidized partially strain compensated Si1−x−y GexCy films

The optical properties of as-prepared and rapid thermal oxidized (RTO) heteroepitaxial Si_1−x−yGe_xC_y alloys grown on Si substrate have been characterized using spectroscopic ellipsometry. The critical points E₁, E₀′, E₂ band gaps were determined by line shape fitting in the second derivative spectra of the pseudo-dielectric functions. For as-prepared films, the E₁ gap increases with C concentration and a linear dependence on C content was observed. However, the E₂ gap decreases as the C concentration increases. For the RTO samples, the amplitude of E₂ transition reduces rapidly and the E₁ transition shifts to a lower energy. The reduction in the amplitude of E₂ transitions is due to the presence of oxide layer. A high Ge content layer and the low C content in the RTO films account for the E₁ shift to lower energy and the increase of the refractive indices.     

Charge-trapping properties of poly-silicon oxides by rapid thermal N2O process

The polyoxide with nitrogen incorporation by RTN₂O process can obtain smoother interface of the polyoxide/polysilicon, thus improving the characteristics of polyoxides. However, too much nitrogen does not improve, instead, degrades, the quality of the polyoxide and to induce thickness non-uniformity. It can be found that initial hole-trapping phenomenon was observed in the polyoxides grown by rapid thermal N₂O oxidation process and the higher the growth temperature is, the larger the hole-trapping rate is. The larger hole-trapping is due to more excessive nitrogen release in short time at the polyoxide/polysilicon interface at high temperature oxidation, which may induce large undulations at the Si/SiO₂ interface and result in localized high electric fields to obtain smaller Qbds. However, the charge-trapping properties can be improved by the N₂O-annealed process at proper temperature due to proper amount of nitrogen incorporated into the polyoxide and piled up at the interface.     

Processing of large YBa2 Cu3Ox domains for levitation applications by a Nd1+x Ba2−x Cu3 Oy-Seeded melt-growth technique

YBa₂Cu₃O_x domains for levitation applications have been produced by a seeding technology that includes Nd_1+x Ba_2−x Cu₃O_y seeds and melt-processing technologies such as conventional melt-textured growth, melt-texturing with PtO₂ and Y₂BaCuO₅ additions, and the new solid-liquid-melt-growth technology. Large domains (∼20 mm) with high levitation forces (F₁ up to 8.2 N) have been produced. The reproducibility of the results is good, and the capability of producing a large number of pellets in a single batch indicates good potential for the production of large amounts of this material.     

Effects of rapid thermal annealing on ohmic contact of AIGaN/GaN HEMTs

Ohmic contacts with Ti/Al/Ti/Au source and drain electrodes on A1GaN/GaN high electron mobility transistors （HEMTs） were fabricated and subjected to rapid thermal annealing （RTA） in flowing N2. The wafer was divided into 5 parts and three of them were annealed for 30 s at 700, 750, and 800 ℃, respectively, the others were annealed at 750 ℃ for 25 and 40 s. Due to the RTA, a change from Schottky contact to Ohmic contact has been obtained between the electrode layer and the A1GaN/GaN heterojunction layer. We have achieved a low specific contact resistance of 7.41 × 10-6Ω cm2 and contact resistance of 0.54 Ω.mm measured by transmission line mode （TLM）, and good surface morphology and edge acuity are also desirable by annealing at 750 ℃ for 30 s. The experiments also indicate that the performance of ohmic contact is first improved, then it reaches a peak, finally degrading with annealing temperature or annealing time rising.     

Effects of rapid thermal annealing on ohmic contact of AlGaN/GaN HEMTs

工艺制作源漏电极为Ti/Al/Ti/Au,并在氮气气氛中对其进行快速退火,研究不同退火条件对欧姆接触的影响。具体实验过程如下：将溅射好源漏电极的外延片分为5部分,其中3片分别在700℃,750℃和800℃下快速退火30s,并相互对比得出最佳退火温度,实验结果发现750℃条件下欧姆接触最好;其余2片在750℃下分别退火25s和40s,并与前边实验750℃ 30s情况下欧姆接触比较,得出最佳退火时间为30s。我们使用传输线模式计算出电极与外延片的欧姆接触电阻率,在750℃ 30s的快速退火条件下得到最低欧姆接触电阻率为0.54 Ω mm,与其余条件下结果比较具有较好的表面形貌和边缘。从实验中我们也得到随着退火温度和退火时间的提高,欧姆接触电阻率先降低到达最低点然后开始升高的现象,为寻找GaN HEMT欧姆接触最佳条件提供了一定依据。     

