Zinc-doping of InP during chemical beam epitaxy using diethylzinc

Diethylzinc was used as ap-type dopant source during InP growth by chemical beam epitaxy. In InP, electrically activated Zn saturated at a concentration of ∼2.0 × 10¹⁸ cm⁻³ for epilayers grown at 540‡ C. Higher role concentrations were obtained by lowering the growth temperature. However, measurements with SIMS indicated that very serious Zn diffusion occurred when the Zn concentration appeared to reduce the pyrolysis efficiency of trimethylindium. This caused a reduction in the InP growth rate and InAs mole fraction in InGaAs epilayers. No Zn “memory effect≓ was detected in our system. Undoped InP epilayers maintained an n-type background of ∼5 × 10¹⁵ cm⁻³.     

Sulfur incorporation during epitaxial growth of inp in the IN-HC1-PH3-H2 system

The growth and dopant uptake of InP in the In-HCl-PH₃-H₂ system using H₂S as a dopant source has been investigated. As extension of an earlier model for the epitaxial growth of InP the sulfur uptake is described as the formation of InS which yields to the regular solution InP_1-xS_x. The molar ratio x is determined by the ratio of the incorporation flux of the dopant and the growth rate of the host lattice. Calculations considering the thermodynamics of the system and the kinetic steps of the growth process show that the model satisfactorily accounts for the experimental data.     

Characterization of Mg-doped InP grown by MOCVD using a bis(methylcyclopentadienyl)magnesium dopant source

The use of bis(methylcyclopentadienyl)magnesium (MCp₂Mg) as ap-dopant source for MOCVD-grown InP has been investigated. The Mg incorporation was nonlinear. The relationship between the H₂ flow through the MCp₂Mg bubbler and the Mg concentra-tion in the epilayers suggested that when [Mg] <20 ppb in the reactor it was mostly depleted from the gas mixture, probably by means of reaction with O₂ or H₂O, but at higher concentrations a large fraction of the Mg diffusing to the epilayers was incor-porated. For concentrations >10¹⁹ cm^s-3 the layer morphology deteriorated and stacking faults were observed by TEM, at a density greater than 10⁹ cm^s−2. Significant diffusion of Mg into the substrates during the growth was observed, with diffusion depths up to 0.1 μm at a concentration of 10¹⁹ cm^s−3 in S-doped, and up to 32 μm at 10¹⁷ cm^s-3 in Fe-doped substrates. These concentrations correspond to the S and Fe doping level in those substrates, and the results are explained in terms of the formation of a complex between the S or Fe dopants and the diffusing Mg, which immobilizes the latter species. At [Mg] >10¹⁸ cm^s−3, the net hole concentration, measured by means of electrochemical C-V pro-filing, decreases with increasing [Mg], indicating significant self compensation. Com-pensation at high [Mg] was also suggested by the effect of excitation power density on the peak shift of the donor to acceptor transition observed during photoluminescence measurements at 7 K.     

Tellurium induced lattice dilation in OMVPE grown InP

For organometallic vapor phase epitaxial (OMVPE) grown InP, the change in lattice constant is measured as a function of tellurium (Te) dopant concentration. We observe ~0.15% dilation in the InP lattice constant at a Te concentration of ~10²⁰ cm^-3. Our measurements are compared to predictions from Vegard’s Law.     

Zone melting of indium phosphide

Bulk indium phosphide crystals have been prepared by zone melting with dislocation densities 104 ≤ N_d ≤ 105 cm^-2. The residual impurity level in nominally undoped crystals and the dopant distribution in Cd-, Sn- and Ge-doped zone melted ingots, as revealed by spark source mass spectrometric analyses, indicate a strong interaction between segregation at the solid/liquid interface and vapor transport. The effective distribution coefficients for Sn and Ge in zone melted InP are k_e(Sn) = 0.3 and k_e(Ge) = 0.4. The free electron concentration measured in the middle section of nominally undoped ingots is N_D-N_A = 1.9 × 10¹⁵ cm^-3 corresponding to a Hall mobility Μ_e = 3263 cm^2V-1sec^-l.     

