固结磨料研磨SiC单晶基片(0001)C面研究

碳化硅(SiC)单晶基片已广泛应用于微电子、光电子等领域.本文针对传统游离磨料研磨加工的缺点,提出了固结磨料研磨SiC单晶基片技术,以前期研究的SiC单晶基片研磨膏配方,试制了一系列固结磨料研磨盘,研究了固结磨料研磨SiC单晶基片(0001)C面时的材料去除率、表面粗糙度及平面度,并与游离磨料研磨进行了对比.结果表明,固结磨料研磨后样品表面有深度较浅的划痕,游离磨料研磨后表面没有划痕,但表面呈凹坑状;游离磨料研磨后工件表面粗糙度轮廓最大高度Rz远大于固结磨料研磨;固结磨料研磨的材料去除率高于游离磨料,固结磨料研磨后的表面粗糙度Ra远低于游离磨料研磨,固结磨料研磨可提高平面度;研究结果可为进一步研究固结磨料化学机械研磨盘、固结磨料研磨工艺参数及机理提供参考依据.     

多线切割工艺对单晶锗损伤层及几何参数的影响

本工作集中研究磨料粒径、进给速度及切割线径对单晶锗片损伤层及几何参数的影响。结果表明:在切割过程中,磨料粒径与锗片损伤层深度及表面粗糙度呈正比关系,采用3 000#磨料切割时,损伤层深度为6μm,表面粗糙度为0.285μm;进给速度的降低会降低锗棒在切割过程中的温度变化,从而降低锗片的几何参数;采用3 000#碳化硅微粉,100μm/min进给速度,0.09 mm切割线的切割工艺,能够获得表面质量优异、几何参数小、切割损耗小的锗片。     

金刚石表面形成Ti3SiC2的反应机理

采用Ti、Si、TiC、金刚石磨料为原料,通过放电等离子烧结(SPS),制备了Ti3SiC2陶瓷结合剂金刚石材料.研究结果表明,Ti-Si-2TiC试样经SPS加热的过程中位移、位移率和真空度在1200℃时发生明显变化,表明试样发生了物理化学变化.XRD分析结果表明1200℃时试样发生化学反应生成了Ti3SiC2.随着温度升高,试样中Ti3SiC2含量逐渐增加.当烧结温度为1200℃、1300℃、1400℃和1500℃时,产物中Ti3SiC2含量分别为65.9%、79.97%、87.5%和90.1%.在Ti/Si/2TiC粉料中添加适量的金刚石5%和10%进行烧结,并未抑制Ti3SiC2的反应合成.SEM观察表明,金刚石与基体结合紧密,同时其表面生长着发育良好的Ti3SiC2板条状晶粒.提出了一种金刚石表面形成Ti3SiC2的机制,即金刚石表面的碳原子首先与周围的Ti反应生成TiC,然后TiC再与Ti-Si相发生化学反应,生成Ti3SiC2.     

往复式线切割对单晶硅表面粗糙度的影响

为了研究不同尺寸的金刚石颗粒、不同切速比(进给速度与线速度之比值)、金刚线切割时间与不同往复切割次数对晶体色散元件表面粗糙度的影响,主要采用四种不同线径的电镀金刚石线在上述条件下做切割晶面(111)单晶硅分光晶体的实验,并实现在脆性材料单晶硅的塑性区域进行线切割加工。结果表明:在塑性区域加工单晶硅分光晶体的表面粗糙度与金刚石颗粒尺寸成正比、与切速比有密切关系,增加往复切割的次数可以有效降低分光晶体的表面粗糙度。此次研究能够给上海同步辐射光源晶体色散元件加工提供一定的参考价值。     

单晶金刚石机械研磨结合化学辅助机械抛光组合加工工艺

单晶金刚石因具有最高的硬度和最低的摩擦系数常被用来制备超精密刀具,而表面粗糙度是影响刀具寿命的重要指标.提出采用机械研磨结合化学辅助机械抛光的组合工艺抛光单晶金刚石.实验优化并确定的加工工艺如下:先用5μm和2μm金刚石粉研磨单晶金刚石表面,然后采用化学机械的方法去除机械研磨带来的损伤.用该工艺抛光单晶金刚石,表面粗糙度Ra可达0.8 nm(测量区域70μm×53μm).表面拉曼光谱分析表明化学机械抛光的表面只有1 332 cm-1拉曼峰.     

单晶金刚石机械研磨与化学机械抛光工艺

单晶金刚石在工业、国防等领域的应用日益广泛,对其加工表面质量的要求不断提高,使用常温低压的化学机械抛光可实现金刚石的超光滑低损伤表面加工.通过理论分析及实验研究得出,使用硅酸盐玻璃材质研磨盘进行研磨加工,可以将金刚石表面粗糙度Ra降至15~25 nm,且无明显机械划痕;在2 MPa压力及室温环境下进行单晶金刚石化学机械抛光实验,优选出Fenton试剂酸性水基抛光液,使用该抛光液抛光单晶金刚石可获得粗糙度Ra值4 nm以下的光滑表面.     

