Electrical properties of fine line printed and light‐induced plated contacts on silicon solar cells

The properties of fine‐line printed contacts on silicon solar cells, in combination with light‐induced plating (LIP), are presented. The seed layers are printed using an aerosol system and a new metallization ink called SISC developed at Fraunhofer ISE. The influence of multiple layer printing on the contact geometry is studied as well as the influence of the contact height on the line resistivity and on the contact resistance. The dependence between contact resistance and contact height is measured using the transfer length model (TLM). Further on, it is explained by taking SEM images of the metal–semiconductor interface, that a contact height of less than 1 µm or a minimum ink amount of only 4–6 mg is sufficient to contact a large area (15·6 cm × 15·6 cm) silicon solar cell on the front side and results in a contact resistance R_c × W < 0·5 Ω cm. As the line resistivity of fine‐line printed fingers needs to be reduced by LIP, three different plating solutions are tested on solar cells. The observed differences in line resistivity between ρ_f = 5 × 10⁻⁸ and 2 × 10⁻⁸ Ω m are explained by taking SEM pictures of the grown LIP‐silver. Finally, the optimum LIP height for different line resistivities is calculated and experimentally confirmed by processing solar cells with an increasing amount of LIP silver. Copyright © 2010 John Wiley & Sons, Ltd.     

Fine line printed silicon solar cells exceeding 20% efficiency

Silicon solar cells with passivated rear side and laser‐fired contacts were produced on float zone material. The front side contacts are built up in two steps, seed and plate. The seed layer is printed using an aerosol jet printer and a silver ink. After firing this seed layer through the silicon nitride layer, the conductive layer is grown by light induced plating. The contact formation is studied on different emitter sheet resistances, 55 Ω/sq, 70 Ω/sq, and on 110 Ω/sq. These emitters are passivated with a PECVD silicon nitride layer which also acts as an anti‐reflection coating. Even on the 110 Ω/sq emitters it was possible to reach a fill factor of 80·1%. The electrical properties i.e., the contact resistance of the front side contacts are studied by transfer length model (TLM) measurements. On a cell area of 4 cm² and emitter sheet resistance of 110 Ω/sq, a record efficiency of 20·3% was achieved. Excellent open‐circuit voltage (V_oc) and short‐circuit current (j_sc) values of 661 mV and 38·4 mA/cm² were obtained due to the low recombination in the 110 Ω/sq emitter and at the passivated rear surface. These results show impressively that it is possible to contact emitter profiles with a very high efficiency potential using optimized printing technologies. Copyright © 2008 John Wiley & Sons, Ltd.     

Low Resistance Contacts to p-CulnSe2 and p-CdTe Crystals

Room temperature formation of ohmic contacts by electroplating gold on chemically treated surfaces of p-CuInSe₂ and p-CdTe single crystals is reported. The effect of Br₂/methanol and KOH+KCN+H₂O treatments prior to plating was analyzed in the case of CuInSe₂. It is shown that the former treatment yields better ohmic contacts, with lower contact resistance, than the latter. While annealing these contacts made them highly non-ohmic, the method gives reasonably ohmic contacts on surfaces, that were purposely oxidized prior to contact preparation. In the case of p-CdTe stable, low resistance ohmic contacts were obtained at room temperature by electrochemical diffusion of Hg from solution, prior to gold plating. The treatment forms a highly degenerated p^+- HgCdTe layer. The contacts, which have a very low contact to bulk resistivity ratio, were further improved by vacuum annealing.     

High efficiency large area n‐type front junction silicon solar cells with boron emitter formed by screen printing technology

In this paper, we report on commercially viable screen printing (SP) technology to form boron emitters. A screen‐printed boron emitter and ion‐implanted phosphorus back surface field were formed simultaneously by a co‐annealing process. Front and back surfaces were passivated by chemically grown oxide capped with plasma‐enhanced chemical vapor deposition silicon nitride stack. Front and back contacts were formed by traditional SP and firing processes with silver/aluminum grid on front and local silver back contacts on the rear. This resulted in 19.6% efficient large area (239 cm²) n‐type solar cells with an open‐circuit voltage V_oc of 645 mV, short‐circuit current density J_sc of 38.6 mA/cm², and fill factor of 78.6%. This demonstrates the potential of this novel technology for production of low‐cost high‐efficiency n‐type silicon solar cells. Copyright © 2014 John Wiley & Sons, Ltd.     

