Numerical Analysis of Flow and Thermal Performance of Liquid-Cooling Microchannel Heat Sinks with Bifurcation

Single-phase liquid-cooling microchannels have received great attention to remove the gradually increased heat loads of heat sinks. Proper changes of the flow path and/or heat transfer surface can result in much better thermal performance of microchannel heat sinks. In this study, a kind of rectangular straight microchannel heat sink with bifurcation flow arrangement has been designed, and the corresponding laminar flow and heat transfer have been investigated numerically. Four different configurations are considered. The effects of the bifurcation ratio (the initial channel number over the bifurcating channel number) and length ratio (the channel length before bifurcation over the bifurcation channel length) on laminar heat transfer, pressure drop, and thermal resistance are considered and compared with those of the traditional straight microchannel heat sink without bifurcation flow. The overall thermal resistances subjected to inlet Reynolds number and pumping power are compared for the five microchannel heat sinks. Results show that the thermal performance of the microchannel heat sink with bifurcation flow is better than that of the corresponding straight microchannel heat sink. The heat sinks with larger bifurcation ratio and length ratio provide much better thermal performance. It is suggested to employ bifurcation flow path in the liquid-cooling microchannel heat sinks to improve the overall thermal performance by proper design of the bifurcation position and number of channels.     

Numerical Analysis of Constructal Water-Cooled Microchannel Heat Sinks with Multiple Bifurcations in the Entrance Region

The Constructal Theory is applied to obtain better thermal performance from a type of microchannel heat sink. Based on a smooth, straight, rectangular microchannel heat sink (Case 1), three different configurations of constructal multiple bifurcation are designed for the entrance region of each microchannel. These types are one bifurcation (Case 2), two bifurcations with the second placed in the front part (Case 3), and two bifurcations with the second bifurcation placed in the front part (Case 4). The corresponding laminar flow and heat transfer fields are investigated numerically by means of computational fluid dynamics. The effects of the bifurcation number and length ratio on pressure drop and overall thermal resistance are observed. The overall thermal resistance for the four microchannel heat sinks is compared when subjected to pumping power. It is found that designing one or two bifurcations (Cases 2, 3, 4) in the entrance region can improve thermal performance effectively. It is also recommended to place the second bifurcation in the back part (Case 4) of the microchannel heat sinks to obtain good overall thermal performance by proper design of the bifurcation position and number of channels.     

Constructal Parallel-Flow and Counterflow Microchannel Heat Sinks with Bifurcations

Based on the Constructal Theory, parallel-flow and counterflow microchannels heat sinks with bifurcations are put forward to manage the temperature nonuniformity and further reduce the temperature of microchannel heat sinks bottom plates. Several models with different lengths of bifurcations are designed, and the corresponding laminar fluid flow and heat transfer of all models have been investigated through numerical simulations. The pressure, velocity, temperature distributions, and averaged Nusselt numbers are analyzed in details, and then the overall thermal resistances and overall thermal performance are compared. The results show that the thermal performance of counterflow microchannel heat sinks is better than that of parallel-flow heat sinks for the same geometry, and bifurcation can improve the thermal performance for all cases. It is suggested that a proper design of the length of bifurcation counterflow microchannel can be employed to improve the overall thermal performance of microchannel heat sinks. The study complements and extends previous works.     

The effect of geometrical parameters on heat transfer characteristics of microchannels heat sink with different shapes

The effect of geometrical parameters on water flow and heat transfer characteristics in microchannels is numerically investigated for Reynolds number range of 100–1000. The three-dimensional steady, laminar flow and heat transfer governing equations are solved using finite volume method. The computational domain is taken as the entire heat sink including the inlet/outlet ports, wall plenums, and microchannels. Three different shapes of microchannel heat sinks are investigated in this study which are rectangular, trapezoidal, and triangular. The water flow field and heat transfer phenomena inside each shape of heated microchannels are examined with three different geometrical dimensions. Using the averaged fluid temperature and heat transfer coefficient in each shape of the heat sink to quantify the fluid flow and temperature distributions, it is found that better uniformities in heat transfer coefficient and temperature can be obtained in heat sinks having the smallest hydraulic diameter. It is also inferred that the heat sink having the smallest hydraulic diameter has better performance in terms of pressure drop and friction factor among other heat sinks studied.     