Insitu incorporation of Al and N andp-n junction diode fabrication in alpha(6H)-SiC thin films

Aluminum and nitrogen have been introduced asp- andn-type dopants, respectively, during chemical vapor deposition (CVD) ofα(6H)-SiC films on 6H-SiC substrates. The atomic concentration of each dopant in the films showed a linear dependence on partial pressure of the dopant source gas. The Al species exhibited ideal behavior based on a dilute solution model. Thus elemental Al and/or a complex containing only one Al atom were the principal species which contributed to the incorporation of this constituent. The incorporation of N was greater than expected from the dilute solution theory which implied interaction between N and Si in the SiC. The relationship between ionized dopant concentration (carrier concentration) and the concentration in each dopant source gas was also linear and parallel to its atomic concentration. The ratios of the carrier concentration to the atomic concentration for Al and N were 0.02 and 0.06, respectively.P-n junction diodes were fabricated which exhibited rectification and reverse leakage currents at 100 V of 0.19, 0.75, and 1.3 ΜA at 298, 523, and 623 K, respectively. The turn-on voltage decreased from 2.2 to 2.1 and 1.9 V with each incremental increase in temperature.     

Low pressure MOCVD growth of buried heterostructure laser wafers using high quality semi-insulating InP

Semi-insulating Fe doped InP has been grown by low pressure MOCVD at 100 mbar and 630° C. Complete activation of Fe below the solubility limit of 5 × 10₁₆ cm^-3 has been achieved by reducing the PH₃ concentration during crystal growth to the lowest value required to maintain good surface morphology of the layer. Diffusion of the Fe dopant and dopant spikes at the interface between the substrate and grown layer can be minimized by ensuring that the total Fe concentration in the layer does not exceed the diffusion threshold of 2 × 10¹⁷ cm⁻³. Growth of Fe doped InP around a double heterostructure mesa formed by reactive ion etching produces a structure without either growth of InP on the mesa or notches at the mesa sidewalls, even with minimal overhang of the dielectric mask. Examination of regrown heterostructures shows no evidence of interdiffusion of Fe and Zn, indicating that Fe diffusion has been successfully prevented. Completed lasers have threshold current densities of 2.5 kA/cm² at 20° C and initial aging results which indicate that these devices have good lasing characteristics and potentially high reliability.     

Indium doping of HgCdTe grown by metalorganic chemical vapor deposition-direct alloy growth using triisopropylindium and diisopropyltellurium triisopropylindium adduct

A new indium source, triisopropylindium, was used to dope HgCdTe layers grown by metalorganic chemical vapor deposition n-type with carrier concentrations, n_H, in the range between low 10¹⁵ and low 10¹⁷ cm⁻³ at 77K. The reproducibility of carrier concentration was found to be excellent for n_H<3×10¹⁵ cm⁻³. High electron mobilities and minority carrier lifetime comparable to published values indicate that indium doping produces high quality n-type HgCdTe material. State-of the-art photodiodes were obtained by growing a p-type HgCdTe layer by liquid phase epitaxy on an indium doped layer. In addition, and adduct compound formed between diisopropyltellurium (DIPTe) and triisopropylindium (TIPIn): DIPTe·InTIP, was also found to be a viable n-type dopant for HgCdTe especially at concentrations in the low 10¹⁵ cm⁻³ or less.     

Spun on arsenolica films as sources for shallow arsenic diffusions with high surface concentration

An arseno silica glass film applied in liquid form is used as doping source for high concentrated, less than one micron deep, arsenic diffusions into silicon. The influence of source concentration, source thickness and diffusion ambient on the resulting diffusion properties is reported. Electrically active As surface concentrations of 1·7 × 10²⁰ cm^?3 at 1000°C were achieved. This represents about 60 per cent of the total As concentration. A diffused As layer is at a quasi equilibrium only, the amount of electrically active As can be changed by heat treatments. The diffusion coefficient of As shows a 50-fold increase, when the dopant concentration rises from 5 × 10¹⁹ cm^?3 to its maximum value of about 2 × 10²⁰ cm^?3. D increases about linearly with electron concentration. The results reported are consistent with models outlined recently: Diffusion via negatively charged vacancies and As clustering at low temperature treatments.     

