Effects of substrate parameters on structure and optical properties of ZnO thin films fabricated by pulsed laser deposition

Highly oriented zinc oxide thin films have been grown on quartz, Si (1 1 1) and sapphire substrates by pulsed laser deposition (PLD). The effect of temperature and substrate parameter on structural and optical properties of ZnO thin films has been characterized by X-ray diffraction (XRD), atomic force microscopy (AFM), optical transmission spectra and PL spectra. The experimental results show that the best crystalline thin films grown on different substrate with hexagonal wurtzite structure were achieved at growth temperature 400–500 °C. The growth temperature of ZnO thin film deposited on Si (1 1 1) substrate is lower than that of sapphire and quartz. The band gaps are increasing from 3.2 to 3.31 eV for ZnO thin film fabricated on quartz substrate at growth temperature from 100 to 600 °C. The crystalline quality and UV emission of ZnO thin film grown on sapphire substrate are significantly higher than those of other ZnO thin films grown on different substrates.     

The effects of oxygen partial pressure on BST thin films deposited on multilayered bottom electrodes

Ba_0.5Sr_0.5TiO₃ (BST) thin films have been deposited by r.f. magnetron sputtering on silicon and platinum-coated silicon substrates with different buffer and barrier layers. BST films deposited on Si/SiO₂/SiN/Pt and Si/SiO₂/Ti/TiN/Pt multilayer bottom electrode have been used for the fabrication of capacitors. XRD and SEM studies were carried out for the films. It was found that the crystallinity of the BST thin film was dependent upon oxygen partial pressure in the sputtering gas. The role of multilayered bottom electrode on the electrical properties of Ba_0.5Sr_0.5TiO₃ films has been also investigated. The dielectric properties of BST films were measured. The results show that the films exhibit pure perovskite phase and their grain sizes are about 80–90 nm. The dielectric properties of the BST thin film on Si/SiO₂/Ti/TiN/Pt electrode was superior to that of the film grown on Si/SiO₂/SiN/Pt electrode.     

Integration of coplanar (Ba,Sr)TiO3 microwave phase shifters onto Si wafers using TiO2 buffer layers.

In this paper, a Ba0.6Sr0.4TiO3 (BST) tunable phase shifter with TiO2 films as microwave buffer layer between BST and silicon (Si) substrates is presented. The TiO2 buffer layer is grown by atomic layer deposition (ALD) onto Si substrate followed by pulsed laser deposition (PLD) of BST thin films onto the TiO2 buffer layer. The phase shifter fabricated on BST films grown on TiO2/Si substrate shows a good figure of merit (FOM) of 75.4 degrees/dB by exhibiting improved tunablity while retaining an appropriate dielectric Q as compared to 55.1 degrees/dB of BST/MgO structure. The TiO2 buffer layer grown by ALD enables successful integration of BST-based microwave tunable devices with high resistive Si wafer.     

Ti/La_(0.7)Ca_(0.3)MnO_3/Pt结构器件中“负”电阻开关特性研究

以Pt/Ti/SiO2/Si为衬底,制备了具有电阻转变特性的Ti/La0.7Ca0.3MnO3(LCMO)/Pt结构器件.X射线衍射分析表明LCMO薄膜呈纳米晶或非晶态,扫描电子显微镜及原子力显微镜分析表明LCMO薄膜表面平整、光滑致密.电学测试结果表明Ti/LCMO/Pt结构具有明显的双极型"负"电阻转变特性,低电阻态的导电过程为空间电荷限制电流机制,高电阻态的导电过程为Poole-Frenkel发射机制.利用氧化还原反应的随机性和TiOx中间层空间分布的不均匀性,定性地解释了高电阻态的不稳定性以及电流-电压曲线上的电流突变现象.     

