非晶硅薄膜晶体管室温红外探测器的优化设计

介绍了基于非晶硅薄膜晶体管的室温红外探测器的基本特征及性能指标,对晶体管宽长比对探测器性能的影响进行了理论分析,分析表明,提高晶体管的宽长比可以改善探测器的探测率.为了克服传统微桥结构室温红外探测器成品率低的不足,提出了一种新的热绝缘材料,并将该材料应用到了非制冷红外探测器中,实际制备了探测器单元,对该材料的热绝缘能力进行了验证.     

非晶硅薄膜晶体管室温红外探测器的优化设计

介绍了基于非晶硅薄膜晶体管的室温红外探测器的基本特征及性能指标，对晶体管宽长比对探测器性能的影响进行了理论分析，分析表明，提高晶体管的宽长比可以改善探测器的探测率。为了克服传统微桥结构室温红外探测器成品率低的不足，提出了一种新的热绝缘材料，并将该材料应用到了非制冷红外探测器中，实际制备了探测器单元，对该材料的热绝缘能力进行了验证。     

用于室温红外探测的新型非晶硅薄膜晶体管

研究了用于室温红外探测的非晶硅薄膜晶体管。分别从理论和实验角度对非晶硅薄膜晶体管的沟道电流随着宽长比的线性变化进行了分析验证。理论分析和实验结果表明,增大晶体管的宽长比不会影响沟道电流温度系数,但可以显著改善探测器的探测率,从而为a2SiTFT红外探测器的优化设计指明了方向。     

非晶YBCO薄膜热释电红外探测器

介绍了非晶YBCO薄膜用作非制冷热释电红外探测器材料。它在室温下显示出强的热释电行为,并且容易在室温下采用射频磁控溅射法沉积,制备工艺与CMOS工艺相兼容,是 一种很有潜力的热释电探测器材料。并介绍了非晶YBCO热释电薄膜的研究现状,阐述了该薄膜及其探测器的制备技术和研究动向。     

基于导电聚合物的非制冷辐射热探测技术研究

非制冷辐射热探测技术的发展使在室温下进行红外探测成为可能,目前的热探测一般采用无机材料.探讨了导电聚合物聚乙烯二氧噻吩:聚对苯乙烯磺酸(PEDOT:PSS)作为非制冷辐射热探测器敏感材料的可行性,研究了其热敏特性和红外吸收特性,制备了PEDOT:PSS自支撑悬空微桥单元,并进行了初步测试,在室温下,预计该热探测器响应时间约为12ms,探测度D*可达3×1010cm·Hz1/2·W-1,在响应时间与无机材料热探测器相当的情况下,探测度高一个量级以上.     

非制冷型热释电薄膜红外探测器的制备及应用

介绍了室温非制冷型热释电薄膜红外探测器的原理和优势。从热释电材料的选择及器件的结构设计等方面阐述了热释电薄膜红外探测器的制备技术和研究动向,并归纳了器件的主要应用领域。     

室温红外探测器研究与进展

简要概述了室温红外探测器技术的最新研究现状,首先根据工作机理的不同对红外探测器进行了分类,详细阐述了室温红外探测器的优点所在;接着在给出了室温红外探测器典型结构的基础上,对这些典型结构进行了比较和讨论;给出了最近出现的几种新型探测器,介绍了其工作原理、制作工艺和主要性能指标;最后对室温红外探测器的发展方向进行了预测。     

非致冷红外焦平面阵列研究进展

主要介绍了在室温下工作的红外焦平面的研究进展。非致冷红外焦平面阵列的研制主要分为两大类，即热释电焦平面阵列以及测辐射热红外焦平面阵列。文中较为详细地介绍这两种探测器的材料及结构，并给出国外对这两种探测器结构研究的最新发展趋势     

热释电探测器光谱响应的改善

热释电探测器是一种室温宽光谱响应的红外探测器。它在分析仪器中有广泛的应用。获得宽光谱响应的常规方法是在光敏面内涂敷金黑等吸收系数高的材料。由于金黑吸收系数与波长成反比,为了提高长波吸收率,金黑的厚度必须很厚,这无疑会大大减小响应率。本文从Siberg推导的金属—透明介质—金属夹层结构的吸收率公式求得使吸收率与波     

晶体HgCdTe

晶体HgCdTe材料主要应用于高速成像列阵和红外探测器。尤其受到红外探测器的欢迎,因为它具有宽可调直接禁带和出色的电学特性,以及高吸收效率和中等的热膨胀。     

Study on new structure uncooled a-Si microbolometer for infrared detection

A new structure uncooled amorphous silicon (a-Si) microbolometer for infrared (IR) detection has been fabricated and characterized. New type of thermal isolation and IR absorption structures based on polyimide (PI) and bottom metal reflective layer are presented. The fabrication process is described in this paper. The as-prepared microbolometer has the advantage of low cost, high yield and moderate performance. The dependence of resistance with different aspect ratio on operating temperature has been investigated and the temperature coefficient of resistance (TCR) is achieved. Based on the measured responsivity and noise characteristics, the influence of detectivity on chopping frequency is discussed. According to the measurements and calculations results, the maximal TCR is −2.8% and at a bias voltage of 5 V, the maximum detectivity of 1.7×10⁸ cm Hz^1/2 W⁻¹ is achieved at chopping frequency of 30 Hz.     

