Induced nanosecond absorption in InP:Fe

Induced absorption was observed in an InP:Fe crystal under nanosecond pulse illumination at 1.06-μm wavelength. The maximum induced absorption was 0.05 cm^-1 when probed at a 1.06-μm wavelength and 0.30 cm^-1 when probed at a 1.30-μm wavelength. The kinetics are studied together with the photocurrent giving the recombination times of holes (100 ns) at room temperature and an estimate for that of electrons (0.5 ns). The induced absorption is attributed to a population redistribution of the different iron impurity states. Computer simulations are able to explain all the features found in the experiments and give values for the photoionization cross sections, in particular for the unknown cross section Fe^2+*→Fe³⁺+e^-     

Disposable polysilicon LDD spacer technology

An advanced 0.5-μm CMOS disposable lightly doped drain (LDD) spacer technology has been developed. This 0.5-μm CMOS technology features surface-channel LDD NMOS and PMOS devices, n⁺/p⁺ poly gates, 125-A-thick gate oxide, and Ti-salicided source/drain/gate regions. Using only two masking steps, the NMOS and PMOS LDD spacers are defined separately to provide deep arsenic n⁺ regions for lower salicided junction leakage, while simultaneously providing shallow phosphorus n^- and boron p^- regions for improved device short-channel effects. Additionally, the process allows independent adjustment of the LDD and salicide spacers to optimize the LDD design while avoiding salicide bridging of source/drain to gate regions. The results indicate extrapolated DC hot-carrier lifetimes in excess of 10 years for a 0.3-μm electrical channel-length NMOS device operated at a power-supply voltage of 3.3 V     

The sublinear relationship between index change and carrier densityin 1.5 and 1.3 μm semiconductor lasers

The carrier-induced index change was measured using a novel injection-reflection technique in combination with differential carrier lifetime data. The observed relation between index change and injected carrier density at bandgap wavelength is nonlinear and is approximately given by δn_act=-6.1×10^-14 ( N)^0.66 for a 1.5-μm laser and δn _act=-1.3×10^-14 (N)^0.68 for a 1.3-μm laser. The carrier-induced index change for a 1.3-μm laser at 1.53-μm wavelength is smaller and is given by δn _act=-9.2×10^-16 (N)^0.72      

A new p-channel MOSFET with large-tilt-angle implanted punchthroughstopper (LATIPS)

A buried-channel p-MOSFET with a large-tile-angle implanted punchthrough stopper (LATIPS) is described. In this device the n⁺ LATIPS region was successfully realized adjacent to the p⁺ source/drain, even without a sidewall spacer, by taking advantage of the n⁺ large-tilt-angle implant. In spite of the relatively deep p⁺ junction of 0.2-μm depth and the low n-well concentration of 1×10¹⁶ cm^-3, the 0.5-μm LATIPS device (with corresponding channel length of 0.3 μm) achieved high punchthrough resistance, e.g. a low subthreshold swing of 95 mV/decade with a high transconductance of 135 mS/mm     

1.55-μm Ce,Er:ZBLAN fiber laser operation under 980-nm pumping:experiment and simulation

Fiber laser operating property at 1.55-μm band in a newly developed Ce,Er:ZBLAN fiber by a continuous-wave laser diode pumping at 980 nm is presented. The output characteristics of the Ce,Er:ZBLAN fiber laser system are analyzed in detail based on the rate equations model by taking into account the energy transfer between Ce³⁺ and Er ³⁺ ions, as well as the upconversion mechanisms. The promotion role of the Ce in the erbium-doped ZBLAN for the 1.55-μm band fiber laser operation has been realized     

Schottky-clamped NMOS transistors implemented in a conventional0.8-μm CMOS process

An 0.8-μm n-channel MOSFET with a TiSi₂-Si Schottky clamped drain-to-body junction (SCDR) and an n⁺ implanted standard source structure have been fabricated in a conventional 0.8-μm salicide CMOS process without any process modifications. The SCDR should be useful for reducing susceptibility for latch-up in integrated CMOS RF power amplifiers and switches where drain to p-substrate junctions can be forward biased during normal operations. Output I-V characteristics of the devices are the same as those of conventional MOSFETs, while parasitic lateral n⁺-drain/p-substrate/n⁺-source bipolar transistor measurements showed significantly reduced current gains because the Schottky barrier diode which does not inject minority carriers (electrons) to the p-substrate base clamps the n⁺ drain-to-p-substrate guard-ring diode connected in parallel     

