反应注射成型纳米CuS/PDCPD复合材料的制备与性能

以钨配合物为主催化剂, AlEt₂Cl为助催化剂, 表面改性CuS纳米粉体为填料, 采用反应注射成型工艺, 原位聚合方法制备了纳米CuS/聚双环戊二烯(CuS/PDCPD)复合材料。利用红外光谱、 扫描电镜、 透射电镜、 三维轮廓测定仪、 高温气氛摩擦磨损试验机等多种手段对表面改性CuS纳米粉体及纳米CuS/PDCPD复合材料的结构、 填料分散性、 磨损形貌、 力学性能以及摩擦磨损性能进行了表征和测试。结果表明, 改性CuS在极低的添加范围内, 即可实现对PDCPD同时起到增强增韧和耐磨的作用; 在CuS添加质量分数为1% 时, 纳米CuS/PDCPD复合材料的综合性能达到最佳; 与PDCPD性能相比, 冲击强度、 拉伸强度和弯曲强度的最大提高量分别为13.2%、 22.0%、 13.8%; 磨损质量和摩擦因数最大降低了31%和36%。表面改性CuS纳米粉体在PDCPD基体中具有良好的界面相容性,是实现纳米CuS/PDCPD复合材料在低添加范围内具有较佳力学性能和耐磨性能的重要原因。     

聚双环戊二烯的性能研究

采用ＲＩＭ方法完成了聚双环戊二烯的合成,对聚合物的力学性能、热性能及耐介质性能进行了研究。实验结果表明,聚双环戊二烯性能优良,它同时具有高拉强度和中度,能耐中等强度的酸碱及热水的侵蚀,同时它还具有优良的涂膜性能。     

反应条件对聚双环戊二烯性能的影响

以ＷＣｌ６／ＷＯＣｌ４－ＡｌＥｔ３为催化剂,采用ＲＩＭ方法完成了双环戊二烯（ＤＣＰＤ）的聚合反应,研究了催化剂的用量,反应温度对聚双环戊二烯（ＰＤＣＰＤ）性能的影响,实验结果表明,在ＤＣＰＤ／Ｗ＝１０００￣３０００／１（ｍｏｌ ｒａｔｉｏ）,Ａｌ／Ｗ＝２／１（ｍｏｌ／ｒａｔｉｏ）,反应温度为７０￣１２０℃,ＰＤＣＰＤ具有优良的性能。     

SBA-15/PDCPD复合材料的阻燃性能

分别采用介孔分子筛SBA-15原位聚合及SBA-15负载催化剂六氯化钨原位聚合的方法制备了SBA-15/聚双环戊二烯(PDCPD)复合材料,研究了SBA-15/PDCPD复合材料的阻燃性能.研究结果表明:采用原位聚合方法制备的复合材料,SBA-15孔道中的双环戊二烯(DCPD)单体难以发生聚合反应生成PDCPD分子链,...     

反应注射成型（RIM）用单体双环戊二烯的改性及表征

对反应注射成型（简称ＲＩＭ）用双环戊二烯（ＤＣＰＤ）改性的工艺条件及其产物凝固点的模型参数方程进行了研究，提供了一种简便可行的制备室温液态ＤＣＰＤ的方法。研究结果表明，ＤＣＰＤ可以通过热聚反应实现改性的目的，适宜的反应温度为１４５～１５０℃，反应时间为４～６ｈ，首次通过多元线性回归得出热聚产物凝固点的半经验模型参数方程为：Ｔｆ＝１７．２－６．３３×１０１２ｅｘｐ（－９５．０×１０３＼ＲＴ）ｔ０．７８３该模型对双环戊二烯改性工艺参数的选择具有使用价值。     

二氧化双环戊二烯/纳米SiO2复合材料的制备与性能

首次报道了采用超声、高速剪切分散的方法制备二氧化双环戊二烯与二氧化硅纳米复合材料.对制得的材料进行了力学性能测试、电镜扫描、热失重测试分析.结果表明,纳米复合材料的力学性能有很大的提高,其中当二氧化硅添加的质量分数为4%时,复合材料的冲击强度达到了36.57J/M,比纯树脂提高了252%.扫描电镜分析表明:复合材料的断...     

碳纤维增强尼龙6复合材料的阴离子聚合反应注射成型工艺

以己内酰胺为原料,自制己内酰胺钠(C10)、双酰化内酰胺-1,6-己二胺(C20)分别为引发剂和活化剂,首先对适用于反应注射成型技术(RIM)的尼龙6(PA6)阴离子聚合工艺进行探究。实验结果表明,提高引发剂浓度可提升聚合反应速率,转化率受影响并不明显,但分子量有所降低;而提高活化剂浓度,会导致聚合反应不完全;随着聚合温度的升高,反应速率明显加快,同时分子量增大,结晶度呈下降趋势。最终选取1.5 mol%的C10、1 mol%的C20,浸胶温度100℃、聚合温度180℃的工艺参数,利用自行研制的反应注射设备成功制备了单向碳纤维增强尼龙6 (CF/PA6)复合材料单向板,其沿纤维方向的拉伸强度可达974.2 MPa,弯曲强度达786.9 MPa。      

