Multilayer AlN/AlGaN/GaN/AlGaN heterostructures for high-power field-effect transistors grown by ammonia MBE on silicon substrates

We report preliminary results on the transfer of the ammonia MBE technology of AlN/AlGaN/GaN/AlGaN heterostructures to silicon substrates. Optimization of the growth conditions allowed the number of macroscopic cracks in the epilayers to be reduced and ensured the growth of heterostructures with two-dimensional electron gas, which are suitable for the creation of field-effect transistors. The saturation current of prototype devices based on the heterostructures grown on silicon substrates are comparable with the analogous parameter of devices grown on sapphire and exhibits no decrease related to thermal scattering at high bias voltages.     

Determination of two-dimensional electron and hole gas carriers in AlGaN/GaN/AlN heterostructures grown by Metal Organic Chemical Vapor Deposition

Resistivity and Hall effect measurements on nominally undoped Al_0.25Ga_0.75N/GaN/AlN heterostructures grown on sapphire substrates prepared by metal organic chemical vapor deposition have been carried out as a function of temperature (20-300 K) and magnetic field (0-1.4 T). Variable magnetic field Hall data have been analyzed using the improved quantitative mobility spectrum analysis technique. The mobility and density of the two-dimensional electron gas at the AlGaN/GaN interface and the two-dimensional hole gas at the GaN/AlN interface are separated by quantitative mobility spectrum analysis. The analysis shows that two-channel conduction is present in nominally undoped Al_0.25Ga_0.75N/GaN/AlN heterostructures grown on sapphire substrate.     

Dopant-free GaN/AlN/AlGaN radial nanowire heterostructures as high electron mobility transistors

We report the rational synthesis of dopant-free GaN/AlN/AlGaN radial nanowire heterostructures and their implementation as high electron mobility transistors (HEMTs). The radial nanowire heterostructures were prepared by sequential shell growth immediately following nanowire elongation using metal-organic chemical vapor deposition (MOCVD). Transmission electron microscopy (TEM) studies reveal that the GaN/AlN/AlGaN radial nanowire heterostructures are dislocation-free single crystals. In addition, the thicknesses and compositions of the individual AlN and AlGaN shells were unambiguously identified using cross-sectional high-angle annular darkfield scanning transmission electron microscopy (HAADF-STEM). Transport measurements carried out on GaN/AlN/AlGaN and GaN nanowires prepared using similar conditions demonstrate the existence of electron gas in the undoped GaN/AlN/AlGaN nanowire heterostructures and also yield an intrinsic electron mobility of 3100 cm(2)/Vs and 21,000 cm(2)/Vs at room temperature and 5 K, respectively, for the heterostructure. Field-effect transistors fabricated with ZrO(2) dielectrics and metal top gates showed excellent gate coupling with near ideal subthreshold slopes of 68 mV/dec, an on/off current ratio of 10(7), and scaled on-current and transconductance values of 500 mA/mm and 420 mS/mm. The ability to control synthetically the electronic properties of nanowires using band structure design in III-nitride radial nanowire heterostructures opens up new opportunities for nanoelectronics and provides a new platform to study the physics of low-dimensional electron gases.     

Multilayer AlN/AlGaN/GaN/AlGaN heterostructures for high-power field-effect transistors grown by ammonia MBE

The results of the optimization of the ammonia MBE technology of AlN/AlGaN/GaN/AlGaN heterostructures for high-power microwave field-effect transistors (FETs) are presented. The creation of technological systems of the EPN type for the deposition of group III nitrides by ammonia MBE, in combination with the development of optimum growth and postgrowth processes, make it possible to obtain AlN/AlGaN/GaN/AlGaN based heterostructures for high-power microwave FETs with the output static characteristics on the world best level. One of the main fields of application of the semiconductor heterostructures based on group III nitrides is the technology of high electron mobility transistors (HEMTs). Most investigations in this field have been devoted to the classical GaN/AlGaN structures with a single heterojunction. An alternative approach based on the use of double heterostructures with improved two-dimensional electron gas (2DEG) confinement offers a number of advantages, but such structures are usually characterized by a lower carrier mobility as compared to that in the single-junction structures. We succeeded in optimizing the double heterostructure parameters and growth conditions so as to obtain conducting channels with a 2DEG carrier mobility of 1450, 1350, and 1000 cm²/(V s) and a sheet electron density of 1.3 × 10¹³, 1.6 × 10¹³, and 2.0 × 10¹³ cm^?2, respectively. Experimental HEMTs with 1-μm-long gates based on the obtained multilayer heterostructure with a doped upper barrier layer exhibit stable current-voltage characteristics with maximum saturation current densities of about 1 A/mm and a transconductance of up to 180 mS/mm.     