Simultaneous Modification of Bottom‐Contact Electrode and Dielectric Surfaces for Organic Thin‐Film Transistors Through Single‐Component Spin‐Cast Monolayers

An efficient process is developed by spin‐coating a single‐component, self‐assembled monolayer (SAM) to simultaneously modify the bottom‐contact electrode and dielectric surfaces of organic thin‐film transistors (OTFTs). This effi cient interface modifi cation is achieved using n‐alkyl phosphonic acid based SAMs to prime silver bottom‐contacts and hafnium oxide (HfO₂) dielectrics in low‐voltage OTFTs. Surface characterization using near edge X‐ray absorption fi ne structure (NEXAFS) spectroscopy, X‐ray photoelectron spectroscopy (XPS), attenuated total reflectance Fourier transform infrared (ATR‐FTIR) spectroscopy, atomic force microscopy (AFM), and spectroscopic ellipsometry suggest this process yields structurally well‐defi ned phosphonate SAMs on both metal and oxide surfaces. Rational selection of the alkyl length of the SAM leads to greatly enhanced performance for both n‐channel (C₆₀) and p‐channel (pentacene) based OTFTs. Specifi cally, SAMs of n‐octylphos‐phonic acid (OPA) provide both low‐contact resistance at the bottom‐contact electrodes and excellent interfacial properties for compact semiconductor grain growth with high carrier mobilities. OTFTs based on OPA modifi ed silver electrode/HfO₂ dielectric bottom‐contact structures can be operated using < 3V with low contact resistance (down to 700 Ohm‐cm), low subthreshold swing (as low as 75 mV dec^?1), high on/off current ratios of 107, and charge carrier mobilities as high as 4.6 and 0.8 cm² V^?1 s^?1, for C60 and pentacene, respectively. These results demonstrate that this is a simple and efficient process for improving the performance of bottom‐contact OTFTs.     

Organic Thin‐Film Transistors: Simultaneous Modification of Bottom‐Contact Electrode and Dielectric Surfaces for Organic Thin‐Film Transistors Through Single‐Component Spin‐Cast Monolayers (Adv. Funct. Mater. 8/2011)

An efficient process is developed by spin‐coating a single‐component, self‐assembled monolayer (SAM) to simultaneously modify the bottom‐contact electrode and dielectric surfaces of organic thin‐film transistors (OTFTs). This effi cient interface modifi cation is achieved using n‐alkyl phosphonic acid based SAMs to prime silver bottom‐contacts and hafnium oxide (HfO₂) dielectrics in low‐voltage OTFTs. Surface characterization using near edge X‐ray absorption fi ne structure (NEXAFS) spectroscopy, X‐ray photoelectron spectroscopy (XPS), attenuated total reflectance Fourier transform infrared (ATR‐FTIR) spectroscopy, atomic force microscopy (AFM), and spectroscopic ellipsometry suggest this process yields structurally well‐defi ned phosphonate SAMs on both metal and oxide surfaces. Rational selection of the alkyl length of the SAM leads to greatly enhanced performance for both n‐channel (C₆₀) and p‐channel (pentacene) based OTFTs. Specifi cally, SAMs of n‐octylphos‐phonic acid (OPA) provide both low‐contact resistance at the bottom‐contact electrodes and excellent interfacial properties for compact semiconductor grain growth with high carrier mobilities. OTFTs based on OPA modifi ed silver electrode/HfO₂ dielectric bottom‐contact structures can be operated using < 3V with low contact resistance (down to 700 Ohm‐cm), low subthreshold swing (as low as 75 mV dec^?1), high on/off current ratios of 107, and charge carrier mobilities as high as 4.6 and 0.8 cm² V^?1 s^?1, for C60 and pentacene, respectively. These results demonstrate that this is a simple and efficient process for improving the performance of bottom‐contact OTFTs.     