Numerical study of the inlet/outlet arrangement effect on microchannel heat sink performance

In this study, fluid flow and heat transfer in microchannel heat sinks are numerically investigated. The three-dimensional governing equations for both fluid flow and heat transfer are solved using the finite-volume scheme. The computational domain is taken as the entire heat sink including the inlet/outlet ports, inlet/outlet plenums, and microchannels. The particular focus of this study is the inlet/outlet arrangement effects on the fluid flow and heat transfer inside the heat sinks.The microchannel heat sinks with various inlet/outlet arrangements are investigated in this study. All of the geometric dimensions of these heat sinks are the same except the inlet/outlet locations. Because of the difference in inlet/outlet arrangements, the resultant flow fields and temperature distributions inside these heat sinks are also different under a given pressure drop across the heat sink. Using the averaged velocities and fluid temperatures in each channel to quantify the fluid flow and temperature maldistributions, it is found that better uniformities in velocity and temperature can be found in the heat sinks having coolant supply and collection vertically via inlet/outlet ports opened on the heat sink cover plate. Using the thermal resistance, overall heat transfer coefficient and pressure drop coefficient to quantify the heat sink performance, it is also found these heat sinks have better performance among the heat sinks studied. Based on the results from this study, it is suggested that better heat sink performance can be achieved when the coolant is supplied and collected vertically.     

Comparative Study of the Flow and Thermal Performance of Liquid-Cooling Parallel-Flow and Counter-Flow Double-Layer Wavy Microchannel Heat Sinks

Applications of microchannel heat sinks for dissipating heat loads have received great attention. Wavy channels are recognized to be an alternative cooling technology to enhance the heat transfer, and are successfully applied in heat exchangers. In this article, three kinds of liquid-cooling double-layer microchannel heat sinks, such as a rectangular straight microchannel heat sink, a parallel-flow wavy microchannel heat sink, and a counter-flow double-layer wavy microchannel heat sink, have been designed and the corresponding laminar flow and heat transfer have been investigated numerically. The effects of the wave amplitude and volumetric flow ratio on heat transfer, pressure drop, and thermal resistance are also observed. Results show that the counter-flow double-layer wavy microchannel heat sink is superior at a larger flow rate, and a more uniform temperature rise is achieved. For a slightly larger flow rate, the parallel flow layout shows better performance. In addition to the overall thermal resistance, other criteria for evaluation of the overall thermal performance, e.g., (Nu/Nu₀)/(f/f₀) and (Nu/Nu₀)/(f/f₀)^1/3, are applied and similar results are obtained.     

Numerical simulation of fluid flow and heat transfer in a microchannel heat sink with offset fan-shaped reentrant cavities in sidewall

The paper is focused on the investigation of fluid flow and heat transfer characteristics in a microchannel heat sink with offset fan-shaped reentrant cavities in sidewall. In contrast to the new microchannel heat sink, the corresponding conventional rectangular microchannel heat sink is chosen. The computational fluid dynamics is used to simulate the flow and heat transfer in the heat sinks. The steady, laminar flow and heat transfer equations are solved in a finite-volume method. The SIMPLEX method is used for the computations. The effects of flow rate and heat flux on pressure drop and heat transfer are presented. The results indicate that the microchannel heat sink with offset fan-shaped reentrant cavities in sidewall improved heat transfer performance with an acceptable pressure drop. The fluid flow and heat transfer mechanism of the new microchannel heat sink can attribute to the interaction of the increased heat transfer surface area, the redeveloping of the hydraulic and thermal boundary layers, the jet and throttling effects and the slipping over the reentrant cavities. The increased heat transfer surface area and the periodic thermal developing flow are responsible for the significant heat transfer enhancement. The jet and throttling effects enhance heat transfer, simultaneously increasing pressure drop. The slipping over the reentrant cavities reduces pressure drop, but drastically decreases heat transfer.     

Parametric study on the combined thermal and hydraulic performance of single phase micro pin-fin heat sinks part I: Square and circle geometries

