100mm直径硅衬底上MOCVD外延生长无裂纹GaN

为实现在100 mm直径硅衬底上金属有机物化学气相外延(MOCVD)生长无裂纹GaN,系统研究了预铺铝时间参数对AlN成核质量的影响、不同厚度条件下AlN层对GaN生长的影响以及Al组分渐变的AlGaN缓冲层对GaN裂纹抑制的效果。实验结果表明,适当的预铺铝时间可以显著提高AlN成核层晶体质量,合理的AlN层厚度有助于上层GaN的生长,AlN与GaN之间AlGaN缓冲层的引入可以有效抑制GaN裂纹的产生。最后,采用高分辨率X射线衍射(HRXRD)测试了MOCVD外延生长的无裂纹GaN材料,得到AlN(002)面、GaN(002)面和GaN(102)面的衍射峰半峰宽(FWHM)分别为1 382,550和746 arcsec。     

AlN缓冲层厚度对脉冲激光沉积技术生长的GaN薄膜性能的影响

在蓝宝石(Al2O3)衬底上应用脉冲激光沉积技术(PLD)生长不同厚度的AlN缓冲层后进行GaN薄膜外延生长。采用高分辨X射线衍射仪(HRXRD)和扫描电子显微镜(SEM)对外延生长所得GaN薄膜的晶体质量和表面形貌进行了表征。测试结果表明:相比直接在Al2O3衬底上生长的GaN薄膜,通过生长AlN缓冲层的GaN薄膜虽然晶体质量较差,但表面较平整;而且随着AlN缓冲层厚度的增加,GaN薄膜的晶体质量和表面平整度均逐渐提高。可见,AlN缓冲层厚度对在Al2O3衬底上外延生长GaN薄膜的晶体质量和表面形貌有着重要的影响。     

AlN缓冲层厚度对脉冲激光沉积技术生长的GaN薄膜性能的影响

在蓝宝石(Al2O3)衬底上应用脉冲激光沉积技术(PLD)生长不同厚度的AlN缓冲层后进行GaN薄膜外延生长。采用高分辨X射线衍射仪(HRXRD)和扫描电子显微镜(SEM)对外延生长所得GaN薄膜的晶体质量和表面形貌进行了表征。测试结果表明: 相比直接在Al2O3衬底上生长的GaN薄膜, 通过生长AlN缓冲层的GaN薄膜虽然晶体质量较差, 但表面较平整; 而且随着AlN缓冲层厚度的增加, GaN薄膜的晶体质量和表面平整度均逐渐提高。可见, AlN缓冲层厚度对在Al2O3衬底上外延生长GaN薄膜的晶体质量和表面形貌有着重要的影响。     

预辅Al及AlN缓冲层厚度对GaN/Si(111)材料特性的影响

主要研究了采用高温AlN缓冲层外延生长GaN/Si(111)材料的工艺技术。利用高分辨X射线双晶衍射(HRXRD)分析研究了GaN/Si(111)样品外延层的应变状态和晶体质量,通过原子力显微镜(AFM)分析研究了不同厚度的高温AlN缓冲层对GaN外延层的表面形貌的影响。实验结果表明,AlN缓冲层生长前预通三甲基铝(TMAl)的时间、AlN缓冲层的厚度对GaN外延层的应变状态、外延层的晶体质量以及表面形貌都有显著影响。得到最优的预辅Al时间为10s,AlN缓冲层的厚度为40nm。在此条件下外延生长的GaN样品(厚度约为1μm)表面形貌较好,X射线衍射(XRD)双晶摇摆曲线半峰全宽(FWHM)(0002)面和(10-12)面分别为452″和722″。     

利用平片蓝宝石衬底制备高功率垂直结构LED

在平片蓝宝石衬底上,通过引入AlN缓冲层,优化成核层与粗糙层的生长条件,生长出了表面平整的GaN薄膜,晶体质量得到显著提升。通过引入AlN缓冲层,将X射线衍射(XRD)下样品(002)面的半高宽(FWHM)由232″降低至148″;通过减薄成核层厚度、提升粗糙层生长压力,将样品(102)面和(100)面的FWHM分别由243″和283″降低至169″和221″。研究了不同成核层和粗糙层的生长参数对GaN薄膜表面形貌的影响,随着(102)面和(100)面FWHM的降低,表面平整度亦得到改善,粗糙度由约3.8 nm下降到约1.6 nm。利用优化后的底层条件生长了高质量GaN薄膜,在3.5 A/mm^2电流密度下,与参考样品相比,制备出的LED样品的光输出功率由863 mW提升至942 mW,提升了约9%。     

