Stack system of PECVD amorphous silicon and PECVD silicon oxide for silicon solar cell rear side passivation

A stack of hydrogenated amorphous silicon (a‐Si) and PECVD‐silicon oxide (SiO_x) has been used as surface passivation layer for silicon wafer surfaces. Very good surface passivation could be reached leading to a surface recombination velocity (SRV) below 10 cm/s on 1 Ω cm p‐type Si wafers. By using the passivation layer system at a solar cell's rear side and applying the laser‐fired contacts (LFC) process, pointwise local rear contacts have been formed and an energy conversion efficiency of 21·7% has been obtained on p‐type FZ substrates (0·5 Ω cm). Simulations show that the effective rear SRV is in the range of 180 cm/s for the combination of metallised and passivated areas, 120 ± 30 cm/s were calculated for the passivated areas. Rear reflectivity is comparable to thermally grown silicon dioxide (SiO₂). a‐Si rear passivation appears more stable under different bias light intensities compared to thermally grown SiO₂. Copyright © 2008 John Wiley & Sons, Ltd.     

19% efficient n‐type Czochralski silicon solar cells with screen‐printed aluminium‐alloyed rear emitter

High and stable lifetimes recently reported for n‐type silicon materials are an important and promising prerequisite for innovative solar cells. To exploit the advantages of the excellent electrical properties of n‐type Si wafers for manufacturing simple and industrially feasible high‐efficiency solar cells, we focus on back junction n⁺np⁺ solar cells featuring an easy‐to‐fabricate full‐area screen‐printed aluminium‐alloyed rear p⁺ emitter. Independently confirmed record‐high efficiencies have been achieved on n‐type phosphorus‐doped Czochralski‐grown silicon material: 18·9% for laboratory‐type n⁺np⁺ solar cells (4 cm²) with shadow‐mask evaporated front contact grid and 17·0% for front and rear screen‐printed industrial‐type cells (100 cm²). The electrical cell parameters were found to be perfectly stable under illumination. Copyright © 2006 John Wiley & Sons, Ltd.     

High‐efficiency solar cells on phosphorus gettered multicrystalline silicon substrates

Measurements of the dislocation density are compared with locally resolved measurements of carrier lifetime for p‐type multicrystalline silicon. A correlation between dislocation density and carrier recombination was found: high carrier lifetimes (>100 µs) were only measured in areas with low dislocation density (<10⁵ cm⁻²), in areas of high dislocation density (>10⁶ cm⁻²) relatively low lifetimes (<20 µs) were observed. In order to remove mobile impurities from the silicon, a phosphorus diffusion gettering process was applied. An increase of the carrier lifetime by about a factor of three was observed in lowly dislocated regions whereas in highly dislocated areas no gettering efficiency was observed. To test the effectiveness of the gettering in a solar cell manufacturing process, five different multicrystalline silicon materials from four manufacturers were phosphorus gettered. Base resistivity varied between 0·5 and 5 Ω cm for the boron‐ and gallium‐doped p‐type wafers which were used in this study. The high‐efficiency solar cell structure, which has led to the highest conversion efficiencies of multicrystalline silicon solar cells to date, was used to fabricate numerous solar cells with aperture areas of 1 and 4 cm². Efficiencies in the 20% range were achieved for all materials with an average value of 18%. Best efficiencies for 1 cm² (20·3%) and 4 cm² (19·8%) cells were achieved on 0·6 and 1·5 Ω cm, respectively. This proves that multicrystalline silicon of very different material specification can yield very high efficiencies if an appropriate cell process is applied. Copyright © 2006 John Wiley & Sons, Ltd.     

Metal aerosol jet printing for solar cell metallization

Metal aerosol jet printing is a new non‐contact direct‐write technique for the front side metallization of highly efficient industrial silicon solar cells. With this technique the first layer of a two‐layer contact structure is created. It features a low contact resistance and good mechanical adhesion to the silicon surface. The second layer is formed by light‐induced silver plating (LIP) to increase the line conductivity. To form the first layer a metal‐containing aerosol is created in the printer and focused via a second surrounding gas stream through a nozzle and deposited onto the substrate. The focussing gas avoids the contact between the aerosol and the nozzle tip. In addition, line widths significantly smaller than the outlet diameter of the nozzle tip can be reached. Fine and continuous lines with a width of 14 µm were printed using a metal organic ink. As the adhesion of these layers was not sufficient, a commercially available screen‐printing paste for solar cell metallization was modified and tested. Monocrystalline silicon solar cells of 12·5 cm × 12·5 cm with an aluminum back surface field were processed, achieving energy conversion efficiencies up to 17·8%. Copyright © 2007 John Wiley & Sons, Ltd.     