优质克拉级Ib型金刚石单晶的高温高压合成及应用研究

利用温度梯度法,在国产六面顶压机上进行优质克拉级Ib型金刚石单晶的高温高压合成及应用研究.通过合理设计实验组装,优化生长工艺,严格控制生长速度等成功合成出了多颗优质克拉级金刚石单晶.借助扫描电子显微镜(SEM)对克拉级金刚石单晶的表面缺陷进行了测试分析.考察了生长速度对晶体品质的影响.同时,对优质克拉级大单晶在饰品钻石...     

SiC/DLC过渡层对类金刚石薄膜力学性能的影响

采用等离子体浸没离子注入及沉积技术在钛合金(Ti6Al4V)表面制备了类金刚石薄膜和含有SiC/DLC过渡层的类金刚石薄膜。采用拉曼光谱及扫描电子显微镜分析了薄膜的成分和结构,并利用超显微硬度计、薄膜结合力测试仪和往复式摩擦实验机研究了薄膜的硬度、韧性、膜/基结合力和耐磨性。研究结果表明,SiC/DLC过渡层可以提高钛合金(Ti6Al4V)表面类金刚石薄膜的韧性及膜/基结合力,与未制备过渡层的类金刚石薄膜相比,含有SiC/DLC过渡层的类金刚石薄膜的耐磨性明显提高。     

SiC在异质衬底生长金刚石膜的作用分析

利用扫描电子显微镜 (SEM)、Raman光谱分析了Si衬底上金刚石膜核化和生长的过程 ,并着重分析了核化过程产生的SiC的性能。利用划痕法测量了在WC衬底上沉积SiC和未沉积SiC时生长金刚石膜的粘附力 ,同时还分析了WC衬底上有和没有SiC沉积层时表面附近金刚石膜的内应力。结果表明 ,SiC层大大地增强了含碳粒子的聚集和金刚石膜与衬底之间的粘附性 ,降低了金刚石膜与衬底之间的内应力     

衬底表面预处理对金刚石薄膜形核及长大的影响

用燃烧火焰法在 TC4 Ti 合金和单晶 Si(001)面上沉积了金刚石薄膜。对合成的膜进行了扫描电镜、激光喇曼光谱分析。结果表明,金刚石薄膜的结构和形貌强烈取决于沉积温度、O_2/C_2H_2流量比等工艺参数。研究了衬底表面预处理对金刚石薄膜形核及长大的影响,并对表面预处理影响形核的原因进行了初步探讨。     

Fixed Abrasive Diamond Wire Saw Slicing of Single-Crystal Silicon Carbide Wafers

This article investigates the slicing of single-crystal silicon carbide (SiC) with a fixed abrasive diamond wire. A spool-to-spool rocking motion diamond wire saw machine using a 0.22 mm nominal diameter diamond wire with 20 µm average size diamond grit was used. The effect of wire downfeed speed on wafer surface roughness and subsurface damage was first investigated. The surface marks generated by loose diamond grit and stagnation of the wire during the change of the wire-cutting direction were studied. The use of scanning acoustic microscopy (SAcM) as a nondestructive evaluation method to identify the subsurface damage was explored. Effects of using a new diamond wire on cutting forces and surface roughness were also investigated. Scanning electron microscopy has been used to examine the machined surfaces and wire wear. This study demonstrated the feasibility of fixed abrasive diamond wire cutting of SiC wafers and the usage of a SAcM to examine the subsurface damage.     

电镀金刚石线锯的研究现状

电镀金刚石线锯是用电镀的方法在金属丝(线)上沉积一层金属,并在沉积的金属内固结金刚石磨料制成的一种线性超硬材料工具.综述了电镀金刚石线锯的原理、模型和特点,以及制备过程中使用的材料(基体材料、金刚石和电镀液)和工艺及其应用实例,并对电镀金刚石线锯的进一步发展进行了展望.为开展电镀金刚石线锯的研究和生产提供了一定的指导.     

表面活性剂对金刚石在树脂中悬浮性及与树脂结合性的影响

用KH550硅烷偶联剂和聚电解质型表面活性剂聚乙烯亚胺(PEI)分别对金刚石进行表面改性,研究了KH550和PEI对金刚石表面电性、金刚石在聚酰胺酰亚胺树脂液中的悬浮性及与树脂结合性的影响.结果表明:改性后金刚石表面的电性能发生显著变化,在酸性条件下,zeta电位绝对值明显提高,颗粒间的静电斥力增强,改善了金刚石在树脂液中的悬浮稳定性;改善了树脂对金刚石表面润湿性及其界面结合性,提高了线锯的切割性能;KH550对金刚石的改性效果优于PEI的改性效果.     

Comparative Analysis of Fracture Strength of Slurry and Diamond Wire Sawn Multicrystalline Silicon Solar Wafers

This paper presents an analysis of fracture strength of multicrystalline silicon (mc‐Si) solar wafers produced by slurry and diamond wire sawing. The wafers were bent in two orthogonal orientations relative to the saw marks. The fracture strength of slurry sawn wafers increases gradually from wire entry to wire exit whereas the strength variation in the wire feed direction is small. The fracture strength of diamond wire sawn wafers is bi‐directional, with a higher strength if bent perpendicular to the saw marks and a lower strength if bent parallel to the saw marks. The fracture strength variation is related to the microcracks generated in the vicinity of grit‐induced surface damage.     

