An efficient similarity measure approach for PCB surface defect detection

In this paper, an efficient similarity measure method is proposed for printed circuit board (PCB) surface defect detection. The advantage of the presented approach is that the measurement of similarity between the scene image and the reference image of PCB surface is taken without computing image features such as eigenvalues and eigenvectors. In the proposed approach, a symmetric matrix is calculated using the companion matrices of two compared images. Further, the rank of a symmetric matrix is used as similarity measure metric for defect detection. The numerical value of rank is zero for the defectless images and distinctly large for defective images. It is reliable and well tolerated to local variations and misalignment. The various experiments are carried out on the different PCB images. Moreover, the presented approach is tested in the presence of varying illumination and noise effect. Experimental results have shown the effectiveness of the proposed approach for detecting and locating the local defects in a complicated component-mounted PCB images.     

A case-based reasoning system for PCB defect prediction

The manufacturing process for a new Printed Circuit Board (PCB) design is often instable and might generate a number of defects during the complicated production process. Defects reduce the yield rate and increase the production costs. Although skilled engineers can predict the possible defect items for a new PCB product, this approach requires strong engineering experience and is time consuming. To conquer this problem, this research applies case-based reasoning (CBR) methodology to develop a defect prediction system for new PCB products. In the CBR system, each case is represented using the design specifications, defect items and corresponding costs. A vantage-based case indexing mechanism is developed to accelerate the case retrieval efficiency. In addition, a reasoning algorithm that considers the defect cost is proposed to infer the defect items that are interesting to PCB manufacturers. The system performance is analyzed to show the efficiency and accuracy of the proposed system. A practical implementation using a case-base provided by a PCB manufacturer is demonstrated.     

基于卷积神经网络的PCB缺陷检测

印刷电路板(PCB)在生产制造中由于生产工序等问题易导致电路板存在瑕疵缺陷,为提高对电路板缺陷的检测效率,提出了一种基于卷积神经网络(CNN)的电路板缺陷检测网络.该检测网络基于YOLO v4网络进行优化改造,针对于PCB制作精密、复杂,各类缺陷不易检测的难点,在优化后的网络中加入了基于细粒度空间域的长距离全局注意力机...     

基于视觉传感器的PCB缺陷检测系统的研究与实现

为了实现PCB缺陷的在线自动检测,设计了一种PCB缺陷自动检测系统,该系统主要由机器臂、电气控制系统以及视觉传感器系统等组成。通过可编程控制的图像采集系统获取高质量的原始视觉图像,利用图像处理实现对缺陷目标的自动检测及识别。实验结果验证了该系统检测PCB板缺陷的高效性和实时性。     

Simulation of a PCB assembly line: A modified JIT approach

In this paper, a simulation model of an existing printed circuit board (PCB) assembly line is developed in an attempt to identify strategies which tend to improve the system performance. The model is based on the concept of the JIT (Just-In-Time) production approach. Parameters investigated includes sequencing rules, lot sizes, number of Kanbans used, and number of PCB types.     

CCD在双玻璃晒架的精密光学定位中的设计

随着电子工业的不断发展,对印制电路板的质量要求越来越高。传统销钉/孔定位方式已经不能适合现代生产的精密要求。CCD光学定位是全新的定位概念,设计了CCD光学定位系统的结构,实验验证了CCD光学对位精度可达到10μm,该指标明显优于传统定位方式的对位精度。     

一种印刷电路板缺陷图像边缘信息提取方法

为了较好地提取印刷电路板缺陷图像边缘信息,提出了基于二阶曲线拟合、模式聚类与阈值比较法相结合的印刷电路板缺陷图像边缘信息提取方法。首先分析了最小二乘法拟合的基本原理;然后在此基础上提出了采用二阶曲线拟合法来设定阈值进行拟合得到大致的图像边缘,并分析了其基本原理;最后在模式聚类基础上利用阈值比较法选择适当阈值截取拟合曲线得到图像边缘点、去除噪声边缘点,连接各个图像边缘点可得到缺陷图像的边缘信息。用由显微镜及CCD获取的4幅印刷电路板缺陷图像进行了实验;从实验主观效果看,用该方法提取出图像边缘信息的效果较好,图像边缘比较连续,噪声点极少;从实验客观效果评价看,用该方法所得到的图像边缘信息熵较大。实验结果表明,该方法结合了二阶曲线拟合、模式聚类与阈值比较法优点,可较好地提取出印刷电路板缺陷图像的边缘信息。     

