Electrical properties of alumina films grown on Si at low temperature using catalytic CVD

The electrical properties of alumina films formed at substrate temperatures as low as 27 °C using tri-methyl aluminum (TMA) and molecular oxygen (O₂) by catalytic chemical vapor deposition (Cat-CVD) have been investigated by capacitance-voltage (C-V), current-voltage (I-V) measurements and X-ray photoelectron spectroscopy (XPS). Substrate temperature dependence of dielectric constant and leakage current of the films has been explained on the basis of deficiency in oxygen. Interface trapping density of the order of 10⁹ ev^− 1cm^− 2 has been obtained. Angle resolved XPS measurements have revealed that the direct bonding of alumina and Si was realized with very small interface trapping density.     

Photoluminescence behaviors in ZnGa2O4 thin film phosphors deposited by a pulsed laser ablation

ZnGa₂O₄ thin film phosphors have been deposited using a pulsed laser deposition technique on Si (1 0 0) and Al₂O₃ (0 0 0 1) substrates at a substrate temperature of 550 °C with various oxygen pressures 100, 200 and 300 mTorr, and various substrate temperatures of 450, 550 and 650 °C with a fixed oxygen pressure of 100 mTorr. The films grown under different deposition conditions have been characterized using microstructural and luminescent measurements. Under the different substrate temperatures, ZnGa₂O₄ thin films show the different crystallinity and luminescent intensity. The crystallinity and photoluminescence (PL) of the ZnGa₂O₄ films are highly dependent on the deposition conditions, in particular, oxygen pressure, substrate temperature, a kind of substrates. The luminescent spectra show a broad band extending from 350 to 600 nm peaking at 460 nm. The PL brightness data obtained from the ZnGa₂O₄ films grown under optimized conditions have indicated that the sapphire is one of the most promised substrates for the growth of high quality ZnGa₂O₄ thin film phosphor.     

Characterization of SiO2 and TiO2 films prepared using rf magnetron sputtering and their application to anti-reflection coating

Preparation of TiO₂ and SiO₂ films for optical applications was attempted using conventional rf magnetron sputtering in the sputtering ambient with various O₂/Ar+O₂ ratios and at substrate temperatures between room temperature and 400 °C. X-ray photoelectron spectroscopy (XPS) and optical spectroscopy investigations indicated that oxygen addition in the sputtering ambient was essential for growing TiO₂ films with stoichiometric compositions and good transmittance, while SiO₂ films had a stoichiometric composition of O/Si ratio=2.1-2.2 and were highly transparent in the visible wavelength region, independent of gas composition in the growing ambient. It was also identified from scanning electron microscope (SEM), atomic force microscope (AFM) and Fourier transform infrared spectroscopy (FTIR) measurements that the structural characteristics of both TiO₂ and SiO₂ films were significantly improved with O₂ addition in the sputtering ambient, showing smoother surface morphologies and higher resistances to water absorption when compared with films grown without O₂ addition. Heating of the substrate between 200 and 400 °C considerably increased the refractive index of TiO₂ layers, resulting in dense structures along with an improvement of crystallinity. For optical applications, AR coatings composed of 2-4 multi-layers on glass were designed and manufactured by stacking in turn the SiO₂ and TiO₂ films at room temperature and O₂/Ar+O₂=10%, and the performance of the produced coatings was compared with simulation results.     

Advantages of inductively coupled plasma-assisted sputtering for preparation of stoichiometric VO2 films with metal-insulator transition

Inductively coupled plasma (ICP)-assisted sputtering with an internal coil enabled deposition of stoichiometric crystalline vanadium dioxide (VO₂) films on a sapphire (Al₂O₃) (001) substrate under widely various deposition conditions. The films showed a metal-insulator (M-I) transition around temperatures of 68 °C with several orders of change in resistivity. Particularly, low-temperature (250 °C) growth of VO₂ film with two orders transition decade was achieved in ICP-assisted sputtering, in contrast with conventional sputtering, which required 400 °C for VO₂ growth. Rutherford back scattering (RBS) measurements revealed that the VO₂ film prepared by ICP-assisted sputtering was exactly stoichiometric, containing no impurity atoms from the inserted coil material. The ICP-assisted sputtering was examined in comparison to conventional sputtering in view of plasma characteristics.     

