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1.
In this work, poly(amide‐amidic acid) (PAA) was used to modify tetraglycidyl 4,4′‐diaminodiphenylmethane (TGDDM)/4,4′‐diaminodiphenylsulfone (DDS) system. Results of non‐isothermal differential scanning calorimetry analysis indicated that PAA played a role of catalyst during the process of the curing reaction. The curing mechanism was studied by Fourier transform infrared spectroscopy, showing that the PAA acted as a co‐curing agent in the system. The glass transition temperature decreased firstly and then increased with the increase of the PAA content. PAA equally rendered TGDDM more fire resistant with higher char yield. On examining the fracture surface morphology using scanning electron microscopy, it was observed that there was no obvious phase separation when the content of PAA was less than 20 phr (per hundred weight of TGDDM/DDS resin), however, phase separation was observed when the content of PAA was 25 and 30 phr. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013  相似文献   

2.
This article describes the curing behavior of diglycidyl ether of bisphenol‐A using Cysteine (A)/ Methionine (B)/Cystine (C)/ mixture of 4,4′‐diaminodiphenyl sulfone (DDS) and Cysteine/DDS and Methionine/DDS and Cystine in various molar ratios as curing agent. Differential scanning calorimetry was used to study the cure kinetics by recording the DSC scans at heating rates of 5, 10, 15, and 20°C/min. The peak exotherm temperature was found to be dependent on the heating rate, structure of the amino acids and on the DDS/amino acids molar ratio. A broad exotherm was observed in the temperature range of 150–245°C (EA), 155–240°C (EB), and 190–250°C (EC). Curing of DGEBA with mixture of amino acids and 4, 4′‐diaminodiphenyl sulfone (DDS) resulted in a decrease in characteristic curing temperatures. Activation energy of curing reaction is determined in accordance to Ozawa's method and was found to be dependent on the structure of the amino acids and on the ratio of 4,4′‐diaminodiphenyl sulfone (DDS) to amino acid. Thermal stability of the isothermally cured resins was evaluated using dynamic thermogravimetry in nitrogen atmosphere. No significant change has been observed in the char yield of all the samples, but it was highest in the system cured using either Cystine alone (EC‐1) or a mixture of DDS/Cystine (EC‐2, EC‐3, and EC‐4). © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009  相似文献   

3.
Tetra‐functional epoxy resin N,N,N′,N′‐tetraglycidyl‐3,3′‐diethyl‐4,4′‐diaminodiphenylmethane (TGDEDDM) was synthesized and characterized. The viscosity of TGDEDDM at 25°C was 7.2 Pa·s, much lower than that of N,N,N′,N′‐tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM). DSC analysis revealed that the reactivity of TGDEDDM with curing agent 4,4′‐diamino diphenylsulfone (DDS) was significantly lower than that of TGDDM. Owing to its lower viscosity and reactivity, TGDEDDM/DDS exhibited a much wider processing temperature window compared to TGDDM/DDS. Trifluoroborane ethylamine complex (BF3‐MEA) was used to promote the curing of TGDEDDM/DDS to achieve a full cure, and the thermal and mechanical properties of the cured TGDEDDM were investigated and compared with those of the cured TGDDM. It transpired that, due to the introduction of ethyl groups, the heat resistance and flexural strength were reduced, while the modulus was enhanced. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2014 , 131, 40009.  相似文献   

4.
A bismaleimide monomer, 4,4′‐bis(4‐maleimidophenoxy)‐3,3′,5,5′‐tetramethyl biphenyl (BMITB), was synthesized in high yield (94%) via a facile four‐step reaction from 2,2′,6,6′‐tetramethyl‐4,4′‐biphenol. The chemical structure of BMITB was confirmed by FTIR, 1H NMR, 13C NMR and elemental analysis. The monomer used to modify the epoxy cresol‐formaldehyde novolac resin (ECN)/diaminodiphenyl sulfone (DDS) system. Cured ECN/BMITB/DDS blends with higher BMITB content had two distinct glass transition temperatures that were above 250°C according to differential scanning calorimetry, indicating that an interpenetrated polymer network structure may be formed. The initial thermal decomposition temperature and integral procedure decomposition temperature of the cured ECN/BMITB/DDS blends were >390 and 1080°C, respectively, according to thermogravimetric analyses. No phase separation was observed in dynamic mechanical analysis of cured ECN/BMITB/DDS blends with small amounts of BMITB (5 and 10 wt%). POLYM. ENG. SCI., 2009. © 2009 Society of Plastics Engineers  相似文献   

