烧结温度对冲击磨用Al2O3陶瓷靶材性能的影响

利用无压烧结工艺制备了陶瓷靶材,并借助扫描电子显微镜和液压机等测试设备研究了烧结温度对陶瓷靶材显微结构和力学性能的影响.结果表明,随着烧结温度的升高,掺杂Al2O3陶瓷靶材的晶粒尺寸逐渐增大,晶粒形状也由各向异性生长逐步向等轴状发育;靶材的抗弯强度也随着烧结温度的升高先升高后降低,并在1600℃时强度和耐磨性达到最大.     

ZnO陶瓷靶制备及其薄膜 RF溅射工艺研究

利用固相反应制备了直径为70mm,厚度为10-15mm高质量掺杂Li2CO2的ZnO陶瓷靶材,实验了不同摩尔浓度的Li+掺杂对靶材性能的影响,确定了最佳Li+掺杂量为2．2mol％,同时通过在不同温度烧结实验、不同成型压力实验确定了ZnO靶材制备的最佳工艺,并采用所制备的ZnO-Li2.2％陶瓷靶和RF(射频磁控)技术在Si(100)、玻璃(载玻片)、及Pt(111)／Ti／SiO2／Si(100)基片上制备出高度c轴(002)择优取向的ZnO薄膜,其绝缘电阻率ρ为4．12×108Ω·cm,达到了声表面波器件(SAW)的使用要求．     

钼板轧制及热处理工艺对溅射薄膜微观组织及性能的影响

通过研究钼金属靶材轧制变形量及热处理工艺对溅射薄膜的微观组织、表面粗糙度及晶形的影响,结果表明:变形量为80%的钼靶材溅射制备的薄膜晶化程度优于变形量小的靶材溅射薄膜;溅射相同的薄膜厚度,随着靶材变形量的增大,溅射薄膜的方阻越大;1373K退火靶材溅射薄膜的粗糙度最小,表面颗粒最细小均匀,晶粒取向明显。     

氧化锌铝(ZAO)陶瓷靶材制备及其薄膜性能

溶胶-凝胶方法制备的ZnO和Al2O3混合粉末经冷压预成型加真空低压烧结,制备了高致密度(相对密度99%)、低成本的ZAO陶瓷靶材.研究了ZAO靶材与无氧铜的粘接性能.用中频交流磁控溅射ZAO靶材的工艺制备了ZAO薄膜.利用SEM和XRD分析测试了陶瓷靶材断口形貌以及靶材和薄膜的结构.试验结果表明制得的ZAO靶材具有良好的粘接性和溅射性能,内部组织致密,靶材中有明显的ZnAl2O4相.在优化沉积工艺条件下,制备的ZAO薄膜方块电阻为35 Ω,电阻率可达3.84×10-4 Ω·cm,可见光透过率(λ=550 nm)可达91.1%.沉积态的ZAO薄膜具有很好的结晶性,并呈现(002)择优取向.ZAO薄膜有明显的紫外吸收限,带隙Eg约为3.76 eV.ZAO靶材的工业化磁控镀膜试验也取得了较好的结果.     

不同相结构Ti_(33)Al_(67)靶材磁控溅射薄膜对比研究

采用磁控溅射的方法,选用化学成分相同而相结构完全不同的两种靶材在硬质合金基体上沉积薄膜,使用X射线衍射、扫描电镜、X射线能谱仪和压痕法分别测量了薄膜的相结构、表面形貌、薄膜的化学成分和薄膜与基体的结合力,结果表明,未合金化靶材中Al和Ti在溅射过程中部分发生了化合反应生成了Al2Ti相,但还有密排六方的Ti相存在,未合金化靶材薄膜的晶粒大于合金化靶材薄膜的晶粒,薄膜结合强度优于合金化靶材薄膜。本文认为两种靶材的薄膜在沉积过程中生长机理不同,未合金化靶材薄膜与基体有很好的润湿性,以层状结构生长,而合金化靶薄膜与基体的润湿性差,岛状生长倾向明显。     