Growth and vacuum post-annealing effect on the properties of the new absorber CuSbS2 thin films

Post-growth treatments in vacuum atmosphere were performed on CuSbS₂ films prepared by the single-source thermal evaporation method on glass substrates. The films were annealed in vacuum atmosphere for 2 h in temperature range 130-200 °C. The effect of this thermal treatment on the structural, optical and electrical properties of the films was studied. X-ray diffraction (XRD) patterns indicated that the films exhibited an amorphous structure for annealing temperature below 200 °C and a polycrystalline structure with CuSbS₂ principal phase. For the films annealed at temperatures below 200 °C one direct optical transition in range 1.8-2 eV was found. For the films annealed at 200 °C, two optical direct transitions emerged at 1.3 and 1.79 eV corresponding to the CuSbS₂ and Sb₂S₃ values respectively. The electrical measurements showed a conversion from low resistivities (3.10^− 2-9.10^− 2) Ω cm for the samples annealed at temperatures below 200 °C to relatively high resistivities (2 Ω cm) for the samples annealed at 200 °C. In all cases the samples exhibited p-Ztype conductivity.     

Optical and structural properties of CuSbS2 thin films grown by thermal evaporation method

Structural, optical and electrical properties of CuSbS₂ thin films grown by thermal evaporation have been studied relating the effects of substrate heating conditions of these properties. The CuSbS₂ thin films were carried out at substrate temperatures in the temperature range 100-200 °C. The structure and composition were characterized by XRD, SEM and EDX. X-ray diffraction revealed that the films are (111) oriented upon substrate temperature 170 °C and amorphous for the substrate temperatures below 170 °C. No secondary phases are observed for all the films. The optical absorption coefficients and band gaps of the films were estimated by optical transmission and reflection measurements at room temperature. Strong absorption coefficients in the range 10⁵-10⁶ cm^− 1 at 500 nm were found. The direct gaps Eg lie between 0.91-1.89 eV range. It is observed that there is a decrease in optical band gap Eg with increasing the substrate temperature. Resistivity of 0.03-0.96 Ω cm, in dependence on substrate temperature was characterized. The all unheated films exhibit p-type conductivity. The characteristics reported here also offer perspective for CuSbS₂ as an absorber material in solar cells applications.     

Effects of process parameters on the LaNiO3 thin films deposited by radio-frequency magnetron sputtering

LaNiO₃ thin films were deposited by radio-frequency magnetron sputtering on both (100) Si and platinized Si substrates. The effects of relative oxygen ratio, substrate and annealing temperatures on the microstructure and the electrical properties of the films were investigated. The La/Ni ratio was found to be influenced by the relative oxygen ratio. On the other hand, the orientation of LaNiO₃ was significantly influenced by the substrate temperature. Highly (100)-oriented LaNiO₃ thin films were obtained on SiO₂/Si(100) and Pt/Ti/SiO₂/Si substrates when the substrates temperature was 300 °C with the relative oxygen ratio below 33%. In addition, the (100)-oriented LaNiO₃ showed the lower resistivity than that of random-oriented LaNiO₃.     

Photocatalytic properties of Cr-doped TiO2 films prepared by oxygen cluster ion beam assisted deposition

We prepared Cr-doped titanium dioxide (TiO₂) films by oxygen (O₂) cluster ion beam assisted deposition method, and investigated photocatalytic properties of the films as well as crystallographic property, optical property and surface morphology. The films prepared at a substrate temperature below 200 °C were found to be amorphous from the X-ray diffraction measurement. For the substrate temperatures such as 300 °C and 400 °C, the films exhibited rutile and/or anatase structures. The film surface measured by the atomic force microscope (AFM) was smooth at an atomic level. Furthermore, the optical band gap decreased with increase of Cr-composition, and it was approximately 3.3 eV for the non-doped films, 3.2 eV for the 1% Cr-doped films and 3.1 eV for the 10% Cr-doped films, respectively. With regard to the photocatalytic properties of the Cr-doped TiO₂ films, we measured the change of contact angle as well as the photocatalytic degradation of methylene blue by the UV light irradiation. Compared with the non-doped films, the 1% Cr-doped films prepared at a substrate temperature of 400 °C showed high degradation efficiency. In addition, the contact angle of the 1% Cr-doped films with an initial value of 60° decreased to 10° by the UV light irradiation for 20 min, and the films exhibited the predominant properties of photocatalytic hydrophilicity even for the UV light irradiation with longer wavelengths.     