Low-resistance self-aligned Ti-silicide technology for sub-quartermicron CMOS devices

A low-resistance self-aligned Ti-silicide process featuring selective silicon deposition and subsequent pre-amorphization (SEDAM) is proposed and characterized for sub-quarter micron CMOS devices. 0.15-μm CMOS devices with low-resistance and uniform TiSi₂ on gate and source/drain regions were fabricated using the SEDAM process. Non-doped silicon films were selectively deposited on gate and source/drain regions to reduce suppression of silicidation due to heavily-doped As in the silicon. Silicidation was also enhanced by pre-amorphization, using ion-implantation, on the narrow gate and source/drain regions. Low-resistance and uniform TiSi₂ films were achieved on all narrow, long n⁺ and p⁺ poly-Si and diffusion layers of 0.15-μm CMOS devices. TiSi₂ films with a sheet resistance of 5 to 7 Ω/sq were stably and uniformly formed on 0.15-μm-wide n⁺ and p⁺ poly-Si. No degradation in leakage characteristics was observed in pn-junctions with TiSi₂ films. It was confirmed that, using SEDAM, excellent device characteristics were achieved for 0.15-μm NMOSFET's and PMOSFET's with self-aligned TiSi₂ films     

Absorption loss coefficient of the active layer for 1.48-μm bulkand MQW lasers

It is shown that the absorption loss coefficient of the active layer for 1.48-μm bulk lasers is 66 cm^-1 which is between 45 and 107 cm^-1 for 1.3-μm bulk lasers and for 1.55-μm bulk lasers, respectively. It is also described that the absorption loss coefficient of the active layer for 1.48-μm multiple-quantum-well (MQW) lasers is 28 cm^-1 which is about two-fifths of that for 1.48-μm bulk lasers. Therefore, the high slope efficiency of the 1.48-μm MQW lasers is attributed not only to the small optical confinement factor but also to the small absorption loss coefficient of the active layer     

Electrical properties of Si p+-n junctions for sub-0.25μm CMOS fabricated by Ga FIB implantation

p⁺-n junction diodes for sub-0.25-μm CMOS circuits were fabricated using focused ion beam (FIB) Ga implantation into n-Si (100) substrates with background doping of N_b=(5-10)×10 ¹⁵ and N_b⁺=(1-10)×10¹⁷ cm^-3. Implant energy was varied from 2 to 50 keV at doses ranging from 1×10¹³ to 1×10¹⁵ cm^-2 with different scan speeds. Rapid thermal annealing (RTA) was performed at either 600 °C or 700°C for 30 s. Diodes fabricated on N_b⁺ with 10-keV Ga⁺ exhibited a leakage current (^I_R) 100× smaller than those fabricated with 50-keV Ga⁺. Tunneling was determined to be the major current transport mechanism for the diodes fabricated on N_b⁺ substrates. An optimal condition for I_R on N_b⁺ substrates was obtained at 15 keV/1×10¹⁵ cm^-2. Diodes annealed at 600°C were found to have an I_R 1000× smaller than those annealed at 700°C. I-V characteristics of diodes fabricated on N_b substrates with low-energy Ga⁺ showed no implant energy dependence. I-V characteristics were also measured as a function of temperature from 25 to 200°C. For diodes implanted with 15-keV Ga ⁺, the cross-over temperatures between I_diff and I_g-r occurred at 106°C for N_b ⁺ and at 91°C for N_b substrates     

A high-speed and highly uniform submicrometer-gate BPLDD GaAsMESFET for GaAs LSIs

The authors present formation conditions for ion-implanted regions of a GaAs buried p-layer lightly doped drain (BPLDD) MESFET that can improve short-channel effect, V_th uniformity, and FET operating speed, simultaneously. For 0.7-μm gates, a Mg⁺ dose of 2×10¹² cm^-2 at 300 keV and a Si⁺ dose of 2×10¹² cm^-2 at 50 keV are suitable for the p layer and n' layer, respectively. A σV _th of 7 mV is realized. Gate-edge capacitance of the 0.7-μm-gate BPLDD that consists of both overlap capacitance and fringing capacitance is successfully reduced to 0.5 fF/μm, which is about 50% of that of a non-LDD buried p-layer (BP) FET. Another parasitic capacitance due to the p-layer was found to have less effect on the speed than the gate-edge one. Consequently, the gate propagation delay time of the BPLDD can be reduced to 15 ps at power dissipation of 1 mW/gate, which is about 65% of that of a BP. Applying the 0.7-μm-gate BPLDD to 16-kb SRAMs, the authors have obtained a maximum access time of less than 5 ns with a galloping test pattern     