多晶硅表面金属催化化学腐蚀法制绒研究现状

在多晶硅太阳能电池的生产过程中,金刚线切割(Diamond wire sawing, DWS)技术具有切割速度快、精度高、原材料损耗少等优点,受到了广泛关注。金刚线切割多晶硅表面形成的损伤层较浅,与传统的酸腐蚀制绒技术无法匹配,金属催化化学腐蚀法应运而生。金属催化化学腐蚀法制绒具有操作简单、结构可控且易形成高深宽比的绒面等优点,具有广阔的应用前景。本文总结了不同类型的金属催化剂在制绒过程中的腐蚀机理及其形成的绒面结构,深入分析和讨论了具有代表性的银、铜的单一及复合催化腐蚀过程及绒面结构和电池片性能。最后对金刚线切割多晶硅片表面的金属催化化学腐蚀法存在的问题进行了分析,并展望了未来的研究方向。     

On theoretical substantiation of the choice of effective grain profile shape in modeling of diamond layer in dressing tools. Part 2. Electroforming

The paper describes, from the statistical standpoint, the mechanism of formation of spherical shape of the averaged cross section of scratches produced by flat faces of diamond grains in abrasive material of grinding wheels during their dressing with diamond rolls manufactured by electroforming. The distribution of parameters of orientation of diamond grain cutting faces has been determined and a brief comparative analysis of characteristics of dressing tools manufactured by electroforming and electroplating has been performed. A notion of the reduced effective diameter has been introduced into the model representation of a diamond cutting grain; a relationship between this diameter and the tool grain size has been found, which is needed for calculating individual and total cross-sections of cuts, dressing forces, and surface roughness of workpieces ground with pre-dressed abrasive wheels.     

绳锯线弓角静态测量方法的研究

金刚石绳锯在切割圆弧板材时,受到进给方向的阻力,形成"线弓角",使板材中部产生"过切",严重时导致材料报废.为解决这一问题,提出了线弓角的概念,从理论上提出了一种基于悬臂式力传感器的绳锯线弓角的静态测量方法,通过轴力传感器输出的电压值计算出线弓角度.试验在自行设计和搭建的绳锯线弓角测量平台上进行,用钢丝绳模拟串珠绳产生线弓角,并进行导轮受力与线弓角关系的静态测量试验分析,以验证该方法测量线弓角的可行性.试验结果表明:在一定范围内,串珠绳初始张紧力越大,线弓角的计算值越接近理论值.因此,采用所提出的测量方法,当装有轴力传感器的导轮处在刚好与钢丝绳接触的状态下,选择合适的初始张紧力,可以测得较准确的角度值.     

多约束条件下金刚石圆锯片结构优化研究

基于序列响应面模型和混合优化算法相结合的方式,提出一种在复杂载荷条件下降低金刚石圆锯片锯切噪声的优化方法。建立了多变量、多约束条件下金刚石圆锯片结构优化的数学模型,经计算得到了满足刚度要求的优化圆锯片。通过数学统计分析,获得了尺寸参数对锯片的声学、变形以及应力等性能影响规律。根据结果制备了金刚石圆锯片,锯切实验表明优化锯片能够有效的降低噪声,表明这种方法可为锯片或此类结构的声学优化研究提供新的方向和参考依据。     

A pneumatic conveying method for the manufacturing of ultraviolet curing diamond wire saws

The dominant method to cut brittle materials is using fixed-abrasive wire saw slicing. This paper investigates the mechanism of pneumatic conveying diamond grains in the process of manufacturing diamond wire saws. Based on the theories of gas–solid two-phase flow, a mathematical model is developed for the process of diamond grains embedding into the metal-covered wire with resin. The model is divided into five stages for insights into the action of diamond grains. Then the embedding rate is calculated. From the experiments, we can compare the theoretical analysis and practical results of the embedding depth of diamond grains under different pressures in a three-dimensional microscopy experimental setup. With the present mathematical model, it is feasible to produce diamond wires by the method of pneumatic conveying diamond grains with the help of this study.     

Investigation into Influence of Feed Speed on Surface Roughness in Wire Sawing

Aimed at obtaining the minimum machined surface roughness at an appropriate feed speed during the wire-sawing process, the theoretical mathematical model of material removal rate of the non-rigid cutting tool-wire saw is presented, which is based on the Preston equation. According to this theoretical model, this diamond wire-sawing experiment is designed to study the effects of feed speed on machined surface roughness. The experimental results indicate that the minimum machined surface roughness can be acquired by setting the process parameters as the setting curve of spindle speed and feed speed. The investigation provides the theoretical basis and research methods for study of this kind of wire-sawing machine and optimizing process parameters, in order to obtain a low-roughness machined surface.