磁控溅射工艺对Mo膜性能的影响

采用中频磁控溅射方法制备用于CIGS薄膜太阳能电池背电极的Mo膜。研究了靶面磁场强度、溅射气压、溅射电流等工艺参数对Mo膜沉积速率、电阻率、形貌及应力的影响。研究表明:随着靶面磁场强度的增强,Mo膜电阻率和沉积速率均下降;使用较高的溅射电流可以获得较高的沉积速率和较低的电阻率,使用较低的溅射气压可以获得较低的电阻率和较高的沉积速率。在本试验条件下制备的Mo膜基本上呈现拉应力状态并且随溅射气压的升高而增大。     

磁控溅射铜薄膜微观结构对其电爆性能的影响

采用直流磁控溅射法在不同溅射功率和工作气压条件下沉积Cu薄膜,对其进行X射线衍射、原子力显微镜、电阻率测试,分析了工艺参数对Cu薄膜的沉积速率、微观结构和电阻率的影响。通过紫外光刻技术将Cu薄膜制成桥箔,采用电爆测试平台获得Cu桥箔的电爆参数,研究了Cu薄膜的晶粒尺寸、择优取向对其电爆性能的影响。结果表明:随溅射功率的增大,Cu薄膜的沉积速率增加、晶粒尺寸增大、Cu(111)晶面择优取向特性变差,且电阻率降低;随溅射工作气压增大,Cu薄膜的沉积速率降低、晶粒尺寸减小、Cu(111)晶面择优取向越明显,且电阻率增加。对于相同桥区参数的Cu桥箔,晶粒尺寸越小,其爆发时刻就越早;Cu(111)晶面择优取向越明显,其爆发电流和峰值功率就会越大。     

射频溅射工艺参数对AZO薄膜结构和性能的影响

采用射频磁控溅射法制备了掺铝氧化锌(AZO)薄膜,研究了衬底温度及溅射工作压强对沉积薄膜的晶体结构、表面形貌及电学性能的影响。结果显示,随衬底温度增加,薄膜的结晶结构发生显著变化,而溅射工作气压增加主要影响沉积薄膜(103)面与(002)面的相对强度。薄膜的表面形貌受温度影响严重,而气压对形貌的影响相对较小。衬底温度增加,薄膜的电阻率急剧降低,迁移率和载流子浓度都显著增加,而工作气压增加则导致电阻率先减小后增大。     

直流磁控溅射功率对溅射生长GZO薄膜光电性能的影响

本文采用直流磁控溅射沉积系统在玻璃基底上沉积镓掺杂氧化锌(GZO)薄膜,将溅射功率从120W调整到240W,步长为30W,研究功率变化对GZO薄膜的晶体结构、表面形貌、光学性能和电学性能的影响。结果表明,溅射功率对GZO薄膜电阻率有显著的影响。溅射功率为210W时薄膜呈现最低电阻率为3.31×10~(-4)Ω·cm,可见光波段平均光学透光率接近84%。随着溅射功率的增加,薄膜表面形貌和生长形态发生较大变化,并直接得到具有一定凸凹不平的微结构,GZO薄膜的致密性先增加后降低。     

RF磁控溅射制备Al_2O_3薄膜及其介电性能研究

以-αAl2O3为靶材,采用射频磁控溅射法制备了非晶Al2O3薄膜。利用X射线衍射仪、扫描电镜、划痕仪、表面粗糙轮廓仪和阻抗仪研究了不同溅射功率和不同溅射气压对薄膜制备的影响,探索了不同溅射功率下制备的Al2O3薄膜的介电常数和介电损耗与频率的关系。试验结果表明,制备的非晶Al2O3薄膜表面平滑致密;随着工作气压的增加,薄膜沉积速率增加;随着溅射功率的增加,Al2O3薄膜的沉积速率和介电常数逐渐增加、介电损耗逐渐减小;随着频率的增加,Al2O3薄膜的介电常数逐渐减小,高频阶段趋于稳定。     