锆钛酸铅铁电薄膜的制备及性能研究

本文用无机锆盐代替锆的醇盐，研究了溶胶－凝胶技术制备锆钛酸铅（简称ＰＺＴ）铁电薄膜的热处理工艺、结构和电性能。研究结果表明，在Ｓｉ单晶基片上制备的ＰＺＴ薄膜为钙钛矿型结构的陶瓷薄膜，其晶粒细小、致密，且具有良好的铁电性能，适合于制备铁电存贮器。     

BaPbO3 导电薄膜的制备、结构及性能研究

以可溶性无机盐为原料，EDTA、柠檬酸、酒石酸为复合螯合剂，水为溶剂，采用改进的溶胶-凝胶法制备了无裂纹、晶粒尺寸小且均匀分布的钙钛矿结构的BaPb03导电薄膜．利用XRD、SEM和EDS表征方法结合薄膜方阻的测定，具体分析了Pb／Ba比和晶粒生长情况对BaPbO3薄膜导电性能的影响．实验结果表明：Pb／Ba比和晶粒生长情况是决定BaPbO3薄膜导电性的两个主要因素，Pb／Ba比的上升和晶粒的长大，都会提高BaPbO3薄膜的导电性能；热处理次数对BaPb03薄膜方阻的影响与薄膜厚度有关．在700℃下保温10min的快速热处理方法，可以获得钙钛矿结构、薄膜方阻为5．86Ω．口-1的BaPbO3薄膜．     

脉冲激光沉积金刚石基c轴取向LiNbO3压电薄膜

采用等化学计量比的LiNbO3多晶陶瓷为靶材,利用脉冲激光沉积技术在以非晶SiO2为缓冲层的金刚石/Si衬底上制备c轴取向LiNbO3薄膜。研究了靶材与衬底之间的距离对LiNbO3薄膜的结晶质量和c轴取向性的影响,发现在靶材与衬底之间的距离为4.0cm时获得了具有优异结晶质量的完全c轴取向LiNbO3压电薄膜。采用扫描电子显微镜和原子力显微镜对最佳条件下制备的薄膜进行了分析,结果表明制得的薄膜呈与衬底垂直的柱状结构,且薄膜表面光滑,晶粒均匀致密,表面平均粗糙度约为9.5 nm。     

ZnO薄膜的制备和结构性能分析

ZnO作为一种宽带隙半导体材料,近几年来已经成为国际上紫外半导体光电子材料和器件领域的研究热点.激光分子束外延(L-MBE)系统是获得器件级ZnO外延薄膜的先进技术之一.高质量精密ZnO陶瓷靶材对于该工艺的实施是十分关键的,本文中采用高纯原料,在洁净条件下制备了大面积、薄片型、尺寸可控的符合理想化学配比的高纯ZnO陶瓷靶材.采用所制备的靶材,利用L-MBE技术在(0001)蓝宝石基片上进行了ZnO薄膜的外延生长,在280 ℃～300 ℃低温条件下所生长的薄膜样品具有(0001)取向的纤锌矿晶体结构,薄膜光学性能良好,论文中对ZnO薄膜的低温L-MBE生长机理进行了探讨.     

陶瓷粉末靶与陶瓷块状靶溅射制备PZT薄膜的性能比较

介绍了RF溅射冷压法制备的PZT陶瓷粉末靶和块状靶制取PZT薄膜的过程.二种方法避开了热压法制作PZT陶瓷块状靶的复杂工艺及昂贵设备,均能获得化学成分稳定的钙钛矿结构PZT铁电薄膜;用粉末靶制取的薄膜的热处理温度比块状靶低200℃;用块状靶制取的薄膜具有清晰的晶粒,较好的化学配比、电性能及高的密度;用粉末靶未见有明显的晶粒,存在玻璃质,其化学配比与源材料相比有较大差异,电性能也略为逊色.     

