Si(111)衬底上多层石墨烯薄膜的外延生长

利用固源分子束外延(SSMBE)技术, 在Si(111)衬底上沉积碳原子外延生长石墨烯薄膜, 通过反射式高能电子衍射(RHEED)、红外吸收谱(FTIR)、拉曼光谱(RAMAN)和X射线吸收精细结构谱(NEXAFS)等手段对不同衬底温度(400、600、700、800℃)生长的薄膜进行结构表征. RAMAN和NEXAFS结果表明: 在800℃下制备的薄膜具有石墨烯的特征, 而 400、600和700℃生长的样品为非晶或多晶碳薄膜. RHEED和FTIR结果表明, 沉积温度在600℃以下时C原子和衬底Si原子没有成键, 而衬底温度提升到700℃以上, 沉积的C原子会先和衬底Si原子反应形成SiC缓冲层, 且在800℃沉积时缓冲层质量较好. 因此在Si衬底上制备石墨烯薄膜需要较高的衬底温度和高质量的SiC缓冲层.     

衬底温度对Si(111)衬底上MBE异质外延3C-SiC薄膜的影响

利用固源分子束外延(SSMBE)技术, 在Si(111)衬底上异质外延生长3C-SiC单晶薄膜, 通过RHEED、XRD、AFM、XPS等实验方法研究了衬底温度对薄膜结构、形貌和化学组分的影响. 研究结果表明, 1000℃生长的样品具有好的结晶质量和单晶性. 在更高的衬底温度下生长, 会导致大的孔洞形成, 衬底和薄膜间大的热失配使降温过程中薄膜内形成更多位错, 从而使晶体质量变差. 在低衬底温度下生长, 由于偏离理想的化学配比也会导致薄膜的晶体质量降低.     

蒸发速率对Si衬底上SSMBE外延SiC薄膜的影响

采用固源分子束外延（SSMBE）生长技术,用不同的蒸发速率,在Si（111）衬底上生长SiC薄膜。利用反射式高能电子衍射（RHEED）、X射线衍射（XRD）、原子力显微镜（AFM）等实验技术,对生长的样品的形貌和结构进行研究。结果表明,在优化的蒸发速率（1.0 nm·min^-1）下,所生长的薄膜质量最好。低的蒸发速率（0.25 nm·min^-1）难以抑制孔洞的形成,衬底的Si原子可通过这些孔洞扩散到样品表面,导致结晶质量变差。在高的蒸发速率（1.8 nm·min^-1）下,以岛状方式生长甚至以团簇聚集,表面的原子难以迁移到最佳取向的平衡位置,导致样品表面粗糙度变大,薄膜的结晶质量变差,甚至出现多晶。     

硅碳比对Si(111)表面SSMBE异质外延SiC薄膜的影响

利用固源分子束外延(SSMBE)生长技术, 在不同的硅碳蒸发速率比(Si/C)条件下, 在Si(111)衬底上生长SiC单晶薄膜. 利用反射式高能电子衍射(RHEED)、X射线衍射(XRD)、原子力显微镜(AFM)和傅立叶变换红外光谱(FTIR)等实验技术, 对生长的样品形貌和结构进行了研究. 结果表明, 在Si/C比(1.1:1.0)下生长的薄膜样品, XRDω扫描得到半高宽为2.1°; RHEED结果表明薄膜具有微弱的衍射环, 有孪晶斑点. 在Si/C比(2.3:1.0)下生长的薄膜, XRDω扫描得到的半高宽为1.5°, RHEED显示具有Si的斑点和SiC的孪晶斑点. AFM显示在这两个Si/C比下生长的样品表面都有孔洞或者凹坑, 表面比较粗糙. 从红外光谱得出 薄膜存在着比较大的应力. 但在Si/C比(1.5:1.0)下生长的薄膜样品, XRDω 扫描得到的半高宽仅为1.1°; RHEED显示出清晰的SiC的衍射条纹, 并可看到SiC的3×3表面重构, 无孪晶斑点; AFM图像表明, 没有明显的空洞, 表面比较平整. FTIR谱的位置显示, 在此Si/C比下生长的薄膜内应力比较小. 因此可以认为, 存在着一个优化的Si/C比(1.5:1.0), 在这个Si/C比下, 生长的薄膜质量较好.     

衬底温度对磁控溅射制备外延ZnO薄膜结构特性的影响

在不同的衬底温度下,采用磁控溅射方法在蓝宝石(0001)衬底上制备了外延生长的ZnO薄膜.采用原子力显微镜(AFM)、X射线衍射仪(XRD)、可见-紫外分光光度计系统研究了衬底温度对ZnO薄膜微观结构和光学特性的影响.AFM结果表明在不同村底温度制备的ZnO薄膜具有较为均匀的ZnO晶粒,且晶粒的尺寸随衬底温度的增加逐渐增大.XRD结果显示不同温度生长的ZnO薄膜均为外延生长,400℃生长的薄膜具有最好的结晶质量;光学透射谱显示在370nm附近均出现一个较陡的吸收边,表明制备的ZnO薄膜具有较高的质量,其光学能带隙随着衬底温度的增加而减小.     