A comparative study on cost and life‐cycle analysis for 100 MW very large‐scale PV (VLS‐PV) systems in deserts using m‐Si,a‐Si,CdTe, and CIS modules

This paper is a study of comparisons between five types of 100 MW Very Large‐Scale Photovoltaic Power Generation (VLS‐PV) Systems, from economic and environmental viewpoints. The authors designed VLS‐PV systems using typical PV modules of multi‐crystalline silicon (12·8% efficiency), high efficiency multi‐crystalline silicon (15·8%), amorphous silicon (6·9%), cadmium tellurium (9·0%), and copper indium selenium (11·0%), and evaluated them by Life‐Cycle Analysis (LCA). Cost, energy requirement, and CO₂ emissions were calculated. In addition, the authors evaluated generation cost, energy payback time (EPT), and CO₂ emission rates. As a result, it was found that the EPT is 1·5–2·5 years and the CO₂ emission rate is 9–16 g‐C/kWh. The generation cost was 11–12 US Cent/kWh on using 2 USD/W PV modules, and 19–20 US Cent/kWh on using 4 USD/W PV module price. Copyright © 2007 John Wiley & Sons, Ltd.     

Bifacial silicon solar cells with 21·3% front efficiency and 19·8% rear efficiency

We introduced a triode structure with p–n junctions on both sides into single‐crystalline bifacial silicon solar cells in order to improve solar cell performance. These fabricated bifacial silicon solar cells have an energy conversion efficiency of 21·3% under front 1 sun illumination (the standard 1 kW/m² AM 1·5 global spectrum at 25°C) and 19·8% under rear 1 sun illumination tested at the Japan Quality Assurance Organization. The total of the front and rear conversion efficiencies is the highest ever reported for bifacial silicon solar cells. Copyright © 2000 John Wiley & Sons, Ltd.     

Evaluation of solar energy potential and PV module performance in the Gobi Desert of Mongolia

Here, we present the results of evaluation of solar energy potential and photovoltaic (PV) module performance from actual data measured over a period of more than 2 years in the Gobi Desert of Mongolia. To allow estimation of solar energy potentials and durability of PV systems in the Gobi Desert area, a data acquisition system, including crystalline silicon (c‐Si), polycrystalline silicon (p‐Si) modules, and two sets of precision pyranometers, thermometers, and anemometer, was installed at Sainshand City in October 2002. This system measures 23 parameters, including solar irradiation and meteorological parameters, every 10 min. High output gain was observed due to operation at extremely low ambient temperatures and the module performance ratios (PRs) were high (>1·0) in winter. In summary, the present study showed that a PV module with a high temperature coefficient, such as crystalline silicon, is advantageous for use in the Gobi Desert area. Copyright © 2006 John Wiley & Sons, Ltd.     

Industrial high‐rate (∼5 nm/s) deposited silicon nitride yielding high‐quality bulk and surface passivation under optimum anti‐reflection coating conditions

High‐quality surface and bulk passivation of crystalline silicon solar cells has been obtained under optimum anti‐reflection coating properties by silicon nitride (a‐SiN_x:H) deposited at very high deposition rates of ∼5 nm/s. These a‐SiN_x:H films were deposited using the expanding thermal plasma (ETP) technology under regular processing conditions in an inline industrial‐type reactor with a nominal throughput of 960 solar cells/hour. The low surface recombination velocities (50–70 cm/s) were obtained on p‐type silicon substrates (8·4 Ω cm resistivity) for as‐deposited and annealed films within the broad refractive index range of 1·9–2·4, which covers the optimum bulk passivation and anti‐reflection coating performance reached at a refractive index of ∼2·1. Copyright © 2005 John Wiley & Sons, Ltd.     