Sc2W3O12薄膜制备及其负热膨胀性能

采用脉冲激光沉积法制备了斜方相Sc₂W₃O₁₂薄膜。利用X射线衍射仪(XRD)和场发射扫描电镜(FESEM)对Sc₂W₃O₁₂靶材和Sc₂W₃O₁₂薄膜组分、表面形貌和靶材断面形貌进行表征, 研究衬底温度与氧分压对薄膜制备的影响。采用变温XRD和热机械分析仪(TMA)分析了Sc₂W₃O₁₂陶瓷靶材和薄膜的负热膨胀特性。实验结果表明: 经1000℃烧结6 h得到结构致密的斜方相Sc₂W₃O₁₂陶瓷靶材, 其在室温到600℃的温度范围内平均热膨胀系数为-5.28×10^-6 K^-1。在室温到500℃衬底温度范围内脉冲激光沉积制备的Sc₂W₃O₁₂薄膜均为非晶态, 随着衬底温度的升高, 薄膜表面光滑程度提高; 随着沉积氧压强增大, 表面平整性变差。非晶膜经1000℃退火处理7 min后得到斜方相Sc₂W₃O₁₂多晶薄膜, 在室温到600℃温度区间内, Sc₂W₃O₁₂薄膜的平均热膨胀系数为-7.17×10^-6 K^-1。     

Fabrication of thin films by sputtering deposition using (Ba<Subscript>0.3</Subscript>Sr<Subscript>0.7</Subscript>)(Zn<Subscript>1/3</Subscript>Nb<Subscript>2/3</Subscript>)O<Subscript>3</Subscript> ceramic as target

Dielectric ceramic thin films were fabricated on SiO₂ (110) substrates by the radio frequency (RF) magnetron sputtering method using (Ba_0.3Sr_0.7)(Zn_1/3Nb_2/3)O₃ microwave dielectric ceramic as target. The microstructure, components, and morphology of the thin films were investigated thoroughly. The results reveal that the experimental conditions can affect the growth of the thin films significantly. The main phases of the thin films are Ba_0.5Sr_0.5Nb₂O₆ and Ba_0.27Sr_0.75Nb₂O_5.78, which are of different composition from that of the ceramic target due to Zn loss. The thin films are polycrystalline with high-quality crystalline and are made up of dense rod-like structures. The growth mechanism of the thin films is discussed in particular.     

溅射工艺参数对PZT铁电薄膜相变过程的影响

采用射频磁控溅射工艺,在（１１１）Ｐｔ／Ｔｉ／ＳｉＯ２／Ｓｉ衬底上用ＰＺＴ（５３／４７）陶瓷靶制备铁电薄膜。用快速光热退火炉对原位沉积的薄膜进行ＲＴＡ处理。     

ZnO transparent thin films for gas sensor applications

Zinc oxide (ZnO) transparent thin films were deposited onto silicon and Corning glass substrates by dc magnetron sputtering using metallic and ceramic targets. Surface investigations carried out by Atomic Force Microscopy (AFM) and X-ray Diffraction (XRD) have shown a strong influence of deposition technique parameters on film surface topography. Film roughness (RMS), grain shape and dimensions are correlated with the deposition technique parameters as well as with the target material. XRD measurements have proven that the dc sputtered films are polycrystalline with the (002) as preferential crystallographic orientation. AFM analysis of thin films sputtered from a ceramic target has shown a completely different surface behavior compared with that of the films grown from a metallic target. This work demonstrates that the target material and the growth conditions determine the film surface characteristics. The gas sensing characteristics of these films are strongly influenced by surface morphology. Thus correlating the optical and electrical film properties with surface parameters (i.e. RMS and Grain Radius) can lead to an enhancement of the material's potential for gas sensing applications.     