Orders‐of‐Magnitude Reduction of the Contact Resistance in Short‐Channel Hot Embossed Organic Thin Film Transistors by Oxidative Treatment of Au‐Electrodes

In this study we report on the optimization of the contact resistance by surface treatment in short‐channel bottom‐contact OTFTs based on pentacene as semiconductor and SiO₂ as gate dielectric. The devices have been fabricated by means of nanoimprint lithography with channel lengths in the range of 0.3 μm < L < 3.0 μm. In order to reduce the contact resistance the Au source‐ and drain‐contacts were subjected to a special UV/ozone treatment, which induced the formation of a thin AuO_x layer. It turned out, that the treatment is very effective (i) in decreasing the hole‐injection barrier between Au and pentacene and (ii) in improving the morphology of pentacene on top of the Au contacts and thus reducing the access resistance of carriers to the channel. Contact resistance values as low as 80 Ω cm were achieved for gate voltages well above the threshold. In devices with untreated contacts, the charge carrier mobility shows a power‐law dependence on the channel length, which is closely related to the contact resistance and to the grain‐size of the pentacene crystallites. Devices with UV/ozone treated contacts of very low resistance, however, exhibit a charge carrier mobility in the range of 0.3 cm² V^–1 s^–1 < μ < 0.4 cm² V^–1 s^–1 independent of the channel length.     

Microstructural analysis of NiInGe ohmic contacts for n-type GaAs

NiInGe ohmic contact materials, which are attractive to use in future GaAs devices, were previously developed in our laboratories. Although the NiInGe contacts provided low contact resistances of about 0.3 Ω-mm and excellent thermal stability, further reduction of the contact resistance (R_C) of the NiInGe contacts was mandatory to use these contacts in submicron devices. In this paper, the microstructural parameters, which influence the R_C values, were investigated by correlating the R_C values with the microstructure at the interface between the contact materials and the GaAs substrate. The R_C values of the NiInGe contacts were found to depend strongly on the volume fraction and the In concentration (x) of the In_xGa_1−xAs compound semiconductor layers, which were formed at the metal/GaAs interface. Both the volume fraction and the In concentration of the In_xGa_1−xAs layers were found to depend on the thickness of the In layer used in the NiInGe contact and the annealing temperature to form the ohmic contact. A R_C value of 0.18 Ω-mm was obtained for the Ni (18 nm)/In (13 nm)/Ge (30 nm) contact (where a slash “/” indicates the deposition sequence) after annealing at temperature of 650°C for 5 sec.     

Enhanced Performance of Fullerene n‐Channel Field‐Effect Transistors with Titanium Sub‐Oxide Injection Layer

Enhanced performance of n‐channel organic field‐effect transistors (OFETs) is demonstrated by introducing a titanium sub‐oxide (TiO_x) injection layer. The n‐channel OFETs utilize [6,6]‐phenyl‐C₆₁ butyric acid methyl ester (PC₆₁BM) or [6,6]‐phenyl‐C₇₁ butyric acid methyl ester (PC₇₁BM) as the semiconductor in the channel. With the TiO_x injection layer, the electron mobilities of PC₆₁BM and PC₇₁BM FET using Al as source/drain electrodes are comparable to those obtained from OFETs using Ca as the source/drain electrodes. Direct measurement of contact resistance (R_c) shows significantly decreased R_c values for FETs with the TiO_x layer. Ultraviolet photoelectron spectroscopy (UPS) studies demonstrate that the TiO_x layer reduces the electron injection barrier because of the relatively strong interfacial dipole of TiO_x. In addition to functioning as an electron injection layer that eliminates the contact resistance, the TiO_x layer acts as a passivation layer that prevents penetration of O₂ and H₂O; devices with the TiO_x injection layer exhibit a significant improvement in lifetime when exposed to air.     

Metal aerosol jet printing for solar cell metallization

Metal aerosol jet printing is a new non‐contact direct‐write technique for the front side metallization of highly efficient industrial silicon solar cells. With this technique the first layer of a two‐layer contact structure is created. It features a low contact resistance and good mechanical adhesion to the silicon surface. The second layer is formed by light‐induced silver plating (LIP) to increase the line conductivity. To form the first layer a metal‐containing aerosol is created in the printer and focused via a second surrounding gas stream through a nozzle and deposited onto the substrate. The focussing gas avoids the contact between the aerosol and the nozzle tip. In addition, line widths significantly smaller than the outlet diameter of the nozzle tip can be reached. Fine and continuous lines with a width of 14 µm were printed using a metal organic ink. As the adhesion of these layers was not sufficient, a commercially available screen‐printing paste for solar cell metallization was modified and tested. Monocrystalline silicon solar cells of 12·5 cm × 12·5 cm with an aluminum back surface field were processed, achieving energy conversion efficiencies up to 17·8%. Copyright © 2007 John Wiley & Sons, Ltd.     