5 Gb/s optical soliton transmission experiment using Ramanamplification for fiber-loss compensation

Optical soliton transmission of 5 Gb/s over a 23-km amplification spacing using a gain-switched 1.55-μm distributed feedback laser diode and Ti:LiNbO₃ intensity modulator is discussed. An Er ⁺-doped fiber amplifier, pumped by 1.45- and 1.48-μm laser diodes, is employed for achieving intense optical pulses. Transmission fiber-loss is completely compensated for by Raman amplification using by 1.45- and 1.48-μm laser-diode pumping. A bit error rate (BER) of 2×10^-10 has been obtained     

Nitrogen-implanted SiC diodes using high-temperature implantation

6H-SiC diodes fabricated using high-temperature nitrogen implantation up to 1000°C are reported. Diodes were formed by RIE etching a 0.8-μm-deep mesa across the N⁺/P junction using NF₃/O₂ with an aluminum transfer mask. The junction was passivated with a deposited SiO₂ layer 0.6 μm thick. Contacts were made to N⁺ and P regions with thin nickel and aluminum layers, respectively, followed by a short anneal between 900 and 1000°C. These diodes have reverse-bias leakage at 25°C as low as 5×10^-11 A/cm² at 10 V     

High-performance In0.08Ga0.92As MESFETs onGaAs(100) substrates

In_0.08Ga_0.92As MESFETs were grown in GaAs (100) substrates by molecular beam epitaxy (MBE). The structure comprised an undoped compositionally graded In_xGa_1-x As buffer layer, an In_0.08Ga_0.92As active layer, and an n⁺-In_0.08Ga_0.92As cap layer. FETs with 50-μm width and 0.4-μm gate length were fabricated using the standard processing technique. The best device showed a maximum current density of 700 mA/mm and a transconductance of 400 mS/mm. The transconductance is extremely high for the doping level used and is comparable to that of a 0.25-μm gate GaAs MESFET with an active layer doped to 10¹⁸ cm^-3. The current-gain cutoff frequency was 36 GHz and the power-gain cutoff frequency was 65 GHz. The current gain cutoff frequency is comparable to that of a 0.25-μm gate GaAs MESFET     

Repetitively pulsed Nd-glass slab lasers

The possibility of obtaining high laser output energies at a 1.32-μm wavelength using thin LiNdLa phosphate glass slabs with a high Nd³⁺ concentration is discussed. In the experiments, 3×14×125-mm slabs were prepared from LiNdLa phosphate glass with a Nd-concentration of 1.2×10²¹ cm^-3. The facets of the slabs were not antireflection-coated. They were tested in a silver-coated quartz tube reflector of 25-mm diameter and pumped by 450-μs pulses from a flash lamp with a 120-mm arc length. In this construction the light, which passes through the slab, returns to it after reflection from the tube surface. Most of the radiation falls on the wider side of the slab at large angles of incidence, thus maximizing its path inside the slab. The quartz reflector was water cooled. The 150-mm laser resonator was formed by two flat mirrors. At 1.32-μm lasing wavelength an output mirror of r=95% reflectivity was used with less than 10% reflectivity at 1.32 μm     

Modeling the gain degradation of high concentration erbium-dopedfiber amplifiers by introducing inhomogeneous cooperative up-conversion

The gain degradation of erbium-doped fiber amplifiers (EDFAs) with high erbium ion (Er³⁺) concentration at 1.48- and 0.98-μm pump wavelengths is modeled by introducing inhomogeneous cooperative up-conversion (IhCU). General formulas describing the gain degradation as a function of IhCU rate are obtained by solving rate equations for population probabilities in the relevant Er³⁺ energy levels. The experimental results, such as low gain for high Er³⁺ concentration, and higher saturated gain with counterpropagation than with copropagation pumping, which have not yet been explained theoretically, are qualitatively explained by this model. Good agreement between the measured and calculated gain is obtained. The gain degradation characteristics at 1.48- and 0.98-μm pump wavelengths are analyzed with this model. The advantage of counterpropagation pumping is determined qualitatively. The noise figure degradation is also evaluated     