Boron‐doped hydrogenated silicon carbide alloys containing silicon nanocrystallites for highly efficient nanocrystalline silicon thin‐film solar cells

Boron‐doped hydrogenated silicon carbide alloys containing silicon nanocrystallites (p‐nc‐SiC:H) were prepared using a plasma‐enhanced chemical vapor deposition system with a mixture of CH₄, SiH₄, B₂H₆ and H₂ gases. The influence of hydrogen dilution on the material properties of the p‐nc‐SiC:H films was investigated, and their roles as window layers in hydrogenated nanocrystalline silicon (nc‐Si:H) solar cells were examined. By increasing the R_H (H₂/SiH₄) ratio from 90 to 220, the Si―C bond density in the p‐nc‐SiC:H films increased from 5.20 × 10¹⁹ to 7.07 × 10¹⁹/cm³, resulting in a significant increase of the bandgap from 2.09 to 2.23 eV in comparison with the bandgap of 1.95 eV for p‐nc‐Si:H films. For the films deposited at a high R_H ratio, the Si nanocrystallites with a size of 3–15 nm were formed in the amorphous SiC:H matrix. The Si nanocrystallites played an important role in the enhancement of vertical charge transport in the p‐nc‐SiC:H films, which was verified by conductive atomic force microscopy measurements. When the p‐nc‐SiC:H films deposited at R_H = 220 were applied in the nc‐Si:H solar cells, a high conversion efficiency of 8.26% (V_oc = 0.53 V, J_sc = 23.98 mA/cm² and FF = 0.65) was obtained compared to 6.36% (V_oc = 0.44 V, J_sc = 21.90 mA/cm² and FF = 0.66) of the solar cells with reference p‐nc‐Si:H films. Further enhancement in the cell performance was achieved using p‐nc‐SiC:H bilayers consisting of highly doped upper layers and low‐level doped bottom layers, which led to the increased conversion efficiency of 9.03%. Copyright © 2015 John Wiley & Sons, Ltd.     

Comparison of boron- and gallium-doped p-type Czochralski silicon for photovoltaic application

A set of p-type Czochralski (Cz) silicon materials grown by Shin-Etsu Handotai was used for a comprehensive investigation, including carrier lifetime measurements and fabrication of high-efficiency solar cells at Fraunhofer ISE. The set of different materials consists of gallium and boron doped wafers grown with the Cz method and boron doped wafers grown with the magnetic Czochralski (MCz) method. A clear correlation of the Cz-specific lifetime degradation and the concentration of boron and interstitial oxygen was observed. Thus, gallium-doped wafers with a high concentration of interstitial oxygen of 13·7 ppm showed no degradation. Excellent stable lifetimes of 1098 μs and 862 μs were determined for boron-doped MCz wafers and for gallium-doped Cz wafers, respectively. This high lifetime level was maintained or even improved throughout the cell process optimized for Cz silicon and record efficiencies of 22·7% and 22·5% were achieved for boron-doped MCz silicon and gallium-doped Cz silicon, respectively. Copyright © 1999 John Wiley & Sons, Ltd.     

Simulation and fabrication of heterojunction silicon solar cells from numerical computer and hot‐wire CVD

In this paper, we will present a Pc1D numerical simulation for heterojunction (HJ) silicon solar cells, and discuss their possibilities and limitations. By means of modeling and numerical computer simulation, the influence of emitter‐layer/intrinsic‐layer/crystalline‐Si heterostructures with different thickness and crystallinity on the solar cell performance is investigated and compared with hot wire chemical vapor deposition (HWCVD) experimental results. A new technique for characterization of n‐type microcrystalline silicon (n‐µc‐Si)/intrinsic amorphous silicon (i‐a‐Si)/crystalline silicon (c‐Si) heterojunction solar cells from Pc1D is developed. Results of numerical modeling as well as experimental data obtained using HWCVD on µc‐Si (n)/a‐Si (i)/c‐Si (p) heterojunction are presented. This work improves the understanding of HJ solar cells to derive arguments for design optimization. Some simulated parameters of solar cells were obtained: the best results for J_sc = 39·4 mA/cm², V_oc = 0·64 V, FF = 83%, and η = 21% have been achieved. After optimizing the deposition parameters of the n‐layer and the H₂ pretreatment of solar cell, the single‐side HJ solar cells with J_sc = 34·6 mA/cm², V_oc = 0·615 V, FF = 71%, and an efficiency of 15·2% have been achieved. The double‐side HJ solar cell with J_sc = 34·8 mA/cm², V_oc = 0·645 V, FF = 73%, and an efficiency of 16·4% has been fabricated. Copyright © 2009 John Wiley & Sons, Ltd.     