This paper is the first part of a three paper series studying the overall performance of a micro pin-fin heat sink with single phase liquid flow and different pin-fin geometries operating under and similar conditions. Two different heat sinks, one with square shaped pin-fins and the other with circular pin-fins are selected for study in this paper. The paper focuses on studying the effect of thermal resistance and pressure drop of micro heat sinks when subjected to various factors such as pitch distance in axial and transverse directions, aspect ratio of the pin-fin, hydraulic diameters of the pin-fin, and the liquid flow rate through the device. A figure of merit (FOM) involving both the thermal resistance and pressure drop across the heat sink is introduced in the paper and the performance is evaluated on the basis of this FOM. The heat sinks are subjected to uniform heat flux at the bottom of the heat sink and the characteristic study is based on constant Reynolds number of liquid flow at the entrance of the channel. Water is used as the fluid in this study. The study is conducted over the Reynolds number range of 50–500. The characteristic study is carried out with the help of simulations developed using commercially available computational fluid dynamics software CoventorWare?. The characteristic study carried out in this paper is divided into four cases. In the first case the axial pitch distance is varied between 350 μm and 650 μm by keeping the aspect ratio of the pin-fin structure constant at 0.5. For the second case the transverse pitch distance is varied between 150 μm and 300 μm and the aspect ratio is kept the same as in the first case. Third case studies the effect of varying the aspect ratio (between 0.33 and 1) of the pin-fin structures by keeping both pitches constant. Case four studies the variation in the performance of the heat sink with the change in the hydraulic diameter of the pin-fins. The study conducted in this paper reveals the importance of considering the pressure drop along with the thermal resistance in evaluating the overall performance of the micro pin-fin heat sink. At low Reynolds number (below 300) the heat sinks with circular pin-fins shows better performance compared with heat sinks with square pin-fins and vice versa at high Reynolds number (above 300). FOM varies considerably with the change in the parameters like axial pitch distance, transverse pitch distance, aspect ratio and hydraulic diameter of the pin-fins.     

Numerical investigations of developing flow and heat transfer in raccoon type microchannels under inlet pulsation

The present study investigates numerically the simultaneously developing unsteady laminar fluid flow and heat transfer inside a two dimensional wavy microchannel caused by a sinusoidal varying velocity component at an inlet. The flow was both thermally and hydro dynamically developing while the channel walls were kept at a uniform temperature. The simulation was performed in the laminar regime for Prandtl number 7(water) and Reynolds number ranging from 0.1 to 100. A Wavy microchannel having non-dimensional hydraulic diameter 1 with varying pulsating amplitude and frequency represented by the Strouhal number was designed for the given Reynolds number range. Based on the comparison with steady flow in a wavy channel it was found that imposed sinusoidal velocity at the inlet can provide improved heat transfer performance at different amplitudes (0.2, 0.5, 0.8) and frequencies (1, 5, 10) while keeping the pressure drop within acceptable limits.     

Thermal performance of plate-fin vapor chamber heat sinks

Since vapor chambers exhibit excellent thermal performance, they are suited to use as bases of heat sinks. This work experimentally studies the thermal performance of plate-fin vapor chamber heat sinks using infrared thermography. The effects of the width, height and number of fins and of the Reynolds number on the thermal performance are considered. Experimental data are compared with corresponding data for conventional aluminum heat sinks. The results show that generated heat is transferred more uniformly to the base plate by a vapor chamber heat sink than by a similar aluminum heat sink. Therefore, the maximum temperature is effectively reduced. The overall thermal resistance of the vapor chamber heat sink declines as the Reynolds number increases, but the strength of the effect falls. The effect of the fin dimensions on the thermal performance is stronger at a lower Reynolds number. At a low Reynolds number, a suitable number of fins must be chosen to ensure favorable thermal performance of the vapor chamber heat sink. However, at a high Reynolds number, the thermal performance improves as the fin number increases.     

Analytical analysis of heat transfer and pumping power of laminar nanofluid developing flow in microchannels

Thermal management issues are limiting barriers to high density electronics packaging and miniaturization. Liquid cooling using micro and mini channels is an attractive alternative to large and bulky aluminum or copper heat sinks. These channels can be integrated directly into a chip or a heat spreader, and cooling can be further enhanced using nanofluids (liquid solutions with dispersed nanometer-sized particles) due to their enhanced heat transfer effects reported in literature. The goals of this study are to evaluate heat transfer improvement of a nanofluid heat sink with developing laminar flow forced convection, taking into account the pumping power penalty. The phrase heat transfer enhancement ratio (HTR) is used to denote the ratio of average heat transfer coefficient of nanofluid to water at the same pumping power. The proposed model uses semi-empirical correlations to calculate nanofluid thermophysical properties. The predictions of the model are found to be in good agreement with experimental studies. The validated model is used to identify important design variables (Reynolds number, volume fraction and particle size) related to thermal and flow characteristics of the microchannel heat sink with nanofluids. Statistical analysis of the model showed that the volume fraction is the most significant factor impacting the HTR, followed by the particle diameter. The impact of the Reynolds number and other interaction terms is relatively weak. The HTR is maximized at smallest possible particle diameter (since smaller particles improve heat transfer but do not impact pumping power). Then, for a given Reynolds number, an optimal value of volume fraction can be obtained to maximize HTR. The overall aim is to present results that would be useful for understanding and optimal design of microchannel heat sinks with nanofluid flow.     