Incorporation of Sn on GaAs (111)A substrates by molecular beam epitaty

Behavior of Sn as donor species in the MBE growth of GaAs on (111)A substrates has been investigated by varying the growth temperature from 460 to 620°C, As₄:Ga flux ratio from 4 to 25, and Sn concentration from 10¹⁶ to 10²⁰ atoms cm^-3. Secondary ion mass microscopy measurements show that Sn does not surface segregate on (111)A substrates under this growth condition, in contrast to that on (001) substrates. Sn is uniformly incorporated throughout the bulk of the grown layer for all samples, apart from the most highly doped ones. To increase the Sn carrier concentration on the (111)A substrates, the measured carrier concentration shows that doping should be carried out at a low growth temperature and/or high As₄:Ga flux ratio.     

A Large Bandgap Organic Salt Dopant for Sn-Based Perovskite Thin-Film Transistor

Metal halide perovskite optoelectronic devices have made significant progress over the past few years, but precise control of charge carrier density through doping is essential for optimizing these devices. In this study, the potential of using an organic salt, N,N-dimethylanilinium tetrakis(pentafluorophenyl)borate, as a dopant for Sn-based perovskite devices, is explored. Under optimized conditions, the thin film transistors based on the doped 2D/3D perovskite PEAFASnI₃ demonstrate remarkable improvement in hole mobility, reaching 7.45 cm²V⁻¹s⁻¹ with a low subthreshold swing and the smallest sweep hysteresis (ΔV_hysteresis = 2.27 V) and exceptional bias stability with the lowest contact resistance (2.2 kΩ cm). The bulky chemical structure of the dopant prevents it from penetrating the perovskite lattice and also surface passivation against Sn oxidation due to its hydrophobic nature surface. This improvement is attributed to the bifunctional effect of the dopant, which simultaneously passivates defects and improves crystal orientation. These findings provide new insights into potential molecular dopants that can be used in metal halide perovskite devices.     

Rapid thermal annealing of dual Si and P implants in InP

In this study we evaluate the effects of dual implantation with different doses of Si and P on dopant activation efficiency and carrier mobility in InP:Fe. The implants were activated by a rapid thermal annealing step carried out in an optimized phosphoruscontaining ambient. For high dose implants (10¹⁴–10¹⁵ cm⁻²), which are typically employed for source/drain regions in FETs, dual implantation of equal doses of Si and P results in a higher sheet carrier concentration and lower sheet resistance. For 10¹⁴ cm⁻² Si implants at 150 keV, the optimal P co-implant dose is equal to the Si dose for most anneal temperatures. We obtain an activation efficiency of ∼70% for dual implanted samples annealed at 850° C for 10 sec. The high activation efficiencies and low sheet resistances obtained in this study emphasize the importance of stoichiometry control through the use of P co-implants and a phosphorus-containing ambient during the thermal processing of InP.     

Some characteristics of highly N-doped VPE grown GaAs epilayers

The doping behaviour of S and Se in the VPE growth of GaAs at 760 and 660°C is studied by carrier concentra-tion, mobility, photo and cathodoluminescence measure-ments. The carrier concentration increases linearly with the partial pressure of S or H₂Se up to a solubi-lity limit, the highest value of which is obtained with Se at about 10¹⁹cm^-3. The mobility for Se-doped layers is higher than for S-doped ones when n > 4.10¹⁷cm^-3, and a mobility decrease is observed for both at dopings exceeding the solubility limit. Postgrowth annealing at the growth temperature of highly doped samples decreases their carrier concentration to values corresponding to the bulk solubility limit. The decrease of the room temperature luminescence intensity at high doping levels in tentatively interpreted as due to precipitate for-mation. Finally, the linear dependence on the dopant partial pressure of the impurity incorporation as well as the observed annealing behaviour are interpreted by an incorporation mechanism controlled by the surface states.     