Excellent performance of gas sensor based on In2O3-Fe2O3 nanotubes

In₂O₃-Fe₂O₃ nanotubes are synthesized by an electrospinning method. The as-synthesized materials are characterized by scanning electron microscope and X-ray powder diffraction. The gas sensing results show that In₂O₃-Fe₂O₃ nanotubes exhibit excellent sensing properties to acetone and formaldehyde at different operating temperatures. The responses of gas sensors based on In₂O₃-Fe₂O₃ nanotubes to 100 ppm acetone and 100 ppm formaldehyde are 25 (240℃) and 15 (260℃), and the response/recovery times are 3/7 s and 4/7 s, respectively. The responses of In₂O₃-Fe₂O₃ nanotubes to 1 ppm acetone (240℃) and formaldehyde (260℃) are 3.5 and 1.8, respectively. Moreover, the gas sensor based on In₂O₃-Fe₂O₃ nanotubes also possesses an excellent selectivity to acetone and formaldehyde.     

YBa2Cu3-xZnxO7薄膜红外探测器的研究

在对红外探测器进行理论分析的基础上,设计并研制了液氮温度下的Yba2Cu3-xZnxO7薄膜红外探测器,系统地测试了器件的特征参数.最好的结果为:对于波长为10μm,调制频率为f=500Hz,带宽为Δf=1Hz的红外输入辐射Rv(500,10,1)=3587V/W,NEP(500,10,1)=6.5×10-12W/Hz1/2,D*(500,10,1)=7.2×1012cmHz1/2/W,τ(500,10,1)=1.2ms.     

微波法制备高活性H1-xSr2Nb3-xMoxO10 (x = 0, 0.05, 0.1, 0.15 and 0.2) 光催化剂

通过微波辅助法制备出高活性H1-xSr2Nb3-xMoxO10光催化材料,制备过程和时间均被大大缩短。采用X射线粉末衍射（XRD）、扫描电镜（SEM）、紫外-可见吸收吸收光谱（UV-Vis DRS）等表征其材料性能。考察了催化材料在40W汞灯辐照下催化降解甲基橙的催化性能。实验结果表明,MoO3的掺入量为15%（摩尔分数）时,材料的光催化性能最优。     

Integration of HfxTayN metal gate with SiO2 and HfOxNy gate dielectrics for MOS device applications

Interaction of Hf_xTa_yN metal gate with SiO₂ and HfO_xN_y gate dielectrics has been extensively studied. Metal-oxide-semiconductor (MOS) device formed with SiO₂ gate dielectric and Hf_xTa_yN metal gate shows satisfactory thermal stability. Time-of-flight secondary ion mass spectroscopy (TOF-SIMS) analysis results show that the diffusion depths of Hf and Ta are less significant in SiO₂ gate dielectric than that in HfO_xN_y. Compared to HfO_xN_y gate dielectric, SiO₂ shows better electrical properties, such as leakage current, hysteresis, interface trap density and stress-induced flat-band voltage shift. With an increase in post metallization annealing (PMA) temperature, the electrical characteristics of the MOS device with SiO₂ gate dielectric remain almost unchanged, indicating its superior thermal and electrical stability.     

Co3O4/Fe2O3异质结复合材料的制备及其紫外光光电探测性能

分别采用旋涂法和水热法在FTO衬底上制备Co₃O₄种子层和Co₃O₄薄膜,再在Co₃O₄薄膜上水热生长Fe₂O₃纳米棒,获得了高质量的Co₃O₄/Fe₂O₃异质结复合材料。通过改变Fe₂O₃前驱体溶液浓度来改变异质结复合材料中Fe₂O₃组分的含量。结果表明,Fe₂O₃纳米棒覆盖在呈网状结构的Co₃O₄薄膜上,随着Fe₂O₃前驱体溶液浓度即Fe₂O₃组分含量的增加,Co₃O₄/Fe₂O₃异质结复合材料对紫外光的响应逐渐增强,当Fe₂O₃前驱体溶液浓度为0.015mol/L时,异质结复合材料有着很好的光电稳定性,并表现出较高的响应率(12.5mA/W)和探测率(4.4×10¹⁰Jones)。     