Autodiffusion: a novel method for emitter formation in crystalline silicon thin‐film solar cells

The in situ formation of an emitter in monocrystalline silicon thin‐film solar cells by solid‐state diffusion of dopants from the growth substrate during epitaxy is demonstrated. This approach, that we denote autodiffusion, combines the epitaxy and the diffusion into one single process. Layer‐transfer with porous silicon (PSI process) is used to fabricate n‐type silicon thin‐film solar cells. The cells feature a boron emitter on the cell rear side that is formed by autodiffusion. The sheet resistance of this autodiffused emitter is 330 Ω/□. An independently confirmed conversion efficiency of (14·5 ± 0·4)% with a high short circuit current density of (33·3 ± 0·8) mA/cm² is achieved for a 2 × 2 cm² large cell with a thickness of (24 ± 1) µm. Transferred n‐type silicon thin films made from the same run as the cells show effective carrier lifetimes exceeding 13 µs. From these samples a bulk diffusion length L > 111 µm is deduced. Amorphous silicon is used to passivate the rear surface of these samples after the layer‐transfer resulting in a surface recombination velocity lower than 38 cm/s. Copyright © 2006 John Wiley & Sons, Ltd.     

24·5% Efficiency silicon PERT cells on MCZ substrates and 24·7% efficiency PERL cells on FZ substrates

This paper reports the recent improvements in the energy conversion efficiencies of solar cells on magnetically-confined Czochralski grown (MCZ) and float zone (FZ) silicon substrates at the University of New South Wales. A PERT (passivated emitter, rear totally-diffused) cell structure has been used to reduce the cell series resistance from higher resistivity substrates. The total rear boron diffusion in this PERT structure appears to improve the surface passivation quality of MCZ and some FZ substrates. Hence, higher open-circuit voltages were observed for some PERT cells. One of these cells on MCZ substrates demonstrated 24·5% energy conversion efficiency at Sandia National Laboratories under the standard global spectrum (100 mW/cm²) at 25°C. This is the highest efficiency ever reported for a MCZ silicon solar cell. The cells made on MCZ substrates also showed stable cell performance rather than the usually reported unstable performance for boron-doped CZ substrates. Also reported is a PERL (passivated emitter, rear locally-diffused) cell on a FZ substrate of 24·7% efficiency, which is the highest efficiency ever reported for any silicon solar cell. Copyright © 1999 John Wiley & Sons, Ltd.     

Electron‐beam crystallized large grained silicon solar cell on glass substrate

Thin film hetero‐emitter solar cells with large‐grained poly‐silicon absorbers of around 10 µm thickness have been prepared on glass. The basis of the cell concept is electron‐beam‐crystallization of an amorphous or nanocrystalline silicon layer deposited onto a SiC:B layer. The SiC:B layer covers a commercially well available glass substrate, serving as diffusion barrier, contact layer and dopand source. For silicon absorber deposition a low pressure chemical vapour deposition was used. The successively applied e‐beam crystallization process creates poly‐silicon layers with grain sizes up to 1 × 10 mm² with low defect densities. The high electronic quality of the absorber is reflected in open circuit voltages as high as 545 mV, which are realized making use of the well‐developed a‐Si:H hetero‐emitter technology. Copyright © 2011 John Wiley & Sons, Ltd.     

RIE‐induced carrier lifetime degradation

Reactive Ion Etching (RIE) is used in the fabrication of some types of solar cells to achieve a highly directional etch. However, cells fabricated using RIE have lower than expected efficiency, possibly caused by increased carrier recombination. Characterisation of the carrier lifetime in solar cells was conducted using the quasi steady state photoconductance (QSSPC) measurement technique. Substantial effective lifetime degradation was observed for silicon samples processed by RIE. Lifetime degradation for samples where RIE etches into silicon is found to be permanent, while for samples where RIE etches only on dielectric layers of SiO₂ grown on the wafer, the lifetime degradation is found to be reversible. The reversible degradation in RIE‐processed samples is associated with radiation damage. By reducing the proportion of a wafer exposed to RIE, the degradation of the effective lifetime of RIE‐etched silicon samples can be minimised, and the performance of silicon solar cells can be improved significantly. Copyright © 2010 John Wiley & Sons, Ltd.     

