Power Generation Characteristics of Mg2Si Uni-Leg Thermoelectric Generator

Mg₂Si thermoelectric (TE) elements were fabricated by a plasma-activated sintering method using a commercial polycrystalline n-type Mg₂Si source produced by the Union Material Co., Ltd. This material typically has a ZT value of ??0.6. A monobloc plasma-activated sintering technique was used to form Ni electrodes on the TE elements. The dimensions of a single element were 4.0?mm?×?4.0?mm?×?10?mm, and these were used to construct a TE module comprising nine elements connected in series. To reduce the electrical and thermal contact resistance of the module, each part of the module, i.e., the elements, terminals, and insulating plates, was joined using a Ag-based brazing alloy. In addition, to maintain the temperature difference between the top and bottom of the module, a thermal insulation board was installed in it. The observed values of open-circuit voltage (V _OC) and output power (P) of a uni-leg structure module were 594?mV and 543?mW, respectively, at a maximum ??T?=?500?K.     

Stress Analysis and Output Power Measurement of an n-Mg2Si Thermoelectric Power Generator with an Unconventional Structure

We examine the mechanical stability of an unconventional Mg₂Si thermoelectric generator (TEG) structure. In this structure, the angle θ between the thermoelectric (TE) chips and the heat sink is less than 90°. We examined the tolerance to an external force of various Mg₂Si TEG structures using a finite-element method (FEM) with the ANSYS code. The output power of the TEGs was also measured. First, for the FEM analysis, the mechanical properties of sintered Mg₂Si TE chips, such as the bending strength and Young’s modulus, were measured. Then, two-dimensional (2D) TEG models with various values of θ (90°, 75°, 60°, 45°, 30°, 15°, and 0°) were constructed in ANSYS. The x and y axes were defined as being in the horizontal and vertical directions of the substrate, respectively. In the analysis, the maximum tensile stress in the chip when a constant load was applied to the TEG model in the x direction was determined. Based on the analytical results, an appropriate structure was selected and a module fabricated. For the TEG fabrication, eight TE chips, each with dimensions of 3 mm × 3 mm × 10 mm and consisting of Sb-doped n-Mg₂Si prepared by a plasma-activated sintering process, were assembled such that two chips were connected in parallel, and four pairs of these were connected in series on a footprint of 46 mm × 12 mm. The measured power generation characteristics and temperature distribution with temperature differences between 873 K and 373 K are discussed.     

Development of an Mg2Si Unileg Thermoelectric Module Using Durable Sb-Doped Mg2Si Legs

Mg₂Si unileg structure thermoelectric (TE) modules, which are composed only of n-type Mg₂Si legs, were fabricated using Sb-doped Mg₂Si. The Mg₂Si TE legs used in our module were fabricated by a plasma-activated sintering method using material produced from molten commercial doped polycrystalline Mg₂Si, and, at the same time, nickel electrodes were formed on the Mg₂Si using a monobloc plasma-activated sintering technique. The source material used for our legs has a ZT value of 0.77 at 862 K. The TE modules, which have dimensions of 21 mm × 30 mm × 16 mm, were composed of ten legs that were connected in series electrically using nickel terminals, and the dimensions of a single leg were 4.0 mm  × 4.0 mm × 10 mm. From evaluations of the measured output characteristics of the modules, it appeared that the electrical resistance of the wiring that is used to connect each leg considerably affects the power output of the unileg module. Thus, we attempted to reduce the wiring resistance of the module and fabricated a module using copper terminals. The observed values of the open-circuit voltage and output power of the Sb-doped Mg₂Si unileg module were 496 mV and 1211 mW at ΔT = 531 K (hot side: 873 K; cool side: 342 K).     

Convenient Melt-Growth Method for Thermoelectric Mg2Si

We have succeeded in growing single-crystalline-like n-type Mg₂Si bulk crystals by a convenient melt-growth method that requires no vacuum or inert gas. The Sb-doped, n-type Mg₂Si crystals had a density equivalent to the theoretical ideal of 1.99 g cm³ to 2.00 g cm^?3 and well-developed crystalline grains. Powder x-ray diffraction measurements and scanning electron microscopy observations confirmed the single-phase Mg₂Si nature of the grown crystals, with no MgO or unreacted Si and Mg observed. The crystals had high Hall mobility and power factor compared with Sb-doped sintered Mg₂Si crystals. The achieved ZT values were 0.10 at 300 K and 0.36 at 600 K for 0.317 at.%Sb-doped Mg₂Si.     