A comprehensive analysis of the CVD growth of boron nitride nanotubes

Boron nitride nanotube (BNNT) films were grown on silicon/silicon dioxide (Si/SiO(2)) substrates by a catalytic chemical vapor deposition (CVD) method in a horizontal electric furnace. The effects of growth temperature and catalyst concentration on the morphology of the films and the structure of individual BNNTs were systematically investigated. The BNNT films grown at 1200 and 1300?°C consisted of a homogeneous dispersion of separate tubes in random directions with average outer diameters of ~30 and ~60 nm, respectively. Meanwhile, the films grown at 1400?°C comprised of BNNT bundles in a flower-like morphology, which included thick tubes with average diameters of ~100 nm surrounded by very thin ones with diameters down to ~10 nm. In addition, low catalyst concentration led to the formation of BNNT films composed of entangled curly tubes, while high catalyst content resulted in very thick tubes with diameters up to ~350 nm in a semierect flower-like morphology. Extensive transmission electron microscopy (TEM) investigations revealed the diameter-dependent growth mechanisms for BNNTs; namely, thin and thick tubes with closed ends grew by base-growth and tip-growth mechanisms, respectively. However, high catalyst concentration motivated the formation of filled-with-catalyst BNNTs, which grew open-ended with a base-growth mechanism.     

InGaAs quantum dots grown by molecular beam epitaxy for light emission on Si substrates

The aim of this study is to achieve homogeneous, high density and dislocation free InGaAs quantum dots grown by molecular beam epitaxy for light emission on silicon substrates. This work is part of a project which aims at overcoming the severe limitation suffered by silicon regarding its optoelectronic applications, especially efficient light emission device. For this study, one of the key points is to overcome the expected type II InGaAs/Si interface by inserting the InGaAs quantum dots inside a thin silicon quantum well in SiO2 fabricated on a SOI substrate. Confinement effects of the Si/SiO2 quantum well are expected to heighten the indirect silicon bandgap and then give rise to a type I interface with the InGaAs quantum dots. Band structure and optical properties are modeled within the tight binding approximation: direct energy bandgap is demonstrated in SiO2/Si/InAs/Si/SiO2 heterostructures for very thin Si layers and absorption coefficient is calculated. Thinned SOI substrates are successfully prepared using successive etching process resulting in a 2 nm-thick Si layer on top of silica. Another key point to get light emission from InGaAs quantum dots is to avoid any dislocations or defects in the quantum dots. We investigate the quantum dot size distribution, density and structural quality at different V/III beam equivalent pressure ratios, different growth temperatures and as a function of the amount of deposited material. This study was performed for InGaAs quantum dots grown on Si(001) substrates. The capping of InGaAs quantum dots by a silicon epilayer is performed in order to get efficient photoluminescence emission from quantum dots. Scanning transmission electronic microscopy images are used to study the structural quality of the quantum dots. Dislocation free In50Ga50As QDs are successfully obtained on a (001) silicon substrate. The analysis of QDs capped with silicon by Rutherford Backscattering Spectrometry in a channeling geometry is also presented.     

Integration of coplanar (Ba,Sr)TiO/sub 3/ microwave phase shifters onto Si wafers TiO/sub 2/ buffer layers

In this paper, a Ba/sub 0.6/Sr/sub 0.4/TiO/sub 3/ (BST) tunable phase shifter with TiO/sub 2/ films as microwave buffer layer between BST and silicon (Si) substrates is presented. The TiO/sub 2/ buffer layer is grown by atomic layer deposition (ALD) onto Si substrate followed by pulsed laser deposition (PLD) of BST thin films onto the TiO/sub 2/ buffer layer. The phase shifter fabricated on BST films grown on TiO/sub 2//Si substrate shows a good figure of merit (FOM) of 75.4/spl deg//dB by exhibiting improved tunability while retaining an appropriate dielectric Q as compared to 55.1/spl deg//dB of BST/MgO structure. The TiO/sub 2/ buffer layer grown by ALD enables successful integration of BST-based microwave tunable devices with high resistive Si wafer.     

