An InGaAs-InP HBT differential transimpedance amplifier with 47-GHz bandwidth

Return-to-zero differential phase-shift keying applications require a differential amplifier with high bandwidth, high gain, low noise, and good input impedance match. In this paper, we describe an InGaAs-InP heterostructure bipolar transistor differential transimpedance amplifier with high bandwidth of 47 GHz and high gain of 56 dB-/spl Omega/. The input-referred current noise is less than 35 pA//spl radic/Hz over the measurement range up to 40 GHz.     

40-GHz transimpedance amplifier with differential outputs using InP-InGaAs heterojunction bipolar transistors

High-gain and high-bandwidth transimpedance amplifiers (TIAs) are required for fiber-optic receiver modules. This paper reports on the design, fabrication, and characterization of a 40-Gb/s TIA for SONET/SDH STS-768/STM-256 applications based on an InP-InGaAs single heterojunction bipolar transistor (SHBT) process developed at Vitesse Semiconductor Corporation (Vitesse Indium Phosphide Release 1 or VIP-1). This amplifier consists of a single-ended input transimpedance pre-amplifier and a differential output post-amplifier. The measured differential transimpedance is 1800 /spl Omega/ with -3-dB bandwidth greater than 40 GHz. The high gain of this circuit eliminates the need for a standalone limiting amplifier between the conventional transimpedance pre-amplifier and the demultiplexer in short-reach applications.     

6-k/spl Omega/ 43-Gb/s differential transimpedance-limiting amplifier with auto-zero feedback and high dynamic range

A high-gain, 43-Gb/s InP HBT transimpedance-limiting amplifier (TIALA) with 100-/spl mu/A/sub pp/ sensitivity and 6 mA/sub pp/ input overload current is presented. The circuit also operates as a limiting amplifier with 40-dB differential gain, better than 15-dB input return loss, and a record-breaking sensitivity of 8 mV/sub pp/ at 43 Gb/s. It features a differential TIA stage with inductive noise suppression in the feedback network and consumes less than 450mW from a single 3.3-V supply. The TIALA has 6-k/spl Omega/ (76dB/spl Omega/) differential transimpedance gain and 35-GHz bandwidth and comprises the transimpedance and limiting gain functions, an auto-zero dc feedback circuit, signal level monitor, and slicing level adjust functions. Other important features include 45-dB isolation and 800-mV/sub pp/ differential output.     

High-gain SiGe transimpedance amplifier array for a 12/spl times/10 Gb/s parallel optical-fiber link

A transimpedance amplifier array for 12 parallel optical-fiber channels each operating at 10 Gb/s is presented, which is used in the receiver of short-distance links. It stands out for the following features: high gain (transimpedance 25 k/spl Omega/ in the limiting mode), high input sensitivity and wide input dynamic range (input current swing from 20 to 240 /spl mu/A/sub p-p/), constant output voltage swing (differential 0.5 V/sub p-p/ at 50 /spl Omega/ load), and low power consumption (1.4 W) at a single supply voltage (5 V). Each channel has its own offset-current control circuit. To the best of the authors' knowledge, the total throughput of 12/spl times/10 Gb/s=120 Gb/s is the highest value reported for a single-chip amplifier array. The target specifications have been achieved with the first technological run without needing any redesign. This fact demonstrates that the inherent severe crosstalk problems of such high-gain amplifier arrays can reliably be solved by applying adequate decoupling measures and simulation tools.     

Substrate coupling in a high-gain 30-Gb/s SiGe amplifier-modeling, suppression, and measurement

For demonstrating substrate coupling in high-gain broadband amplifiers, a limiting differential transimpedance amplifier has been developed and fabricated in a SiGe bipolar technology. It operates up to 30 Gb/s and stands out for a maximum (nonlinear) transimpedance in the limiting mode of 25 k/spl Omega/, resulting in a gain /spl times/ speed product as high as 750 k/spl Omega//spl middot/Gb/s. This record value could be achieved by applying several techniques for suppression of noise coupling simultaneously. The effectiveness of each technique was verified experimentally by measuring the output eye diagrams of different mounted amplifier versions. The high accuracy potential of the substrate modeling tools applied for optimizing the amplifier design has been demonstrated separately by measurements on special (mounted) test structures up to 40 GHz. These investigations also showed the strong degradation of shielding measures by bond inductances with increasing frequency.     