Directed evolution of α-grains in thin metastable-Al2O3 films deposited on Si(100) after post-deposition annealing

A 250-nm-thick Al₂O₃ film was deposited on a Si(100) by a radio-frequency magnetron sputtering and annealed at 1100 °C for various periods of time in air. In the matrix composed of fine metastable-Al₂O₃ grains of 50-100 nm in diameter, large α-Al₂O₃ grains of about 2-10 μm in diameter appeared, interestingly aligning themselves along various directions. The compressive stress developed in the alumina films because the thermal expansion coefficient of the film was higher than that of the silicon substrate. The stress distribution in the film is expected to be inhomogeneous due to some discontinuities or defects, such as arrays of dislocation pits and steps on the surface of the Si substrate, which could be generated by intersections of the substrate surface and the slip and twin planes in the Si substrate. The enhanced phase transformation into α-Al₂O₃ along various directions is suggested to arise from such discontinuities or defects.     

Low-Loss Optical Waveguides for the Near Ultra-Violet and Visible Spectral Regions with Al(2)O(3) Thin Films from Atomic Layer Deposition

In this work, we report low-loss single-mode integrated optical waveguides in the near ultra-violet and visible spectral regions with aluminum oxide (Al₂O₃) films using an atomic layer deposition (ALD) process. Alumina films were deposited on glass and fused silica substrates by the ALD process at substrate/chamber temperatures of 200 °C and 300 °C. Transmission spectra and waveguide measurements were performed in our alumina films with thicknesses in the range of 210-380 nm for the optical characterization. Those measurements allowed us to determine the optical constants (n_w and k_w), propagation loss, and thickness of the alumina films. The experimental results from the applied techniques show good agreement and demonstrate a low-loss optical waveguide. Our alumina thin-film waveguides are well transparent in the whole visible spectral region and also in an important region of the UV; the measured propagation loss is below 4 dB/cm down to a wavelength as short as 250 nm. The low propagation loss of these alumina guiding films, in particular in the near ultra-violet region which lacks materials with high optical performance, is extremely useful for several integrated optic applications.     

Preparation of LaNiO3 thin films with very low room-temperature electrical resistivity by room temperature sputtering and high oxygen-pressure processing

LaNiO₃ (LNO) thin films were deposited by radio frequency magnetron sputtering on n-type Si (100) wafers at room temperature (RT). The as-sputtered LNO thin films were amorphous and had very high RT electrical resistivity even after post-annealing at 800 °C. The amorphous as-sputtered LNO films could be transformed to polycrystalline LNO films in rhombohedral phase by heating at 400 °C in an O₂ atmosphere at pressure ranging from 1.5 to 8.0 MPa. Very low RT resistivity of LNO films were obtained by this high oxygen-pressure processing. The lowest value was as low as 1.09 × 10^− 4 Ω cm by processing at oxygen pressure of 8 MPa. Such preparation of LNO thin films is compatible with the Si-based readout integrated circuits. Highly (100)-oriented perovskite structure of Pb(Zr_0.52Ti_0.48)O₃ thin films was formed on this rhombohedral phase LNO, and good ferroelectricity could also be obtained on these HOPP-processed rhombohedral phase LNO films.     

Preparation of anatase TiO2 thin films by vacuum arc plasma evaporation

Anatase titanium dioxide (TiO₂) thin films with high photocatalytic activity have been prepared with deposition rates as high as 16 nm/min by a newly developed vacuum arc plasma evaporation (VAPE) method using sintered TiO₂ pellets as the source material. Highly transparent TiO₂ thin films prepared at substrate temperatures from room temperature to 400 °C exhibited photocatalytic activity, regardless whether oxygen (O₂) gas was introduced during the VAPE deposition. The highest photocatalytic activity and photo-induced hydrophilicity were obtained in anatase TiO₂ thin films prepared at 300 °C, which correlated to the best crystallinity of the films, as evidenced from X-ray diffraction. In addition, a transparent and conductive anatase TiO₂ thin film with a resistivity of 2.6 × 10^− 1 Ω cm was prepared at a substrate temperature of 400 °C without the introduction of O₂ gas.     