Numerical Investigation into the Thermal Performance of Single Microchannels with Varying Axial Length and Different Shapes of Micro Pin-Fin Inserts

This study investigates numerically the thermal performance of combined microchannel heat sink with micro pin-fins with different cross-sectional shapes. The objective of this study is to investigate the best geometric configuration that maximizes the heat transfer from the heated base when the combined heat sink is subjected to a steady, laminar, incompressible convective fluid flow and heat transfer. The axial length of the solid substrate and microchannel is varied from 1 to 10 mm with fixed total volume of 0.9 mm³ while the number of rows of the different shapes of micro pin-fins was varied between three and seven. It was observed that best performance is obtained with a sixth row of circular-shaped micro pin-fins for the optimized combination of the microchannel and micro pin-fin heat sink. Results of the optimal axial length for fixed pressure drop range are also presented.     

Analysis of three-dimensional heat transfer in micro-channel heat sinks

In this study, the three-dimensional fluid flow and heat transfer in a rectangular micro-channel heat sink are analyzed numerically using water as the cooling fluid. The heat sink consists of a 1-cm² silicon wafer. The micro-channels have a width of 57 μm and a depth of 180 μm, and are separated by a 43 μm wall. A numerical code based on the finite difference method and the SIMPLE algorithm is developed to solve the governing equations. The code is carefully validated by comparing the predictions with analytical solutions and available experimental data. For the micro-channel heat sink investigated, it is found that the temperature rise along the flow direction in the solid and fluid regions can be approximated as linear. The highest temperature is encountered at the heated base surface of the heat sink immediately above the channel outlet. The heat flux and Nusselt number have much higher values near the channel inlet and vary around the channel periphery, approaching zero in the corners. Flow Reynolds number affects the length of the flow developing region. For a relatively high Reynolds number of 1400, fully developed flow may not be achieved inside the heat sink. Increasing the thermal conductivity of the solid substrate reduces the temperature at the heated base surface of the heat sink, especially near the channel outlet. Although the classical fin analysis method provides a simplified means to modeling heat transfer in micro-channel heat sinks, some key assumptions introduced in the fin method deviate significantly from the real situation, which may compromise the accuracy of this method.     

Numerical investigations of simultaneously developing flow in wavy microchannels under pulsating inlet flow condition

The simultaneously developing unsteady laminar fluid flow and heat transfer inside a two dimensional wavy microchannel, due to sinusoidally varying velocity component at inlet has been numerically investigated. The flow was both thermally and hydrodynamically developing while the channel walls were kept at a uniform temperature. The transient solution of two-dimensional Navier-Stokes equation was obtained using the SIMPLE algorithm with the momentum interpolation technique of Rhie and Chow. The simulation was performed in the laminar regime for Prandtl number 7 and Reynolds number ranging from 0.1 to 100. Based on the comparison with steady flow in wavy channel it was found that imposed sinusoidal velocity at inlet can provide improved heat transfer performance at different amplitude (0.2, 0.5, 0.8) and frequency (1, 5, 10).     

Numerical investigation of two-phase laminar pulsating nanofluid flow in a helical microchannel

ABSTRACT

Numerical investigations on the thermal and hydraulic characteristics of pulsating laminar flow in a three-dimensional helical microchannel heat sink (HMCHS) model are performed using Al₂O₃-water-based nanofluid. The simulation is performed in the laminar regime for Reynolds number ranging from 6 to 25. The two-phase mixture model with modified effective thermal conductivity and viscosity equations is employed to solve the problem numerically. The detailed results for thermal and flow fields are reported for the effects of amplitude (1–3), frequency (5–20 rad/s), and nanoparticle concentration (1%–3%). The results indicate that the heat transfer performance improves significantly for sinusoidal velocity inlet conditions compared with steady flow conditions.     