A Common-Base Transistor Differential Amplifier

A differential amplifier with the input transistor pair operating in the common-base mode was designed for a dc to 100-MHz current preamplifier application. It features 0.6-ohm input impedance and 1.0-k /spl Omega/ transimpedance gain.     

High-gain differential CMOS transimpedance amplifier with on-chip buried double junction photodiode

An integrated fully differential CMOS transimpedance amplifier (TIA) with buried double junction photodiode input is described. The TIA features a variable high transimpedance gain (250 k/spl Omega/ to 2.5 M/spl Omega/), large DC photocurrent rejection capability (>55 dB) and low input referred noise density at 100 kHz (2pA//spl radic/Hz).     

A low-power 20-GHz 52-dB/spl Omega/ transimpedance amplifier in 80-nm CMOS

This paper describes the design of a transimpedance amplifier (TIA) for a low-power, short-distance, high-density fiber-optic interconnect communication system. The single-ended circuit has been designed in an 80-nm digital CMOS process and consumes only 2.2 mW from a 1-V supply. The measured results show a transimpedance gain of 52 dB/spl Omega/ and a large bandwidth of 20 GHz. This work presents the highest bandwidth at the lowest power consumption for CMOS transimpedance amplifiers reported to date.     

Design of a low-power 3.5-GHz broad-band CMOS transimpedance amplifier for optical transceivers

This paper describes a novel low-power low-noise CMOS voltage-current feedback transimpedance amplifier design using a low-cost Agilent 0.5-/spl mu/m 3M1P CMOS process technology. Theoretical foundations for this transimpedance amplifier by way of gain, bandwidth and noise analysis are developed. The bandwidth of the amplifier was extended using the inductive peaking technique, and, simulation results indicated a -3-dB bandwidth of 3.5 GHz with a transimpedance gain of /spl ap/60 dBohms. The dynamic range of the amplifier was wide enough to enable an output peak-to-peak voltage swing of around 400 mV for a test input current swing of 100 /spl mu/A. The output noise voltage spectral density was 12 nV//spl radic/Hz (with a peak of /spl ap/25 nV//spl radic/Hz), while the input-referred noise current spectral density was below 20 pA//spl radic/Hz within the amplifier frequency band. The amplifier consumes only around 5 mA from a 3.3-V power supply. A test chip implementing the transimpedance amplifier was also fabricated using the low-cost CMOS process.     

1-Gb/s 80-dB/spl Omega/ fully differential CMOS transimpedance amplifier in multichip on oxide technology for optical interconnects

A 1-Gb/s differential transimpedance amplifier (TIA) is realized in a 0.25-/spl mu/m standard CMOS technology, incorporating the regulated cascode input configuration. The TIA chip is then integrated with a p-i-n photodiode on an oxidized phosphorous-silicon (OPS) substrate by employing the multichip-on-oxide (MCO) technology. The MCO TIA demonstrates 80-dB/spl Omega/ transimpedance gain, 670-MHz bandwidth for 1-pF photodiode capacitance, 0.54-/spl mu/A average input noise current, -17-dBm sensitivity for 10/sup -12/ bit-error rate (BER), and 27-mW power dissipation from a single 2.5-V supply. It also shows negligible switching noise effect from an embedded VCO on the OPS substrate. Furthermore, a four-channel MCO TIA array is implemented for optical interconnects, resulting in less than -40-dB crosstalk between adjacent channels.     

Low-power InP/GaAsSb/InP DHBT cascode transimpedance amplifier with GBP/P/sub dc/ of 7.2 GHz/mW

A low-power high gain-bandwidth monolithic cascode transimpedance amplifier using novel InP/GaAsSb/InP DHBT technology was investigated. The amplifier exhibited state-of-the-art performance of 17.3 dB gain, 12 GHz bandwidth, 55 dB/spl Omega/ transimpedance, and a corresponding gain-bandwidth of 6.7 THz/spl Omega/ while consuming only 12.2 mW DC power. It also achieved good gain-bandwidth-product per DC power figure-of-merit (GBP/P/sub dc/) of 7.2 GHz/mW     

Bipolar high-gain limiting amplifier IC for optical-fiber receivers operating up to 4 Gbit/s