Tuning Interfacial Properties by Spontaneously Generated Organic Interlayers in Top‐Contact‐Structured Organic Transistors

Controlling the interfacial properties between the electrode and active layer in organic field‐effect transistors (OFETs) can significantly affect their contact properties, resulting in improvements in device performance. However, it is difficult to apply to top‐contact‐structured OFETs (one of the most useful device structures) because of serious damage to the organic active layer by exposing solvent. Here, a spontaneously controlled approach is explored for optimizing the interface between the top‐contacted source/drain electrode and the polymer active layer to improve the contact resistance (R_C). To achieve this goal, a small amount of interface‐functionalizing species is blended with the p‐type polymer semiconductor and functionalized at the interface region at once through a thermal process. The R_C values dramatically decrease after introduction of the interfacial functionalization to 15.9 kΩ cm, compared to the 113.4 kΩ cm for the pristine case. In addition, the average field‐effect mobilities of the OFET devices increase more than three times, to a maximum value of 0.25 cm² V^?1 s^?1 compared to the pristine case (0.041 cm² V^?1 s^?1), and the threshold voltages also converge to zero. This study overcomes all the shortcomings observed in the existing results related to controlling the interface of top‐contact OFETs by solving the discomfort of the interface optimization process.     

Impact of excess phosphorus doping and Si crystalline defects on Ag crystallite nucleation and growth in silver screen‐printed Si solar cells

Good quality contacts between metal and silicon emitter are crucial for high crystalline solar cell efficiencies. We investigate the impact of defects originating from electrically inactive phosphorus on contact formation within silver thick film metallized silicon solar cells. For this purpose, emitters with varying sheet resistance, depth, and dead layer were metallized with silver pastes from different generations. Macroscopic contact resistivity measurements were compared with the microscopic contact configurations studied by scanning electron microscopy. The density of direct contacts between Ag crystallites grown into Si and the Ag finger bulk is essential for low contact resistivity. The presence of glass‐free regions needed for such direct contacts depends on the paste composition and on the surface texture, and does not vary with the Si emitter properties. Indeed, the decrease in contact resistivity correlates with increasing density of Ag crystallites embedded in the Si surface. Furthermore, the density of Si surface‐embedded Ag crystallites scales proportional to the electrically inactive P and is independent of the sheet resistance. Using the newest silver paste, the Ag crystallite density is independent of the emitter doping, but the Ag crystallite size increases as a function of the thickness of the dead layer. Transmission electron microscopy characterization of the excess P‐doped Si crystal lattice shows that significant strain and Si bond weakening may play a major role for both Ag crystallite nucleation and growth. Finally, we studied Si crystal defects by metallizing nanocracks, dislocations, and grain boundaries and found that Ag crystallite nucleation is defect‐property dependent. Copyright © 2013 John Wiley & Sons, Ltd.     

Modeling the potential of screen printed front junction CZ silicon solar cell with tunnel oxide passivated back contact

Carrier selective passivated contacts composed of thin oxide, n + polycrystalline Si and metal on top of a n‐Si absorber can significantly lower the recombination current density (J_orear ≤8 fA/cm²) under the contact while providing excellent specific contact resistance (5–10 mΩ‐cm²); 25.1% efficient small area cells with photolithography front contacts on boron doped selective emitter and Fz wafers have been achieved by Fraunhofer ISE using their tunnel oxide passivated contact (TOPCon) approach. This paper shows a methodology to model such passivated contact cells using Sentaurus device model, which involves replacing the TOPCon region by carrier selective electron and hole recombination velocities to match the measured J_orear of the TOPCon region as well as all the light IV values of the cell. We first validated the methodology by modeling a 24.9% reference cell. The model was then extended to assess the efficiency potential of large area TOPCon cells on commercial grade n‐type Cz material with screen‐printed front contacts. To use realistic input parameters, a 21% n‐type PERT cell was fabricated on Cz wafer (5 Ω‐cm, 1.5‐ms lifetime). Modeling showed that the cell efficiency will improve to only 21.6% if the back of this cell is replaced by the above TOPCon, and the performance is limited by the homogenous emitter. Efficiency was then modeled to improve to 22.6% with the implementation of selective emitter (150/20 Ω/sq). Finally, it is shown that screen printing of 40‐µm‐wide lines and improved bulk material (10 Ω‐cm, 3‐ms lifetime) can raise the single side TOPCon Cz cell efficiency to 23.2%. Copyright © 2016 John Wiley & Sons, Ltd.     