玻璃衬底上制备GaN薄膜的研究进展

近年来,GaN基发光二极管(LED)的发展异常迅速,以玻璃为衬底的LED具有成本低、可大面积化生产等优点而引起了国内外许多科研机构的广泛研究兴趣.但由于普通玻璃较低的软化温度(500～ 600℃)以及与GaN之间存在较大的晶格失配问题,一直阻碍其发展.重点综述了玻璃衬底上生长GaN薄膜的方法以及改善外延层晶体质量的技术.分别介绍了两种在普通玻璃上生长GaN的方法,即低温生长和局部加热生长,同时详述了采用缓冲层和横向外延过生长(ELO)技术对外延GaN晶体质量的影响.对局部加热、ELO等技术在玻璃衬底LED方面的应用进行了分析和预测,认为以玻璃为衬底的LED终会取得快速地发展.     

6H-SiC衬底上采用不同厚度AlN缓冲层对GaN外延层的影响

采用不同厚度AlN作为缓冲层在6H-SiC衬底上生长了GaN外延层,并利用X射线衍射,拉曼散射和透射电子显微镜等对GaN性质进行了研究。AlN缓冲层的应变状态对GaN的晶体质量和表面形貌有很大影响。较厚的AlN缓冲层会导致GaN表面出现裂纹,而太薄的AlN缓冲层会导致GaN层较高的位错密度,从而恶化器件性能。分析了GaN产生裂纹和高位错密度的机制,并采用较优厚度（100nm）的AlN缓冲层生长出高质量的GaN外延层。     

引入GaN过渡层对Si（111）衬底上生长GaN外延的影响

本文研究了在Si(111)衬底上生长GaN外延层的方法。相比于直接在AlN缓冲层上生长GaN外延层,引入GaN过渡层显著地提高了外延层的晶体质量并降低了外延层的裂纹密度。使用X射线双晶衍射仪、光学显微镜以及在位监测曲线分析了GaN过渡层对外延层的晶体质量以及裂纹密度的影响。实验发现,直接在AlN缓冲层上生长外延层,晶体质量较差, X射线(0002)面半高宽最优值为0.686°,引入GaN过渡层后,通过调整生长条件,控制岛的长大与合并的过程,从而控制三维生长到二维生长过渡的过程,外延层的晶体质量明显提高, (0002)面半高宽降低为0.206°,并且裂纹明显减少。研究结果证明,通过生长合适厚度的GaN过渡层,可以得到高质量、无裂纹的GaN外延层。     

正晶向SiC衬底上表面光滑的N极性GaN薄膜材料的生长

采用MOCVD技术在101.6 mm(4英寸)正晶向半绝缘C面SiC衬底上生长了厚度为1μm的GaN缓冲层。通过深入研究不同AlN成核层上生长的GaN缓冲层的性质,揭示了正晶向SiC衬底上氮极性GaN的生长机制,发现成核层表面AlN岛的密度是决定缓冲层表面形貌的重要参数,对后续GaN的成核以及GaN岛间的合并具有显著影响。通过在AlN成核层外延期间引入N2作为载气并且以脉冲方式供应铝源,研制的成核层表面成核岛尺寸小且致密性高,有利于促进GaN成核岛之间的横向合并,并抑制GaN缓冲层的岛状生长模式,从而获得了表面光滑的N极性GaN薄膜材料,原子力显微镜20μm×20μm扫描范围下的均方根(rms)粗糙度值为1.5 nm。此外,在表面平滑的GaN薄膜上生长的GaN/AlGaN异质结的电子输运特性也同步得到提升,这有利于N极性GaN材料的微波应用。     

GaN缓冲层对生长InN薄膜的影响

采用金属有机物化学气相沉积(MOCVD)方法生长六方相InN薄膜,利用氮化镓(GaN)缓冲层技术制备了高质量薄膜,得到了其能带带隙0.7eV附近对应的光致发光光谱(PL).通过比较未采用缓冲层,同时采用低温和高温GaN缓冲层,以及低温GaN缓冲层结合高温退火三种生长过程,发现低温GaN缓冲层结合高温退火过程能够得到更优表面形貌和晶体质量的InN薄膜,同时表征了材料的电学性质和光学性质.通过对InN薄膜生长模式的讨论,解释了薄膜表面形貌和晶体结构的差异.     