Electrical and optical properties of oxygen doped GaN grown by MOCVD using N2O

Oxygen doped GaN has been grown by metalorganic chemical vapor deposition using N₂O as oxygen dopant source. The layers were deposited on 2″ sapphire substrates from trimethylgallium and especially dried ammonia using nitrogen (N₂) as carrier gas. Prior to the growth of the films, an AIN nucleation layer with a thickness of about 300? was grown using trimethylaluminum. The films were deposited at 1085°C at a growth rate of 1.0 μm/h and showed a specular, mirrorlike surface. Not intentionally doped layers have high resistivity (>20 kW/square). The gas phase concentration of the N₂O was varied between 25 and 400 ppm with respect to the total gas volume. The doped layers were n-type with carrier concentrations in the range of 4×10¹⁶ cm⁻³ to 4×10¹⁸ cm⁻³ as measured by Hall effect. The observed carrier concentration increased with increasing N₂O concentration. Low temperature photoluminescence experiments performed on the doped layers revealed besides free A and B exciton emission an exciton bound to a shallow donor. With increasing N₂O concentration in the gas phase, the intensity of the donor bound exciton increased relative to that of the free excitons. These observations indicate that oxygen behaves as a shallow donor in GaN. This interpretation is supported by covalent radius and electronegativity arguments.     

Low temperature dopant activation of BF2 implanted silicon

Boron activation and carrier mobility were measured after low temperature furnace heat treatments, in silicon layers implanted with BF ₂ ⁺ ions at 60 keV and at fluence in the 1 − 5 × 10¹⁵ ions cm⁻² range. These quantities were correlated with boron and fluorine chemical depth profiles obtained with secondary ion mass spectrometry (SIMS), and with the lattice defects revealed by transmission electron microscopy (TEM). High dopant activation, well above the extrapolated boron solid solubility, was found for all the fluences investigated after a thermal treatment of 20 min at 600‡ C. In the high fluence implanted samples, the solid phase epitaxial regrowth of the amorphous layer induces a severe fluorine redistribution which causes the formation of a defective band at the sample surface containing microtwins and small precipitates; a decrease in both the activated dopant concentration and carrier mobility was found in this region. The comparison with dopant activation data obtained in samples diffused at higher temperature (from 900 to 1000‡ C) shows that twins are electrically active only when they are decorated by isolated impurities and/or in presence of very small precipitates.     

High gain AllnAs/GaAsSb/AllnAs NpN HBTs on InP

We report the first growth and characterization of high gain double heterojunction NpN HBTs on InP with a lattice-matched GaAs₅Sb₅ base layer. This AllnAs/GaAsSb heterojunction has almost no discontinuity in the conduction band edge, eliminating the need to grade the emitter-to-base heterojunction to achieve optimal carrier injection. The layers were grown in a solid source MBE system, using tetramer As₄ and Sb₄ sources. Be is an efficient acceptor in the GaAsSb, but the mobility is about half that measured inp type GaAs on GaAs substrates. The HBTs fabricated were large area mesa isolated transistors, with a beta of 80 at a current density of 2 kA/cm², and the gain remained high at lower current densities. The turnon voltage,V _be, is only 0.45 V at a current density of 2 A/cm².     

Investigation of short-term current gain stability of GaInP/GaAs-HBTs grown by MOVPE

Initial current gain variation in GaInP/GaAs-HBTs stressed at high-current density was investigated in dependence on base–dopant concentration and hydrogen passivation. It is shown that current-induced acceptor activation results in short-term current gain reduction, but does not affect emitter–base heterojunction properties. The incorporation of hydrogen during growth and the resulting passivation of carbon acceptors in the base layer depends mainly on carbon doping level and the precursors present during growth and cool-down. Under the growth conditions used, in-diffusion of hydrogen within AsH₃-rich growth steps turned out to be the major source of base–dopant passivation. Utilizing the blocking effect of n-type layers for H⁺ in-diffusion we were able to reduce the base passivation ratio [H]/[C] to 0.1 leading to significant improvements in gain stability. It is shown that current gain instabilities can be completely suppressed by using a high-current density pre-stress treatment.     