Substrate considerations for graphene synthesis on thin copper films

Chemical vapor deposition on copper substrates is a primary technique for synthesis of high quality graphene films over large areas. While well-developed processes are in place for catalytic growth of graphene on bulk copper substrates, chemical vapor deposition of graphene on thin films could provide a means for simplified device processing through the elimination of the layer transfer process. Recently, it was demonstrated that transfer-free growth and processing is possible on SiO(2). However, the Cu/SiO(2)/Si material system must be stable at high temperatures for high quality transfer-free graphene. This study identifies the presence of interdiffusion at the Cu/SiO(2) interface and investigates the influence of metal (Ni, Cr, W) and insulating (Si(3)N(4), Al(2)O(3), HfO(2)) diffusion barrier layers on Cu-SiO(2) interdiffusion, as well as graphene structural quality. Regardless of barrier choice, we find the presence of Cu diffusion into the silicon substrate as well as the presence of Cu-Si-O domains on the surface of the copper film. As a result, we investigate the choice of a sapphire substrate and present evidence that it is a robust substrate for synthesis and processing of high quality, transfer-free graphene.     

磁控溅射MoS2/WS2复合薄膜的工艺与摩擦学性能研究

采用MoS2/WS2复合靶材在不锈钢和硅基片上溅射MoS2/WS2纳米薄膜,通过多次实验,得到溅射MoS2/WS2薄膜的最佳工艺如下:溅射气压4.0Pa,靶基距为70mm,溅射功率为150W,溅射时间为3h.使用X-射线衍射仪,能谱仪,扫描电子显微镜对薄膜的成分和结构进行分析.采用HH-3000薄膜结合强度划痕试验仪,纳米压痕测试系统,UNT-3摩擦磨损试验机对薄膜进行机械性能和摩擦磨损性能分析,结果表明:在大气环境中,WS2/MoS2 复合薄膜摩擦性能要优于纯MoS2薄膜.     

CVD growth and characterization of 3C-SiC thin films

Cubic silicon carbide (3C-SiC) thin films were grown on (100) and (111) Si substrates by CVD technique using hexamethyldisilane (HMDS) as the source material in a resistance heated furnace. HMDS was used as the single source for both Si and C though propane was available for the preliminary carbonization. For selective epitaxial growth, patterned Si (100) substrates were used. The effect of different growth parameters such as substrate orientation, growth temperature, precursor concentration, etc on growth was examined to improve the film quality. The surface morphology, microstructure and crystallinity of grown films were studied using optical microscopy, scanning electron microscopy (SEM), X-ray diffraction (XRD) analysis and X-ray photoelectron spectroscopy (XPS).     

Morphology and current-voltage characteristics of nanostructured pentacene thin films probed by atomic force microscopy

Atomic force microscopy was used to study the growth modes (on SiO2, MoS2, and Au substrates) and the current-voltage (I-V) characteristics of organic semiconductor pentacene. Pentacene films grow on SiO2 substrate in a layer-by-layer manner with full coverage at an average thickness of 20 A and have the highest degree of molecular ordering with large dendritic grains among the pentacene films deposited on the three different substrates. Films grown on MoS2 substrate reveal two different growth modes, snowflake-like growth and granular growth, both of which seem to compete with each other. On the other hand, films deposited on Au substrate show granular structure for thinner coverages (no crystal structure) and dendritic growth for higher coverages (crystal structure). I-V measurements were performed with a platinum tip on a pentacene film deposited on a Au substrate. The I-V curves on pentacene film reveal symmetric tunneling type character. The field dependence of the current indicates that the main transport mechanism at high field intensities is hopping (Poole-Frenkel effect). From these measurements, we have estimated a field lowering coefficient of 9.77 x 10(-6) V-1/2 m1/2 and an ideality factor of 18 for pentacene.     

