缓冲层厚度对透明导电薄膜ZnO∶Zr性能的影响(英文)

利用直流磁控溅射法在有ZnO∶Zr缓冲层的水冷玻璃衬底上成功制备出了ZnO∶Zr透明导电薄膜,缓冲层的厚度介于35～208nm。利用XRD、SEM、四探针测试仪和紫外-可见分光光度计研究ZnO∶Zr薄膜的结构、形貌、电光性能。结果表明,薄膜的颗粒尺寸和电阻率对缓冲层厚度具有较强的依赖性。当缓冲层厚度从35nm增加到103nm时,薄膜的颗粒尺寸增大,电阻率减小。而当缓冲层厚度从103nm增加到208nm时,薄膜的颗粒尺寸减小,电阻率增大。当缓冲厚度为103nm时,薄膜的电阻率最小为2.96×10^-3Ω.cm,远小于没有缓冲层时的12.9×10^-3Ω.cm。实验结果表明,在沉积薄膜之前先沉积一层适当的缓冲层是提高ZnO∶Zr薄膜质量的一种有效方法。     

薄膜厚度对ZnO：Zr透明导电薄膜光电性能的影响

利用射频磁控溅射法在室温水冷玻璃衬底上制备出了可见光透过率高、电阻率低的ZnO:Zr透明导电薄膜.讨论了厚度对ZnO:Zr透明导电薄膜光学、电学性能的影响.当薄膜厚度为213 nm时,薄膜电阻率达到最小值1.81×10-3 Ω·cm.所制备的薄膜样品都具有高透光率,其可见光区平均透过率超过了93.0%.当薄膜厚度从125 nm增加到350 nm时,薄膜的光学带隙从3.58 eV减小到3.50 eV.     

IWO缓冲层对MOCVD-ZnO:B薄膜性能的影响研究

金属有机化学气相沉积(MOCVD)技术生长的绒面ZnO透明导电(ZnO-TCO)薄膜应用于Si基薄膜太阳电池上能够形成"陷光结构",以提高薄膜太阳电池效率和稳定性。本文将电子束反应蒸发技术生长的掺W的In2O3(In2O3:W,(IWO)薄膜作为缓冲层,应用于MOCVD-ZnO:B薄膜与玻璃之间,可促进ZnO:B薄膜的生长,并且有效提升薄膜的光散射特性。当IWO缓冲层厚度为20nm时,获得的IWO/ZnO:B薄膜的电阻率为2.07×10-3Ω.cm,迁移率为20.9cm2.V-1.s-1,载流子浓度为1.44×1020 cm-3;同时,薄膜具有的透过率大于85%,且在550nm处绒度较ZnO:B薄膜提高了约9.5%,在800nm处绒度较ZnO:B薄膜提高了约4.5%。     

溅射功率对PET衬底上ZnO:Zr薄膜性能的影响

采用直流磁控溅射法在室温下柔性PET衬底上制备出了高质量的掺锆氧化锌(ZnO:Zr)透明导电薄膜。研究了溅射功率对ZnO:Zr薄膜表面形貌、结构、电学和光学性能的影响。溅射功率对ZnO:Zr薄膜的电阻率影响显著:当溅射功率从60W增加到90W时,薄膜的电阻率先减小后增大,在最佳功率80W时,电阻率具有最小值3.67×10-3Ω·cm。所制备的ZnO:Zr薄膜具有良好的附着性能,在可见光区平均透射率高达90%。     

直流磁控溅射法低温制备ZnO:Ti透明导电薄膜及特性研究

利用直流磁控溅射法在室温水冷玻璃衬底上制备出了可见光透过率高、电阻率低的掺钛氧化锌(ZnO:Ti)透明导电薄膜.SEM和XRD研究结果表明,ZnO:Ti薄膜为六角纤锌矿结构的多晶薄膜,且具有c轴择优取向.厚度为437 nm薄膜的电阻率为1.73×10~(-4) Ω·cm.所制备薄膜具有良好的附着性能,薄膜样品在500～800 nm的可见光平均透过率都超过了91%.     