Electrical properties of fine line printed and light‐induced plated contacts on silicon solar cells

The properties of fine‐line printed contacts on silicon solar cells, in combination with light‐induced plating (LIP), are presented. The seed layers are printed using an aerosol system and a new metallization ink called SISC developed at Fraunhofer ISE. The influence of multiple layer printing on the contact geometry is studied as well as the influence of the contact height on the line resistivity and on the contact resistance. The dependence between contact resistance and contact height is measured using the transfer length model (TLM). Further on, it is explained by taking SEM images of the metal–semiconductor interface, that a contact height of less than 1 µm or a minimum ink amount of only 4–6 mg is sufficient to contact a large area (15·6 cm × 15·6 cm) silicon solar cell on the front side and results in a contact resistance R_c × W < 0·5 Ω cm. As the line resistivity of fine‐line printed fingers needs to be reduced by LIP, three different plating solutions are tested on solar cells. The observed differences in line resistivity between ρ_f = 5 × 10⁻⁸ and 2 × 10⁻⁸ Ω m are explained by taking SEM pictures of the grown LIP‐silver. Finally, the optimum LIP height for different line resistivities is calculated and experimentally confirmed by processing solar cells with an increasing amount of LIP silver. Copyright © 2010 John Wiley & Sons, Ltd.     

Effect of low segregation coefficient on Ga‐doped multicrystalline silicon solar cell performance

High‐quality Ga‐doped ingots are grown in different casting furnaces at optimized growth parameters; 3·5 kg ingots exhibit normal distribution of diffusion lengths along their height with very high diffusion lengths at the center of the ingot. Effective lifetimes as high as 1·1 ms are realized in 10 Ω cm Ga‐doped wafers after proper P‐diffusion and hydrogen passivation. Average effective lifetimes above 400 µs are also realized after P‐diffusion and hydrogen passivation for Ga‐doped wafers cut from 75 kg ingot where the response to P‐diffusion and hydrogen passivation is pronounced. High effective lifetimes are realized over the whole ingot with minimum values of 20 µs at the top of the ingot, indicating the possible use of about 85% of the ingot for solar cell production. Conversion efficiencies above 15·5% were realized in utilizing more than 80% of the ingot. High efficiencies of about 16% were realized in wafers with resistivities higher than 5 Ω cm p ‐type multicrystalline silicon wafers. Copyright © 2005 John Wiley & Sons, Ltd.     

Boron‐doped selective silicon epitaxy: high efficiency and process simplification in interdigitated back contact cells

The present research and development activities in crystalline silicon photovoltaics include the exploration of doping technologies alternative to the mainstream diffusion process. The goal is to identify those technologies with potential to increase the solar cell efficiency and reduce the cost per watt peak. In that respect, this work presents the selective epitaxial growth of silicon as a candidate for boron doping; showing the results of the evaluation of boron‐doped silicon epitaxial emitters on slurry and diamond‐coated wire‐sliced Czochralski material, their integration in interdigitated back contact solar cells, and the development of a novel process sequence to create the interdigitated rear junction of these devices using selective epitaxial growth. Boron‐doped silicon epitaxy is demonstrated to perform in the high efficiency range (>22%), and the use of selective epitaxial growth is proposed as a route for the simplification of the interdigitated back contact solar cell flow. Copyright © 2013 John Wiley & Sons, Ltd.     

Purification of metallurgical‐grade silicon up to solar grade

An estimate has been made of the feasibility of a metallurgical purification process, the NEDO (New Energy and Industrial Technology Development Organization) melt‐purification process, for manufacturing solar‐grade silicon from metallurgical‐grade silicon. Equipment has been developed to pilot manufacturing plant scale. The system comprises an electron‐beam furnace for phosphorus removal and a plasma furnace for boron removal. Each furnace has a mold for directional solidification to remove metallic impurities. The concentration of each impurity in the silicon ingot purified through the whole process satisfied the solar‐grade level. The Solar‐grade silicon produced showed p‐type polarity and resistivity within the range 0·5–1·5 Ω cm. Copyright © 2001 John Wiley & Sons, Ltd.