Ultraviolet‐curing behavior and mechanical properties of a polyester acrylate resin

Ultraviolet (UV) curing technology has been widely used in many applications because it has several distinct advantages compared to solvent‐based processes or thermal‐curing technology. The effects of photoinitiator types and their contents as well as reactive diluent types and their contents on the UV‐curing behavior and mechanical properties of a UV‐curable polyester acrylate resin were investigated in this study. Three photoinitiators, Irgacure 184, Darocur 1173, and benzophenone, were used in this study. Hexanediol diacrylate, tripropylene glycol diacrylate, and trimethylol propane triacrylate were used as reactive diluents to modify the properties of the acrylate resin. The change of chemical structure during UV curing was monitored by FTIR. A universal testing machine was used to measure the tensile properties of various UV‐cured acrylate films of different compositions. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 3921–3928, 2004     

光固化光纤彩色涂料的研制

采用环氧丙烯酸酯和脂肪族聚氨酯丙烯酸酯共混的方法研制了一种新型光固化光纤彩色涂料。研究了基料树脂、活性稀释剂、光引发剂、颜料、助剂等对涂料综合性能的影响。结果表明，环氧丙烯酸树脂与脂肪族聚氨酯丙烯酸酯配比为40：20，单、双、多官能团稀释单体配比为3：20：10，复合光引发剂用量10％，有机颜料用量1．5％，所配制的光固化光纤涂料性能优良。     

Study on esterification of acrylic phenolic resin by maleic anhydride and photocrosslinking properties of the alkali‐soluble product

An alkali‐soluble, photocrosslinkable polymer was synthesized by esterification of OH groups of acrylic phenolic resin with maleic anhydride. The OH groups were formed by the ring‐opening reaction of epoxy groups of epoxy phenolic resin with acrylic acid. The esterification conditions were studied. The results showed that it is better to use tetramethyl ammonium bromide as catalyst than N,N‐dimethylbenzylamine. The conversion of maleic anhydride in acetone can reach about 80% at 56°C for 4 h. The purified product was characterized by IR, DSC, and TGA. The product containing acrylate and maleic acid monoester groups, above a certain content, can be dissolved in 1% Na₂CO₃ solution. The photocrosslinkable properties of the product were investigated through selection of photoinitiator, accelarator, crosslinkable diluent monomer, etc. The acrylate and maleic acid monoester group‐containing phenolic resin exhibited very good photocrosslinking behavior, since it contains double bonds from both acrylate groups and maleic acid monoester groups. The activity of photoinitiator decreases in the order: isopropylthioanthraquinone > benzoin ethyl ether (BE) > anthraquinone (AQ) > benzophenone > Michel ketone (MK) > 2,2‐diethoxyacetophenone. The combination of some photoinitiators showed synergistic effects. The order of increasing activity for the accelerator is as follows: MK > ethyl p‐(dimethylamino)benzoate > N,N‐dimethylaniline > triethanolamine. The optimum diluent monomer is trimethylolpropane trimethacrylate. The gel content of the mixture of the resin and trimethylolpropane trimethacrylate could reach 85% using the combined photoinitiators of BE and AQ under UV exposure for 120 s. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 98: 1607–1614, 2005     

UV涂料对光纤附加光衰减的影响

采用双酚A环氧丙烯酸酯(EA)和聚氨酯丙烯酸酯(PUA)共混,加入活性稀释剂、光引发剂、颜料等制备了紫外光固化光纤涂料。讨论了EA与PUA的配比,预聚物与活性稀释剂的配比以及光引发剂及颜料的含量对光纤带附加光衰减的影响。结果表明:当EA/PUA为1∶1.5(质量比),预聚物质量分数为52%,活性稀释剂质量分数为28%,光引发剂质量分数为14%,颜料质量分数为1.5%时,光纤具有最小的附加光衰减值。     

Cure kinetics of multifunctional epoxies with 2,2′‐dichloro‐4,4′‐diaminodiphenylmethane as hardener