Influence of annealing treatments for ZnO-doped Zr0.8Sn0.2TiO4 thin films by RF magnetron sputtering

Zirconium tin titanium oxide doped 1 wt.% ZnO thin films on n-type Si substrate were deposited by rf magnetron sputtering at a fixed rf power of 300 W, a substrate temperature of 450 °C, a deposition pressure of 5 mTorr and an Ar/O₂ ratio of 100/0 with various annealing temperatures and annealing times. Electrical properties and microstructures of 1 wt.% ZnO-doped (Zr_0.8Sn_0.2)TiO₄ thin films prepared by rf magnetron sputtering on n-type Si(100) substrates at different annealing temperatures (500 °C-700 °C) and annealing times (2 h-6 h) have been investigated. The structural and morphological characteristics analyzed by X-ray diffraction (XRD) and atomic force microscope (AFM) were sensitive to the treatment conditions such as annealing temperature and annealing time. At an annealing temperature of 600 °C and an annealing time of 6 h, the ZnO-doped (Zr_0.8Sn_0.2)TiO₄ thin films possess a dielectric constant of 46 (at f = 10 MHz), a dissipation factor of 0.059 (at f = 10 MHz), and a low leakage current density of 3.8 × 10^− 9 A/cm² at an electrical field of 1 kV/cm.     

CexAlyOz/TiN stack analysis for Metal-Insulator-Metal applications: Effect of annealing and the metal electrode deposition method

Ce_xAl_yO_z thin films were deposited on TiN metal electrode by metalorganic chemical vapour deposition method at 400 °C. The detailed physical characterization on Ce_xAl_yO_z/TiN stack upon annealing at different temperatures (600 °C and 850 °C) and for different deposition methods (Atomic vapour deposition (AVD) and Physical vapour deposition (PVD)) of electrode material were done for possible Metal-Insulator-Metal applications. X-ray diffraction results exhibited that the dielectric and TiN(AVD) are amorphous while TiN(PVD) is crystalline for the as deposited stacks. Annealing on Ce_xAl_yO_z/TiN(AVD) at 600 °C, initiates CeO₂ crystallization in the dielectric with composition of Ce:Al = 0.5 as obtained by X-ray photoelectron spectroscopy. In Ce_xAl_yO_z/TiN(PVD) stack, the dielectric remains in its amorphous state until 850 °C. However, TiO₂ crystallization is formed at 600 °C in Ce_xAl_yO_z/TiN(PVD). Time of flight secondary ion mass spectroscopy depth profiling data proves that the annealing at 600 °C caused the oxidation of both the metal electrodes and the inter-diffusion of Ti from the bottom metal electrode through the dielectric layer.     

Deposition and characterization of pulsed direct current magnetron sputtered Al95.5Cr2.5Si2 (N1 − xOx) thin films

Aluminum rich oxynitride thin films were prepared using pulsed direct current (DC) magnetron sputtering from an Al_95.5Cr_2.5Si₂ (at.%) target. Two series of films were deposited at 400 °C and 650 °C by changing the O₂/(O₂ + N₂) ratio in the reactive gas from 0% (pure nitrides) to 100% (pure oxides). The films were investigated by X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), scanning electron microscopy (SEM) and nanoindentation. The results showed the existence of three different regions of microstructure and properties with respect to the oxygen concentration. For the samples deposited at 650 °C in the nitrogen rich region (O₂/(O₂ + N₂) ≤ 0.08), the formation of the h-AlN (002) and Al-N bond were confirmed by XRD and XPS measurements. The hardness of the films was around 30 GPa. In the intermediate region (0.08 ≤ O₂/(O₂ + N₂) ≤ 0.24), the presence of an amorphous structure and the shifting of the binding energies to lower values corresponding to non-stoichiometric compounds were observed and the hardness decreased to 12 GPa. The lowering of mechanical properties was attributed to the transition of the clean target to the reacted target under non-steady state deposition conditions. In the oxygen rich region (0.24 ≤ (O₂/(O₂ + N₂) ≤ 1), the existence of α-Al₂O₃-(113), α-Al₂O₃-(116) and Al-O bonds confirmed the domination of this phase in this region of deposition and the hardness increased again to 30-35 GPa. Films deposited at 400 °C showed the same behavior except in the oxygen rich region, where hardness remains low at about 12-14 GPa.     

Single-source chemical vapor deposition of clean oriented Al2O3 thin films

Clean oriented Al₂O₃ thin film with a dominant Al₂O₃ <1 1 3> plane was deposited on Si <1 0 0> substrate at 550 °C, by single-source chemical vapor deposition (CVD) using aluminium(III) diisopropylcarbamate, Al₂(O₂CNⁱPr₂)₆. This process represents a substantial reduction in typical CVD film growth temperatures which are typically > 1000 °C. Through the studies of thermal stability of this precursor, we propose a specific β-elimination decomposition pathway to account for the low temperature of the precursor decomposition at the substrate, and for the lack of carbon impurity byproducts in the resulting alumina films that are characterized using X-ray photoelectron spectroscopy and depth profiling.     