5.
X‐ray crystallographic study of 2,2′,2″,2′′′,4,4′,4″,4′′′,6,6′,6″,6′′′‐dodecanitro‐1,1′ : 3′1″ : 3″,1′′′‐quaterphenyl (DODECA) has been carried out. Nonbonding interatomic distances of oxygen atoms inside of all the nitro groups are shorter than those corresponding to the intermolecular contact radii for oxygen. By means of the DFT B3LYP/6‐31(d, p) method a difference of 136 kJ mol−1 between the X‐ray and DFT structures of DODECA was found. The bearer of the highest initiation reactivity in its molecule in solid phase should be the nitro group at 4′′′‐position, in contrast to those at 2′‐ or 2″‐positions in its isolated molecule. The most reactive nitro group in the DODECA molecule can be well specified by the relationship between net charges on nitro groups and charges on their nitrogen atoms, both of them for the X‐ray structure. The 15N chemical shift, corresponding to this nitro group for the initiation by impact and shock, correlates very well with these shifts of the reaction centers of the other six “genuine” polynitro arenes.  相似文献   

6.
A novel adamantane‐containing epoxy resin diglycidyl ether of bisphenol‐adamantane (DGEBAda) was successfully synthesized from 1,3‐bis(4‐hydroxyphenyl)adamantane by a one‐step method. The proposed structure of the epoxy resin was confirmed with Fourier transform infrared, 1H‐NMR, gel permeation chromatography, and epoxy equivalent weight titration. The synthesized adamantane‐containing epoxy resin was cured with 4,4′‐diaminodiphenyl sulfone (DDS) and dicyandiamide (DICY). The thermal properties of the DDS‐cured epoxy were investigated with differential scanning calorimetry and thermogravimetric analysis (TGA). The dielectric properties of the DICY‐cured epoxy were determined from its dielectric spectrum. The obtained results were compared with those of commercially available diglycidyl ether of bisphenol A (DGEBA), a tetramethyl biphenol (TMBP)/epoxy system, and some other associated epoxy resins. According to the measured values, the glass‐transition temperature of the DGEBAda/DDS system (223°C) was higher than that of the DGEBA/DDS system and close to that of the TMBP/DDS system. TGA results showed that the DGEBAda/DDS system had a higher char yield (25.02%) and integral procedure decomposition temperature (850.7°C); however, the 5 wt % degradation temperature was lower than that of DDS‐cured DGEBA and TMBP. Moreover, DGEBAda/DDS had reduced moisture absorption and lower dielectric properties. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007  相似文献   

7.
A novel bismaleimide, 2,2′‐dimethyl‐4,4′‐bis(4‐maleimidophenoxy)biphenyl, containing noncoplanar 2,2′‐dimethylbiphenylene and flexible ether units in the polymer backbone was synthesized from 2,2′‐dimethyl‐4,4′‐bis(4‐aminophenoxy)biphenyl with maleic anhydride. The bismaleimide was reacted with 11 diamines using m‐cresol as a solvent and glacial acetic acid as a catalyst to produce novel polyaspartimides. Polymers were identified by elemental analysis and infrared spectroscopy, and characterized by solubility test, X‐ray diffraction, and thermal analysis (differential scanning calorimetry and thermogravimetric analysis). The inherent viscosities of the polymers varied from 0.22 to 0.48 dL g−1 in concentration of 1.0 g dL−1 of N,N‐dimethylformamide. All polymers are soluble in N‐methyl‐2‐pyrrolidone, N,N‐dimethylacetamide, N,N‐dimethylformamide, dimethylsulfoxide, pyridine, m‐cresol, and tetrahydrofuran. The polymers, except PASI‐4, had moderate glass transition temperature in the range of 188°–226°C and good thermo‐oxidative stability, losing 10% mass in the range of 375°–426°C in air and 357°–415°C in nitrogen. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 279–286, 1999  相似文献   

