Superior suppression of gate current leakage in Al<Subscript>2</Subscript>O<Subscript>3</Subscript>/Si<Subscript>3</Subscript>N<Subscript>4</Subscript> bilayer-based AlGaN/GaN insulated gate heterostructure field-effect transistors

AlGaN/GaN-based metal-insulator-semiconductor heterostructure field-effect transistors (MIS-HFETs) with Al₂O₃/Si₃N₄ bilayer as insulator have been investigated in detail, and compared with the conventional HFET and Si₃N₄-based MIS-HFET devices. Al₂O₃/Si₃N₄ bilayer-based MIS-HFETs exhibited much lower gate current leakage than conventional HFET and Si₃N₄-based MIS devices under reverse gate bias, and leakage as low as 1×10⁻¹¹ A/mm at −15 V has been achieved in Al₂O₃/Si₃N₄-based MIS devices. By using ultrathin Al₂O₃/Si₃N₄ bilayer, very high maximum transconductance of more than 180 mS/mm with ultra-low gate leakage has been obtained in the MIS-HFET device with gate length of 1.5 μm, a reduction less than 5% in maximum transconductance compared with the conventional HFET device. This value was much smaller than the more than 30% reduction in the Si₃N₄-based MIS device, due to the employment of ultra-thin bilayer with large dielectric constant and the large conduction band offset between Al₂O₃ and nitrides. This work demonstrates that Al₂O₃/Si₃N₄ bilayer insulator is a superior candidate for nitrides-based MIS-HFET devices.     

The electrical and physical analysis of Pt gate/Al<Subscript>2</Subscript>O<Subscript>3</Subscript>/p-Si (100) with dual high-k gate oxide thickness for deep submicron complementary metal-oxide-semiconductor device with low power and high reliability

In order to examine the electrical and physical properties of Al₂O₃ layers with dual thickness on a chip, Pt gate/Al₂O₃ with dual thickness/p-type Si (100) samples were fabricated using atomic-layer deposition, separation photolithography, and 100:1 HF wet etching to remove the first Al₂O₃ layer. Dual metal-oxide-semiconductor (MOS) capacitors with thin (physical thickness, ∼4.5 nm, equivalent oxide thicknesses (EOT): 2.8 nm) and thick (physical thickness, ∼8.2 nm, EOT: 4.3 nm) Al₂O₃ layers showed a good leakage current density of −5.4×10⁻⁶ A/cm² and −2.5×10⁻⁹ A/cm² at −1 V, respectively; good reliability characteristics as a result of the good surface roughness; low capacitance versus voltage measurements (C-V) hysteresis; and a good interface state density (∼7×10¹⁰ cm⁻²eV⁻¹ near the midgap) as a result of pre-rapid thermal annealing (pre-RTA) after depositing the Al₂O₃ layer compared with the single MOS capacitors without the pre-RTA. These results suggest that dual Al₂O₃ layers using the dual gate oxide (DGOX) process can be used for the simultaneous integration of the low power transistors with a thin Al₂O₃ layer and high reliability regions with a thick Al₂O₃ layer.     

Solid-State Reaction Mechanism and Deliquescence Phenomenon of K<Subscript>0.5</Subscript>Na<Subscript>0.5</Subscript>Nb<Subscript>0.7</Subscript>Al<Subscript>0.3</Subscript>O<Subscript>3</Subscript> Ceramic

Development of (K,Na)NbO₃-based ceramics has attracted much attention in recent decades. In this work, K_0.5Na_0.5Nb_0.7Al_0.3O₃ ceramic was prepared using conventional solid-state processing. A deliquescence phenomenon was observed when the specimen was exposed to moist atmosphere. The reaction mechanism and cause of deliquescence were investigated using x-ray diffraction analysis, scanning electron microscopy, energy-dispersive spectrometry, electron microprobe analysis, inductively coupled plasma mass spectrometry, and thermogravimetric/differential scanning calorimetric analysis. The results revealed interactions mainly amongst the raw materials K₂CO₃, Na₂CO₃, and Nb₂O₅ as well as K₂CO₃, Na₂CO₃, and Al₂O₃, which can influence the sintering behavior of the mixture. (K,Na)NbO₃ and (K,Na)AlO₂ were present in the sintered K_0.5Na_0.5Nb_0.7Al_0.3O₃ ceramic, with the latter leading to deliquescence. During the sintering process, Al₂O₃ reacts with alkali oxides (Na₂O and K₂O), which are the decomposition products of carbonates, to form (K,Na)AlO₂. In addition, Al₂O₃ is more likely to react with K₂O compared with Na₂O.     