Analysis of the Microstructure of Mg2Si Thermoelectric Devices

High-performance Mg₂Si thermoelectric devices have been obtained by spark plasma sintering of high-purity, pre-synthesized, all-molten Mg₂Si powder. We studied the effects of source powder particle size on thermoelectric performance. To improve the performance, further investigation of the microstructure of the devices is needed. In this work we studied the microstructure of grain boundaries and interfaces between electrodes and Mg₂Si sintered bodies to increase understanding of Mg₂Si thermoelectric devices.     

Synthesis and Characterization of Al-Doped Mg2Si Thermoelectric Materials

Magnesium silicide (Mg₂Si)-based alloys are promising candidates for thermoelectric (TE) energy conversion for the middle to high range of temperature. These materials are very attractive for TE research because of the abundance of their constituent elements in the Earth’s crust. Mg₂Si could replace lead-based TE materials, due to its low cost, nontoxicity, and low density. In this work, the role of aluminum doping (Mg₂Si:Al = 1:x for x = 0.005, 0.01, 0.02, and 0.04 molar ratio) in dense Mg₂Si materials was investigated. The synthesis process was performed by planetary milling under inert atmosphere starting from commercial Mg₂Si pieces and Al powder. After ball milling, the samples were sintered by means of spark plasma sintering to density >95%. The morphology, composition, and crystal structure of the samples were characterized by field-emission scanning electron microscopy, energy-dispersive spectroscopy, and x-ray diffraction analyses. Moreover, Seebeck coefficient analyses, as well as electrical and thermal conductivity measurements were performed for all samples up to 600°C. The resultant estimated ZT values are comparable to those reported in the literature for these materials. In particular, the maximum ZT achieved was 0.50 for the x = 0.01 Al-doped sample at 600°C.     

Solid-State Synthesis and Thermoelectric Properties of Al-Doped Mg2Si

The electronic transport and thermoelectric properties of Al-doped Mg₂Si (Mg₂Si:Al _m , m?=?0, 0.005, 0.01, 0.02, 0.03) compounds prepared by solid-state synthesis were examined. Mg₂Si was synthesized by solid-state reaction (SSR) at 773?K for 6?h, and Al-doped Mg₂Si powders were obtained by mechanical alloying (MA) for 24?h. Mg₂Si:Al _m were fully consolidated by hot pressing (HP) at 1073?K for 1?h, and all samples showed n-type conduction, indicating that the electrical conduction is due mainly to electrons. The electrical conductivity increased significantly with increasing Al doping content, and the absolute value of the Seebeck coefficient decreased due to the significant increase in electron concentration from 10¹⁶ cm^?3 to 10¹⁹ cm^?3 by Al doping. The thermal conductivity was increased slightly by Al doping, but was not changed significantly by the Al doping content due to the much larger contribution of lattice thermal conductivity over electronic thermal conductivity. Mg₂Si:Al_0.02 showed a maximum thermoelectric figure of merit of 0.47 at 823?K.     

Solid-State Synthesis and Thermoelectric Properties of Sb-Doped Mg2Si Materials

Sb-doped magnesium silicide compounds have been prepared through ball milling and solid-state reaction. Materials produced were near-stoichiometric. The structural modifications have been studied with powder x-ray diffraction. Highly dense pellets of Mg₂Si_1?x Sb _x (0 ≤ x ≤ 0.04) were fabricated via hot pressing and studied in terms of Seebeck coefficient, electrical and thermal conductivity, and free carrier concentration as a function of Sb concentration. Their thermoelectric performance in the high temperature range is presented, and the maximum value of the dimensionless figure of merit was found to be 0.46 at 810 K, for the Mg₂Si_0.915Sb_0.015 member.     