磁控溅射法制备低电阻率Ta薄膜研究

在无匹配层、常温、溅射气体为纯Ar的条件下,利用直流磁控溅射法在Si表面制备了Ta薄膜,系统研究了工作气压及直流功率对薄膜电阻率及微观结构的影响。分别用四探针测试仪、X射线衍射仪、原子力显微镜对不同条件下制备的Ta薄膜电阻率、相结构及表面形貌进行表征。结果发现,随溅射气压升高,高阻β相出现,薄膜电阻率随之增大;在相同溅射气压下,随着溅射功率的增加,薄膜电阻率先降低后升高。优化溅射工艺后制得的Ta薄膜的电阻率低至29.7μΩ·cm。     

CIGS薄膜太阳能电池用Mo背电极的制备与结构性能研究

利用磁控溅射技术在Soda-lime玻璃衬底上沉积CIGS薄膜太阳能电池用金属Mo背电极薄膜,并研究了Mo靶功率、基片脉冲宽度以及预清洗时间对Mo薄膜的相结构、形貌及电阻率的影响。结果表明,沉积的Mo薄膜均沿(110)晶面呈柱状择优生长;增大Mo靶溅射功率可以促进薄膜晶粒长大、提高薄膜的致密性、降低电阻率;合适的基片脉冲电压脉宽促进了晶核的形成、长大并有助于沉积过程中Mo晶粒长大,进而降低薄膜电阻率;通过延长预清洗时间可获得致密性好、电阻率低的Mo薄膜,所获得的Mo薄膜最低电阻率为3.5×10-5Ω.cm。     

工艺参数和热处理温度对ZrW_2O_8薄膜制备的影响

采用WO3和ZrO2复合陶瓷靶材,以射频磁控溅射法在石英基片上沉积制备了ZrW2O8薄膜.利用X射线衍射仪(XRD)、表面粗糙轮廓仪和扫描电子显微镜(SEM),研究了不同工艺参数和不同退火温度对ZrW20s薄膜的相组成、沉积速率和表面形貌的影响.采用高温X射线衍射和Powder X软件研究薄膜的负热膨胀特性.实验结果表明随着溅射功率的增加,薄膜沉积速率增加;而随着工作气压的增加,薄膜沉积速率先增加后减小;磁控溅射沉积制备的ZrW20s薄膜为非晶态,表面平滑、致密,随着热处理温度的升高,薄膜开始结晶且膜层颗粒增大;在740℃热处理3 n血后得到膜层颗粒呈短棒状的三方相ZrW2O8薄膜,在1200℃密闭条件下热处理3 min淬火后得到膜层颗粒呈球状的立方相ZrW2O8薄膜,且具有良好的负热膨胀特性.     

射频磁控溅射沉积高质量ZnO薄膜的工艺研究

在室温下利用射频磁控溅射法在硅(100)基片上制备ZnO薄膜,利用X射线衍射(XRD)和扫描电子显微镜(SEM)对其结晶性能进行分析。研究了制备条件对薄膜沉积速率的影响。分析了薄膜沉积速率对薄膜结晶状况的影响及源气体中的氧气和氩气的流量比对薄膜结晶状况的影响。研究结果表明,薄膜的生长速率强烈依赖于射频功率和工作气压,薄膜的结晶性能强烈依赖于薄膜的沉积速率和反应气体中氧气和氩气的流量比。制备高结晶质量的ZnO薄膜的最佳工艺参数为靶到衬底的距离为4cm,输入功率为250W,源气体中氩气和氧气的流量比n(Ar)∶n(O2)为5∶20,溅射工作气压为2Pa。在最佳工艺条件下所制备的薄膜表面平整致密,接近单晶,在可见光区的透射率高达90%。     

铝/改性氟塑料复合薄膜的制备

采用射频磁控溅射技术在改性氟塑料表面沉积铝层,制备了金属/氟化高聚物复合薄膜.利用场发射扫描电镜(FESEM)及能量散射谱(EDS)分析仪对沉积的铝层进行了表面形貌的表征和化学组分的分析.初步探讨了溅射功率、气压和时间等不同溅射参数对铝层结构和铝层在氟塑料表面附着情况的影响.结果表明:溅射功率是决定复合薄膜质量的重要因素,功率过低得不到致密的铝层结构,而且铝层容易从氟塑料表面脱离,功率过高则会产生很强的热效应而使复合薄膜弯曲.溅射气压和时间分别影响铝层在氟塑料表面的沉积速率和生长厚度.     