基于目标轮廓几何特征的电容元件定位方法

随着印刷电路板(PCB)生产工艺愈加复杂,电容元件的定位识别难度也随之增加。在实际生产中,为了节约成本、减少出错率,需要在焊接之前对电路板进行检测,同时为了固定电路板上元器件,一般会使用压板固定电路板。针对此种情况,提出一种复杂背景下被遮盖电容元件的定位方法,通过对采集到的PCB图像进行预处理、阈值分割、边缘提取和Harris角点检测等操作,进而根据电容元件目标轮廓的几何特征对元件进行定位。该方法已经在实践中得到应用,定位准确率高、速度快,能广泛应用于实际生产中。     

Chaotic species based particle swarm optimization algorithms and its application in PCB components detection

An improved particle swarm optimizer using the notion of chaos and species is proposed for solving a template matching problem which is formulated as a multimodal optimization problem. Template matching is one of the image comparison techniques. This technique is widely applied to determine the existence, location and alignment of a component within a captured image in the printed circuit board (PCB) industry where 100% quality assurance is always required. In this research, an efficient auto detection method using a multiple templates matching technique for PCB components detection is described. The new approach using chaotic species based particle swarm optimization (SPSO) is applied to the multi-template matching (MTM) process. To test its performance, the proposed Chaotic SPSO based MTM algorithm is compared with other approaches by using real captured PCB images. The Chaotic SPSO based MTM method is proven to be superior to other methods in both efficiency and effectiveness.     

Automated extraction of PCB components based on specularity using layered illumination

This paper investigates the methodologies for locating and identifying components on a printed circuit board (PCB) used for surface mount device inspection. It’s the foundation of other inspections, such as solder joint inspection, component type recognization and so on. The proposed scheme consists of two stages: solder joint extraction and protective coating extraction. This work uses automatic multilevel thresholding approach for detecting specular areas which contain solder joints. Some invalid specular areas, such as markings and via-holes are recognized and removed by comparing the colour distribution features of the target objects and the reference objects. A novel approach based on connection graph and the segmented gray-scale PCB images is developed to classify all recognized solder joints as several clusters. And then, the protective coating is extracted by the positions of the clustered solder joints. Experimental results show that the proposed method can recognize most of components effectively.     

Realization of a flow injection analysis in PCB technology

In this paper a microflow injection analysis (FIA) is presented, which was developed completely in printed circuit board (PCB) technology. The multilayer printed circuit board, which was made as stack of four individual printed circuit boards, contains both the passive and active fluid elements, and necessary electronics for the control and evaluation. For a reference reaction the FIA detects Fe³⁺. A calibration curve was recorded and a reproducibility measurement was carried out. An accuracy of 10% was reached. Data acquisition and control was made with the help of a PC and a Labview-program.     

Automatic inspection system for printed circuit boards

The purpose of this correspondence is to present problems and methods in automating visual inspection of printed circuit boards (PCB's). Vertical and diagonal illumination are useful in detecting PCB patterns correctly. An algorithm comparing local features of the patterns to be inspected with those of the pattern to be referenced is proposed. An inspection system using developed technologies is also described.     

Open curve segmentation via a two-phase scheme

A two-phase scheme is proposed for the segmentation of open curves. In the first phase, the curvature of each point of the curve is calculated based on the coordinates of five skipped points and the assumption that these five points form a B-spline curve. The points with significant curvatures are collected as candidate corners. During the second phase, the candidate corners are verified for deviations in the global trend of the curve. Those with small deviations are considered excessive and are removed. Application of the proposed method in the segmentation of a typical PCB (printed circuit board) curve, an aerial image of Medioni and Yasumoto (Comput. Vision Graphics Image Process. 39, 267–278 (1987)), and a multi-scale four-semicircle curve of Teh and Chin (IEEE Trans. Pattern Analysis Mach. Intell. PAMI-11, 859–872 (1989)) show that it is both minimal and accurate.     

