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The large signal RF power transmission characteristics of an advanced InGaP HBT in an RF power amplifier are investigated and analyzed experimentally. The realistic RF powers reflected by the transistor, transmitted from the transistor and reflected by the load are investigated at small signal and large signal levels. The RF power multiple frequency components at the input and output ports are investigated at small signal and large signal levels, including their effects on RF power gain compression and nonlinearity. The results show that the RF power reflections are different between the output and input ports. At the input port the reflected power is not always proportional to input power level; at large power levels the reflected power becomes more serious than that at small signal levels, and there is a knee point at large power levels. The results also show the effects of the power multiple frequency components on RF amplification. 相似文献
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A new on-chip temperature compensation circuit for a GaAs-based HBT RF amplifier applied to wireless communication is presented.The simple compensation circuit is composed of one GaAs HBT and five resistors with various values,which allow the power amplifier to achieve better thermal characteristics with a little degradation in performance.It effectively compensates for the temperature variation of the gain and the output power of the power amplifier by regulating the base quiescent bias current.The temp... 相似文献
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A new on-chip temperature compensation circuit for a GaAs-based HBT RF amplifier applied to wireless communication is presented.The simple compensation circuit is composed of one GaAs HBT and five resistors with various values,which allow the power amplifier to achieve better thermal characteristics with a little degradation in performance.It effectively compensates for the temperature variation of the gain and the output power of the power amplifier by regulating the base quiescent bias current.The temperature compensation circuit is applied to a 3-stage integrated power amplifier for wireless communication applications,which results in an improvement in the gain variation from 4.0 to 1.1 dB in the temperature range between -20 and +80℃. 相似文献
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Pan N. Elliott J. Knowles M. Vu D.P. Kishimoto K. Twynam J.K. Sato H. Fresina M.T. Stillman G.E. 《Electron Device Letters, IEEE》1998,19(4):115-117
Excellent long term reliability InGaP/GaAs heterojunction bipolar transistors (HBT) grown by metalorganic chemical vapor deposition (MOCVD) are demonstrated. There were no device failures (T=10000 h) in a sample lot of ten devices (L=6.4 μm ×20 μm) under moderate current densities and high-temperature testing (Jc=25 kA/cm 2, Vce=2.0 V, Junction Temp =264°C). The dc current gain for large area devices (L=75 μm ×75 μm) at 1 kA/cm2 at a base sheet resistance of 240 ohms/sq (4×10 19 cm-3@700 Å) was over 100. The dc current gain before reliability testing (L=6.4 μm ×10 μm) at 0.8 kA/cm2 was 62. The dc current gain (0.8 kA/cm2) decreased to 57 after 10000 h of reliability testing. The devices showed an fT=61 GHz and fmax=103 GHz. The reliability results are the highest ever achieved for InGaP/GaAs HBT and these results indicate the great potential of InGaP/GaAs HBT for numerous low- and high-frequency microwave circuit applications. The reliability improvements are probably due to the initial low base current at low current densities which result from the low surface recombination of InGaP and the high valence band discontinuity between InGaP and GaAs 相似文献