The Influence of Grain Boundary Scattering on Thermoelectric Properties of Mg2Si and Mg2Si0.8Sn0.2

The temperature dependences of the Seebeck coefficient, and electrical and thermal conductivities of bulk hot-pressed Sb-doped n-type Mg₂Si and Mg₂Si_0.8Sn_0.2 samples were measured in the temperature range from 300 K to 850 K together with the Hall coefficients at room temperature. The features of the complex band structure and scattering mechanisms were analyzed based on experimental data within the relaxation-time approximation. Based on the obtained model parameters, the possibility of improvement of the thermoelectric figure of merit due to nanostructuring and grain boundary scattering was theoretically analyzed for both Mg₂Si and the solid solution.     

Modeling of Thermoelectric Properties of Magnesium Silicide (Mg2Si)

Thermoelectric (TE) materials based on alloys of magnesium (Mg) and silicon (Si) possess favorable properties such as high electrical conductivity and low thermal conductivity. Additionally, their abundance in nature and lack of toxicity make them even more attractive. To better understand the electronic transport and thermal characteristics of bulk magnesium silicide (Mg₂Si), we solve the multiband Boltzmann transport equation within the relaxation-time approximation to calculate the TE properties of n-type and p-type Mg₂Si. The dominant scattering mechanisms due to acoustic phonons and ionized impurities were accounted for in the calculations. The Debye model was used to calculate the lattice thermal conductivity. A unique set of semiempirical material parameters was obtained for both n-type and p-type materials through simulation testing. The model was optimized to fit different sets of experimental data from recently reported literature. The model shows consistent agreement with experimental characteristics for both n-type and p-type Mg₂Si versus temperature and doping concentration. A systematic study of the effect of dopant concentration on the electrical and thermal conductivity of Mg₂Si was also performed. The model predicts a maximum dimensionless figure of merit of about 0.8 when the doping concentration is increased to approximately 10²⁰?cm^?C3 for both n-type and p-type devices.     

Thermoelectric Performance of Sb- and La-Doped Mg2Si0.5Ge0.5

La _x Mg_2?x Si_0.49Ge_0.5Sb_0.01 compounds (x?=?0, 0.005, 0.01, 0.02) were synthesized by solid-state reaction followed by spark plasma sintering. The thermoelectric properties, such as the Seebeck coefficient, the electrical and thermal conductivities, and ZT, of these compounds have been studied in the temperature range of 300?K to 823?K. The figure of merit of this n-type compound has been raised above unity at 823?K for the sample with x?=?0.01, a value 60% higher than that of Mg₂Si_0.49Ge_0.5Sb_0.01. The reduction of the thermal conductivity via increasing phonon scattering is considered as the main reason for the enhanced ZT. These observations demonstrate an opportunity to improve the thermoelectric performance of Mg₂Si_1?x Ge _x solid solutions.     

Model for Increasing the Power Obtained from a Thermoelectric Generator Module

We have developed a model for finding the most efficient way of increasing the power obtained from a thermoelectric generator (TEG) module with a variety of operating conditions and limitations. The model is based on both thermoelectric principles and thermal resistance circuits, because a TEG converts heat into electricity consistent with these two theories. It is essential to take into account thermal contact resistance when estimating power generation. Thermal contact resistance causes overestimation of the measured temperature difference between the hot and cold sides of a TEG in calculation of the theoretical power generated, i.e. the theoretical power is larger than the experimental power. The ratio of the experimental open-loop voltage to the measured temperature difference, the effective Seebeck coefficient, can be used to estimate the thermal contact resistance in the model. The ratio of the effective Seebeck coefficient to the theoretical Seebeck coefficient, the Seebeck coefficient ratio, represents the contact conditions. From this ratio, a relationship between performance and different variables can be developed. The measured power generated by a TEG module (TMH400302055; Wise Life Technology, Taiwan) is consistent with the result obtained by use of the model; the relative deviation is 10%. Use of this model to evaluate the most efficient means of increasing the generated power reveals that the TEG module generates 0.14 W when the temperature difference is 25°C and the Seebeck coefficient ratio is 0.4. Several methods can be used triple the amount of power generated. For example, increasing the temperature difference to 43°C generates 0.41 W power; improving the Seebeck coefficient ratio to 0.65 increases the power to 0.39 W; simultaneously increasing the temperature difference to 34°C and improving the Seebeck coefficient ratio to 0.5 increases the power to 0.41 W. Choice of the appropriate method depends on the limitations of system, the cost, and the environment.     