Achieve 2-inch-diameter homogeneous GaN films on sapphire substrates by pulsed laser deposition

The 2-inch-diameter homogeneous GaN films have been epitaxially grown on sapphire substrates by pulsed laser deposition (PLD) technique with optimized laser rastering and PLD growth conditions. The as-grown GaN films are characterized by in situ reflection high-energy electron diffraction, white-light interferometry, scanning electron microscopy, atomic force microscopy (AFM), grazing incidence angle X-ray reflectivity, reciprocal space mappings, and micro-Raman spectroscopy for surface morphologies and structural properties. The as-grown 2-inch-diameter single-crystalline GaN films exhibit excellent thickness uniformity with a root-mean-square (RMS) inhomogeneity less than 3.4 % and very smooth surface with a RMS roughness less than 1.3 nm measured by AFM. There is a maximum of 1.2 nm thick interfacial layer existing between the as-grown GaN films and sapphire substrates, and the as-grown 310 nm thick GaN films are almost fully relaxed only with an in-plane compressive strain of 0.044 %. This work demonstrates a possibility for achieving high-quality large-scale GaN films with uniform thickness and atomically abrupt interface by PLD, and is of great interest for the commercial development of GaN-based optoelectronic devices.     

Scalable flame synthesis of SiO2 nanowires: dynamics of growth

Silica nanowire arrays were grown directly onto plain glass substrates by scalable flame spray pyrolysis of organometallic solutions (hexamethyldisiloxane or tetraethyl orthosilicate). The silicon dioxide films consisted of a network of interwoven nanowires from a few to several hundred nanometres long (depending on the process conditions) and about 20 nm in diameter, as determined by scanning electron microscopy. These films were formed rapidly (within 10-20 s) at high growth rates (ca 11-30 nm s(-1)) by chemical vapour deposition (surface growth) at ambient conditions on the glass substrate as determined by thermophoretic sampling of the flame aerosol and microscopy. In contrast, on high purity quartz nearly no nanowires were grown while on steel substrates porous SiO(2) films were formed. Functionalization with perfluorooctyl triethoxysilane converted the nanowire surface from super-hydrophilic to hydrophobic. Additionally, their hermetic coating by thin carbon layers was demonstrated also revealing their potential as substrates for synthesis of other functional 1D composite structures. This approach is a significant step towards large scale synthesis of SiO(2) nanowires facilitating their utilization in several applications.     

激光脉冲沉积制备钛酸锶钡薄膜及其介电调协特性

在Pt（111）／Ti／SiO2／Si（100）衬底上,用脉冲激光沉积工艺制备出了高度a轴取向生长的（Ba0.65Sr0．35）TiO3（BsT）薄膜。薄膜为柱状生长的纳米晶粒,平均晶粒尺寸为50nm。在外加电场254kV／cm时,BST薄膜的相对介电常数与介电调谐率为810和76．3％。高的介电调谐率主要是BST薄膜具有高度a轴取向的柱状生长晶粒,因为来自沿平面c轴极化而产生的内部应力,在电场作用下,获得了高介电调谐率。     

Hot-wire chemical vapor deposition for epitaxial silicon growth on large-grained polycrystalline silicon templates

We investigate low-temperature epitaxial growth of thin silicon films by HWCVD on Si [1 0 0] substrates and polycrystalline template layers formed by selective nucleation and solid phase epitaxy (SNSPE). We have grown 300-nm thick epitaxial layers at 300 °C on silicon [1 0 0] substrates using a high H₂:SiH₄ ratio of 70:1. Transmission electron microscopy confirms that the films are epitaxial with a periodic array of stacking faults and are highly twinned after approximately 240 nm of growth. Evidence is also presented for epitaxial growth on polycrystalline SNSPE templates under the same growth conditions.     

Growth of diborides thin films on different substrates by pulsed laser ablation

The growth of scandium, titanium and zirconium diborides thin films by pulsed laser ablation technique on different substrates has been studied. In situ reflection high energy electron diffraction and ex situ X-ray diffraction analyses indicate that the films are strongly c-axis oriented on all the substrates and also epitaxial, apart from Si(111), where the in plane orientation is poor. Atomic force microscopy imaging reveals a flat surface in all the epitaxial samples, with roughness lower than 1 nm. The results on silicon carbide and sapphire are very promising for using these materials as buffer layers in magnesium diboride thin films growth, especially to improve epitaxy and to prevent oxygen diffusion from the substrate, and also to study the influence of lattice strain on MgB₂ critical temperature.     