Conduction Mechanisms in Multiferroic Multilayer BaTiO<Subscript>3</Subscript>/NiFe<Subscript>2</Subscript>O<Subscript>4</Subscript>/BaTiO<Subscript>3</Subscript> Memristors

Memristive devices and materials are extensively studied as they offer diverse properties and applications in digital, analog and bio-inspired circuits. In this paper, we present an important class of memristors, multiferroic memristors, which are composed of multiferroic multilayer BaTiO₃/NiFe₂O₄/BaTiO₃ thin films, fabricated by a spin-coating deposition technique on platinized Si wafers. This cost-effective device shows symmetric and reproducible current–voltage characteristics for the actuating voltage amplitude of ±10 V. The origin of the conduction mechanism was investigated by measuring the electrical response in different voltage and temperature conditions. The results indicate the existence of two mechanisms: thermionic emission and Fowler–Nordheim tunnelling, which alternate with actuating voltage amplitude and operating temperature.     

Absorption Properties of Hybrid SnO<Subscript>2</Subscript> Nanocrystal-Carbon Nanotube Structures

Tin oxide (SnO₂) nanocrystals of a few nanometers are of great interest for electronic applications. Here we present a mini-arc plasma method to produce aerosol tin oxide nanocrystals at atmospheric pressure. The product SnO₂ nanocrystals are then assembled onto the external surface of carbon nanotubes (CNTs) to form hybrid SnO₂–CNT structures. The absorption properties of both the SnO₂ nanocrystals and the SnO₂–CNT hybrid structures have been characterized. Quantum size effects have been observed for as-produced SnO₂ nanocrystals. The intrinsic nanoparticle size selection during the assembly process results in a blue shift of the absorption spectrum for hybrid nanostructures.     

Biosensor properties of SOI nanowire transistors with a PEALD Al<Subscript>2</Subscript>O<Subscript>3</Subscript> dielectric protective layer

The properties of protective dielectric layers of aluminum oxide Al₂O₃ applied to prefabricated silicon-nanowire transistor biochips by the plasma enhanced atomic layer deposition (PEALD) method before being housed are studied depending on the deposition and annealing modes. Coating the natural silicon oxide with a nanometer Al₂O₃ layer insignificantly decreases the femtomole sensitivity of biosensors, but provides their stability in bioliquids. In deionized water, transistors with annealed aluminum oxide are closed due to the trapping of negative charges of <(1–10) × 10¹¹ cm^?2 at surface states. The application of a positive potential to the substrate (V_sub > 25 V) makes it possible to eliminate the negative charge and to perform multiple measurements in liquid at least for half a year.     

Memory Effect of Metal-Insulator-Silicon Capacitor with HfO<Subscript>2</Subscript>-Al<Subscript>2</Subscript>O<Subscript>3</Subscript> Multilayer and Hafnium Nitride Gate

Metal-insulator-silicon capacitors have been fabricated using novel insulators of SiO₂/HfO₂-Al₂O₃-HfO₂ (HAH)/Al₂O₃ and metallic HfN gate, exhibiting a program-erasable characteristic. The memory capacitor presents a large memory window of 2.4 V under +12 V program/–14 V erase for 10 ms, no erase saturation, and sufficient electron- and hole-trapping efficiencies such as an electron density of ∼7 × 10¹² cm^–2 under 13 V program for 0.5 ms and a hole density of ∼4 × 10¹² cm^–2 under –12 V erase for 0.5 ms. The observed properties are attributed to the introduction of high permittivity atomic-layer-deposited HAH/Al₂O₃ as well as high work function HfN gate. The related mechanism is addressed accordingly.     