A monolithic integrated high-gain limiting amplifier for future optical-fiber receivers is described. It is characterized by the following features: high insertion-voltage gain (maximum 54 dB); high input dynamic range (about 52 dB) at constant output-voltage swing (400 mV/SUB p-p/); high operating speed (up to at least 4 Gb/s); low power dissipation (350 mW at 50-/spl Omega/ load); standard supply voltage (5 V); 50-/spl Omega/ output buffer; one-chip solution; and small fabrication costs by use of a 2-/spl mu/m standard bipolar technology without needing polysilicon self-aligning processes. The good values of operating speed and power consumption, which the authors believe has until now not nearly been achieved by other comparable bipolar amplifier ICs, are a result of careful circuit design and optimization. The amplifier was extended to a high-sensitivity (amplitude and time) decision circuit operating at up to 4.0 Gb/s by adding a high-speed master-slave D-flip-flop IC fabricated with the same technology.     

A new integrated front-end for a noninvasive brain imaging system based on near-infrared spectroreflectometry

In this paper, we present a fully integrated front-end of a portable spectroreflectometry-based brain imaging system dedicated for acquisition of modulated optical signals at a frequency of 1 Hz to 25 kHz. The proposed front-end preamplifier is composed of a photodetector, a transimpedance preamplifier, a two-stage voltage amplifier and a mixer. Strict constraints regarding noise thus have to be considered. The preamplifier consists of a transimpedance block featuring a 95-dB/spl Omega/ gain and an average input current noise density at the frequency of interest of approximately 3 pA//spl radic/Hz. Each of the two subsequent voltage amplifiers allows the user to obtain an additional 25-dB gain. Considering the tuning capabilities and the losses due to the filters and the nonideal buffers, the proposed front-end allows us to obtain a total gain up to 145 dB. The back-end of the amplification chain is composed of a mixer which is used to produce a continuous voltage proportional to the amplitude of the input optical signals. All those features were integrated using CMOS 0.18-/spl mu/m technology and the experimental results are in agreement with the initial design requirements.     

A high precision monolithic super-beta operational amplifier

A single-chip (67/spl times/90 mil) integrated-circuit operational amplifier using thin-film resistors and super-gain transistors has been designed to achieve dc follower accuracies of 0.001 percent with 100-k/spl Omega/ source resistance. The circuit achieves gains of 140 dB using thermally balanced layout designs for both input and output stages, nulled drifts of 0.3 /spl mu/V//spl deg/C, and offset currents well under 1 nA. All other dc specifications including power-supply variation error (PSRR), common-mode gain error (CMRR), etc., are in the 1-10 ppm error range; and a procedure is given by which long-term drifts of less than 10 /spl mu/V/month can be assured. AC performance is comparable to general-purpose integrated-circuit operational amplifiers, i.e., f/SUB t/=300 kHz and slew rate of 1.2 V//spl mu/s at gain of ten. The circuit is externally compensated for unity gain with a single 390-pF capacitor and is fully input and output protected.     

An inductance enhancement technique and its application to a shunt-peaked 2.5 Gb/s transimpedance amplifier design

This brief presents a bandwidth enhancement technique that is applicable to gigahertz-range broadband circuits. Using the inductance enhancement technique proposed in this brief, a 2.5-Gb/s transimpedance amplifier (TIA) has been implemented based on a 0.35-/spl mu/m CMOS technology. With the input noise reduction, the TIA with the proposed active inductor loads improves the overall system performances including more that 90% increase in bandwidth. Measurements show the bandwidth of 1.73 GHz, transimpedance gain of 68 dB/spl Omega/, and the averaged input referred noise current of 3.3 pA//spl radic/Hz, respectively, while dissipating 50 mW of dc power.     

1.25-Gb/s regulated cascode CMOS transimpedance amplifier for Gigabit Ethernet applications

A transimpedance amplifier (TIA) has been realized in a 0.6-/spl mu/m digital CMOS technology for Gigabit Ethernet applications. The amplifier exploits the regulated cascode (RGC) configuration as the input stage, thus achieving as large effective input transconductance as that of Si Bipolar or GaAs MESFET. The RGC input configuration isolates the input parasitic capacitance including photodiode capacitance from the bandwidth determination better than common-gate TIA. Test chips were electrically measured on a FR-4 PC board, demonstrating transimpedance gain of 58 dB/spl Omega/ and -3-dB bandwidth of 950 MHz for 0.5-pF photodiode capacitance. Even with 1-pF photodiode capacitance, the measured bandwidth exhibits only 90-MHz difference, confirming the mechanism of the RGC configuration. In addition, the noise measurements show average noise current spectral density of 6.3 pA//spl radic/(Hz) and sensitivity of -20-dBm for a bit-error rate of 10/sup -12/. The chip core dissipates 85 mW from a single 5-V supply.     