不同插入层对抑制Mg掺杂p-GaN的记忆效应

研究了低温(LT) GaN和AlN不同插入层对抑制Mg掺杂p-GaN金属有机化学气相沉积外延中存在的记忆效应的影响,外延生长p-GaN缓冲层,制作具有该缓冲层的AlGaN/GaN高电子迁移率晶体管(HEMT),并对该器件进行电学测试.二次离子质谱仪测试表明p-GaN上10 nm厚的LT-GaN插入层相比于2 nm厚的AlN插入层能更好地抑制Mg扩散.霍尔测试表明,2 nm厚的AlN插入层的引入和GaN存在较大的晶格失配会引入位错,进而会降低AlGaN/GaNHEMT的电子迁移率以及增加其方块电阻;含有10 nm厚的LT-GaN插入层的p-GaN作为缓冲层的AlGaN/GaN HEMT,其方块电阻、电子迁移率以及二维电子气(2DEG)密度分别为334.9 Ω/口,1 923 cm2/(V·s)和9.68×1012 cm-2.器件具有很好的直流特性,其饱和电流为470 mA/mm,峰值跨导为57.7 mS/mm,电流开关比为3.13×109.     

Surface etching of 6H-SiC (0001) and surface morphology of the subsequently grown GaN via MOCVD

The correlation between surface morphological properties of the GaN epilayers and the surface conditions of 6H-SiC (0001) substrates etched in H₂, C₂H₄/H₂, and HCl/H₂ was studied. Etching 6H-SiC in H₂ produced a high quality surface with steps and terraces, while etching in HCl/H₂ produced either a rough surface with many pits and hillocks or a smooth surface similar to that etched in H₂, depending on the HCl concentration and temperature. The GaN epilayers were subsequently deposited on these etched substrates using either a low temperature GaN or a high temperature AlN buffer layer via MOCVD. The substrate surface defects increased the density and size of the “giant” pinholes (2–4 μm) on GaN epilayers grown on a LT-GaN buffer layer. Small pinholes (<100 nm) were frequently observed on the samples grown on a HT-AlN buffer layer, and their density decreased with the improved surface quality. The non-uniform GaN nucleation caused by substrate surface defects and the slow growth rate of planes of the islands were responsible for the formation of “giant” pinholes, while the small pinholes were believed to be caused by misfit dislocations.     

Investigations of GaN growth on the sapphire substrate by MOCVD method with different AlN buffer deposition temperatures

The effects of different AlN buffer deposition temperatures on the GaN material properties grown on sapphire substrate was investigated. At relatively higher AlN buffer growth temperature, the surface morphology of subsequent grown GaN layer was decorated with island-like structure and revealed the mixed-polarity characteristics. In addition, the density of screw TD and leakage current in the GaN film was also increased. The occurrence of mixed-polarity GaN material result could be from unintentional nitridation of the sapphire substrate by ammonia (NH₃) precursor at the beginning of the AlN buffer layer growth. By using two-step temperature growth process for the buffer layer, the unintentional nitridation could be effectively suppressed. The GaN film grown on this buffer layer exhibited a smooth surface, single polarity, high crystalline quality and high resistivity. AlGaN/GaN high electron-mobility transistor (HEMT) devices were also successfully fabricated by using the two-step AlN buffer layer.     

石墨烯上生长GaN纳米线

采用金属Ga升华法在石墨烯/蓝宝石衬底上生长了高质量GaN纳米线,研究了不同的生长条件,如NH3流量、反应时间、催化剂和缓冲层等对GaN纳米线形貌的影响,采用扫描电子显微镜(SEM)对GaN纳米线进行表征.研究发现,在适当的NH3流量且无催化剂时,衬底上可以生长出粗细均匀的GaN纳米线.反应时间为5 min时,纳米线密集分布在衬底上,表面光滑.在石墨烯/蓝宝石上预先低温生长GaN缓冲层,然后升温至1 100℃进行GaN纳米线生长,获得了具有择优取向的GaN纳米线结构.研究表明,石墨烯和缓冲层对获得GaN纳米线结构有序阵列具有重要的作用.     