利用射频磁控溅射法在柔性衬底上制备ZnO∶Zr透明导电薄膜

利用射频磁控溅射法首次在室温水冷柔性衬底 PET上制备出了可见光透过率高、电阻率低的掺锆氧化锌(ZnO∶Zr)透明导电薄膜.X射线衍射和扫描电子显微镜表明,ZnO∶Zr薄膜为六角纤锌矿结构的多晶薄膜,且具有平行于衬底方向的择优取向.实验获得ZnO∶Zr薄膜的最小电阻率为1.55×10-3 Ω·cm.实验制备的ZnO∶Zr薄膜具有良好的附着性能,其可见光区平均透过率超过90%.     

缓冲层对太阳电池用ZnO:B薄膜结构及其光电性能的影响

通过优化ZnO缓冲层(buffer layer),有效地改善了由金属有机化学气相沉积(MOVCD)法制备的ZnO:B薄膜的光电特性。结果表明,"富氧"的缓冲层有效增加了ZnO:B-TCO的近红外区域透过率,使其更适应宽光谱薄膜太阳电池的发展要求。经过优化的ZnO:B,"类金字塔"状晶粒尺寸约300～500nm,波长550nm处绒度(haze)为10.8%,薄膜电子迁移率为20.7cm2/Vs,电阻率为2.14×10-3Ω.cm,载流子浓度为1.41×1020cm-3,且在400～1 500nm波长范围内的平均透过率为83%(含2mm厚玻璃衬底)。     

(Al,Zr)共掺杂ZnO透明导电薄膜的结构以及光电性能研究

用射频磁控溅射法在玻璃衬底上氩气气氛中制备出(Al,Zr)共掺杂的ZnO透明导电薄膜,研究了不同Zr掺杂浓度和薄膜厚度ZnO薄膜的结构、电学和光学特性。结果表明,在最佳沉积条件下我们制备出了具有(002)单一择优取向的多晶六角纤锌矿结构,电阻率为2.2×10-2Ω.cm,且可见光段(320～800nm)平均透过率达到85%的ZnO透明导电薄膜。在150℃的条件下对(Al,Zr)共掺杂的ZnO薄膜进行1h的退火处理,薄膜电阻率降低至8.4×10-3Ω.cm。Zr杂质的掺入改善了薄膜的可见光透光性。     

薄膜厚度对直流溅射制备AZO薄膜的特性影响

采用直流磁控溅射法,当衬底温度为室温时,在普通玻璃衬底上制备出了低电阻率、高透过率的ZnO:Al透明导电薄膜.研究了薄膜厚度对薄膜结构以及光电特性影响.当薄膜厚度为930 nm,薄膜的光电特性最好,电阻率为4.65×10~(-4)Ω·cm,可见光范围内的平均透过率为85.8%,禁带宽度约为3.51 eV.     

IWO缓冲层对磁控溅射生长绒面HGZO薄膜性能的影响

研究了W掺In2O3(IWO)缓冲层(buffer layer)对磁控溅射直接生长绒面结构H化Ga掺杂ZnO(HGZO)薄膜的微观结构和光电性能的影响。实验发现,加入IWO缓冲层能够有效地增大薄膜表面粗糙度,提高了薄膜光散射能力,薄膜绒度(550nm波长处)由7.05%提高至18.37%;具有IWO缓冲层的HGZO(IWO/HGZO)薄膜的电学性能稍微提升。通过优化工艺条件,当IWO缓冲层厚为10nm时,生长获得的IWO/HGZO复合薄膜方块电阻为3.6Ω,电阻率为6.21×10-4Ωcm,可见光及近红外区域透过率(400～1 100nm)为82.18%,薄膜绒度(550nm波长处)为18.37%。     