Numerical study of a solar thermoelectric generator with nanofluids based microcooling system

Abstract

Nanofluids have been recently gaining ever-increasing attention in solar thermoelectric applications due to their promising potentials as heat transfer fluids. This research investigates numerically the performance of a thermoelectric generator (TEG) that is cooled by Al₂O₃/water nanofluid flows in zigzag microchannel heat sinks (ZMCHS). The one-way fluid–structure interaction (FSI) tool was used to couple the thermal-electric and fluid flow tools in ANSYS 15.0. The present study focused on the effects of heat flux (2–50?kW/m²), laminar Reynolds number (5–1500), inlet flow temperature (293–303?K) and the nanoparticle concentration (1–6%) on the output electric power and the efficiency of the TEG module. The applied heat flux limitations and its relation to the thermal limitations of thermoelectric materials were considered. The results indicated that the increase of heat flux increased the output power and the efficiency of TEG. Higher Reynolds numbers (Re > 400), inlet temperature and nanofluid concentration had an insignificant impact on the TEG performance.     

A Numerical Study on the Forced Convection of Laminar Nanofluid in a Microchannel with Both Slip and No-Slip Conditions

This article provides numerically study of the thermal performance of a microchannel, cooled with either pure water or a Cu-water nanofluid, while considering the effects of both slip and no-slip boundary conditions on the flow field and heat transfer. The microchannel is partially heated at a constant temperature and cooled by forced convection of a laminar flow at a relatively lower temperature. The effects of pertinent parameters such as Reynolds number, solid volume fraction, and slip velocity coefficient on the thermal performance of the microchannel are studied. The results of the numerical simulation indicate that the heat transfer rate is significantly affected by the solid volume fraction and slip velocity coefficient at high Reynolds numbers.     

Thermal performance of finned aluminum heat sink filled with ERG aluminum foam: Experimental and numerical approach

The rapid improvements in electronic devices have led to a high demand for effective cooling techniques. The purpose of this study was to investigate the heat transfer characteristics and performance of different aluminum heat sinks filled with aluminum foam for an Intel core i7 processor. The aluminum foam heat sinks were subjected to water flow covering the non-Darcy flow regime (300-600 Reynolds numbers). The bottom side of the heat sinks was heated with a heat flux between 8.5 and 13.8 W/cm². Three different heat sinks were examined in this study. Models A, B, and C contained two, three and four channels, respectively. Each channel gap was filled with ERG aluminum foam. The distributions of the local surface temperature and the local Nusselt number were measured for each heat sink design. The experimental data were compared with the numerical results. The average Nusselt number was obtained for the range of Reynolds numbers, and an empirical correlation of the average Nusselt number as a function of the Reynolds number was derived for each heat sink. The pressure drop across the characteristics of each heat sink design was measured. The thermal performance of each aluminum foam heat sink was evaluated based on the average Nusselt number and the required pumping power. The experimental results revealed that model B achieved the highest average Nusselt number compared with models A and C. However, model C had the highest surface to volume ratio; the thermal boundary layers, which are formed on adjacent fin surfaces inside the aluminum foam, interface with each other causing a reduction in the overall heat transfer. The numerical results were in good agreement with experimental data of local Nusselt number and local temperature with maximum relative errors of 2% and 1%, respectively.     

The heat transfer and fluid flow of a partially heated microchannel heat sink

Numerical modeling of the conjugate heat transfer in microchannel heat sink is presented. As the most of the cooling applications deals with the partial heated sections, the influence of the heating position on the thermal and hydrodynamic behavior is analyzed. The laminar fluid flow regime and the water as a working fluid are considered. It is observed that partial heating together with variable viscosity has a strong influence on thermal and hydrodynamic characteristics of the micro-heat sink.     

Effects of shield on thermal-fluid performance of vapor chamber heat sink

This work investigates the effects of a shield on the thermal and hydraulic characteristics of plate-fin vapor chamber heat sinks under cross flow cooling. The surface temperature distributions of the vapor chamber heat sinks are measured using infrared thermography. The thermal-fluid performance of vapor chamber heat sinks with a shield is determined by varying the fin width, the fin height, the fin number and the Reynolds number. The experimental data thus obtained are compared with those without a shield.Experimental results indicate that the maximum surface temperature of the vapor chamber heat sink is effectively reduced by adding the shield, which forces more cooling fluid into the inter-fin channel to exchange heat with the heat sink. However, using the shield increases the pressure drop across the heat sink. The experimental data also show that the enhancement of the heat transfer increases with the Reynolds number, but the improvement declines as the Reynolds number increases. When the pumping power and heat transfer are simultaneously considered, vapor chamber heat sinks with thinner, higher or more fins exhibit better thermal-hydraulic performance.