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提出了一种具有可调预失真功能的共集电极放大电路,对其动态偏置点及双负反馈回路进行了分析.AWR Microwave Office仿真表明:该预失真电路产生的增益扩展与负相位偏差可以补偿该功率放大器后级电路产生的增益压缩和正相位偏差,提高其线性度.采用该预失真电路作为输入级,设计了一款功率放大器,并基于截止频率为29.5 GHz的2 μm InGaP/GaAs HBT工艺成功流片.测试结果表明,该宽带放大器在3.5 V偏置电压下和1.3~2.0 GHz频段范围内功率增益可达27 dB,P1dB为28.6 dBm,最大功率附加效率为39%. 相似文献
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A three-stage 4.8-6 GHz monolithic power amplifier(PA) compatible with IEEE 802.11a/n designed based on an advanced 2μm InGaP/GaAs hetero-junction bipolar transistor(HBT) process is presented.The PA integrates input matching and closed-loop power control circuits on chip.Under 3.3 V DC bias,the amplifier achieves a ~31 dB small signal gain,excellent wide band input and output matching among overall 1.2 GHz bandwidth,and up to 24.5 dBm linear output power below EVM 3%with IEEE 802.11a 64QAM OFDM input signal. 相似文献
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对自对准InGaP/GaAs HBT单片集成跨阻放大器进行了研究.采用发射极金属做腐蚀掩膜并利用GaAs腐蚀各向异性的特点来完成BE金属自对准工艺,最终制作出的器件平均阈值电压为1.15V,单指管子电流增益为50,发射极面积4μm×14μm的单管在IB=200μA和VCE=2V偏压条件下截止频率达到了40GHz.设计并制作了直接反馈和CE-CC-CC两种单片集成跨阻放大器电路,测量得到的跨阻增益在3dB带宽频率时分别为50.6dBΩ和45.1dBΩ,3dB带宽分别为2.7GHz和2.5GHz,电路最小噪声系数分别为2.8dB和3.2dB. 相似文献
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In wireless mobile communications and wireless local area networks (WLAN), advanced InGaP HBT with power amplifiers are key components. In this paper, the microwave large signal dynamic waveform characteristics of an advanced InGaP HBT are investigated experimentally for 5.8 GHz power amplifier applications. The microwave large signal waveform distortions at various input power levels, especially at large signal level, are investigated and the reasons are analyzed. The output power saturation is also explained. These analyses will be useful for power amplifier designs. 相似文献
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In wireless mobile communications and wireless local area networks (WLAN), advanced lnGaP HBT with power amplifiers are key components. In this paper, the microwave large signal dynamic waveform characteristics of an advanced InGaP HBT are investigated experimentally for 5.8 GHz power amplifier applications. The microwave large signal waveform distortions at various input power levels, especially at large signal level, are investigated and the reasons are analyzed. The output power saturation is also explained. These analyses will be useful for power amplifier designs. 相似文献
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A high linearity InGaP/GaAs heterojunction bipolar transistor (HBT) monolithic microwave integrated circuit (MMIC) power amplifier is demonstrated using a new structure for a bias circuit for wideband-code division multiple access (W-CDMA) application. A one shunt capacitor is added to a novel active bias circuit and acts as a lineariser improving input P1 dB of 16 dB and phase distortion of 5.1° for the hybrid phase shift keying (HPSK) modulated signal at the 28 dBm output power; the lineariser showing no significant increase of signal loss and chip area. The two-stage HBT MMIC amplifier exhibits a power-added efficiency (PAE) of 37%, a linear power gain of 24.5 dB, and an output power of 28 dBm with an adjacent channel power ratio (ACPR) of -45 dBc, under a 3 V operation voltage 相似文献
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自对准InGaP/GaAs HBT单片集成跨阻放大器 总被引:2,自引:1,他引:2
对自对准 In Ga P/ Ga As HBT单片集成跨阻放大器进行了研究 .采用发射极金属做腐蚀掩膜并利用 Ga As腐蚀各向异性的特点来完成 BE金属自对准工艺 ,最终制作出的器件平均阈值电压为 1.15 V,单指管子电流增益为5 0 ,发射极面积 4μm× 14μm的单管在 IB=2 0 0μA和 VCE=2 V偏压条件下截止频率达到了 4 0 GHz.设计并制作了直接反馈和 CE- CC- CC两种单片集成跨阻放大器电路 ,测量得到的跨阻增益在 3d B带宽频率时分别为 5 0 .6 d BΩ和 4 5 .1d BΩ ,3d B带宽分别为 2 .7GHz和 2 .5 GHz,电路最小噪声系数分别为 2 .8d B和 3.2 d B. 相似文献
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对VB IC B JT模型用于Ⅲ-V族化合物HBT器件建模的可行性进行了讨论和借鉴,结合UCSD HBT模型优点,提出一个新的可精确用于单异质结InGaP/GaAsHBT模型,并用于该类器件建模。测量和模型仿真I-V特性及多偏置条件下多频率点S参数对比结果表明,DC~20GHz频率范围内,新模型可对单、多指InGaP/GaAs HBT器件交流小信号特性进行精确表征。运用所建模型准确的预见了一宽带放大器性能。 相似文献