Effects of the ZnO buffer layer and Al proportion on AZO film properties

To evaluate the influence of the ZnO buffer layer and Al proportion on the properties of ZnO: Al (AZO)/ZnO bi-layer films, a series of AZO/ZnO films are deposited on the quartz substrates by electron beam evaporation. The X-ray diffraction measurement shows that the crystal quality of the films is improved with the increase of the film thickness. The electrical properties of the films are investigated. The carrier concentration and Hall mobility both increase with the increase of buffer layer thickness. However, the resistivity reaches the lowest at about 50 nm-thick buffer layer. The lowest resistivity and the maximum Hall mobility are both obtained at 1 wt% Al concentration. But the optical transmittance of all the films is greater than 80% regardless of the buffer layer thickness with Al concentration lower than 5 wt% in the visible region.     

MgO缓冲层对Si衬底上制备Fe3Si薄膜性能的影响

采用磁控溅射方法和热加工工艺在n型Si衬底上溅射不同厚度的MgO层并制备Fe-Si薄膜层,退火后形成Fe3Si/MgO/Si多层膜结构.利用MgO缓冲层对退火时Si衬底扩散原子进行屏蔽,并分析MgO层对Fe3Si薄膜结构和电学性质的影响.通过X射线衍射仪(XRD)、扫描电子显微镜(SEM)和四探针测试仪对Fe3Si薄膜的晶体结构、表面形貌、断面形貌和电阻率进行表征与分析.研究结果表明:当MgO层厚度为20 nm时生成Fe0.9Si0.1薄膜,当厚度为50,100,150和200 nm时都生成了Fe3Si薄膜,生成的Fe3Si和Fe0.9Si0.1薄膜以(110)和(211)取向为主.随MgO缓冲层厚度增加,Si衬底扩散原子对Fe3Si薄膜的影响减小,Fe3 Si薄膜的晶格常数逐渐减小,晶粒大小趋向均匀,平均电阻率呈现先增大后减小趋势.研究结果为后续基于Fe3 Si薄膜的器件设计与制备提供了参考.     

The Influence of Film Thickness on the Transparency and Conductivity of Al-Doped ZnO Thin Films Fabricated by Ion-Beam Sputtering

To evaluate the influence of film thickness on the structural, electrical, and optical properties of Al-doped ZnO (AZO) films, a set of polycrystalline AZO samples with different thickness were deposited on glass substrates by ion-beam sputtering deposition (IBSD). X-ray diffraction (XRD), atomic force microscopy (AFM), energy-dispersive x-ray spectroscopy (EDS), four-point probe measurements, and spectrophotometry were used to characterize the films. XRD showed that all the AZO films had preferred c-axis orientation. The ZnO (110) peak appeared, and the intensity increased, with increasing thickness. All the samples exhibited compressive intrinsic stresses. AFM showed that the grain size along with the root-mean-square (RMS) roughness increased with increasing thickness. The decrease of resistivity is due to the corresponding change in grain size, surface morphology, and chemical composition. The average optical transmittance of the AZO films was over 80%, and a sharp fundamental absorption edge with red-shifting was observed in the visible region. The optical band gap decreased from 3.95 eV to 3.80 eV when the AZO film thickness increased from 100 nm to 500 nm.     

Filtered cathodic vacuum arc deposition of copper thin film

Copper thin films with low electrical resistivity were successfully deposited using a filtered cathodic vacuum arc technique at room temperature. It was found that there is a critical film thickness of ~135 nm, above which the resistivity has an almost unchanged value of 1.8 μΩcm. Below the critical thickness, the resistivity increases with decreasing thickness and is correlated with the copper grain size measured by AFM and X-ray diffraction     

在柔性衬底上制备透明导电薄膜ZnO:Zr(英文)

采用射频磁控溅射法在室温柔性衬底PET上制备了掺锆氧化锌(ZZO)透明导电薄膜.利用不同方法提高了ZZO薄膜的电阻率而未使其可见光透过率降低.X射线衍射(XRD)和扫描电子显微镜(SEM)表明,ZZO薄膜为六角纤锌矿结构的多晶薄膜.在有机衬底和玻璃衬底上制备ZZO薄膜的择优取向不同,前者为(100)晶面,而后者为(002)晶面.在有ZnO缓冲层的PET衬底上制备的ZZO薄膜电阻率比直接生长在玻璃衬底样品上的小.通过优化参数,在PET衬底上制备出了最小电阻率为1.7×10-3Ω·cm、可见光透过率超过93%的ZZO薄膜.实验表明,镀膜之前在柔性衬底上沉积ZnO缓冲层能有效地提高ZZO薄膜的质量.     