Ultra-Thin Si<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>Ge<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript> Dislocation Blocking Layers for Ge/Strained Si CMOS Devices

We demonstrate ultra-thin (<150 nm) Si_1−x Ge _x dislocation blocking layers on Si substrates used for the fabrication of tensile-strained Si N channel metal oxide semiconductor (NMOS) and Ge P channel metal oxide semiconductor (PMOS) devices. These layers were grown using ultra high vacuum chemical vapor deposition (UHVCVD). The Ge mole fraction was varied in rapid, but distinct steps during the epitaxial layer growth. This results in several Si_1−x Ge _x interfaces in the epitaxially grown material with significant strain fields at these interfaces. The strain fields enable a dislocation blocking mechanism at the Si_1−x Ge _x interfaces on which we were able to deposit very smooth, atomically flat, tensile-strained Si and relaxed Ge layers for the fabrication of high mobility N and P channel metal oxide semiconductor (MOS) devices, respectively. Both N and P channel metal oxide semiconductor field effect transister (MOSFETs) were successfully fabricated using high-k dielectric and metal gates on these layers, demonstrating that this technique of using ultra-thin dislocation blocking layers might be ideal for incorporating high mobility channel materials in a conventional CMOS process.     

Effect of Proton Irradiation on Interface State Density in Sc<Subscript>2</Subscript>O<Subscript>3</Subscript>/GaN and Sc<Subscript>2</Subscript>O<Subscript>3</Subscript>/MgO/GaN Diodes

Proton irradiation of Sc₂O₃/GaN and Sc₂O₃/MgO/GaN metal-oxide semiconductor diodes was performed at two energies, 10 MeV and 40 MeV, and total fluences of 5 × 10⁹ cm⁻², corresponding to 10 years in low-earth orbit. The proton damage causes a decrease in forward breakdown voltage and a flat-band voltage shift in the capacitance-voltage characteristics, indicating a change in fixed oxide charge and damage to the dielectric. The interface state densities after irradiation increased from 5.9 × 10¹¹ cm⁻² to 1.03 × 10¹² cm⁻² in Sc₂O₃/GaN diodes and from 2.33 × 10¹¹ to 5.3 × 10¹¹ cm⁻² in Sc₂O₃/MgO/GaN diodes. Postannealing at 400°C in forming gas recovered most of the original characteristics but did increase the interfacial roughness.     

Analog/RF Study of Self-aligned In<Subscript>0.53</Subscript>Ga<Subscript>0.47</Subscript>As MOSFET with Scaled Gate Length

This study presents the impact of gate length scaling on analog and radio frequency (RF) performance of a self- aligned multi-gate n-type In_0.53Ga_0.47As metal oxide semiconductor field effect transistor. The device is fabricated using a self-aligned method, air-bridge technology, and 8 nm thickness of the Al₂O₃ oxide layer with different gate lengths. The transconductance-to-normalized drain current ratio (g _m/I _D) method is implemented to investigate analog parameters. Moreover, g _m and drain conductance (g _D) as key parameters in analog performance of the device are evaluated with g _m/I _D and gate length variation, where g _m and g _D are both showing enhancement due to scaling of the gate length. Early voltage (V _EA) and intrinsic voltage gain (A _V) value presents a decreasing trend by shrinking the gate length. In addition, the results of RF measurement for cut-off and maximum oscillation frequency for devices with different gate lengths are compared.     

Thermoelectric Properties of Mn-Doped Ca<Subscript>5</Subscript>Al<Subscript>2</Subscript>Sb<Subscript>6</Subscript>

Ca₅Al₂Sb₆ is a relatively inexpensive Zintl compound exhibiting promising thermoelectric efficiency at temperatures suitable for waste heat recovery. Motivated by our previous studies of Ca₅Al₂Sb₆ doped with Na and Zn, this study focuses on doping with Mn²⁺ at the Al³⁺ site. While Mn is a successful p-type dopant in Ca₅Al₂Sb₆, we find that incomplete dopant activation yields lower hole concentrations than obtained with either previously investigated dopant. High-temperature Hall effect and Seebeck coefficient measurements show a transition from nondegenerate to degenerate semiconducting behavior in Ca₅Al_2−x Mn _x Sb₆ samples (x = 0.05, 0.1, 0.2, 0.3, 0.4) with increasing Mn content. Ultimately, no improvement in zT is achieved via Mn doping, due in part to the limited carrier concentration range achieved.     