Structure and electrical properties of Mo back contact for Cu(In, Ga)Se2 solar cells

Mo layers were deposited on soda lime glass via DC magnetron sputtering of a Mo target in a pure Ar atmosphere. The structure and electrical resistivity of Mo thin films, which may be varied by controlling the sputtering pressure, were investigated. The films showed (110) preferred orientation regardless of the working pressure. Films sputtered at low working pressure had low resistivity but adhered poorly to glass. A study of the deposition of a Mo bilayer was conducted. Optimum properties of the Mo bilayer were obtained when the bottom layer was deposited at 10 mtorr and the top layer was deposited at 2.5 mtorr. The extremely low resistivity of 6.57 μΩ-cm was obtained, which is better than other literatures. A Cu(In, Ga)Se₂ cell fabricated on a Mo film sputtered under optimized conditions showed 10.40% efficiency.     

Preparation of CrN thick films by high-rate middle-frequency unbalanced magnetron sputtering

A middle-frequency (MF) unbalanced magnetron sputtering system equipped with an electron source was designed and used for deposition of CrN thick films under various MF power (1.4–14 kW) at fixed temperature, pressure, and gas flow rate. The deposition rate was increased with increasing MF power and the structure and N/Cr ratio of the deposited CrN films exhibited a complicated behavior, where the CrN films were a polycrystalline structure and the films deposited under optimized conditions exhibited a dense columnar structure and a micro-hardness of 16 GPa. The dependence of the structure and micro-hardness on MF power was interpreted by the power deposition efficiency.     

Preparation of CrN thick films by high-rate middle-frequency unbalanced magnetron sputtering

A middle-frequency (MF) unbalanced magnetron sputtering system equipped with an electron source was designed and used for deposition of CrN thick films under various MF power (1.4–14 kW) at fixed temperature, pressure, and gas flow rate. The deposition rate was increased with increasing MF power and the structure and N/Cr ratio of the deposited CrN films exhibited a complicated behavior, where the CrN films were a polycrystalline structure and the films deposited under optimized conditions exhibited a dense columnar structure and a micro-hardness of 16 GPa. The dependence of the structure and micro-hardness on MF power was interpreted by the power deposition efficiency.     

The effect of deposition parameters and post treatment on the electrical properties of Mo thin films

In this study, we deposited low-resistivity molybdenum (Mo) thin films on soda-lime glass substrates with good adhesion. We adjusted various deposition parameters such as the sputtering power (52-102 W), working distance (5.5-9 cm) and annealing temperature (26-400 °C) to investigate their impact on the sheet resistance. By using a DC magnetron sputtering system, we obtained Mo thin films having the lowest sheet resistance of 0.190 Ω/□ with a sputtering power of 82 W, working distance of 6.5 cm, and annealing temperature of 400 °C; in addition, these films had good adhesivity. These Mo thin films were suitable for use as the Mo back contact in Cu(In,Ga)Se₂-based solar cells.     

Origin on amorphization of Co-Mo magnetic thin films: Experiments and thermodynamic calculation

Amorphisation of Co-Mo magnetic thin films has been studied by using X-ray diffraction technique, and thermodynamic calculation based on Miedema's semi-empirical model has been used to clarify the nature of amorphisation in this binary alloy system. The transition composition from the hexagonal cubic packed structure to the amorphous (H/A) is about 19 at.%Mo when the Co-Mo thin films are deposited at room temperature (RT) under a working Ar pressure of 0.2 Pa and a deposition rate of about 0.7 Å/s, but increases up to about 23 at.%Mo when deposited at 300 °C. The calculated transition composition at RT based on the Miedema's model or the thermodynamically assessed parameters is 18.7 at.%Mo or 16.1 at.%Mo, respectively, well consistent with the experimental value of ~ 19.0 at.%Mo. Higher deposition rate and lower pressure shift the H/A transition composition to a higher Mo content.     

Growth of ITO thin films by magnetron sputtering: OES study,opticaland electrical properties

In this work tin doped indium oxide (ITO) thin films were deposited onto soda lime glass substrates by the direct current magnetron sputtering system analyzing process of deposition with optical emission spectroscopy (OES). The dependence of electro-optical characteristics of the deposited films on the sputtering pressure, O₂/Ar working gas flow ratio and the discharge power was investigated. Transparency of the ITO films was measured using the ultraviolet and visible light spectrometer (UV–vis). The X-Ray photoelectron spectroscopy (XPS) method was applied for analysis of thin films surface chemical composition. It was found that in-situ measurement of plasma emission spectra allowed prediction and control of parameters of ITO thin films, namely resistivity and transparency. The correlation between the thin films resistivity, optical transparency and kinetics of deposition was examined.     

Growth and characterization of diamond films deposited at high-pressure using a low-power microwave plasma reactor

Diamond films were deposited on molybdenum substrates from mixtures of methane diluted in hydrogen using a high-pressure microwave plasma reactor. In this reactor, a compressed waveguide structure was used to increase the electric field strength, and accordingly the reactor was able to operate stably with low gas flow rate and microwave power. The films deposited on 12 mm diameter substrates were characterized by film morphology, Raman spectra, growth rate and crystalline quality. The morphology of diamond films deposited in this reactor depends mainly on the substrate temperature. When the deposition pressure was 48 kPa and microwave power was only 800 W, high quality diamond films could be uniformly deposited with a growth rate around 20 μm/h.     

Structural and morphological investigations on DC-magnetron-sputtered nickel films deposited on Si (100)

Pure nickel thin films were deposited on Si (100) substrates under different conditions of sputtering using direct current magnetron sputtering from a nickel metal target. The different deposition parameters employed for this study are target power, argon gas pressure, substrate temperature and substrate-bias voltage. The films exhibited high density of void boundaries with reduction in <111> texture deposited under high argon gas pressures. At argon gas pressure of 5 mTorr and target power of 300 W, Ni deposition rate was ~40 nm/min. In addition, coalescence of grains accompanied with increase in the film texture was observed at high DC power. Ni films undergo morphological transition from continuous, dense void boundaries to microstructure free from voids as the substrate-bias voltage was increased from −10 to −90 V. Furthermore, as the substrate temperature was increased, the films revealed strong <111> fiber texture accompanied with near-equiaxed grain structure. Ni films deposited at 770 K showed the layer-by-layer film formation which lead to dense, continuous microstructure with increase in the grain size.     

直流磁控溅射制备铝薄膜的工艺研究

采用直流磁控溅射方法，以高纯Al为靶材，高纯Ar为溅射气体，在玻璃衬底上成功地制备了铝薄膜，并对铝膜的沉积速率、结构和表面形貌进行了研究。结果表明：A1膜的沉积速率随着溅射功率的增大先几乎呈线性增大而后缓慢增大；随着溅射气压的增加，沉积速率先增大，在一定气压时达到峰值后继续随气压的增大而减小。X射线衍射图谱表明Al膜结构为多晶态；用扫描电子显微镜对薄膜进行表面形貌的观察，溅射功率为2600W，溅射气压为0．4Pa时制备的Al膜较均匀致密。     

射频磁控反应溅射制备Al2O3薄膜的工艺研究

采用射频磁控反应溅射法,以高纯Al为靶材,高纯O2为反应气体,在不锈钢和单晶Si基片上成功地制备了氧化铝(Al2O3)薄膜,并对氧化铝薄膜的沉积速率、结构和表面形貌进行了研究.结果表明,沉积速率随着射频功率的增大先几乎呈线性增大而后缓慢增大;随着溅射气压的增加,沉积速率先增大,在一定气压时达到峰值后继续随气压增大而减小,同时随着靶基距的增大而减小;随着氧气流量的不断增加,靶面溅射的物质从金属态过渡到氧化物态,沉积速率也随之不断降低.X射线衍射图谱表明薄膜结构为非晶态;用原子力显微镜对薄膜表面形貌观察,薄膜微结构为柱状.