Investigation of chlorination process in aluminum production by carbothermic-chlorination reduction of Al2O3 under vacuum

The chlorination process in aluminum production by carbothermic-chlorination reduction of Al₂O₃ under vacuum has been investigated by XRD, SEM and thermodynamic analysis. The results of thermodynamic calculations indicated that the chlorination of Al₄C₃ or Al₄O₄C possibly proceeded at temperature 1300 °C under 5-50 Pa. The experiment results showed that aluminum could be produced by the chlorination of Al₄C₃ or Al₄O₄C and the decomposition of AlCl(g). According to the analysis of experiment results, Al₄C₃ and Al₄O₄C were the main reactants participated in chlorination process in aluminum production by carbothermic-chlorination reduction of Al₂O₃ under vacuum. AlCl(g) generated in chlorination of Al₄C₃ or Al₄O₄C would decompose into Al and AlCl₃(g), and then aluminum product would condense in condensation tower.     

Spray pyrolysis deposition of indium sulphide thin films

In₂S₃ thin films were grown by the chemical spray pyrolysis (CSP) method using the pneumatic spray set-up and compressed air as a carrier gas. Aqueous solutions containing InCl₃ and SC(NH₂)₂ at a molar ratio of In/S = 1/3 and 1/6 were deposited onto preheated glass sheets at substrate temperatures T_s = 205-410 °C. The obtained films were characterised by X-ray diffraction (XRD), scanning electron microscopy (SEM,) optical transmission spectra, X-ray photoelectron spectroscopy (XPS) and energy dispersive spectroscopy (EDS). According to XRD, thin films deposited at T_s = 205-365 °C were composed of the (0 0 12) orientated tetragonal β-In₂S₃ phase independent of the In/S ratio in the spray solution. Depositions performed at T_s = 410 °C led to the formation of the In₂O₃ phase, preferably when the 1/3 solution was sprayed. Post-deposition annealing in air indicated that oxidation of the sulphide phase has a minor role in the formation of In₂O₃ at temperatures up to 450 °C. In₂S₃ films grown at T_s below 365 °C exhibited transparency over 70% in the visible spectral region and E_g of 2.90-2.96 eV for direct and 2.15-2.30 eV for indirect transitions, respectively. Film thickness and chlorine content decreased with increasing deposition temperatures. The XPS study revealed that the In/S ratio in the spray solution had a significant influence on the content of oxygen (Me-O, BE = 530.0 eV) in the In₂S₃ films deposited in the temperature range of 205-365 °C. Both XPS and EDS studies confirmed that oxygen content in the films deposited using the solution with the In/S ratio of 1/6 was substantially lower than in the films deposited with the In/S ratio of 1/3.     

Optimization of annealing temperature for YBa2Cu3O7 thin films post-annealed at a low oxygen partial pressure

Post-annealing of YBa₂Cu₃O₇ (YBCO) thin films is usually performed at 850–900°C in atmospheric-pressure oxygen. In this study, coevaporated YBCO films on LaAlO₃ were post-annealed in an oxygen partial pressure of 29 Pa at temperatures in the range 700–825°C. Zero resistance transition temperatures were 89–90 K. Both d.c. (room-temperature resistance and critical-current density) and a.c. parameters (extracted from eddy-current response measurements at 25 MHz) were monitored. The optimum temperature is close to 750°C, which is on the YBCO thermodynamic stability line at this low oxygen partial pressure.     

Effects of substrate temperature on dielectric and structural properties of Ti and Er co-doped HfO2 thin films

We report dielectric and structural properties of Ti and Er co-doped HfO₂ (HfTiErO_x) thin films at different substrate temperatures. The film at 400 °C substrate temperatures has the highest k value of 33, improved flat band voltage of −0.3 V, small hysteresis voltage and the significant interface-state density, which shows better dielectric properties for new high-k microstructure. XPS and XRD results reveal that Hf-Ti-Er-O bond may exist in addition with Hf-O, Hf-Er-O and Hf-Ti-O bonds, while the change in chemical structure and degradation of crystallization quality of HfO₂ thin films are directly related to Ti and Er co-doping.