Characterization of various alloying metal oxide nanoparticles embedded in HfOxNy as charge trapping nodes in nonvolatile memory devices

This work compares Co_xMo_yO, Co_xFe_yO and Fe_xMo_yO alloying metal oxide nanoparticles (AMONs) that were individually embedded in HfO_xN_y high-k dielectric as charge trapping nodes. They were formed by chemical vapor deposition using Co/Mo, Co/Fe and Fe/Mo acetate, respectively, calcined and reduced in Ar/NH₃ ambient. The effects of various pre-treatments on Co_xMo_yO, Co_xFe_yO and Fe_xMo_yO AMONs preparation were investigated. The results indicate that the larger charge trap density, larger memory window and better programming characteristics of Co_xMo_yO AMONs are attributable to their higher surface density and smaller diameter. The average collected charge in each Co_xMo_yO AMON is the smallest among three AMONs, revealing that a local leakage path is associated with the least charge loss. The main mechanism that governs the programming characteristics involves the trapping of holes.     

具有界面依赖光致发光的双层WS2/Ga2O3异质结的能带工程(英文)

利用垂直WS₂/Ga₂O₃异质结构中异质界面诱导了反常的光致发光(PL)发射。垂直堆栈的WS₂/Ga₂O₃异质界面使其形成了II型能带结构,导致与Ga₂O₃层接触的底层WS₂的PL强度下降。而异质界面的强耦合作用也影响了双层WS₂中的同质层间相互作用,使得上层WS₂出现反常的PL增强。这种堆栈新型二维异质结构为定制目标能带结构并控制其光子和电子行为提供一种新的手段。     

New TIT capacitor with ZrO2/Al2O3/ZrO2 dielectrics for 60 nm and below DRAMs

New ZrO₂/Al₂O₃/ZrO₂ (ZAZ) dielectric film was successfully developed for DRAM capacitor dielectrics of 60 nm and below technologies. ZAZ dielectric film grown by ALD has a mixture structure of crystalline phase ZrO₂ and amorphous phase Al₂O₃ in order to optimize dielectric properties. ZAZ TIT capacitor showed small Tox.eq of 8.5 Å and a low leakage current density of 0.35 fA/cell, which meet leakage current criteria of 0.5 fA/cell for mass production. ZAZ TIT capacitor showed a smaller cap leak fail bit than HAH capacitor and stable leakage current up to 550 °C anneal. TDDB (time dependent dielectric breakdown) behavior reliably satisfied the 10-year lifetime criteria within operation voltage range.     

Photoluminescence Studies of CuInS2-CuInSe2 Alloy Crystals

Photoluminescence spectra are presented for single crystals of CuInS₂, CuInSe₂ and CuInS_2ySe_2-2y alloys. The PL spectrum of stoichiometric CuInSe₂ is dominated by free exciton emission of 9 meV FWHM at 1.03 eV, but structure at 090, 0.94 and 0.97 eV is observed due to transitions involving residual native defect states. For pure CuInS₂ broad deep luminescence bands are obtained that involve several deep native defect states, e.g. donors at 45 and 160 meV below the CBE and acceptors at 85 meV above the VBE. These defects persist in S-rich CuInS₂/CuInSe₂ alloys, but excitonic emission is observed, in addition to the deep luminescence. Surprisingly CuInS_2ySe_2-2y crystals at y ≳ l are totally dominated by free exciton emission. This result shows that an increase of at least 20% over the bandgap of CuInSe₂ and excellent crystal quality can be achieved by partial substitution of Se by S.     

Preparation and physical properties of lanthanum-modified Srl-xBaxNb2O6, ferroelectric crystals

The growth parameters and some physical properties of lanthanum-modified strontium barium niobate crystals, grown by the Czochralski method, have been investigated. Crystals were grown from melts having lanthana, La₂O₃ concentrations ranging from 0.01 to 1.50% (by weight;, the Sr to Ba ratio was one. Knoop microhardness was measured as a function of La content and the hardness was found to decrease with increasing La content. Room temperature compressive strength measurements were also made. None of the samples tested exhibited yielding. Fracture stresses did not change in a sensible manner as a function of La content. Lattice parameter measurements were made using x-ray diffraction and showed that the ‘c’ parameter decreased while the ‘a’ parameter increased slightly with increasing La content.