The curing behavior of the epoxy resin N,N,N′,N′‐tetraglycidyldiaminodiphenyl methane (TGDDM) with triglycidyl p‐aminophenol as a reactive diluent was investigated using 2,2′‐dichloro‐4,4′‐diaminodiphenylmethane (DCDDM) as the curing agent. The effect of the curing agent on the kinetics of curing, shelf‐life, and thermal stability in comparison with a TGDDM‐diaminodiphenylsulfone (DDS) system was studied. The results showed a lesser activation energy at the lower level of conversion with a broader cure exotherm for the epoxy‐DCDDM system in comparison with the epoxy‐DDS system, although the overall activation energy for the two systems was comparable. TGA studies showed more stability in the epoxy‐DCDDM system than in the epoxy‐DDS system. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 2097–2103, 2000     

紫外光固化环氧树脂涂层性质的研究

以双酚A型环氧树脂紫外光阳离子固化体系为对象，系统研究了光引发剂和各种单体组成对光固化速度及固化膜机械物理性质的影响。结果表明，光引发剂的种类不但可以有效地影响光固化速度，还能对涂层硬度产生影响；环氧稀释剂在降低体系黏度的同时，对光固化速度和硬度产生负面影响；而羟基化合物对光固化速度几乎不产生影响，但是可以大幅度提高涂层的硬度和柔韧性；三元体系中，由于存在加合作用，在光固化速度和物理机械性质两方面都得到了很好的结果。这就使得能够根据具体要求，配制出各种性能都较好的材料，将大大扩展阳离子紫外光固化技术的应用领域。     

Synthesis of a novel quaternary ammonium tetraphenylborate salt and its use for photo‐induced thermal curing of epoxides and radical polymerization of acrylates

A novel photoinitiator, quaternary ammonium tetraphenylborate salt bearing 4‐(4^′‐benzoylphenyl)‐acetophenone (BPPAPG), has been synthesized and characterized by elemental analysis ¹H NMR and IR. The photochemistry and photophysics of BPPAPG were investigated by UV spectroscopy. The formation of 1,4‐diazabicyclo[2.2.2]octane in the photolysis of BPPAPG was ascertained by mass spectrometry. The photoinitiation reactivity of BPPAPG was studied and the results showed that it possessed two sorts of initiation properties, ie thermal curing of the epoxy resin EPON827 and free radical polymerization of acrylates such as trimethylolpropane triacrylate. Copyright © 2005 Society of Chemical Industry     

紫外光固化防腐涂料的研制

在自制的丙烯酸环氧树脂中加入光引发剂和活性稀释剂,得到环保的紫外光固化防腐涂料。     

UV固化单体结构与其固化热膜稳定性的关系

以环氧丙烯酸酯、活性稀释单体、光引发剂等为原料，制备UV固化涂层，对主要原料及固化后的涂层进行了热失质量分析：结果表明：活性稀释单体的耐热性能随着官能度的不同而不同，官能度越高则热稳定性越强；官能度相同的活性稀释单体，极性越高，热稳定性也越高。     

Photoinitiated cationic polymerization of epoxides

Difunctional epoxy monomers have been polymerized cationically by UV irradiation in the presence of a triarylsulfonium photoinitiator. The curing process was followed quantitatively by monitoring the disappearance of the epoxy group by infrared spectroscopy and the insolubilization and hardening of the resin upon UV exposure. The addition of epoxidized soyabean oil (ESO) to an aromatic diepoxide was shown to accelerate the crosslinking reaction with formation of a tight polymer network. The photoinitiated copolymerization of ESO with a cycloaliphatic diepoxide proceeds extensively and leads within seconds to a fully cured insoluble material showing increased hardness, flexibility and scratch resistance. Interpenetrating polymer networks have been generated by a short UV‐irradiation of blends of acrylate and epoxy monomers. © 2001 Society of Chemical Industry     

Ultraviolet/heat dual‐curable film adhesives with pendant‐acryloyl‐functional‐group‐modified epoxy resin