Thermal oxidation for crystalline silicon solar cells exceeding 19% efficiency applying industrially feasible process technology

Thermal oxides are commonly used for the surface passivation of high‐efficiency silicon solar cells from mono‐ and multicrystalline silicon and have led to the highest conversion efficiencies reported so far. In order to improve the cost‐effectiveness of the oxidation process, a wet oxidation in steam ambience is applied and experimentally compared to a standard dry oxidation. The processes yield identical physical properties of the oxide. The front contact is created using a screen‐printing process of a hotmelt silver paste in combination with light‐induced silver plating. The contact formation on the front requires a short high‐temperature firing process, therefore the thermal stability of the rear surface passivation is very important. The surface recombination velocity of the fired oxide is experimentally determined to be below S ≤ 38 cm/s after annealing with a thin layer of evaporated aluminium on top. Monocrystalline solar cells are produced and 19·3% efficiency is obtained as best value on 4 cm² cell area. Simulations show the potential of the developed process to approach 20% efficiency. Copyright © 2008 John Wiley & Sons, Ltd.     

Selective laser ablation of SiNx layers on textured surfaces for low temperature front side metallizations

For an alternative front side metallization process without screen printing of metal paste the selective opening of the front surface anti‐reflection coating could be realized by laser ablation. A successful implementation of this scheme requires direct absorption of the laser light within the anti‐reflection coating, since the emitter underneath must not be damaged severely. Additionally, the ablation must be feasible on textured surfaces. In this paper, we show that laser light with a wavelength of 355 nm and a pulse length of approximately 30 ns is absorbed directly by a typical silicon nitride anti‐reflection coating. Based on lifetime measurements on ablated samples it is shown that a damage free laser ablation of SiN_x layers on planar surfaces is possible. The characteristic ablation structure on textured surfaces is explained and quantified by rigorous coupled wave analysis (RCWA) simulations. Finally, high efficiency solar cells with a standard emitter (R_sh approx. 50 Ω/sq) have been processed using laser ablation of the silicon nitride anti‐reflection coating. These cells show efficiencies of up to 19·1%, comparable to the reference solar cells using photolithographically opened contact areas. Copyright © 2008 John Wiley & Sons, Ltd.     

The formation of low resistance electrical contacts to shallow junction InP devices without compromising emitter integrity

An investigation is made into the possibility of providing low resistance contacts to shallow junction InP devices which do not require sintering and which do not cause device degradation even when subjected to extended annealing at elevated temperatures. We show that the addition of In to Au contacts in amounts that exceed the solid solubility limit lowers the as-fabricated (unsintered) contact resistivityR _c to the 10^-5 ohm-cm² range. If the In content is made to correspond exactly to that required to form the intermediate compound Au₉ln₄, then the contacts so formed are stable, both electrically and metallurgically, even after extended annealing (12 hr) at 400° C. We next consider the contact system Au/Au₂P₃ which has been shown to exhibit as-fabricatedR _c values in the 10^-6 ohm-cm² range, but which fails quickly when heated. We show that the substitution of a refractory metal (W, Ta) for Au preserves the lowR _c values while preventing the destructive reactions that would normally take place in this system at high temperatures. We show, finally, thatR _c values in the 10 ohm-cm² range can be achievedwithout sintering by combining the effects of In or Ga additions to Au contacts with the effects of introducing a thin Au₂P₃ layer at the metal-InP interface.     

Temperature dependence of contact resistance for Au-Ti-Pd<Subscript>2</Subscript>Si-<Emphasis Type="Italic">n</Emphasis><Superscript>+</Superscript>-Si ohmic contacts subjected to microwave irradiation

Based on a theoretical analysis of the temperature dependence of the contact resistance R _c for an Au-Ti-Pd₂Si-n ⁺-Si ohmic contact, a current-transfer mechanism explaining the experimentally observed increase in R _c in the temperature range 100–380 K is proposed. It is shown that microwave treatment of such contacts results in a decrease in the spread of R _c over the wafer and a decrease in the value of R _c whilst retaining an increase in R _c in the temperatures range 100–380 K.     