聚双环戊二烯阻燃研究进展

综述了可用于聚双环戊二烯的阻燃剂分类及其阻燃机理,简要介绍了现今国内外聚双环戊二烯的阻燃技术。     

注塑级聚烯烃塑木复合材料性能研究

制备了注塑级塑木复合材料,研究了木粉添加量对塑木注塑成型复合材料流变性能、弯曲性能和熔融结晶性能的影响。结果表明:随木粉添加量的增加,塑木注塑成型复合材料弯曲强度、弯曲模量和熔融峰温度均出现先增加再降低的现象,当木粉添加量在30份时,复合材料弯曲强度达到30.85MPa,弯曲模量达到3065.21MPa,熔融峰温度也达到最高。     

Fiber dispersion during compounding/injection molding of PP/kenaf composites: Flammability and mechanical properties

The primary aim of this paper is to analyze the fiber length retention capacity of extrusion and injection molding processes for short and long kenaf fiber reinforced polypropylene composites. The composites were manufactured by adding maleic anhydride grafted polypropylene (MAPP) and an antioxidant (Irganox) using twin-screw extrusion and injection molding processes. A higher level of fiber attrition rate was observed during the twin-screw compounding compared to that in the injection molding. During high-temperature shear mixing, both processes caused a reduction in fiber length below the calculated critical fiber length along with considerable fiber damage. The mechanical and thermal properties of the resultant composites were subsequently characterized. Cone calorimeter tests demonstrated that the peak heat release rate for the kenaf fiber composites (30 wt.%) was reduced by 37% compared to pure polypropylene (PP). In the UL-94V tests, the presence of lignin in kenaf reduced the dripping time considerably, which further led to the formation of char residue after burning. Although the fiber length obtained was below the critical fiber length under high shear processing (twin-screw compounding and injection molding), effective fiber dispersion, orientation and opening led to significantly improved mechanical performance of the PP/kenaf composites, irrespective of the initial fiber length.     

Microcellular polypropylene single-polymer composites prepared by insert-microcellular injection molding

An insert-microcellular injection molding process was performed on an injection molding machine equipped with a supercritical fluid system. The prepared microcellular polypropylene (PP) single-polymer composites (SPCs) combine the advantages of SPCs with benefits of microcellular plastics, they hold the promise for further reduced weight, improved fiber-matrix interface and enhanced recyclability. In comparison with the solid PP, the weight reductions of the tensile and impact microcellular PP SPCs (MPPSPCs) could be up to 12.9% and 3.3% respectively, the tensile and impact strengths of the MPPSPCs were improved by 59% and 1799% respectively. Based on the tensile properties, the injection temperature of 220 °C and injection speed of 70 mm/s were the optimum processing for the tensile MPPSPC samples. The typical morphology structure of the MPPSPC sample includes five different layers: sandwiched fabric layer, transition layer between fabric and core, center core layer, transition layer between skin and center core, skin layer.     

The mechanical properties of MWNT/PMMA nanocomposites fabricated by modified injection molding

This paper established the procedure to fabricate MWNT/PMMA nanocomposite by using both the injection molding and film casting processes. The combined fabrication process could remove demerits while maintaining the merits of each process. Tensile strength of the MWNT/PMMA nanocomposite increased more than 15% and tensile stiffness also increased about 17.5%, compared to the pure PMMA. It was confirmed that this combined fabrication process efficiently dispersed MWNTs in the PMMA matrix, and also maintained the well-dispersed state more effectively. SEM images of the fractural surface show that the degree of dispersion was improved. In addition, a surfactant was used to disperse MWNTs more efficiently, and its effect on mechanical properties was also investigated.     

注塑型烷基化氧化石墨烯/高密度聚乙烯复合膜性能研究

通过注塑成型制备了均匀分散的十二烷基胺功能化氧化石墨烯(DA-GO)/高密度聚乙烯(HDPE)纳米复合薄膜。X射线衍射(XRD)研究表明,室温条件下DA分子可与环氧基团发生亲核取代而接枝于GO表面。复合材料断口扫描显示,DA-GO以剥离的形式均匀分散于HDPE基体中。均匀分散的DA-GO片层能有效提高HDPE复合膜的气体阻隔性能,当DA-GO含量为0.5%(质量分数)时,复合薄膜的透氧系数从纯HDPE的4.555×10-14 cm3cm/(cm2·s·Pa)降低到1.830×10-14 cm3cm/(cm2·s·Pa),阻氧性能提高了60%。此外,DA-GO片层的加入使HDPE的热稳定性明显提高。     

聚苯并(口恶)嗪/凹凸棒土复合材料的制备与性能

以熔融法制备了聚苯并嚼嗪(BZ)/凹凸棒土(AT)复合材料.利用DSC考察了凹凸棒土的引入对苯并噁嗪单体开环温度的影响.通过透射电镜(TEM)观察了凹凸棒土在基体树脂中的分散情况,并对于复合材料的动态机械性能和耐热性进行了研究.     

尖晶石/玻璃复合材料的制备和性能研究

采用电子陶瓷工艺制备了一系列玻璃/尖晶石陶瓷复合材料,结果表明:复合材料的介电常数、热膨胀系数和显微硬度随着尖晶石含量的增加而增加,而且材料中硼酸铝的生成对复合材料的介电和热膨胀性能有一定影响。所制备的复合材料具有低的介电常数(5.5~6.5)、低的热膨胀系数(5.3×10-6~5.5×10-6℃-1)和低的烧结温度(≤1000℃),有望用于先进的微电子封装基板材料。