To facilitate the fabrication of a reliable semiconductor package, the UV/heat dual curing of film adhesives was investigated. The curing system of the epoxy resin affected the film adhesive properties. As the UV/heat dual‐curable epoxy resin, a modified o‐cresol novolak epoxy resin, in which half of the glycidyl groups were substituted by acryloyl groups (OCN‐AE), was applied to the film adhesive. The formulated film adhesive contained acrylic copolymer, OCN‐AE, phenolic aralkyl resin as a heat‐curing agent of the glycidyl groups, and 1‐hydroxycyclohexyl phenyl ketone as a photoinitiator of the acryloyl groups. The formulated reference film adhesive contained unmodified o‐cresol novolak epoxy resin (OCN‐E) in place of OCN‐AE. Formulated film adhesives containing a mixture of OCN‐E and o‐cresol novolak epoxy acrylate were also used as references. The morphology and the film adhesive properties were investigated. In these investigations, the film adhesive of OCN‐AE showed better adhesive properties, lower modulus, and a better stress‐relaxation ability than the referenced adhesives. As a result, a reliable film adhesive for semiconductor packages was successfully developed. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Dendritic carbosilane‐based macrophotoinitiator: synthesis,characterization, and photoinitiating behavior

A novel radical dendritic macrophotoinitiator, bearing alkyl pheone moieties linked to the surface of the dendrimer, was synthesized via alcoholysis of carbosilane dendrimer and the small‐molecule photoinitiator 2‐hydroxy‐2‐methyl‐1‐(4‐tert‐butyl)phenylpropane‐1‐one. The structure of the dendritic carbosilane‐based macrophotoinitiator (MPI) was characterized using Fourier transform infrared spectroscopy, ¹H NMR, ¹³C NMR, ²⁹Si NMR, elemental analysis, size exclusion chromatography/multi‐angle laser light scattering, UV‐visible spectroscopy, and differential photocalorimetry (DPC). UV‐visible analysis indicates that the absorption band of photosensitive moieties shifts towards high wavelength by introducing the carbosilane dendrimer core. The DPC results demonstrate that the initiating efficiency of MPI is effective when using epoxy acrylate (EA) as a model resin. Furthermore, thermogravimetric analysis of cured EA resin indicates that the thermal stability can be improved markedly by the incorporation of MPI in the curing formulation. Copyright © 2007 Society of Chemical Industry     

Epoxy acrylate UV/PU dual‐cured wood coatings

For improving the finishing performances of complicated three‐dimensional coated wood products (e.g., furniture) with some shadow zones in the absence of ultraviolet (UV) light, resulting in incomplete curing of UV coatings, the aim of this study was to investigate the characteristics and effects of curing process on the properties of epoxy acrylate UV/PU dual‐cured resin for wood coatings when compared with traditional UV and polyurethane (PU) coatings. The epoxy acrylate oligomer was synthesized for providing a double bond of acryloyl group and a secondary hydroxyl group. The UV/PU dual‐cured coating was formulated with epoxy acrylate resin/tripropylene glycol diacrylate (TPGDA) monomer by the weight ratio of 80/20, 3% dosage of benzil dimethyl ketal as a photoinitiator, and the NCO/OH mole ratio of 1.0. The aromatic polymeric diphenylmethane diisocyanate was used as a hardener. The films of the dual‐cured coating, obtained from UV‐cured or room temperature‐cured process, showed an excellent tensile strength, elongation at break, impact resistance, and lightfastness when compared with traditional UV and PU coatings; especially, the adhesion of UV/PU dual‐cured coating by UV‐cured process was better than that of traditional UV coating. It can therefore be concluded that the epoxy acrylate oligomer‐based dual‐cured coating could readily be used for complicated wood products finishing. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Morphologies and applied properties of free radical/cationic UV‐cured CPUA/TMPTMA/CER composite films

