2.5D硅转接板关键电参数测试技术研究

硅转接板是3D IC中实现高密度集成的关键模块,获取其技术参数对微系统的设计至关重要.以实际研制的一种2.5D硅转接板为研究对象,对大马士革铜布线(Cu-RDL)、硅通孔(TSV)关键电参数的测试结构与测试方法进行了研究,并对TSV电参数测试结构的寄生电容进行了分析.研究结果表明,研制的2.5D硅转接板中10 μm×8...     

InGaP/GaAs HBT器件研究中的几个重要问题

本文分析了InGaP/GaAs异质结双极晶体管(HBT)微波器件研制中的一些重要问题,优化了发射结阻挡层厚度,解决离子注入实现器件隔离的问题,设计制备出发射极尺寸为(3μm×40μm)×3的HBT单管,并进行了测试。     

自对准栅金刚石MESFET器件研究

基于表面氢化处理的金刚石材料,利用自对准栅工艺技术研制了p型金刚石肖特基栅场效应晶体管(MESFET)。利用AFM和Raman测试方法对材料的特性进行了测试及分析。同时,对研制的金刚石MESFET器件进行了TLM以及直流特性测试及性能分析。利用TLM方法测试获得的表面氢化处理金刚石材料的方阻和Au欧姆接触比接触电阻率分别为4kΩ/□和5.24×10-4Ω.cm2。研制的1μm栅长金刚石MESFET器件的最大电流在-5V偏压下达到10mA/mm以上。     

中国汽车技术研究中心eCham ber建成

正中国汽车技术研究中心(国家轿车质量监督检验中心)2013年底建成的eChamber电波暗室已于2014年2月正式投入使用,该暗室是目前国内唯一一个专门针对电机及电机控制器进行加载、测试EMC性能的试验室。eChamber暗室的尺寸为9.7 m×8.2 m×4.5 m,转台直径4 m,主承重区最大承重3 t;可测试的电机最大直径为760 mm,最大长度为1 m;测试频率范围为9 kHz~18 GHz。该电波暗室配置了传统电波暗室不具备的高压、大电流的直流电源,最高1 000 V/500 A;同     

基于改进粒子群算法的室内可见光定位研究

为了提高现行室内可见光定位系统的定位精度，提出考虑噪声干扰的动态惯性权重及认知因素的改进型粒子群算法。首先，将决定定位精度的欧式距离转换为目标函数最小值优化问题；其次，利用惯性权重动态赋值，增强粒子群算法初期的全局搜索能力和后期的局部搜索能力；然后，利用正弦函数使得个体认知因素值非线性地减小，利用余弦函数使得群体认知因素值线性地增加，以进一步提升定位精度；最后，通过仿真与实验测试对所提定位算法进行验证。仿真测试结果表明，在5 m×5 m×3 m和5 m×4 m×3 m两种定位模型中，在0,0.5,1.0和1.5 m四个高度平面的空间定位平均误差分别为0.65和0.54 cm;实验结果显示，在搭建的1 m×1 m×0.8 m和1 m×0.8 m×0.8 m室内空间中的平均定位误差分别为2.67和1.81 cm。     

有源消噪耳塞测试方法研究

基于现有的有源消噪耳罩的测试参量和测试方法,提出了有源消噪耳塞的测试方法,建立了测试系统并分析了测试系统误差和测试可靠性.详细给出了基于此测试系统的测试方法,并对3款耳塞进行了测试,通过分析结果,验证所提出测试方法的可行性.     

微波辐射参数测试系统低功率密度测试方法研究

为扩展微波辐射参数测试系统功率测试范围,通过对微波辐射参数测试系统的分析研究,本文提出了微波辐射参数测试系统低功率密度测试方法,经过测试验证,该方法能够测试低至10-4W的功率信号,对比系统正常测试方法的最低10-1W的功率,提高1000倍的功率测试范围,能够弥补系统在低功率测试方面的不足,可以在低功率雷达、干扰系统任务中进行广泛应用。     

低频压电式MEMS振动能量采集器研究

设计了一种低频压电d31模式的"八悬臂梁-中心质量块"结构微机电系统(MEMS)振动能量采集器,实现环境振动能量向电能的转换。首先利用溶胶-凝胶工艺实现PZT压电薄膜的异质集成制造,单个锆钛酸铅(PZT)压电敏感单元的有效尺寸为935μm×160μm×1.5μm;然后通过MEMS加工工艺完成器件微结构的加工制造,器件结构有效体积为9.936×10~(-4)cm~3;最后借助振动测试系统对该器件的各项输出性能进行测试。测试结果表明,谐振频率为60Hz、加速度激励为1g(g=9.8m/s~2)时,该能量采集器的输出电压峰-峰值为232mV。在其两端加载3.0 MΩ的负载时最大输出功率为6×10~(-4)μW,输出功率密度为0.604μW/cm~3,PZT压电敏感单元有效面积下的输出功率密度为0.025μW/cm~2。     

TiO2-ZnO系尖晶石型红外辐射涂料的制备和研究

以Fe2O3-MgO-cordierite体系为基础,用不同质量分数TiO2和ZnO进行掺杂,制得具有高发射率的尖晶石型红外辐射涂料。通过XRD、SEM、红外发射率测试、傅立叶变换红外光谱测试、抗热震性测试等测试方法对所制备的红外辐射涂料的物相、微观形貌、红外发射率和抗热震性能进行分析。结果表明,经高温烧结后生成了ZnFe2O4、TiMg2O4、MgFe2O4尖晶石结构,当TiO2质量分数为10%时,涂料在8～14 m波段的发射率最高达到0.963,并且抗热震性良好。     

一种专用可重配置的FPGA嵌入式存储器模块的设计和实现

本文设计了一种满足FPGA芯片专用定制需求的嵌入式可重配置存储器模块.一共8块,每块容量为18Kbits的同步双口BRAM,可以配置成16K×1bit、8K×2bits、4K×4bits、2K×9bits、1K×18bits、512×36bits六种不同的位宽工作模式;write_first、no_change两种不同的写入模式.多个BRAM还可以通过FPGA中互连电路的级联来实现深度或宽度的扩展.本文重点介绍实现可重配置功能的电路及BRAM嵌入至FPGA中的互连电路.采用SMIC 0.13μm 8层金属CMOS工艺,产生FDP-II芯片的完整版图并成功流片,芯片面积约为4.5mm×4.4mm.运用基于March C+算法的MBIST测试方法,软硬件协同测试,结果表明FDP-II中的BRAM无任何故障,可重配置功能正确,证实了该存储器模块的设计思想.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks