Effects of Ga addition on microstructure and properties of Sn–0.5Ag–0.7Cu solder

The effects of rare element Ga on solderability, microstructure, and mechanical properties of Sn–0.5Ag–0.7Cu lead-free solder were investigated. The experimental results show that Ga plays a positive role in improving the wettability and the microstructure of the solder. When the content of Ga is at 0.5 wt%, the grain size of the solder is smaller and the shear force is enhanced greatly. It is also found that the thickness of the IMCs at the solder/Cu interface is reduced with proper addition of Ga. The increase of mechanical properties may be related to the refining of IMCs of the solder due to Ga addition.     

Effect of adding Ce on interfacial reactions between Sn–Ag solder and Cu

We investigated the effect of adding cerium (Ce) to low Ag content Sn–1.0wt.%Ag solder on the interfacial reactions between the Sn–1.0Ag solder and Cu substrate. The formation and growth of interfacial intermetallic compounds (IMCs) between the Sn–1.0Ag–0.3Ce solder and Cu substrate were studied and the results were compared to those obtained for the Ce-free Sn–1.0Ag/Cu and most promising Sn–3.0Ag–0.5Cu/Cu systems. The addition of Ce to the Sn–Ag solder significantly reduced the growth of the interfacial Cu–Sn IMCs, retarded the interfacial reactions between the solder and the substrate, and prevented the IMC from spalling from the interface. The Sn–1.0Ag–0.3Ce solder alloy had a good interfacial stability with the Cu substrate during solid-state isothermal aging in the viewpoint of IMC growth.     

Effects of trace amount addition of rare earth on properties and microstructure of Sn–Ag–Cu alloys

Ternary lead free solder alloys Sn–Ag–Cu were considered as the promising alternatives to conventional SnPb alloys comparing with other solders. In the present work, effects of trace amounts of rare earth Ce on the wettability, mechanical properties and microstructure of Sn–Ag–Cu solder have been investigated by means of scanning electron microscopy and energy dispersive X-ray analysis systematically. The results indicate that adding trace amount of rare earth Ce can remarkably improve the wettability, mechanical strength of Sn–Ag–Cu solder joint at different temperature, especially when the content of rare earth Ce is at about 0.03%, the tensile strength will be 110% times or more than that of the lead free solder joint without rare earth Ce addition. Moreover, it was observed that the trace amount of rare earth Ce in Sn–Ag–Cu solder may refine the joint matrix microstructure, modify the Cu₆Sn₅ intermetallic phase at the copper substrate/solder interface, and the intermetallic compound layer thickness was reduced significantly. In addition, since rare earth Ce possesses a higher affinity to Sn in the alloy, adding of rare earth Ce can also lead to the delayed formation and growth of the intermetallic compounds of Ag₃Sn and Cu₆Sn₅ in the alloy.     

Properties and microstructure of Sn–0.7Cu–0.05Ni solder bearing rare earth element Pr

Effects of trace amount of rare earth element Pr on properties and microstructure of Sn–0.7Cu–0.05Ni solder were investigated in this paper. The solderability of Sn–Cu–Ni–xPr alloy and shear strengh of Sn–Cu–Ni–xPr soldered micro-joints were determined by means of the wetting balance method and shear test, respectively. Moreover, microstructure of solder alloys bearing Pr, as well as intermetallic compound (IMC) layer formed at solder/Cu interface after soldering were observed. It was concluded that the major benefits of rare earth element Pr on Sn–Cu–Ni lead-free solder are: improving solderability, refining microstructure, and depressing IMC (IMC) growth, which exhibited improved mechanical properties. It also revealed that (Cu,Ni)₆Sn₅ is the majority IMC phase at the interface of Sn–Cu–Ni–xPr/Cu solder joints. Ni added into the solder effectively suppressed the growth of Cu₃Sn and consequently also the total IMC layer thickness. Above all, the thickness and morphology of the interfacial (Cu,Ni)₆Sn₅ IMC were optimized due to alloying Pr. It can be inferred that Pr and Ni would play an important role in improving the reliability of Sn–Cu–Ni lead-free solder joints.     

Effects of Al,Pr additions on the wettability and interfacial reaction of Zn–25Sn solder on Cu substrate

Zn–25Sn alloy suffers from easy oxidation during soldering. This study investigated the feasibility of Al and rare earth Pr addition for enhancing the wettability of the Zn–25Sn solder. The wettability and interfacial reaction of Zn–25Sn, Zn–25Sn–0.05Al, Zn–25Sn–0.05Al–XPr (X = 0.01, 0.05, 0.08, 0.15 wt%) on Cu substrate were investigated. The additions of 0.05 wt% Al in Zn–25Sn and 0.01, 0.05 wt% Pr in Zn–25Sn–0.05Al enhanced the wettability of solders and depressed the growth of intermetallic compounds. However, the additions of 0.08, 0.15 wt% Pr in Zn–25Sn–0.05Al degraded the wettability and enhanced the growth of the intermetallic compound. Pr and Al were shown to accumulate at the surface of solders and the interfaces between solder and substrate by the Secondary Ion Mass Spectroscopy, Scanning Electron Microscope and Transmission Electron Microscopy. The phases PrZn₃, Pr₃Sn₅ and (Cu, Al)₄Zn were formed at the solder/substrate interface.     

Effects of rare earth Ce on properties of Sn–9Zn lead-free solder

The influences of different Ce content on the properties of Sn–9Zn lead-free solder were investigated. The results indicate that Ce plays an important role not only in the structure and the solderability, but also in the interfacial structure of Sn–9Zn–xCe/Cu and mechanical property of soldered joint. Sn–9Zn–0.08Ce shows finer and more uniform microstructure than Sn–9Zn, and when the quantity of Ce is 0.5–1 wt%, some dark Sn–Ce compounds appear in the solder. With the addition of 0.08 wt% Ce, the solderability of solder is significantly improved because the surface tension of molten solder is decreased. Adding Ce makes the Cu5Zn8 IMCs formed at the interface of solder/Cu become much thicker than that of Sn–9Zn/Cu because much more content of Zn diffuse to the interface of solder/Cu to react with Cu. Results also indicate that adding 0.08 wt% Ce to the solder enhances mechanical property of soldered joint. When the Ce content is 0.1–0.5 wt%, some hard and brittle Cu–Zn IMCs appear in the bottom of dimples and the pull force of soldered joint decreases.     

Effects of rare earth element Nd on the solderability and microstructure of Sn�CZn lead-free solder

Effects of trace amount addition of rare earth Nd on the properties of eutectic Sn?CZn solder were studied in this paper. Results indicate that adding trace rare earth element Nd could remarkably improve the solderability and mechanical properties of Sn?C9Zn solder joints. Especially when the content of Nd was 0.06 wt%, the wettability of the solder was improved significantly, and the shear force of Sn?C9Zn?C0.06Nd solder joint was enhanced by 19.6% as well as pull force increased by 26.6% compared to that of Sn?C9Zn solder joint,respectively. It is also found that addition of rare earth Nd could refine the microstructure of the solder and some NdSn₃ phase appeared in the solder matrix. Moreover, the IMCs thickness at the solder/Cu interface was reduced. NdSn₃ phase appeared at the interface with excessive addition of Nd, which is the key reason that deteriorates the mechanical properties of soldered joint.     

Effect of Al on the microstructure and properties of Sn–0.7Cu solder alloy

Effect of Al on the microstructure and mechanical properties were investigated. The results showed that Al could depress the formation of eutectic phase in Sn–Cu–Al solder alloy. The intermetallic compounds of Sn–0.7Cu–0.03Al were refined compared with that of Sn–0.7Cu–0.015Al. Segregated CuAl intermetallic compound was observed in Sn–0.7Cu–0.15Al and Sn–0.7Cu–0.5Al solder alloy. Sn-whisker was observed on the polished surface of Sn–0.7Cu–0.15Al and Sn–0.7Cu–0.5Al. The ultimate tensile strength of Sn–0.7Cu–0.03Al and Sn–0.7Cu–0.5Al was found to be higher than that of Sn–0.7Cu–xAl (x = 0, 0.015 and 0.15). The elongation of Sn–0.7Cu–0.015Al was the highest. The creep performance of Sn–0.7Cu–0.03Al and Sn–0.7Cu–0.5Al was similar and higher than that of Sn–0.7Cu and Sn–0.7Cu–0.15Al.     

Effects of indium addition on properties and wettability of Sn–0.7Cu–0.2Ni lead-free solders

This paper reports the investigation on indium addition into Sn–0.7Cu–0.2Ni lead-free solder to improve its various performances. The effects of indium addition on melting temperature, coefficient of thermal expansion (CTE), wettability, corrosion resistance and hardness of the solder alloys were studied. The results showed that when the addition of indium was ⩽0.3 wt.%, the change in melting temperature of Sn–0.7Cu–0.2Ni–xIn solders was negligible, but the melting range of the solder alloy increased. The CTE and spreading area of Sn–0.7Cu–0.2Ni–xIn solders on copper both increased with the addition of indium. An optimal CTE was 17.5 × 10⁻⁶/°C by adding 0.3 wt.% indium. At this concentration, the spreading area of solder on copper was about 15.6% larger than that of Sn–0.7Cu–0.2Ni indium-free solder. The corrosion resistance also increased with the addition of indium increasing, and the corrosion rate of Sn–0.7Cu–0.2Ni–0.3In solder was reduced by 32.8% compared with Sn–0.7Cu–0.2Ni alloy after 14 days in 5% hydrochloric acid solution at room temperature. However, a decrease of 11.7% in hardness of the solder was found when 0.3 wt.% indium was added.     

Effects of antimony on the microstructure,thermal properties,mechanical performance,and interfacial behavior of Sn–0.7Cu–0.05Ni–xSb/Cu solder joints

Journal of Materials Science: Materials in Electronics - We investigated a new, lead-free solder alloy to replace traditional lead-based solder alloys. A Sn–0.7Cu–0.05Ni solder alloy...     

Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint

Due to the inherent environmental and health toxicities associated with lead, the use of environmental friendly lead-free solder materials has become an unavoidable trend in the electronic packaging industry. Sn-58Bi alloy is gaining attention for its good material properties such as low melting point, reliability and high tensile strength. The presence of the bismuth-rich phase increases the brittleness of Sn-58Bi alloy. The purpose of this study is to suppress the brittleness of Sn-58Bi alloy by the addition of different wt% (0, 10, 20, 30) of Sn powder. The powder metallurgy method was used to prepare the samples. Scanning electron microscopy and energy-dispersive X-ray analysis were done to study the structural properties and a tensile test was done by a universal tensile machine to study the mechanical properties. The results reveal that the Sn particles partially dissolved in the Sn-58Bi solder matrix. The dissolution of Sn particles significantly improved the mechanical strength by 30%, suppressed the brittleness and improved the strain value by 1.3 times.

     

Effects of microstructure and temperature on corrosion behavior of Sn–3.0Ag–0.5Cu lead-free solder

The heterogeneous microstructure of solder could be obtained when cooling rate of the solder joint was not even, which would affect the corrosion behavior of solder during service. The ambient temperature would also affect the corrosion behavior of solder joint. In this paper, the effects of microstructure and temperature on the corrosion behavior of Sn–3.0Ag–0.5Cu (SAC305) lead-free solder were investigated. The various microstructures of SAC305 lead-free solder were obtained by cooling specimens in air and furnace. Compared to the fine-fibrous Ag₃Sn phase inside the commercial SAC305 solder, platelet-like Ag₃Sn formed as cooling speed decreasing. The polarization behavior of SAC305 solders in 3.5 wt.% NaCl solution was not significantly affected by various microstructures, but sensitive to temperature.     

Effects of package geometry on thermal fatigue life and microstructure of Sn–Ag–Cu solder joint

Abstract

Soldering experiments of chip scale package devices were carried out by means of diode laser soldering system with Sn–Ag–Cu solders. In addition, pull tests and a scanning electron microscope were used to analyse the effect of processing parameters on mechanical strength of solder joints. Viscoplastic finite element simulation was utilised to predict solder joint reliability for different package geometry under accelerated temperature cycling conditions. The results indicate that under the conditions of laser continuous scanning mode as well as the fixed soldering time, an optimal power and package geometry exists, while the optimal mechanical properties of microjoints are gained.     

Effects of TiO2 nanoparticles addition on microstructure,microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder

The effects of TiO₂ nanoparticles addition on the microstructure, microhardness, and tensile properties of Sn–3.0 wt.%Ag–0.5 wt.%Cu–x wt.%TiO₂ (x = 0, 0.05, 0.1, and 0.6) composite solders were systematically investigated. Scanning electron microscope (SEM) was used to observe the microstructural evolution of the composite solders, measure the size of the Ag₃Sn grains, and estimate the spacing between the Ag₃Sn grains in the solder matrix. Energy-dispersive X-ray spectroscopy (EDX) and X-ray diffractometry (XRD) were used to identify the phases of eutectic areas in the composite solder matrix. Results show that both the average size of Ag₃Sn grains and the spacing between the Ag₃Sn grains decrease significantly, which might owe to the strong adsorption effect and high surface free energy of the TiO₂ nanoparticles. The microhardness is improved by 37% compared with TiO₂-free noncomposite solder as the weight percentage of TiO₂ nanoparticles is 0.1 wt.%. The improvement is due to the microstructural change of the composite solders, which is in good agreement with the prediction of the classic theory of dispersion strengthening. Tensile tests reveal that the TiO₂-containg composite solder alloys have higher ultimate tensile strength (UTS) than TiO₂-free noncomposite solder alloy due to solid solution hardening. UTS of solder alloys have a logarithmic increase relation with strain rate ranging from 10⁻³ s⁻¹ to 10⁻¹ s⁻¹ and decreases with an increase of test temperatures ranging from 25 °C to 125 °C.     

Effects of zinc on the interfacial reactions of tin–indium solder joints with copper

Sn-20.0 wt%In (Sn-20.0In) alloy is a promising base material in Pb-free solders for low-temperature applications. Zn is often used as an additive to Pb-free solders to reduce the extent of undercooling during reflow. Cu is the most commonly used substrate in electronics industry. Interfacial stability at Sn–In–Zn/Cu joints is crucial to reliability of electronic products. In this study, interfacial reactions between Sn-20.0 wt%In-x wt%Zn (Sn-20.0In-xZn) solders and Cu where x = 0.5, 0.7, 1.0, 2.0, 3.0, and 5.0 at 150, 230, and 260 °C were experimentally examined. It is found that the reaction phase formation and interfacial morphologies are strongly influenced by Zn concentrations. The reaction phases evolve from the Cu₆Sn₅ phase, CuZn and Cu₅Zn₈ phase, to Cu₅Zn₈ phase with higher Zn doping in the solders. The Cu₅Zn₈ phase acted as a diffusion barrier and suppressed the growth of the Cu₆Sn₅ phase. The results indicate that 2.0 wt%Zn addition resulted in the gentlest reactions during both soldering and solid-state ageing in Sn-20.0In-xZn/Cu couples.     

Effects of nano-structured particles on microstructure and microhardness of Sn–Ag solder alloy

In this research, the typical nano-structured Polyhedral Oligomeric Silsesquioxane (POSS) particles were incorporated into the Sn–3.5Ag eutectic solder paste by mechanically mixing to form lead-free composite solder. The effects of nano-structured POSS additions on the microstructure and mechanical properties of as-fabricated composite solder alloys were systematically investigated. Experimental results indicated that the average size and spacing distance of Ag₃Sn intermetallic compounds (IMCs) in composite solder matrix decreased as compared to the Sn–3.5Ag eutectic solder. The 3 wt% addition of nano-structured POSS particles could enhance the microhardness of composite solder by 18.4% compared with the Sn–3.5Ag eutectic solder matrix. The average grain size and spacing distance of Ag₃Sn IMCs in Sn–Ag + 3 wt% POSS composite solder matrix reduced from 0.35 to 0.23 μm and from 0.54 to 0.32 μm, respectively. The refined Ag₃Sn IMCs, acting as a strengthening phase in the solder matrix, could enhance the microhardness of the composite solders.     

Effects of rare earth La on microstructure and properties of Ag–21Cu–25Sn alloy ribbon prepared by melt spinning

Ag–21Cu–25Sn alloy ribbon as a promising intermediate temperature alloy solder (400–600 °C) was prepared by melt spinning technique in this paper. Rare earth La was added into Ag–21Cu–25Sn alloy to refine the microstructures and improve the wettabilities of as-prepared alloy solders. The phase constitutions, microstructures, melting temperatures and wettabilities of selected specimens were respectively tested. The results showed that the dominant phase constitutions of Ag–21Cu–25Sn–xLa alloy ribbons were Ag₃Sn and Cu₃Sn. The grain size of Ag–21Cu–25Sn–xLa alloy decreased with the addition of La increasing. La addition reduced the melting temperatures of Ag–21Cu–25Sn–xLa alloy ribbons, and effectively improved the wettabilities of the alloy ribbons. When the addition of La was 0.5 wt%, the wettability of as-prepared alloy solder achieved the optimal value of 158 cm² g⁻¹ under brazing temperature 600 °C and dwell time 15 min. In addition, raising brazing temperature and prolonging dwell time could improve the wettability of Ag–21Cu–25Sn–xLa alloy ribbon.