A UV‐cured composite film was prepared by free free‐radical photopolymerization from a blend containing oligomer cycloaliphatic polyurethane acrylate (CPUA) and reactive diluent trimethylolpropane trimethaacrylate (TMPTMA) with the same weight (coded as UT) in the presence of free free‐radical photoinitiator Irgacure 754. It was proved to be a homogeneous system featuring only one phase by means of scanning electron microscopy (SEM). Cycloaliphatic epoxy resin (CER) was introduced to enhance mechanical properties of the UV‐cured UT composite film in the presence of cationic photoinitiator Irgacure 250, and a series of UV‐cured CPUA/TMPTMA/CER composite films with different component ratios were prepared by free radical/cationic hybrid UV UV‐curing technique. Results of conversion curves, SEM, and Fourier‐ transform infrared spectroscopy illustrated that UT was cured faster than CER, leading to dynamically asymmetric photopolymerization‐induced phase ‐separation behaviors. The thermal and mechanical properties were evaluated via thermal degradation analysis, dynamic mechanical analysis, and stress–strain curves. Surface properties such as pencil hardness, pendulum hardness, shrinkage rate, contact angle, flexibility, and glossiness were also studied. All these measurements revealed that component ratios, intermolecular attractions, photopolymerization velocities, and viscosities had remarkably influenced on the morphologies and applied properties of UV‐cured composite films, and interpenetrating polymer network films had better comprehensive performances than other UV‐cured composite films with different microstructures. POLYM. COMPOS., 36:1177–1185, 2015. © 2014 Society of Plastics Engineers     

Curing and combustion properties of a PU‐coating system with UV‐reactive phosphazene

A UV‐curable polyurethane (PU)‐coating system containing phosphorus is formulated by the combination of photoinitiator, PU acrylate oligomer, and UV‐reactive phosphazene monomer. PU acrylate oligomer is prepared by the addition of 2‐hydroxyethylmethacrylate (HEMA) to NCO‐terminated PU prepolymer. UV‐reactive phosphazene monomer is derived from the HEMA substitution reaction to hexachlorocyclotriphosphazene (NPCl₂)₃. The curing reaction of this PU‐coating system is carried out by UV irradiation. The resultant UV‐cured PU‐coated films demonstrated better performance properties than those of original UV‐cured PU acrylate (UV‐PU) without UV‐reactive phosphazene monomer. Furthermore, their thermal properties are investigated by a thermogravimetric analyzer and a dynamic mechanical thermal analyzer, respectively. The combustion behaviors of these UV‐cured PU‐coated films are evaluated by the measurements of a limiting oxygen index and a cone calorimeter. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 85: 1980–1991, 2002     

A novel UV‐curable epoxy acrylate resin containing arylene ether sulfone linkages: Preparation,characterization, and properties

UV‐curing processes are used in industrial applications because of their advantages such as high‐speed applications and solvent‐free formulations at ambient temperature. UV‐curable epoxy acrylate resins containing arylene ether sulfone linkages (EAAES) were synthesized through the condensation of bis(4‐chlorophenyl)sulphone and bisphenol‐A, followed by end‐caping of epichlorohydrin and subsequently acrylic acid. UV‐cured coatings were formulated with epoxy acrylates, reactive diluents such as pentaerythritol tri‐acrylate and pentaerythritol dia‐crylate and photoinitiator. Fourier transfer infrared, ¹H NMR, and thermal gravimetrical analysis were employed to investigate the structures and thermal properties of the EAs films. The introduction of EAAES into epoxy acrylate substantially improves its thermal properties and thermo‐oxidative stability at high temperatures. In addition, the acrylate containing arylene ether sulfone linkages can also improve pencil hardness and chemical and solvent resistance of the epoxy acrylate. The obtained UV‐curable epoxy acrylate containing arylene ether sulfone linkages is promising as oligomer for UV‐curable coatings, inks, and adhesives in some high‐tech regions. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 41067.     

异氰酸酯改性环氧丙烯酸酯的合成及其光固化动力学的研究

采用两步法合成了可紫外光固化的异氰酸酯改性的环氧丙烯酸酯树脂,并利用元素分析、傅里叶变换红外光谱、核磁共振氢谱对此树脂的结构进行了表征。对树脂及其固化后涂膜的性能测试表明,合成的树脂具有较低的黏度,为4500mPa-s/60℃,固化膜柔韧性能优,低于3mm。采用红外光谱法对此改性树脂的光固化动力学行为进行了分析,结果表明:光引发剂Irgacure1000作为Darocur1173和Irgacure184以质量比1:1构成的复合型光引发剂,比单一的光引发剂具有更优异的引发效果;随着光引发剂Irgacure1000用量的增加,树脂体系光固化反应的聚合速率和树脂中双键的最终转化率都明显增加,但当其用量超过树脂质量的3%时,光固化反应速率和双键的最终转化率又趋于下降;活性单体对树脂光固化行为的影响为:单体的官能度越低、活性单体的用量越大,越有利于树脂的光固化,固化速率和双键的最终转化率都明显提高;此外,增大入射光的光照射强度也有利于树脂的光固化。     