Thin-Film Thermoelectric Module for Power Generator Applications Using a Screen-Printing Method

A new process for fabricating a low-cost thermoelectric module using a screen-printing method has been developed. Thermoelectric properties of screen-printed ZnSb films were investigated in an effort to develop a thermoelectric module with low cost per watt. The screen-printed Zn _x Sb_1−x films showed a low carrier concentration and high Seebeck coefficient when x was in the range of 0.5 to 0.57 and the annealing temperature was kept below 550°C. When the annealing temperature was higher than 550°C, the carrier concentration of the Zn _x Sb_1−x films reached that of a metal, leading to a decrease of the Seebeck coefficient. In the present experiment, the optimized carrier concentration of screen-printed ZnSb was 7 × 10¹⁸/cm³. The output voltage and power density of the ZnSb film were 10 mV and 0.17 mW/cm², respectively, at ΔT = 50 K. A thermoelectric module was produced using the proposed screen-printing approach with ZnSb and CoSb₃ as p-type and n-type thermoelectric materials, respectively, and copper as the pad metal.     

Effect of Biaxial Strain on Electronic and Thermoelectric Properties of Mg2Si

The electronic and thermoelectric properties of biaxially strained magnesium silicide Mg₂Si are analyzed by means of first-principle calculations and semiclassical Boltzmann theory. Electron and hole doping are examined for different doping concentrations and temperatures. Under strain the degeneracy of the electronic orbitals near the band edges is removed, the orbital bands are warped, and the energy gap closes up. These characteristics are rationalized in the light of the electron density transfers upon strain. The electrical conductivity increases with the biaxial strain, whereas neither the Seebeck coefficient nor the power factor (PF) follow this trend. Detailed analysis of the evolution of these thermoelectric properties is given in terms of the in-plane and cross-plane components. Interestingly, the maximum value of the PF is shifted towards lower temperatures when increasingly intensive strain is applied.     

Computational Investigation of the Electronicand Thermoelectric Properties of Strained Bulk Mg2Si

The purpose of this work was to investigate, by numerical simulation, the effect of isotropic and anisotropic strain on the transport properties of Mg₂Si. Analysis of the effects of temperature and charge-carrier concentration on evolution of the energy gap and on the thermoelectric properties of strained Mg₂Si is also reported in this paper. Gap evolution is highly dependent on the type of strain applied to the structure. The Seebeck coefficient (S) and power factor (PF) are strongly modified; a gain of up to 40% can be obtained for S and up to 100% for PF under specific conditions of strain. In most cases the temperature corresponding to the maximum value of PF was found to shift downward under the effect of strain.     

Room-Temperature Mechanical Properties and Slow Crack Growth Behavior of Mg2Si Thermoelectric Materials

Mg₂Si is of interest as a thermoelectric (TE) material in part due to its low materials cost, lack of toxic components, and low mass density. However, harvesting of waste heat subjects TE materials to a range of mechanical and thermal stresses. To understand and model the material??s response to such stresses, the mechanical properties of the TE material must be known. The Mg₂Si specimens included in this study were powder processed and then sintered via pulsed electrical current sintering. The elastic moduli (Young??s modulus, shear modulus, and Poisson??s ratio) were measured using resonant ultrasound spectroscopy, while the hardness and fracture toughness were examined using Vickers indentation. Also, the Vickers indentation crack lengths were measured as a function of time in room air to determine the susceptibility of Mg₂Si to slow crack growth.     

Individual Module Maximum Power Point Tracking for Thermoelectric Generator Systems

In a thermoelectric generator (TEG) system the DC/DC converter is under the control of a maximum power point tracker which ensures that the TEG system outputs the maximum possible power to the load. However, if the conditions, e.g., temperature, health, etc., of the TEG modules are different, each TEG module will not produce its maximum power. If each TEG module is controlled individually, each TEG module can be operated at its maximum power point and the TEG system output power will therefore be higher. In this work a power converter based on noninverting buck–boost converters capable of handling four TEG modules is presented. It is shown that, when each module in the TEG system is operated under individual maximum power point tracking, the system output power for this specific application can be increased by up to 8.4% relative to the situation when the modules are connected in series and 16.7% relative to the situation when the modules are connected in parallel.