A dual-path bandwidth extension amplifier topology with dual-loop parallel compensation

A dual-path amplifier topology with dual-loop parallel compensation technique is proposed for low-power three-stage amplifiers. By using two parallel high-speed paths for high-frequency signal propagation, there is no passive capacitive feedback network loaded at the amplifier output. Both the bandwidth and slew rate are thus significantly improved. Implemented in a 0.6-/spl mu/m CMOS process, the proposed three-stage amplifier has over 100-dB gain, 7-MHz gain-bandwidth product, and 3.3-V//spl mu/s average slew rate while only dissipating 330 /spl mu/W at 1.5 V, when driving a 25-k/spl Omega///120-pF load. The proposed amplifier achieves at least two times improvement in bandwidth-to-power and slew-rate-to-power efficiencies than all other reported multistage amplifiers using different compensation topologies.     

Analysis, design, and optimization of InGaP-GaAs HBTmatched-impedance wide-band amplifiers with multiple feedback loops

The realization of matched impedance wide-band amplifiers fabricated by InGaP-GaAs heterojunction bipolar transistor (HBT) process is reported. The technique of multiple feedback loops was used to achieve terminal impedance matching and wide bandwidth simultaneously. The experimental results showed that a small signal gain of 16 dB and a 3-dB bandwidth of 11.6 GHz with in-band input/output return loss less than -10 dB were obtained. These values agreed well with those predicted from the analytic expressions that we derived for voltage gain, transimpedance gain, bandwidth, and input and output impedances. A general method for the determination of frequency responses of input/output return losses (or S₁₁, S₂₂) from the poles of voltage gain was proposed. The intrinsic overdamped characteristic of this amplifier was proved and emitter capacitive peaking was used to remedy this problem. The tradeoff between the input impedance matching and bandwidth was also found     

Low-power programmable gain CMOS distributed LNA

A design methodology for low power MOS distributed amplifiers (DAs) is presented. The bias point of the MOS devices is optimized so that the DA can be used as a low-noise amplifier (LNA) in broadband applications. A prototype 9-mW LNA with programmable gain was implemented in a 0.18-/spl mu/m CMOS process. The LNA provides a flat gain, S/sub 21/, of 8 /spl plusmn/ 0.6dB from DC to 6.2 GHz, with an input impedance match, S/sub 11/, of -16 dB and an output impedance match, S/sub 22/, of -10 dB over the entire band. The 3-dB bandwidth of the distributed amplifier is 7GHz, the IIP3 is +3 dBm, and the noise figure ranges from 4.2 to 6.2 dB. The gain is programmable from -10 dB to +8 dB while gain flatness and matching are maintained.     

A 1.25-gb/s burst-mode receiver for GPON applications

This paper presents a 1.25-Gb/s burst-mode receiver (BMRx) for upstream transmission over gigabit passive optical networks (G-PONs). The dc-coupled receiver uses a unique arrangement of three limiting amplifiers to convert the bursty input signal to a current mode logic output signal while rejecting the dc offset from a preceding transimpedance amplifier. Peak detectors extract a decision threshold from a sequence of 12 successive nonreturn-to-zero (NRZ) 1's and 12 successive NRZ 0's received at the beginning of each packet. Automatic compensation of the remaining offsets of the BMRx is performed digitally via digital-to-analog converters. The chip was designed in a 0.35-/spl mu/m SiGe BiCMOS process. The receiver contains an APD with a gain of 6 and a transimpedance amplifier and shows a sensitivity of -32.8 dBm and a dynamic range of 23.8 dB. A sensitivity penalty of 2.2 dB is incurred when a packet with average optical power of -9 dBm precedes the packet under consideration, the guard time between the packets being 25.6 ns. The BMRx includes activity detection circuitry, capable of quickly detecting average optical levels as low as -35.5 dBm. The performed measurements prove that the receiver meets the G-PON physical media dependent layer specification defined in ITU-T Recommendation G.984.2.