Comparative study of zinc oxide and aluminum doped zinc oxide transparent thin films grown by direct current magnetron sputtering

Pure and aluminum (Al) doped zinc oxide (ZnO and ZAO) thin films have been grown using direct current (dc) magnetron sputtering from pure metallic Zn and ceramic ZnO targets, as well as from Al-doped metallic ZnAl2at.% and ceramic ZnAl2at.%O targets at room temperature (RT). The effects of target composition on the film's surface topology, crystallinity, and optical transmission have been investigated for various oxygen partial pressures in the sputtering atmosphere. It has been shown that Al-doped ZnO films sputtered from either metallic or ceramic targets exhibit different surface morphology than the undoped ZnO films, while their preferential crystalline growth orientation revealed by X-ray diffraction remains always the (002). More significantly, Al-doping leads to a larger increase of the optical transmission and energy gap (E_g) of the metallic than of the ceramic target prepared films.     

O2/Ar气体流量比对射频磁控溅射HfO2薄膜的影响

采用射频磁控溅射法,以HfO2陶瓷作为靶材,在石英衬底上制备了HfO2薄膜.通过椭圆偏振光谱仪(SE)、X射线衍射(XRD)、场发射扫描电子显微镜(FE-SEM)研究了不同O2/Ar气体流量比对薄膜沉积速率、结构、形貌等的影响.结果表明,随着O2/Ar气体流量比从0增加到0.50,薄膜的沉积速率逐渐下降.O2/Ar气体...     

激光沉积高温氧化物超导薄膜

本文简要介绍激光沉积技术的原理、特点及国外科研机构采用这种方法制作陶瓷氧化物高温超导薄膜的技术参数等。本文还探讨了激光沉积超导薄膜的形貌及激光束与靶材的交互作用情况,并展望了这种技术的应用前景。     

交流磁控溅射制备ZAO薄膜工艺参数的研究

对于交流磁控溅射氧化锌铝陶瓷靶材制备ZAO薄膜,研究了氧流量、基体温度、靶电流密度、铝的掺杂量、本底真空压力和工作气体压力对ZAO薄膜电学性能的影响规律,优化了工艺参数,为工业化生产提供了实验依据.     

Characterization of ZrO2 and SiC ceramic thin films prepared by electrostatic atomization

ZrO₂ and SiC ceramic thin films and their bilayer have been successfully prepared by a newly developed electrostatic atomization technique. This technique can generate fine spray of ceramic suspensions in a micrometer sized range with a narrow size distribution which is crucial for preparation of uniform thin films of these ceramic materials. Compared to some other thin film deposition techniques, such as Chemical vapour deposition (CVD), physical vapour deposition (PVD) and plasma spray (PS) etc. the thin film deposition process using electrostatic atomization is not only cheap but also controllable. The prepared ZrO₂ and SiC thin films were investigated using scanning electron microscopy (SEM) and energy dispersion analysis (EDA) techniques. These thin films were observed to be homogenous with a particle size less than 10 m. The ZrO₂-SiC bilayer was found to have an abrupt interface, implying that the deposition process is controllable and also that functionally graded ceramic/ceramic materials can be prepared in this way if the thickness of each layer is accurately controlled.     

Effect of processing temperature on characteristics of metal-ferroelectric (BiFeO3)-insulator (HfLaO)-silicon capacitors

The effect of temperature in rapid thermal annealing (RTA) process on the physical and electrical properties of bismuth ferrite ceramic thin films on HfLaO/p-Si substrates has been investigated. In metal-ferroelectric-insulator-silicon (MFIS) capacitors, the high-k HfLaO dielectric layer was prepared as the insulator layer. On HfLaO/Si substrates the bismuth ferrite thin film was fabricated via sputtering process with a BiFeO₃ (BFO) target at room temperature followed by RTA. The RTA temperature ranged from 500 to 700 °C. It is found that the root mean square roughness of ceramic films increases for high-temperature process. The maximum ferroelectric memory window is 1.6 V obtained from a sweep voltage of ± 4 V at the lowest RTA temperature of 500 °C. This good ferroelectric memory performance can be attributed to the low leakage current as a result of smooth surface of nanocrystalline ferroelectric BFO and Bi₂Fe₄O₉ thin films.