A Composite Formation Route to Well‐Crystalline Manganese Oxide Nanocrystals: High Catalytic Activity of Manganate–Alumina Nanocomposites

Manganese oxide nanocrystals are combined with aluminum oxide nanocrystals to improve their crystallinity via calcination without a significant increase of crystal size. A nanocomposite, consisting of two metal oxides, can be synthesized by the reaction between permanganate anions and aluminum oxyhydroxide keggin cations. The as‐prepared manganese oxide–aluminum oxide nanocomposite is X‐ray amorphous whereas heat‐treatment gives rise to the crystallization of an α‐MnO₂ phase at 600 °C and Mn₃O₄/Mn₂O₃ and γ‐Al₂O₃ phases at 800 °C. Electron microscopy and N₂ adsorption‐desorption‐isotherm analysis clearly demonstrate that the as‐prepared nanocomposite is composed of a porous assembly of monodisperse primary particles with a size of ～20 nm and a surface area of >410 m² g^?1. Of particular interest is that the small particle size of the as‐prepared nanocomposite is well‐maintained up to 600 °C, a result of the prevention of the growth of manganate grains through nanoscale mixing with alumina grains. The calcined nanocomposite shows very‐high catalytic activity for the oxidation of cyclohexene with an extremely high conversion efficiency of >95% within 15 min. The present results show that the improvement of the crystallinity without significant crystal growth is very crucial for optimizing the catalytic activity of manganese oxide nanocrystals.     

Effect of Rapid Thermal Annealing on Sputtered CaCu<Subscript>3</Subscript>Ti<Subscript>4</Subscript>O<Subscript>12</Subscript> Thin Films

Calcium copper titanium oxide (CaCu₃Ti₄O₁₂, abbreviated to CCTO) films were deposited on Pt/Ti/SiO₂/Si substrates at room temperature (RT) by radiofrequency magnetron sputtering. As-deposited CCTO films were treated by rapid thermal annealing (RTA) at various temperatures and in various atmospheres. X-ray diffraction patterns and scanning electron microscope (SEM) images demonstrated that the crystalline structures and surface morphologies of CCTO thin films were sensitive to the annealing temperature and ambient atmosphere. Polycrystalline CCTO films could be obtained when the annealing temperature was 700°C in air, and the grain size increased signifi- cantly with annealing in O₂. The 0.8-μm CCTO thin film that was deposited at RT for 2 h and then annealed at 700°C in O₂ exhibited a high dielectric constant (ε′) of 410, a dielectric loss (tan δ) of 0.17 (at 10 kHz), and a leakage current density (J) of 1.28 × 10⁻⁵ A/cm² (at 25 kV/cm).     

Thermoelectric Properties of the One-Dimensional Cobalt Oxide CaCo<Subscript>2</Subscript>O<Subscript>4</Subscript>

In this work we studied the crystal structure and physical properties of the new one-dimensional cobalt oxide CaCo₂O_4+δ . The CaCo₂O_4+δ phase crystallizes as a calcium-ferrite-type structure, which consists of a corner- and edge-shared CoO₆ octahedron network including one-dimensional double chains. The specific-heat Sommerfeld constant γ was found to be 4.48(7) mJ/mol K². This result suggests that the CaCo₂O_4+δ phase has a finite density of states at the Fermi level. Metallic temperature dependence of the Seebeck coefficient S with a large thermoelectric power (S = 151 μV/K at 387 K) was observed. The origin of the large thermoelectric power may be attributed to the quasi one-dimensional character of the energy band near the valence band maximum in CaCo₂O_4+δ .     

Atomic-force-microscopy visualization of Si nanocrystals in SiO<Subscript>2</Subscript> thermal oxide using selective etching

The topography and local hardness of the etched surfaces of layers of SiO₂ thermal oxide that contained Si nanocrystals in its bulk were studied using atomic-force microscopy. The Si nanocrystals were obtained by implanting Si⁺ ions into the oxide with subsequent high-temperature annealing. It is shown that the use of selective etching that removes the oxide material makes it possible to reveal Si nanocrystals that appear in the profile of etched surfaces in the form of nanohillocks with a height of up to 2–3 nm. These values are in satisfactory agreement with the average radius of Si nanocrystals in the SiO₂ oxide layer. Independent confirmation of the Si-nanocrystal observation was obtained by comparing the topography of etched surfaces with the local-hardness maps obtained for the same surfaces; in these maps, the hillocks appear as sites at the surface with a reduced hardness. The phase precipitation of implanted Si is also observed in the form of extended flat clusters oriented in the oxide bulk parallel to the oxide surface. The suggested method for revealing the Si nanocrystals and clusters incorporated into the oxide provides a convenient way to study the specific features of nucleation growth and spinodal decomposition in the Si solid solution in the SiO₂ oxide.     