Er3+-doped fiber amplifier pumped by 0.98 μm laserdiodes

The performance of an Er³⁺-doped fiber amplifier pumped by 0.98 μm InGaAs laser diodes (LDs) is reported. By using a fiber with low Er³⁺ content and optimizing the fiber length, a maximum signal gain of 37.8 dB at 30-mW pump power was realized at a signal wavelength of 1.536 μm. A maximum gain coefficient of 1.9 dB/mW at 14 mW pump power was achieved. It was found that the fiber amplifier pumped by the 0.98-μm LDs is twice as efficient as that pumped by 1.48-μm LDs, from the viewpoint of both required fiber length and the attained gain     

1.3-μm emission of Nd:LaF3 thin films grown bymolecular beam epitaxy

The 1.3-μm emission of Nd³⁺-doped LaF₃ thin films grown on LaF₃ and CaF₂ (111) substrates by molecular beam epitaxy is reported. The waveguide behavior of the heteroepitaxial layers has been demonstrated and the refractive indexes measured. Guided spectra have been obtained from these layers using a prism-coupling technique. The 1.3-μm emission corresponding to the 4F _3/2→⁴I_3/2 transition has been characterized as a function of Nd³⁺ concentration and temperature. The relative efficiencies of different excitation bands were compared. The optimum concentration for Nd³⁺ dopant has been found to be about 1 at.%. A narrowing of the emission lines is observed in the homoepitaxial layers compared to the heteroepitaxial layers. The decay of the luminescence of the ⁴F_3/2 level measured at room temperature is similar for homoepitaxial and heteroepitaxial layers     

The investigation of key technologies for sub-0.1-μm CMOS devicefabrication

The fabrication of sub-0.1-μm CMOS devices and ring oscillator circuits has been successfully explored. The key technologies include: lateral local super-steep-retrograde (SSR) channel doping with heavy ion implantation, 40-nm ultrashallow source/drain (S/D) extension, 3-nm nitrided gate oxide, dual p⁺/n⁺ poly-Si gate electrode, double sidewall scheme, e-beam lithography and RIE etching for sub-0.1-μm poly-Si gate pattern, thin and low sheet resistance SALICIDE process, etc. By these innovations in the technologies, high-performance sub-0.1-μm CMOS devices with excellent short-channel effects (SCEs) and good driving ability have been fabricated successfully; the shortest channel length is 70 nm. 57 stage unloaded 0.1-μm CMOS ring oscillator circuits exhibiting delay 23.8 ps/stage at 1.5 V, and 17.5 ps/stage and 12.5 ps/stage at 2 V and 3 V, respectively, are achieved     

On the dynamics of population inversion for 3 μm Er3+lasers

A generalized model for 3-μm (⁴I_11/2 →⁴I_13/2)Er lasers is proposed. The essential energy transfer processes present in the single-doped Er ³⁺ systems (up-conversion from ⁴I_13/2, up-conversion from ⁴ I_11/2, cross-relaxation from ⁴S _3/2), as well as those present in Cr³⁺ codoped Er ³⁺ systems, are taken into account. In the frame of this model, the main features of 3 μm Er³⁺ lasers, such as long pulse or CW operation, the change of emission wavelength as a function of pumping conditions, and the effects of codoping with Ho³⁺ or Tm³⁺ ions, are explained     

Effects of neutral buried p-layer on high-frequency performance ofGaAs MESFETs

Fully ion-implanted n⁺ self-aligned GaAs MESFETs with Au/WSiN refractory metal gates have been fabricated by adopting neutral buried p-layers formed by 50-keV Be-implantation. S-parameter measurements and equivalent circuit fittings are discussed. When the Be dose is increased from 2×10¹² cm^-2 to 4×10¹² cm^-2, the maximum value of the cutoff frequency with a 0.2-μm gate falls off from 108 to 78 GHz. This is because a neutral buried player makes the intrinsic gate-source capacitance increase markedly, while its influence on gate-drain capacitance and gate-source fringing capacitance is negligible. The maximum oscillation frequency recovers, however, due primarily to the drain conductance suppression by the higher-concentration buried p-layer. An equivalent value of over 130 GHz has been obtained for both 0.2-μm-gate GaAs MESFETs