基于GIS技术的双层PCB布线的空间剖分算法

双层印制电路板(PCB)通常空间结构及布线线形复杂、约束规则众多,而常用PCB空间结构简单、布线线形单一,不能有效利用PCB的空间关系及拓扑信息引导布线规划。为弥补以前工作的不足,提出一种基于GIS(geographic information system)技术的空间剖分算法,首先利用空间距离与几何要素拓扑关系进行分组预处理,然后引入矢栅一体化模型构建复杂空间及属性约束下的网络模型,基于该网络模型提取区域基准线并利用空间缓冲区技术得到空间剖分结果,从而引导布线规划。实验结果表明,该算法能够在满足所有设计规则的情况下实现100%的布线连通率,同时有效利用布线空间资源;提出的算法布线线形接近人工布线,对于实现复杂场景与多约束下的双层PCB自动化布线具有实际意义。     

基于图像处理的印刷电路板质量检测系统设计

针对目前印刷电路板工业高速发展的生产要求,设计了基于图像处理的印刷电路板质量检测系统总体结构,阐述了基于图像处理检测系统的工作原理,讨论了图像采集单元中扫描仪的选择,以及扫描仪驱动的设计;讨论了图像处理单元中的图像去噪,图像分割、图像识别算法,运用图像差分运算方法完成了对缺陷的检测。实验结果证明使用该方法能够简单、快速、有效地识别出PCB板上断路、短路和缺损缺陷。     

PCB数控钻孔最佳走刀路线的建模与求解

目前,采用PCB数控钻自动编程系统生成的钻孔路线并非最佳走刀路线。通过分析,将PCB数控钻孔最佳走刀路线问题归结为大型TSP问题,其目标函数定为钻头的总走刀时间最短。由于TSP问题在理论上属于NP完备问题,因此很难用一般的算法求解。文中详细介绍了用模拟退火方法求解该问题的具体算法,并以上继基础开发了PCB的最优化的自动编程系统。     

High frequency integrated feed for front end circuitry and antenna arrays

Low‐cost printed circuit board waveguide (PCBWG) technology is employed to develop new waveguide‐fed microstrip antenna arrays with low profile and light weight while maintaining high efficiency and gain at 12.5 GHz. The proposed corporate feed network has two parts: on the antenna layer, microstrip lines are used to form a 2 × 4 sequentially rotated sub‐array of circularly polarized microstrip patches and on the feed layer PCB‐WG is utilized to combine any number of these sub‐arrays to form a larger array. Because PCB‐WGs transmit the power over a large portion of the feed network, losses are substantially reduced and spurious radiations from feed circuit are eliminated. Several microstrip arrays with PCBWG feed were designed and fabricated using standard PCB process. Comparing the results with those of a hybrid array with conventional waveguide feed shows that there is only a negligible degradation in gain and efficiency when bulky and expensive aluminum waveguides are replaced by PCB‐WGs. © 2008 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2009.     

Far‐end crosstalk reduction in PCB interconnects using stepped impedance elements and open‐circuited stubs

In this work, new trace configurations using stepped impedance elements and open‐circuited stubs to reduce far‐end crosstalk in printed circuit board (PCB) interconnects are introduced. The goal of this study is to reduce crosstalk without using additional PCB components in the design. Specifically, we use stepped impedance elements and open‐circuited stubs of uniform length and width on the victim traces to suppress high‐frequency electromagnetic interference and to equalize propagation delays or capacitive and inductive couplings between PCB traces. The overall design is very similar to the usual low‐pass filter configurations, which are difficult to implement in the prototype testing. The proposed approach shows remarkably better results when compared with conventional intervening guard trace schemes. © 2011 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2011.     

PCB数控钻孔最佳走刀路线的建模与求解

当前的印刷电路板（ＰＣＢ）数控钻自动编程系统生成的钻孔路线并非最佳走刀路线。本文通过分析,将ＰＣＢ数控钻孔最佳走刀路线问题归结为大型ＴＳＰ问题,其目标函数定为钻头的总走刀时间最短。由于ＴＳＰ问题在理论上属于ＮＰ完备问题,很难用一般的算法求解。本文详细介绍了用模拟退火方法求解该问题的具体算法,并以此为基础开发了ＰＣＢ最优化的自动编程系统。