衬底温度对Mg0.1Zn0.9O薄膜结构及光学性能的影响

利用射频磁控溅射技术在不同温度的(100)Si和玻璃衬底上成功地制备了c轴择优取向的Mg0.1Zn0.9O薄膜.通过X射线衍射(XRD)、场发射扫描电镜(FESEM)、紫外可见光分光光度计和光致发光谱研究了衬底温度对Mg0.1Zn0.9O薄膜结构、表面形貌和光学性能的影响,结果表明,在衬底温度为400℃时生长的Mg0.1Zn0.9O薄膜具有很好的c轴取向和较好的光学性能.用激发波长为300nm的氙灯作为激发光源得到不同衬底温度下Mg0.1Zn0.9O薄膜的室温PL谱.分析表明,紫外发光峰与薄膜的结晶质量密切相关,蓝光发射与氧空位有关.简单探讨了衬底温度影响紫外光致发光峰红移和蓝移的可能机理.     

ZnO/SiC/Si异质结构的特性

用MOCVD方法在p型单晶Si（100）基片上外延SiC层,再用直流溅射在SiC层上生长ZnO薄膜,制备出ZnO／SiC／Si异质结构,用XRD和AFM分析了ZnO／SiC／Si和ZnO／Si异质结构中表层ZnO的结构和形貌的差别,研究了这种异质结构的特性．结果表明,在Si（100）基片上外延生长出的是高取向、高结晶质量的SiC（100）层．这个SiC层缓冲层使在Si基片上外延生长出了高质量ZnO薄膜,因为ZnO与SiC的晶格失配比ZnO与Si的晶格失配更低．     

薄膜太阳能电池硅衬底陷光结构的研究进展

制备高效硅薄膜太阳能电池,需要在整个太阳光谱范围内进行有效陷光和保持低反射率。最近,对于硅衬底的陷光结构展开了大量的研究工作。综述了近年来硅衬底陷光结构的研究进展,分析了陷光结构制作的影响因素,展望了薄膜太阳能电池硅衬底陷光结构研究的发展趋势。     

C面蓝宝石衬底上6H-SiC薄膜的低压化学气相外延生长与表征

采用低压化学气相沉积方法在C面蓝宝石衬底上异质外延生长出高结晶质量和良好表面形貌的6H-SiC薄膜,研究了CsHs气体流速对薄膜结晶质量的影响.随着C3Hs气体流速的降低,薄膜的结晶质量先增加后降低,表明薄膜的生长在开始阶段受表面反应控制,而后受质量输运控制.所得到的结晶质量最好的6H-SiC薄膜,其摇摆曲线半高宽为0.6°,已经达到单晶水平.没有使用A1N过渡层,制备出结晶质量更好的SiC薄膜,表明对于蓝宝石衬底上SiC薄膜的生长,起决定性因素的是温度,过渡层不是影响SiC薄膜结晶质量的主要因素.     

SiC thin films obtained by Si carbonization

This work reports the fabrication and characterization of SiC thin films obtained by carbonization of Si substrates with a recently designed and fabricated hot-wall reactor by rapid thermal chemical vapor deposition. The reactor design is less complex than other ones previously reported, but it permits to reach a similar SiC material crystalline quality. The composition and structure of the fabricated thin films have been assessed by scanning electron microscopy and transmission electron microscopy. The structural quality of the obtained films has been optimized as a function of the temperature ramp rate, flowing gases, Si surface pre-treatment and sample holder design. SiC obtained layers on Si exhibit a flat free surface, they mainly consist of highly oriented 3C-SiC and some hexagonal SiC inclusions have been detected.     

MOCVD制备SiC:Al薄膜的导电类型调控研究

用MOCVD方法在Si基片上生长了Al掺杂的SiC薄膜,发现三甲基铝(TMA)源载气流量与硅烷流量之比的大小,会决定薄膜的导电类型。用XPS方法测试样品后发现,TMA载气流量与硅烷流量比直接影响Al原子在SiC薄膜中的含量。Al含量在1.5%以下,Al原子在SiC薄膜中主要以填隙形式(Ali)存在,薄膜显示出n型;而Al含量在1.5%～3%之间的时候,Al原子主要以替位Si(AlSi)的形式存在,薄膜显示出p型。继续增加掺杂源的流量,所得SiC薄膜结晶质量会变得较差,电阻也变得较高。     

CVD growth and characterization of 3C-SiC thin films

Cubic silicon carbide (3C-SiC) thin films were grown on (100) and (111) Si substrates by CVD technique using hexamethyldisilane (HMDS) as the source material in a resistance heated furnace. HMDS was used as the single source for both Si and C though propane was available for the preliminary carbonization. For selective epitaxial growth, patterned Si (100) substrates were used. The effect of different growth parameters such as substrate orientation, growth temperature, precursor concentration, etc on growth was examined to improve the film quality. The surface morphology, microstructure and crystallinity of grown films were studied using optical microscopy, scanning electron microscopy (SEM), X-ray diffraction (XRD) analysis and X-ray photoelectron spectroscopy (XPS).     