8.
The curing reaction of bisphenol S epoxy resin (BPSER) with 4,4′‐diaminodiphenylmethane (DDM) was studied by means of torsional braid analysis (TBA) in the temperature range of 393–433 K. The glass transition temperature (Tg) of the BPSER/DDM system is determined, and the results show that the reaction rate increases with increasing the Tg in terms of the rate constant, but decreases with increasing conversion. 1 The Tg of BPSER/DDM is about 40 K higher than BPAER/DDM. The gelation and vitrification time were assigned by the isothermal TBA under 373 K; in addition, an FTIR spectrum was carried out to describe the change of the molecular structure. The thermal degradation kinetics of this system was investigated by thermogravimetric analysis (TGA). It illustrated that the thermal degradation of the BPSER/DDM has n‐order reaction kinetics. 2 © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 78: 794–799, 2000  相似文献   

9.
4,4′‐Diamino‐3,3′‐dimethyldiphenylmethane was used to prepare polyimides in an attempt to achieve good organo‐solubility and light color. Polyimides based on this diamine and three conventional aromatic dianhydrides were prepared by solution polycondensation followed by chemical imidization. They possess good solubility in aprotonic polar organic solvents such as N‐methyl 2‐pyrrolidone, N,N‐dimethyl acetamide, and m‐cresol. Polyimide from 4,4′‐diamino‐3,3′‐dimethyldiphenylmethane and diphenylether‐3,3′,4,4′‐tetracarboxylic acid dianhydride is even soluble in common solvents such as tetrahydrofuran and chloroform. Polyimides exhibit high transmittance at wavelengths above 400 nm. The glass transition temperature of polyimide from 4,4′‐diamino‐3,3′‐dimethyldiphenylmethane and pyromellitic dianhydride is 370°C, while that from 4,4′‐diamino‐3,3′‐dimethyldiphenylmethane and diphenylether‐3,3′,4,4′‐tetracarboxylic acid dianhydride is about 260°C. The initial thermal decomposition temperatures of these polyimides are 520–540°C. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 72: 1299–1304, 1999  相似文献   

10.
An exciting methodology for the electrosynthesis of poly(o‐chloroaniline) is proposed, based on the electrochemical polymerisation of o‐chloroaniline (OCA) on a polyaniline‐modified electrode and copolymerisation of OCA with different compositions of biologically important 4,4′‐diaminodiphenylsulfone (DDS) on the same electrode. The copolymer electrosynthesised from an equimolar feed composition of OCA and DDS behaved the best among the other compositions employed for polymerisation. The UV‐visible and Fourier transform infrared spectral data obtained for this copolymer suggest the incorporation of DDS in the polymer chain. The X‐ray diffraction profile of the copolymer indicates a substantial amorphous nature of the as‐synthesised copolymer. Scanning electron micrographs recorded for the homo‐ and copolymer reveal distinctly different morphologies. The average grain size of the prepared copolymer as approximated from the micrographs is 80 nm. The procedure reported is found to be a very efficient method for electrochemically polymerising pristine OCA and poly(OCA‐co‐DDS) and the adopted strategy is the best so far reported for the electrochemical polymerisation of OCA on any electrode surface. Copyright © 2009 Society of Chemical Industry  相似文献   

11.
A crystalline condensate of dibutyltin oxide and tributyl phosphate (Sn‐P‐c) was more effective than the stannous octoate and dibutyltin dilaurate in accelerating the curing of the epoxy resin/4,4′‐diamino diphenyl sulfone (DDS) system, based on an equal tin concentration. Water took part in the reaction and played an important role in the morphology and mechanical properties of the cured resin when Sn‐P‐c was used as the accelerator. In the presence of Sn‐P‐c, water first reacted with glycidyl ether to yield glycerol ether; the yielded hydroxyl group may further catalyze the amino/epoxy group reaction. In the absence of water or polar hydroxyl additives, Sn‐P‐c did not completely dissolve in the resin systems, and the cured resin was translucent material with poor mechanical strength. In the presence of a small amount of water, the cured material became transparent. Both flexural strength and maximum deflection were increased greatly. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 80: 1229–1236, 2001  相似文献   

12.
The thermal properties of carbon nanofibers (CNF)/epoxy composites, composed of tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM) resin and 4,4′‐diaminodiphenylsulfone (DDS) as a curing agent, were investigated with differential scanning calorimetry (DSC), thermogravimetric analysis, and dynamic mechanical thermal analysis. DSC results showed that the presence of CNF had no pronounced influence on the heat of the cure reaction. However, the incorporation of CNF slightly improved the thermal stability of the epoxy. Furthermore, the storage modulus of the TGDDM/DDS epoxy was significantly enhanced, whereas the glass‐transition temperature was not significantly affected, upon the incorporation of CNFs. The storage modulus of 5 wt % CNF/epoxy composites at 25°C was increased by 35% in comparison with that of the pure epoxy. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 295–298, 2006  相似文献   