Structural and optical characterization of GaN grown on porous silicon substrate by MOVPE

GaN was grown on porous silicon (PS) substrates by Metalorganic Vapour Phase Epitaxy at temperature of 1050 °C. An additional AlN buffer layer is used between GaN and PS. The crystalline quality and surface morphology of GaN films were studied by X-ray diffraction and scanning electron microscope (SEM), respectively. Preferential growth of hexagonal GaN with 〈00.1〉 direction is observed and is clearly improved when the thickness of AlN buffer layer increases. Morphological changes in PS layer appearing after growth have been also discussed.GaN optical qualities were determined by photoluminescence at low and room temperature (RT).     

The effect of GaN and ain buffer layers on GaN film properties grown on both C-plane and A-plane sapphire

This paper presents a comparative study of the properties of GaN grown by organometallic vapor phase epitaxy, using both a GaN and A1N buffer layer, as a function of sapphire orientation (c-plane vs a-plane). Results are presented for varying the thickness of the buffer layer, varying the growth temperature of the GaN film, and also varying the ammonia/trimethylgallium mass flow ratio. The electron Hall mobilities of GaN films grown on an A1N buffer layer were, in general, higher compared to films grown using a GaN buffer layer. In addition, growth on a-plane sapphire resulted in higher quality films (over a wider range of buffer thicknesses) than growth on c-plane sapphire. The room temperature electron mobilities were also found to be dependent on, not only the growth temperature, but also the ammonia/trimethylgallium mass flow ratio.     

多缓冲层对MOCVD生长的GaN性能的影响

采用多低温缓冲层法和高低温联合缓冲层法在 MOCVD系统上生长 Ga N外延膜 .对薄膜进行了 X射线衍射和光致发光谱 (PL)测试 ,(0 0 0 2 ) X射线摇摆曲线和 PL 谱的半高宽与常规的单低温缓冲层法制备的薄膜相比均有不同程度的改善 .实验结果表明改进的缓冲层法能提高 MOCVD生长的氮化镓外延膜晶体质量     

以金属为缓冲层在Si(111)上分子束外延GaN及其表征

用电子束蒸发方法在Si(111)衬底上蒸发了Au/Cr和Au/Ti/Al/Ti 两种金属缓冲层,然后在金属缓冲层上用气源分子束外延(GSMBE)生长GaN. 两种缓冲层的表面都比较平整和均匀,都是具有Au(111)面择优取向的立方相Au层. 在Au/Cr/Si(111)上MBE生长的GaN,生长结束后出现剥离. 在Au/Ti/Al/Ti/Si(111)上无AlN缓冲层直接生长GaN,得到的是多晶GaN;先在800℃生长一层AlN缓冲层,然后在710℃生长GaN,得到的是沿GaN(0001)面择优取向的六方相GaN. 将Au/Ti/Al/Ti/Si(111)在800℃下退火20min,金属层收缩为网状结构,并且成为多晶,不再具有Au(111)方向择优取向.     

脉冲激光沉积GaN薄膜的研究进展

脉冲激光沉积(PLD)技术凭借其低温生长优势,逐步在GaN薄膜外延领域得到广泛应用。回顾了近年来PLD技术外延生长GaN薄膜的研究进展,包括新型衬底上的GaN薄膜外延研究进展,以及作为克服异质外延的重要手段——缓冲层技术的发展现状。从目前的研究进展可以看出,应用PLD技术制备GaN薄膜及其光电器件具有广阔的发展前景。     

Reduction of Dislocation Density in HVPE-Grown GaN Epilayers by Using In Situ-Etched Porous Templates

In this paper, a method was demonstrated to reduce the dislocation density of GaN film grown by hydride vapor phase epitaxy (HVPE) on an in situ selective hydrogen-etched GaN/sapphire template. The dislocations regions were etched by hydrogen to form cavities. The porous structure was formed on the GaN template grown by metal organic chemical vapor deposition after in situ hydrogen etching. The etching condition was optimized by modulating the etching temperature, pressure, and etching time. Two-step buffer layer growth and high temperature GaN film deposition were carried on the porous template. The growth parameters were optimized to keep the porous structure unfilled. The dislocations originally located in etched cavities could not propagate to the next layer grown by HVPE. Therefore, the dislocation density could be significantly reduced. High crystal quality of GaN is obtained with a low dislocation density. The full width at half-maximum FWHM of (002) is 35 arcs, and the FWHM of (102) is 48 arcs.