Microwave Dielectric Properties of ZnO-2TiO<Subscript>2</Subscript>-Nb<Subscript>2</Subscript>O<Subscript>5</Subscript> Ceramics with BaCu (B<Subscript>2</Subscript>O<Subscript>5</Subscript>) Addition

The influence of BaCu(B₂O₅) (BCB) addition on the sintering temperature and microwave dielectric properties of ZnO-2TiO₂-Nb₂O₅ (ZTN) ceramic has been investigated using dilatometry, x-ray diffraction, scanning electron microscopy, and microwave dielectric measurements. A small amount of BCB addition to ZTN can lower the sintering temperature from 1100°C to 900°C. The reduced sintering temperature was attributed to the formation of the BCB liquid phase. The ZTN ceramics containing 3.0 wt.% BCB sintered at 900°C for 2 h have good microwave dielectric properties of Q × f = 19,002 GHz (at 6.48 GHz), ε _r = 45.8 and τ _f  = 23.2 ppm/°C, which suggests that the ceramics can be applied in multilayer microwave devices, provided that Ag compatibility exists.     

Modified submicron luminescent materials based on the Y<Subscript>2</Subscript>O<Subscript>3</Subscript>:Eu and Y<Subscript>2</Subscript>O<Subscript>2</Subscript>S:Eu polycrystals for full-color video-imaging devices and light sources

Modifying the polycrystalline phosphors Y₂O₃:Eu and Y₂O₂S:Eu in order to allow their application as submicron composite materials for electrovacuum luminescent video-imaging devices and light sources is considered. The effect of synthesizing such materials through the use of H₃BO₃ on their crystal structure, spectral characteristics, and photo- and cathodoluminescence intensities is investigated.     

Conductivity of Hg<Subscript>3</Subscript>In<Subscript>2</Subscript>Te<Subscript>6</Subscript> crystals in high electric fields

The effect of electric field and temperature on the conductivity of bulk Hg₃In₂Te₆ crystals is investigated. It is shown that the I–V characteristics in high electric fields are of the S type with the effect of switching into a low-resistance state. The critical voltage of transition from the Ohm law to the exponential dependence of the current (I) on the voltage (U) and the threshold voltage of transition into the region of negative differential resistance dU/dI = s< 0 linearly depend on the sample thickness. The activation energies of conductivity in low and high electric fields are determined. It is established that the superlinear portion of the I–V characteristic with dU/dI > 0 is described by the dependence of the type I = I ₀ exp(U/U ₀) and caused by the electron transitions from the local centers with the energy level E _t = 0.19 eV.     

Growth of Polarity-Controlled ZnO Films on (0001) Al<Subscript>2</Subscript>O<Subscript>3</Subscript>

The polarity control of ZnO films grown on (0001) Al₂O₃ substrates by plasma-assisted molecular-beam epitaxy (P-MBE) was achieved by using a novel CrN buffer layer. Zn-polar ZnO films were obtained by using a Zn-terminated CrN buffer layer, while O-polar ZnO films were achieved by using a Cr₂O₃ layer formed by O-plasma exposure of a CrN layer. The mechanism of polarity control was proposed. Optical and structural quality of ZnO films was characterized by high-resolution X-ray diffraction and photoluminescence (PL) spectroscopy. Low-temperature PL spectra of Zn-polar and O-polar samples show dominant bound exciton (I₈) and strong free exciton emissions. Finally, one-dimensional periodic structures consisting of Zn-polar and O-polar ZnO films were simultaneously grown on the same substrate. The periodic inversion of polarity was confirmed in terms of growth rate, surface morphology, and piezo response microscopy (PRM) measurement.     

Thermoelectric Properties of NaCo<Subscript>2–<Emphasis Type="Italic">x</Emphasis></Subscript>Fe<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>O<Subscript><Emphasis Type="Italic">y</Emphasis></Subscript>

NaCo₂O₄ has one of the highest figures of merit among all ceramic thermoelectric materials. Because of its large thermopower and low resistivity, the ceramic oxide NaCo₂O₄ is a promising candidate for potential thermoelectric applications. NaCo₂O₄ is, moreover, a ceramic compound with high decomposition temperature and chemical stability in air and it does not contain any toxic elements. Like all 3-d transition ions, Co ions have multiple spin and oxidation states. In this investigation, thermopower and electrical conductivity of NaCo₂O₄ as a function of substitution of Co by Fe ions were measured. Fe substitution for Co causes resistivity to increase, whereas the Seebeck coefficient remained nearly invariant, especially above 330 K. An erratum to this article can be found at