13.
An X‐ray crystallographic study of 2,2″,4,4′,4″,6,6′,6″‐octanitro‐1,1′ : 3′,1″‐terphenyl (ONT) has been carried out. The dihedral angles between benzene rings vary from 84.9° to 89.4°. Nonbinding interatomic distances of oxygen atoms inside all the nitro groups are shorter than the intermolecular contact radii for oxygen. On the basis of the DFT B3LYP/6‐31(d, p) method it was found that the difference between the X‐ray structure in the solid phase and DFT result for the gas phase is 98 kJ mol−1, and the bearer of the highest initiation reactivity of the ONT molecule in the solid phase should be the nitro group at 4″‐position, in contrast to those at 4′‐ or 6′‐position that play this role in the isolated molecule. It has been stated that the nitro groups at the reaction centers of the ONT molecule are relatively well specified by their 15N NMR chemical shifts.  相似文献   

14.
2′‐Fluoro‐2′‐deoxyguanosine has been reported to have potent anti‐influenza virus activity in vitro and in vivo. Herein we describe the synthesis and biological evaluation of 6‐modified 2′‐fluoro‐2′‐deoxyguanosine analogues and their corresponding phosphoramidate ProTides as potential anti‐influenza virus agents. Whereas the parent nucleosides were devoid of antiviral activity in two different cellular assays, the 5′‐O‐naphthyl(methoxy‐L ‐alaninyl) ProTide derivatives of 6‐O‐methyl‐2′‐fluoro‐2′‐deoxyguanosine, 6‐O‐ethyl‐2′‐fluoro‐2′‐deoxyguanosine, and 2′‐deoxy‐2′‐fluoro‐6‐chloroguanosine, and the 5′‐O‐naphthyl(ethoxy‐L ‐alaninyl) ProTide of 6‐O‐ethyl‐2′‐fluoro‐2′‐deoxyguanosine displayed antiviral EC99 values of ~12 μM . The antiviral results are supported by metabolism studies. Rapid conversion into the L ‐alaninyl metabolite and then 6‐modified 2′‐fluoro‐2′‐deoxyguanosine 5′‐monophosphate was observed in enzymatic assays with yeast carboxypeptidase Y or crude cell lysate. Evidence for efficient removal of the 6‐substituent on the guanine part was provided by enzymatic studies with adenosine deaminase, and by molecular modeling of the nucleoside 5′‐monophosphates in the catalytic site of a model of ADAL1, thus indicating the utility of the double prodrug concept.  相似文献   

15.
Aromatic polyesters were prepared and used to improve the brittleness of bismaleimide resin, composed of 4,4′‐bismaleimidodiphenyl methane and o,o′‐diallyl bisphenol A (Matrimid 5292 A/B resin). The aromatic polyesters included PEPT [poly(ethylene phthalate‐co‐ethylene terephthalate)], with 50 mol % of terephthalate, PEPB [poly(ethylene phthalate‐co‐ethylene 4,4′‐biphenyl dicarboxylate)], with 50 mol % of 4,4′‐biphenyl dicarboxylate, and PEPN [poly(ethylene phthalate‐co‐ethylene 2,6‐naphthalene dicarboxylate)], with 50 mol % 2,6‐naphthalene dicarboxylate unit. The polyesters were effective modifiers for improving the brittleness of the bismaleimide resin. For example, inclusion of 15 wt % PEPT (MW = 9300) led to a 75% increase in fracture toughness, with retention in flexural properties and a slight loss of the glass‐transition temperature, compared with the mechanical and thermal properties of the unmodified cured bismaleimide resin. Microstructures of the modified resins were examined by scanning electron microscopy and dynamic viscoelastic analysis. The toughening mechanism was assessed as it related to the morphological and dynamic viscoelastic behaviors of the modified bismaleimide resin system. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 2352–2367, 2001  相似文献   