Strain–Stress Analysis of AlGaN/GaN Heterostructures With and Without an AlN Buffer and Interlayer

Abstract: The strain–stress analysis of Al_xGa_1?xN/GaN (x = 0.3) heterostructures with and without a high‐temperature HT‐AlN interlayer (IL) grown on sapphire (Al₂O₃) substrates and AlN buffer/Al₂O₃ templates via metal organic chemical vapour deposition (MOCVD) was carried out based on the precise measurement of the lattice parameters by using high‐resolution X‐ray diffraction (HRXRD). The a‐ and c‐lattice parameters were measured from the peak positions that were obtained by rocking the theta axis at the vicinity of the symmetric and asymmetric plane reflection angles, followed by the in‐plane and out‐of‐plane strains. Then, the biaxial and hydrostatic components were extracted from the total strain values that were obtained and were then discussed in the present study as the effect of the HT‐AlN buffer and IL. The AlN buffer layer (BL) affects the strain values of the AlGaN ternary layer (TL). A further effect was realized by inserting an AlN IL between GaN BL and AlGaN TL. However, the experimental results also show that an AlN IL changes the strain behaviour in the a‐ and c‐directions of the AlGaN TL from the tensile to compressive and the compressive to tensile type, respectively. These similar behaviours were observed in hydrostatic strain, biaxial strain and stress. Their reasons are explained with an effective a‐lattice parameter, post‐growth cooling and lattice and thermal mismatches.     

Luminescent properties of GaN-based epitaxial layers and heterostructures grown on porous SiC substrates

The photoluminescence of single epitaxial GaN layers and electroluminescence of double GaN/AlGaN heterostructures grown on porous silicon carbide (PSC) substrates was studied in comparison to the properties of analogous layers and structures grown on nonporous SiC substrates. The epilayers grown on PSC substrates are characterized by a lower concentration of dislocation-related nonradiative recombination centers. It is suggested that this factor favorably influences the radiative recombination processes in device structures based on group III nitride epilayers grown on PSC substrates.     

The Effect of the Method by Which a High-Resistivity GaN Buffer Layer Is Formed on Properties of InAlN/GaN and AlGaN/GaN Heterostructures with 2D Electron Gas

AlGaN/AlN/GaN and InAlN/AlN/GaN structures with 2D electron gas have been grown on sapphire substrates by metal-organic vapor-phase epitaxy. The suppression of the parasitic conductivity of buffer GaN layers was provided either by intentionally raising the density of edge dislocations or by doping with iron (GaN:Fe). It was shown that using GaN buffer layers with a better crystal perfection and more planar surface results in the electron mobility in the 2D channel for carriers becoming 1.2–1.5 times higher.     

Calculation of residual thermal stress in GaN epitaxial layers grown on technologically important substrates

A detailed investigation of residual thermal stress and misfit strain in GaN epitaxial layers grown on technologically important substrates is performed. The thermal stress is low when GaN is grown on AlN, SiC and Si, and relatively higher when Al₂O₃ substrate is used. The stress is compressive for AlN and Al₂O₃ and tensile for Si and SiC substrates. Residual thermal stress analysis was also performed for three layer heterostructures of GaN/AlN/6H-SiC and GaN/AlN/Al₂O₃. The stress remains the same when a sapphire substrate is used with or without an AlN buffer layer but reduces by an order of magnitude when a 6H-SiC substrate is used with an AlN buffer layer.     

基于AlN基板的不同Al组分的AlGaN材料生长

采用脉冲法生长了200nm厚的AlN薄膜,其XRD摇摆曲线的半高宽为130aresec,表面粗糙度为2.021nm.以此AIN层为基板生长了不同Al组分的AlGaN薄膜,高分辨率XRD测试发现,随Al组分的增加,AlN基板层对AlGaN薄膜施加的压应力增大,同时,AlGaN薄膜在生长合并过程中产生的张应力也增大.在Al组分为0.67时,发现这两种应力处于一种平衡的状态,此时的AlGaN薄膜有最优的结晶质量.     