新型SiO2栅介质非晶硅薄膜晶体管室温红外探测器

对用作室温红外探测敏感单元的非晶硅薄膜晶体管进行了研究，提出了一种新型SiO2栅介质非晶硅薄膜晶体管室温红外探测器。该探测器的基本工作机理与传统的SiNx栅介质薄膜晶体管相类似，但在器件性能方面不仅具有较高的响应度，而且具有更好的温度稳定性；在制作工艺方面具有更高的工艺重复性和栅介质淀积的均匀性。     

新型SiO2栅介质非晶硅薄膜晶体管室温红外探测器

对用作室温红外探测敏感单元的非晶硅薄膜晶体管进行了研究,提出了一种新型SiO2栅介质非晶硅薄膜晶体管室温红外探测器。该探测器的基本工作机理与传统的SiN2栅介质薄膜晶体管相类似,但在器件性能方面不仅具有较高的响应度,而且具有更好的温度稳定性;在制作工艺方面具有更高的工艺重复性和栅介质淀积的均匀性。     

CMOS-SOI-MEMS Transistor for Uncooled IR Imaging

This paper reports the design, fabrication technology, post-CMOS micromachining and characterization of CMOS-silicon-on-insulator (SOI)-microelectromechanical system (MEMS) transistors. The thermally isolated micromachined CMOS-SOI-MEMS transistor reported here is designed for uncooled infrared (IR) sensing and is dubbed here as “TMOS.” The measured dc and noise electrical characteristics of the as-processed (virgin) transistor as well as those of the post-CMOS-MEMS-processed transistor (TMOS) are reported and compared. In particular, the threshold voltage temperature dependence and the temperature coefficient of current (TCC) at subthreshold are reported. The results indicate that the post-CMOS-MEMS processing does not degrade the performance of the transistors. The electrooptical performance of the TMOS is characterized and reported. With TCC on the order of 4%–10%, depending on the gate voltage, responsivity of 40 mA/W, noise equivalent power on the order of several tens of picowatts, and calculated noise equivalent temperature difference on the order of 64 mK, this uncooled IR sensor in standard CMOS-SOI technology may provide a high performance at a lower cost compared to state-of-the-art uncooled sensors based on bolometers implemented in non-CMOS materials like vanadium oxide or amorphous silicon.      

非制冷红外探测器多孔硅绝热层的研究

以多孔硅作为绝热层材料,采用超高真空对靶磁控溅射镀膜法,在多孔硅样品表面和硅基底表面沉积氧化钒薄膜。实验采用电化学腐蚀法制备多孔硅,利用场致发射扫描电子显微镜观测了孔隙率为50%,60%,70%三个多孔硅样品的微观形貌。利用显微喇曼光谱法测量其热导率,分别为8.16,7.28和0.624W/mK;利用纳米压入仪测量氧化钒薄膜的显微硬度和杨氏模量,测得沉积在孔隙率为50%,60%,70%的多孔硅基底上氧化钒薄膜的显微硬度分别为1.917,0.928和0.13GPa,杨氏模量分别为31.087,16.921和2.285GPa,而沉积在单晶硅基底的氧化钒薄膜的显微硬度和杨氏模量分别为10.919GPa和193.792GPa,并分析了微观结构差异对多孔硅绝热性能和机械性能的影响,为非制冷红外探测器的工艺制作过程提供一定的热学力学参数。     

Determination of Thermal Parameters of Vanadium Oxide Uncooled Microbolometer Infrared Detector

Vanadium oxide thin films are the potential candidates for uncooled microbolometers due to their high temperature coefficient of resistance (TCR) at room temperature. A 2D array of 10-element test microbolometer without air-gap thermal isolation structure was fabricated with pulsed laser deposited vanadium oxide as IR sensing layer for the first time. Infrared responsivity of the uncooled microbolometer was evaluated in the spectral region 8-15 μm. The device exhibits responsivity of about 12 V/W at 30 Hz chopper frequency for 20 μA bias current. Thermal time constant (τ), Thermal conductance (G) and thermal capacitance (C) are the thermal parameters characterize the performance of the uncooled microbolometer infrared detectors are determined as 15 ms, ～10^-3 W/K and ～3.5 × 10^-5 J/K respectively. The influence of the thermal parameters on the performance of the microbolometer is discussed.     

微辐射热计红外探测器的性能预测

叙述了用微细加工技术制作的非致冷单片式半导体薄膜电阻辐射热红外探测器的结构模型。基于模型所预测的性能与实验结果相符合。性能分析表明，高的热绝缘和低噪声是高性能微辐射热红外探测器的关键。     

New application of polyimide in uncooled a-Si TFT infrared sensors

New application of polyimide (PI) is introduced in this paper. PI film of 27 μm is achieved, and the excellent thermal-isolation performance of the film is simulated by ANSYS. The surface of film is flat, which is suitable for the fabrication of other materials such as aluminum and silicon nitride. The PI film is used as thermal-isolation layer of uncooled a-Si thin film transistor infrared sensors in this research, and the fabrication process is greatly simplified.     

Optimum emitter aspect ratio for bipolar fiber-optic preamplifiers

Many monolithic fiber-optic preamplifiers use a bipolar transistor as the front-end device due to process restraints, despite the relatively poor noise performance of the bipolar transistor. This paper shows that there is an optimum emitter aspect ratio in a bipolar transistor operated at the optimum collector current for noise performance. An expression for this optimum emitter aspect ratio is developed and shown to agree very well with simulation results.     

非制冷微测辐射热计热成像

文中在指出现代制冷型红外成像技术的不足,论述非制冷红外成像技术的优点之后,介绍了微测辐射热计阵列的非制冷热成像系统.首先与非制冷热电热像仪进行了比较,指出测辐射热计热成像的优势.然后描写了微测辐射热计阵列的设计,分析了桥式结构热绝缘对响应率提高所起的作用,并讨论了探测器噪声等效温差(NETD)的性能.最后概括地描述了微测辐射热计成像仪的设计.