Analysis of industrial c‐Si solar cell's front metallization by advanced numerical simulation

The influence of the front metallization on the performance of industrially fabricated c‐Si solar cells is quantified by means of a combination of optical, semiconductor, and circuit modeling. Special attention is given to the front metallization of conventionally processed emitters. First, we verify our model by reproducing the measured I–V curves of industrially fabricated cells. Based on this, the potential changes in performance are predicted by variations in finger spacing, finger resistivity, busbar numbers, and contact resistivity. We also assess the benefits derived from the higher aspect ratios of the fingers: if the fingers are 120 (or 60 µm) wide, increasing the finger height from 15 to 25 µm increases their efficiency by 0.06% (or 0.7%) absolute if a conventional emitter is used. This implies that, if the fingers cannot be made as narrow as 60 µm in industrial mass production, the economic gains from higher aspect ratios may be rather limited, because there is a trade‐off between improved cell efficiency and the increasing cost of silver. Simulations show that, for the light‐induced plating approach, the seed layer must be made as narrow as 50 µm in order to achieve an efficiency gain of 1% absolute with a plating of 10 µm silver. Copyright © 2011 John Wiley & Sons, Ltd.     

Co‐Percolating Graphene‐Wrapped Silver Nanowire Network for High Performance,Highly Stable,Transparent Conducting Electrodes

Transparent conducting electrodes (TCEs) require high transparency and low sheet resistance for applications in photovoltaics, photodetectors, flat panel displays, touch screen devices and imagers. Indium tin oxide (ITO), or other transparent conductive oxides, have typically been used, and provide a baseline sheet resistance (R_S) vs. transparency (T) relationship. However, ITO is relatively expensive (due to limited abundance of Indium), brittle, unstable, and inflexible; moreover, ITO transparency drops rapidly for wavelengths above 1000 nm. Motivated by a need for transparent conductors with comparable (or better) R_S at a given T, as well as flexible structures, several alternative material systems have been investigated. Single‐layer graphene (SLG) or few‐layer graphene provide sufficiently high transparency (≈97% per layer) to be a potential replacement for ITO. However, large‐area synthesis approaches, including chemical vapor deposition (CVD), typically yield films with relatively high sheet resistance due to small grain sizes and high‐resistance grain boundaries (HGBs). In this paper, we report a hybrid structure employing a CVD SLG film and a network of silver nanowires (AgNWs): R_S as low as 22 Ω/□ (stabilized to 13 Ω/□ after 4 months) have been observed at high transparency (88% at λ = 550 nm) in hybrid structures employing relatively low‐cost commercial graphene with a starting R_S of 770 Ω/□. This sheet resistance is superior to typical reported values for ITO, comparable to the best reported TCEs employing graphene and/or random nanowire networks, and the film properties exhibit impressive stability under mechanical pressure, mechanical bending and over time. The design is inspired by the theory of a co‐percolating network where conduction bottlenecks of a 2D film (e.g., SLG, MoS₂) are circumvented by a 1D network (e.g., AgNWs, CNTs) and vice versa. The development of these high‐performance hybrid structures provides a route towards robust, scalable and low‐cost approaches for realizing high‐performance TCE.     

Series resistance characterization of industrial silicon solar cells with screen‐printed contacts using hotmelt paste

This work presents the results of a detailed series resistance characterization of silicon solar cells with screen‐printed front contacts using hotmelt silver paste. Applying the hotmelt technology energy conversion efficiencies up to 18·0% on monocrystalline wafers with a size of 12·5 cm × 12·5 cm have been achieved, an increase of 0·3% absolute compared to cells with conventional screen‐printed contacts. This is mainly due to the reduction in the finger resistance to values as low as 14 Ω/m, which reduces the series resistance of the solar cell significantly. To retrieve the lumped series resistance as accurately as possible under the operating condition, different determination methods have been analyzed. Methods under consideration were fitting of the two‐diode equation function to a dark IV‐curve, integration of the area A under an IV‐curve, comparison of a j_sc–V_oc with a one‐sun IV‐curve, comparison of the j_sc and V_oc points of a shaded curve with the one‐sun IV‐curve as well as comparison of a dark IV‐curve with a one‐sun IV‐curve, and comparison of IV‐curves measured at different light intensities. The performed investigations have shown that the latter four methods all resulted in reliable series resistance values. Copyright © 2007 John Wiley & Sons, Ltd.