Si(001)衬底上方形3 C-SiC岛的LPCVD生长

Si衬底上SiC的异质外延生长深受关注,为了了解Si衬底上的成核及长大过程,采用PLCVD方法在Si(001)衬底上生长出了方形3C-SiC岛,利用Nomarski光学显微镜和扫描电子显微镜（SEM）观察了SiC岛的形状,尺寸,密度和界面形貌,结果表明,3C－SiC岛生长所需的Si原子来自反应气源,衬底上的Si原子不发生迁移或外扩散,气相中C原子浓度决定了SiC岛的生长过程。     

Gas-source molecular beam epitaxy of Si(111) on Si(110) substrates by insertion of 3C-SiC(111) interlayer for hybrid orientation technology

A method to realize a novel hybrid orientations of Si surfaces, Si(111) on Si(110), has been developed by use of a Si(111)/3C-SiC(111)/Si(110) trilayer structure. This technology allows us to use the Si(111) portion for the n-type and the Si(110) portion for the p-type channels, providing a solution to the current drive imbalance between the two channels confronted in Si(100)-based complementary metal oxide semiconductor (CMOS) technology. The central idea is to use a rotated heteroepitaxy of 3C-SiC(111) on Si(110) substrate, which occurs when a 3C-SiC film is grown under certain growth conditions. Monomethylsilane (SiH₃-CH₃) gas-source molecular beam epitaxy (GSMBE) is used for this 3C-SiC interlayer formation while disilane (Si₂H₆) is used for the top Si(111) layer formation. Though the film quality of the Si epilayer leaves a lot of room for betterment, the present results may suffice to prove its potential as a new technology to be used in the next generation CMOS devices.     

Vapor growth of thin heteroepitaxial InP films on CdS

InP was heteroepitaxially deposited onto CdS single-crystal substrates by chemical vapor deposition using phosphine (PH₃), HCl and indium as reactants. Single-crystalline films were deposited at substrate temperatures as low as 450°C. Scanning Auger microscopy shows that the films are InP and that formation of solid solutions between the CdS and the InP is minimal. The as-grown films are n type with residual donor densities of 4 × 10¹⁶–4 × 10¹⁷ cm^-3.     

Synthesis and characterization of heteroepitaxial GaN films on Si(111)

We report crack-free and single-crystalline wurtzite GaN heteroepitaxy layers have been grown on Si (111) substrate by metal-organic chemical vapor deposition(MOCVD). Synthesized GaN epilayer was characterized by X-ray diffraction(XRD), atomic force microscope (AFM) and Raman spectrum. The test results show that the GaN crystal reveals a wurtzite structure with the <0001> crystal orientation and XRD ω-scans showed a full width at half maximum (FWHM) of around 583 arcsec for GaN grown on Si substrate with an HT-AlN buffer layer. In addition, the Raman peaks of E₂^high and A₁(LO) phonon mode in GaN films have an obvious redshit comparing to bulk GaN eigen-frequency, which most likely due to tensile strain in GaN layers. But the AO phonon mode of Si has a blueshit which shows that the Si substrate suffered a compressive strain. And we report that the AlN buffer layer plays a role for releasing the residual stress in GaN films.     

Growth and characterisation of SiC films deposited on a-SiO2/Si (100) substrates

Abstract

The growth of polycrystalline SiC films has been carried out by low pressure chemical vapour deposition in a horizontal quartz reaction chamber using tetramethylsilane and H2 as the precursor gas mixture. Silicon (100) wafers were used as substrates. A thin Si O₂ amorphous layer of ~6 nm was formed before SiC deposition to reduce the strain induced by the 8% difference in thermal expansion coefficients between SiC and Si. Samples were. analysed by X-ray diffraction, scanning electron microscopy, transmission electron microscopy, and infrared reflectivity. The structure of films grown at temperatures between 950 and 1150°C varies from amorphous to polycrystalline SiC. Preferential [111] orientation and columnar growth of polycrystalline films develops with increasing temperature.

MST/3317     

Effects of SiC buffer layer growth temperature on the residual strain of GaN/SiC/Si thin films

Effects of SiC buffer layers were studied on the residual strain of GaN films grown on 3C-SiC/Si (111) substrates. It was clearly observed by Raman scattering measurement that the residual strain of the GaN/Si is reduced by inserting the SiC intermediate layer. Furthermore, residual strain within the GaN/SiC/Si films decreased when the growth temperature of the SiC buffer layer decreased. It was proposed that the irreversible creep phenomenon occurs during the high temperature growth of SiC, affecting nature of the residual strain within the SiC and the GaN layers.