Thickness dependence of the structural and electrical properties of copper films deposited by dc magnetron sputtering technique

This paper addresses the influences of film thickness on structural and electrical properties of dc magnetron sputter-deposited copper (Cu) films on p-type silicon. Cu films with thicknesses of 130-1050 nm were deposited from Cu target at sputtering power of 125 W in argon ambient gas pressure of 3.6 mTorr at room temperature. The electrical and structural properties of the Cu films were investigated by four-point probe, atomic force microscopy (AFM) as well as X-ray diffraction (XRD). Results from our experiment show that the grain grows with increasing film thickness, along with enhanced film crystallinity. The root mean square (RMS) roughness as well as the lateral feature size increase with the Cu film thickness, which is associated with the increase in the grain size. On the other hand, the Cu film resistivity decreases to less than 5 μΩ-cm for 500 nm thick film, and further increase in the film thickness has no significant effects on the film resistivity. Possible mechanisms of film thickness dependent microstructure formation of these Cu films are discussed in the paper, which explain the interrelationship of grain growth and film resistivity with increasing Cu film thickness.     

Thickness dependence of the properties of transparent conducting ZnO:Zr films deposited on flexible substrates by RF magnetron sputtering

Transparent conducting zirconium-doped zinc oxide(ZnO:Zr)thin films with high transparency,low resistivity and good adhesion were successfully prepared on water-cooled flexible substrates(polyethylene glycol terephthalate,PET)by RF magnetron sputtering.The structural,electrical and optical prooerties of the films were studied for different thicknesses in detail.X-ray diffraction(XRD)and scanning electron microscopy(SEM)revealed that all the deposited films are polycrystalline with a hexagonal structure and a preferred orientation perpendicular to the substrate．The lowest resistivity achieved is 1.55×10-3 Ω·cm for a thickness of 189 nm with a Hall mobility of 17.6cm2/(V·s)and a carrier concentration of 2.15×1020cm-3.All the films present a high transmittance of above 90％in the wavelength range of the visible spectrum.     

Electronic properties of zinc oxide thin films prepared by RF magnetron sputtering for varistor applications

ZnO thin films for varistor applications have been prepared by RF magnetron sputtering at a power of 0-1 kW using an argon pressure of 05 Pa. The films were polycrystalline with mean grain size typically 13 nm, and were preferentially oriented in the [002] direction. Optical absorption studies revealed a fundamental absorption edge at a wavelength of approximately 360 nm with a direct bandgap of 3.36 eV. van der Pauw measurements showed a decrease in resistivity from approximately 12ωm at thickness 50 nm to 0-5 ωm at thickness greater than 500 nm. Below 350 K the resistivity was essentially constant, while at higher temperatures an activation energy of approximately 0-2eV was observed, which was attributed to the effects of oxygen vacancies.     

Study on the structural, electrical and optical properties of Al-F co-doped ZnO thin films prepared by RF magnetron sputtering

Al and F co-doped ZnO(ZnO:(Al,F)) thin films on glass substrates are prepared by the RF magnetron sputtering with different F doping contents.The structural,electrical and optical properties of the deposited films are sensitive to the F doping content.The X-ray analysis shows that the films are c-axis orientated along the(002) plane with the grain size ranging from 9 nm to 13 nm.Micrographs obtained by the scanning electron microscope(SEM) show a uniform surface.The best films obtained have a resistivity of 2.16×10-3Ω·cm,while the high optical transmission is 92.0% at the F content of 2.46 wt.%.