Dielectric properties of (Ba,Ca)(Zr,Ti)O3/CaRuO3 heterostructure thin films prepared by pulsed laser deposition

(Ba_0.90Ca_0.10)(Zr_0.25Ti_0.75)O₃ (BCZT) thin films were grown on Pt/Ti/SiO₂/Si substrates without and with a CaRuO₃ (CRO) buffer layer using pulsed laser deposition (PLD). The structure and surface morphology of the films have been characterized by X-ray diffraction (XRD) and scanning electron microscopy (SEM). At room temperature and 1 MHz, the dependence of dielectric constant and tunability of the films with electric field were investigated; the dielectric constant and tunability are 725 and 47.0%, 877 and 50.4%, respectively, for the BCZT film on Pt/Ti/SiO₂/Si substrates without and with the CRO buffer layer at 400 kV/cm. The tunability of the BCZT/CRO heterostructure thin films on Pt/Ti/SiO₂/Si substrates was higher than that of the BCZT thin films on Pt/Ti/SiO₂/Si substrates. The high constant likely results from the oxide electrode (CRO).     

Si(100)衬底上PLD法制备高取向度AlN薄膜

采用脉冲激光沉积法(PLD),以KrF准分子为脉冲激光源,Si(100)为衬底,同时引 入缓冲层TiN和Ti_0.8Al_0.2N,制备了结晶质量优异的A1N薄膜,X射线衍射(XRD)及反射 式高能电子衍射(RHEED)分析表明A1N薄膜呈(001)取向、二维层状生长.研究发现,薄膜 的生长模式依赖于缓冲层种类,直接在Si衬底上或MgO／Si衬底上的A1N薄膜呈三维岛状生 长;而同时引入缓冲层TiN和Ti_0.8Al_0.2N时,A1N薄膜呈二维层状生长.此外,激光能量密 度大小对A1N薄膜的结晶性有显著的影响,激光能量密度过大,薄膜表面粗糙,有颗粒状沉积 物生成.在氮气气氛中沉积,能使薄膜的取向由(001)改变为(100).     

Pulsed laser deposition of epitaxial ferroelectric Pb(Zr,Ti)O3 films on silicon substrates

We report on the epitaxial growth and electrical properties of Pb_0.52Zr_0.48TiO₃ (PZT) thin films deposited by Pulsed Laser Deposition (PLD) on SrTiO₃ (STO)-buffered Si(001). Previously to PZT growth, 40 nm-thick (La,Sr)MnO₃ (LSMO) layer was deposited to serve as electrical bottom electrode. The 200 nm-thick PZT film epitaxy was optimized by PLD on STO-buffered Si(001).The high contrast of stable artificially poled ferroelectric surfaces evidences the good ferroelectric properties of the PZT thin film. The structural as well as the physical properties of the PZT/LSMO/STO/Si(001) structure prove that very good quality layers have been obtained for films grown on silicon substrate.     

平面光波导膜的ECR-PECVD制备及特性研究

采用微波电子回旋共振等离子体增强化学气相沉积技术 ,在单晶硅衬底上制备了用于平面光波导的SiO2 薄膜 ,研究了沉积速率与工艺参数之间的关系 ,并对射频偏置对成膜特性的影响作了初步实验研究。通过X射线光电子能谱、傅立叶变换红外光谱、扫描电镜、原子力显微镜、以及扫描隧道显微镜三维形貌和椭偏仪等测量手段 ,分析了样品的薄膜结构和光学特性等。结果表明 ,在较低温度下沉积出均匀致密、性能优良的SiO2 薄膜。此外 ,还成功制备出掺Ge的SiO2 薄膜 ,并可以精确控制掺杂浓度 ,以适应不同光波导芯的要求