Cationic electron‐beam curing of a high‐functionality epoxy: effect of post‐curing on glass transition and conversion

This paper reports on the cationic electron‐beam curing of a high‐functionality SU8 epoxy resin, which is extensively used as a UV‐curing negative photoresist for micro‐electronics machine systems (MEMS) applications. Results show that elevated post‐curing treatment significantly increased both the conversion and the glass transition. The degree of conversion and the glass transition temperature were measured by using Fourier‐transform infrared (FTIR) spectroscopy and modulated differential scanning calorimetry (MDSC^®), respectively. The glass transition temperature (T_g), which has been observed to be dependent on the degree of conversion, reaches a maximum of 162 °C at 50 Mrad and post‐curing at 90 °C. The degradation pattern of the cured resin does not show much variation for exposure at 5 Mrad, but does show significant variation for 50 Mrad exposure at various post‐curing temperatures. A degree of conversion of more than 0.8 was achieved at a dosage of 30 Mrad with post curing at 80 °C, for the epoxy resin with an average functionality of 8 a feature simply not achievable when using UV‐curing. Copyright © 2004 Society of Chemical Industry     

Study on synthesis and photoactivity of N-substituted diazabicyclononane derivatives with different substituents

N-substituted diazabicyclononanes with different benzylic substituents were synthesized by hydrogenating diazabicyclononene with LiAlH₄ and alkylating secondary amine with halobenzyl derivatives. The synthesized diazabicyclononanes were identified with NMR spectrometry; the UV absorption and fluorescence emission of the diazabicyclononanes were examined with spectroscopes; the reactivity of the diazabicyclononane as radical photoinitiator and photolatent base were evaluated with DSC, FTIR spectroscope and gel fraction determination; the effects of substituents on the photoactivities of the diazabicyclononanes were investigated. Electron conjugation in the substituents played a prominent role on the photoactivity. As the conjugation extended, the extinction coefficient increased and fluorescence decreased; meanwhile, the UV absorption expanded towards low frequency. For diazabicyclononane N-substituted with 4-methylene benzophenone, the maximum absorption appeared around 256 nm with extinction coefficient 1.78×10⁴⁻ mol⁻¹ L cm⁻¹. It could work as radical photoinitiator and photolatent base simultaneously. With this diazabicyclononane, epoxy acrylate could be UV cured within seconds and the activation temperature of epoxy/anhydride could be reduced 50 °C after UV excitation. The gel fraction of acrylate/epoxy hybrid resins could be about 90% after UV-thermal dual curing.     

Curing characteristics of epoxy resin systems that include a biphenyl moiety

The curing characteristics of epoxy resin systems that include a biphenyl moiety were investigated according to the change of curing agents. Their curing kinetics mainly depend on the type of hardener. An autocatalytic kinetic reaction occurs in epoxy resin systems with phenol novolac hardener, regardless of the kinds of epoxy resin and the epoxy resin systems using Xylok and DCPDP (dicyclopentadiene‐type phenol resin) curing agents following an nth‐order kinetic mechanism. The kinetic parameters of all epoxy resin systems were reported in terms of a generalized kinetic equation that considered the diffusion term. The fastest reaction conversion rate among the epoxy resin systems with a phenol novolac curing agent was obtained in the EOCN‐C epoxy resin system, and for systems with Xylok and DCPDP hardeners, the highest reaction rate values were obtained in NC‐3000P and EOCN‐C epoxy resin systems, respectively. The system constants in DiBenedetto's equation of each epoxy resin system with different curing agents were obtained, and their curing characteristics can be interpreted by the curing model using a curing agent as a spacer. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 1942–1952, 2002