Dopant incorporation in GaAs and AlGaAs grown by MOMBE for high speed devices

Continued improvement in GaAs/AlGaAs device technology requires higher doping levels, both to reduce parasitics such as source resistances, and to enhance speed in devices such as the heterostructure bipolar transistor (HBT). In this paper we will discuss doping issues which are critical to high speed performance. In particular, we will focus on doping of GaAs and AIGaAs using carbon as the acceptor and Sn as the donor. Due to the unique growth chemistry of metalorganic molecular beam epitaxy (MOMBE), both of these impurities can be used to achieve high doping levels when introduced from gaseous sources such as trimethylgallium (TMG) or tetraethyltin (TESn). Comparison of SIMS and Hall measurements show that both elements give excellent electrical activation to 1.5 × 10¹⁹ cm³ for Sn and 5 × 10²⁰ cm⁻³ for C. More importantly, we have found that both impurities canbe used to achieve high quality junctions, indicating that little or no diffusion or segregation is occurring during growth. Because of the excellent incorporation behavior of these dopants, we have been able to fabricate a wide range of devices including field effect transistors (FETs), high electron mobility transistors (HEMTs), and Pnp HBTs whose performance equals or exceeds that of similar devices grown by other techniques. In addition to these results, we will briefly discuss the key differences in growth kinetics which allow such abruptness and high doping levels to be achieved more readily in MOMBE than in other growth techniques.     

Characterization of InP grown by OMVPE using trimethylindium and tertiarybutylphosphine (TBP) at low V/III ratios and reduced TBP partial pressures

We report an OMVPE growth process for InP using trimethylindium (TMI) and tertiarybutylphosphine (TBP), a V/III ratio of 15, and a TBP partial pressure of 0.5 Torr. Growth is initiated with a 0.1 μm buffer layer employing a ramped TBP flow. Results are presented for InP grown with two different samples of both TMI and TBP and compared to previous experimental results and theoretical predictions. Good surface morphology is obtained from 540 to 600° C. The net carrier concentrations, N_d-N_a, decrease with increasing growth temperature—but never fall below 1.3 × 10¹⁶ cm^-3. Mobilities of 3990 and 11200 cm²/V.sec are observed at 300 and 77 K, respectively. At 77 K, we infer a compensation ratio of ∼0.4, independent of N_d-N_a. Photoluminescence measurements at 6 K show intense near bandgap emission with a full width half maximum proportional to N_d-N_a. Weak emission is also observed from carbon acceptors, independent of growth temperature. Secondary ion mass spectroscopy measurements are performed on an InP wafer grown with four different temperatures. The observed sulfur concentration drops from 1 × 10¹⁸ to 6 × 10¹⁶ cm^-3 with increasing growth temperature. This confirms that sulfur is an important residual impurity in TBP. The observed carbon concentration is 4–6 × 10¹⁶ cm^-3, regardless of growth temperature.     

Advances in LEC growth of InP crystals

By reducing the temperature gradients in the vicinity of the crystal-melt interface, 35-mm-diameter InP boules with much reduced dislocation densities have been grown by the liquid-encapsulated Czochralski technique. A reduction in the residual donor concentration of InP grown by this technique has been achieved by using In-rich charges prepared by adding elemental In to polycrystalline InP ingot material. Nominally undoped crystals with carrier concentrations as low as 1–2 x₄ 10¹⁵ Cm − 1 and 77 K mobilities as high as 7.0 × 10 cm² V⁻¹ s⁻¹ have been obtained. By growing doped crystals at increased seed or crucible rotation rates, short-range longitudinal variations in dopant concentration have been reduced to a few per cent, as determined by optical absorption measurements with a scanning CO₂ laser.