Study on structure of AlGaN on AlN interlayer by synchrotron radiation XRD and RBS

The AlGaN samples have been grown on AlN interlayer (IL) by metalorganic vapor phase epitaxy (MOVPE). The effects of AlN interlayer (IL) on improvement of crystalline quality of AlGaN and Al incorporation efficiency were investigated. The samples were characterized by synchrotron radiation X-ray diffraction (XRD) and MeV He ion Rutherford backscattering spectrometry (RBS). The AlN IL played a role in suppressing edge threading dislocations (TDs) and enhancing the screw ones. It also changed the state of stress in AlGaN from tension to compression. Crack-free AlGaN films were grown successfully by inserting AlN IL.     

Structural properties of GaN grown on AlGaN/AlN stress mitigating layers on 100-mm Si (111) by ammonia molecular beam epitaxy

The structural properties of GaN grown on AlGaN/AlN stress mitigating layers on 100-mm diameter Si (111) substrate by ammonia molecular beam epitaxy have been reported. High resolution X-ray diffraction, micro-Raman spectroscopy, transmission electron microscopy and secondary ion mass spectroscopy have been used to study the influence of AlN thickness and AlGaN growth temperature on the quality of GaN. GaN grown on thicker AlN showed reduced dislocation density and lesser tensile strain. Three-dimensional growth regime was observed for GaN grown at lower AlGaN growth temperature while higher AlGaN growth temperature resulted in two-dimensional growth mode. The dislocation bending and looping at the AlGaN/AlN interface was found to have significant influence on the dislocation density and strain in the GaN layer. The evolution and interaction of threading dislocations play a major role in determining the quality and the strain states of GaN.     

Ion-Beam Deposition of Thin AlN Films on Al2O3 Substrate

Technical Physics Letters - Thin aluminum nitride (AlN) films on sapphire (Al2O3) substrates were grown by means of ion-beam deposition (IBD) and studied by methods of scanning electron microscopy,...     

Growth of GaN and AlN thin films by laser induced molecular beam epitaxy

Hexagonal GaN and AlN thin films were grown by laser induced molecular beam epitaxy using Al or Ga metal as target material and N₂as nitrogen source. The films were deposited on sapphire (0001) and SiC (0001) substrates. Epitaxial growth of GaN has been achieved at 730°C and 10⁻³ mbar N₂ pressure. The AlN films were polycrystalline with predominant (0001) orientation.     

AlGaN/GaN-heterostructures on (111) 3C-SiC/Si pseudo substrates for high frequency applications

We present the realization of high electron mobility transistors (HEMTs) based on AlGaN/GaN heterostructures, which were grown on silicon substrates using an ultrathin SiC transition layer. The growth of AlGaN/GaN heterostructures on 3C-SiC(111)/Si(111) was performed using metalorganic chemical vapour deposition (MOCVD). The 3C-SiC(111) transition layer was realized by low pressure CVD and prevented Ga-induced meltback etching and Si-outdiffusion in the subsequent MOCVD growth. The two-dimensional electron gas (2DEG) formed at the AlGaN/GaN interface showed an electron sheet density of 1.5 × 10¹³ cm^− 3 and a mobility of 870 cm²/Vs. The HEMTs DC and RF characteristics were analysed and showed a peak cut-off frequency as high as 29 GHz for a 250 nm gate length.     

Room-temperature growth of AlN/TiN epitaxial multi-layer by laser molecular beam epitaxy

We have fabricated epitaxial AlN thin films at room temperature on sapphire (0001) substrates with a TiN (111) epitaxial buffer layer by pulsed laser deposition in ultra-high vacuum (laser molecular beam epitaxy method). The TiN buffer layers were also fabricated at room temperature. Four-circle X-ray diffraction analysis and reflection high-energy electron diffraction results indicate the heteroepitaxial structure of AlN (0001)/TiN (111)/sapphire (0001) with the epitaxial relationship of AlN [10-10]||TiN [11-2]||sapphire [11-20]. The surface of the room-temperature grown AlN film was found to be atomically flat, reflecting the nano-stepped surface of ultrasmooth sapphire substrates. Then, we could achieve the room-temperature epitaxial growth of [AlN/TiN] multi-layer. The temperature dependence of resistivity of the AlN/TiN multi-layer film was also measured.     