16.
Copolycondensations of IPA, TPA, bisphenol A (BPA), and several cimonomers were carried out to improve thermal properties, such as, the glass transition temperature (Tg) of the IPA/TPA (50/50)–BPA polyester. Among the comonomers examined, 4,4′‐Dihydroxydiphenylsulfone (BPS) and 4,4′‐Dicarboxydiphenylsulfone (DCDPS) having a strongly dipolar sulfonyl group in the chain were significantly effective. The favorable effect upon the Tgs was studied by varying the amounts of BPS and DCDPS incorporated into the copolymers. In the copolycondensation with BPS, two‐stage copolycondensation of BPA first and then BPS, the reverse order of reaction, and their spontaneous addition were examined to investigate the effect of distribution of the BPS unit segments in the copolymer upon the Tgs of the resulted copolymers. The distribution was briefly studied from distribution of the IPA/TPA‐BPA oligomers in the initial reaction using GPC. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 875–879, 2000  相似文献   

17.
The solubilities of 3,4‐diaminofurazan (DAF) and 3,3′‐diamino‐4,4′‐azoxyfurazan (DAAF) were investigated in water, dichloromethane, acetonitrile, ethyl acetate, methanol, and acetone between 293.15 K and 313.15 K. The solubility was determined by high‐pressure liquid chromatography with ultraviolet detection. The solubilities of DAF and DAAF are increased with the increasing of temperature in all solvents studied. The enthalpy of solution in each solvent was calculated according to van't Hoff Equation.  相似文献   

18.
Tetramethylbisphenol F epoxy resin (TMBPFE) was successfully synthesized based on tetramethylbisphenol F (TMBPF) and epichlorohydrin with tetrabutylammonium bromide as the catalyst. The structure of TMBPFE was characterized by Fourier transform infrared spectroscopy, nuclear magnetic resonance and elemental analysis. Then, a mixed system composed of TMBPFE and 4,4′‐diglycidyl (3,3′,5,5′‐tetramethylbiphenyl) epoxy (TMBP) was prepared by a melting method, i.e. without any solvent. Both the TMBPFE and the mixed system were cured using 4,4′‐diaminodiphenyl methane (DDM) as the curing agent. The thermal properties of TMBPFE and the mixed system were studied using differential scanning calorimetry, dynamic mechanical analysis and thermogravimetric analysis (TGA). The results showed that the TMBP mixed in the TMBPFE matrix had little effect on the thermal properties of TMBPFE. However, the glass transition temperature improved markedly with increasing content of TMBP. Moreover, the TGA results showed that the degradation characteristics of TMBPFE resins did not seriously decrease when TMBP was incorporated into the TMBPFE matrix, although there are large steric hindrance biphenyl groups in TMBP. Both TMBPFE and the TMBPFE/TMBP system have potential applications in electrical and electronic fields. Copyright © 2011 Society of Chemical Industry  相似文献   

19.
A novolac epoxy resin based on 4,4′‐dihydroxybenzophenone (BZPNE) was synthesized via epoxidation of 4,4′‐dihydroxybenzophenone novolac resin (BZPN). BZPN was obtained by strong mineral acid catalyzed reaction of 4,4′‐dihydroxybenzophenone (BZP) and paraformaldehyde. The formation of BZPNE and BZPN was confirmed by Fourier transform infrared spectroscopy, proton and carbon nuclear magnetic resonance spectroscopy, gel permeation chromatography, and epoxy equivalent weight. Different blends of BZPNE with diglycidyl ether of bisphenol‐A (DGEBA; EEW ~180) were cured using dicyandiamide were characterized by thermogravimetric analysis, thermomechanical analysis, dynamic mechanical analysis, and interfacial property between aluminum adherends at ambient and elevated temperature. Thermal properties were found to improve on increasing quantity of BZPNE in DGEBA as it is evidenced from glass transition temperature (Tg). Likewise, no deterioration in interfacial properties was observed with the highest quantity of BZPNE (30%) in DGEBA blend, when tested at 150 °C. Cure kinetics of compositions were studied by nonisothermal differential scanning calorimetry and Kissinger method was used to compute the kinetic parameters such as frequency factor (A), activation energy (Ea) followed by the dependency of rate constant (k) on temperature of different blends. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46164.  相似文献   

20.
This paper reviews the synthesis, properties, performance, and safety of the insensitive explosive 3,3′‐diamino‐4,4′‐azoxyfurazan (DAAF, C4H4N8O3), CAS‐No. [78644‐89‐0], and 18 formulations based on it. Though having a moderate crystal density only, DAAF offers high positive heat of formation and hence superior performance when compared with TATB. It is friction and impact insensitive but is more sensitive to shock than TATB and has an exceptionally small critical diameter and performs very well at low temperatures unlike other insensitive explosives. 39 references to the public domain are given. For Part I see Ref. [1].  相似文献   

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