Multilayer AIN/AlGaN/GaN/AlGaN heterostructures with quantum wells for high-power field-effect transistors grown by ammonia MBE

High-power field-effect transistors (FETs) are among the main applications of heterostructures based on group III metal nitrides, which in most cases implement the classical GaN/AlGaN structure with a single junction. An alternative approach based on the use of double heterostructures with imporved two-dimensional electron gas (2DEG) confinement offers a number of advantages, but such structures are usually characterized by a lower carrier mobility and density (in GaN layers of reduced thickness) as compared to the values in the single-junction structures. Optimization of the heterostructure design and ammonia MBE growth conditions allowed us to obtain multilayer AlN/AlGaN/GaN/AlGaN heterostructures with quantum wells, which are characterized by a 2DEG carrier mobility of 1100–1300 cm²/(V s) and a sheet electron density of (1.1–1.3) × 10¹³ cm^-2. Experimental FETs based on the obtained multilayer heterostructures in a static regime exhibit working current densities up to 0.6 A/mm at a transconductance of up to 150 mS/mm and a breakdown voltage above 100 V.     

AlN钝化层对AlGaN/GaN异质结及其高温特性的影响

主要研究了A1N钝化介质层对AlGaN/GaN异质结势垒层应力的修改以及应力的变化对二维电子气高温输运性质的影响.研究结果表明:AlN介质层会对AlGaN势垒层产生附加的平面压应变;AlN和传统的si3N4钝化介质都能减轻AlGaN势垒层在高温下的应变弛豫,但AlN介质层效果更明显.和传统的Si,N4钝化介质相比较,AlN钝化层不仅会显著增加AlGaN/GaN异质结二维电子气密度度,还会明显提高二维电子气迁移率,同时,AlN钝化后二维电子气密度的温度稳定性也更好.因此,对AlGaN/GaN异质结器件来说,AIN是一种有潜力的钝化介质.     

The effects of LT AlN buffer thickness on the properties of high Al composition AlGaN epilayers

To fabricate nitride-based ultraviolet optoelectronic devices, a deposition process for high-Al-composition AlGaN (Al content > 50%) films with reduced dislocation densities must be developed. This paper describes the growth of high-Al-composition AlGaN film on (0001) sapphire via a LT AlN nucleation layer by low pressure metalorganic chemical vapor deposition (LPMOCVD). The influence of the low temperature AlN buffer layer thickness on the high-Al-content AlGaN epilayer is investigated by triple-axis X-ray diffraction (TAXRD), scanning electron microscopy (SEM), and optical transmittance. The results show that the buffer thickness is a key parameter that affects the quality of the AlGaN epilayer. An appropriate thickness results in the best structural properties and surface morphology.     

Growth properties of AlN films on sapphire substrates by reactive sputtering

Aluminum nitride (AlN) films were grown on sapphire substrates by radio frequency (RF) magnetron sputtering in plasma containing a mixture of argon and nitrogen, using a pure aluminum target. The effect of RF power was investigated with respect to growth rate, surface roughness, and transmittance of AlN films. As the RF power increases, the growth rate increases and the root mean square of surface roughness decreases while the absorption edge shifts to longer wavelength. This shift is believed to be due to the defects induced by ion bombardment.     

Selective MBE growth of nonalloyed ohmic contacts to 2D electron gas in high-electron-mobility transistors based on GaN/AlGaN heterojunctions

Specific features of how nonalloyed ohmic contacts to the 2D conducting channel of high-electron-mobility transistors based on AlGaN/(AlN)/GaN heterostructures are fabricated via deposition of heavily doped n ⁺-GaN through a SiO₂ mask by ammonia molecular-beam epitaxy have been studied. The technique developed makes it possible to obtain specific resistances of contacts to the 2D gas as low as 0.11 Ω mm on various types of Ga-face nitride heterostructures, which are several times lower than the resistance of conventional alloyed ohmic contacts.